CN208489184U - A kind of radiator of semiconductor device - Google Patents
A kind of radiator of semiconductor device Download PDFInfo
- Publication number
- CN208489184U CN208489184U CN201821284477.7U CN201821284477U CN208489184U CN 208489184 U CN208489184 U CN 208489184U CN 201821284477 U CN201821284477 U CN 201821284477U CN 208489184 U CN208489184 U CN 208489184U
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- connect
- reducer pipe
- radiating block
- semiconductor device
- exchange
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of radiator of semiconductor device, it is related to technical field of semiconductors；Semiconductor core on piece is provided with radiating block, it is provided with several heat dissipation wind channels arranged side by side in radiating block, is radiating ribs between heat dissipation wind channel, one end of radiating block is connected with the first reducer pipe, the other end is provided with cooling tuyere, first reducer pipe is connect with duct set, and duct set is connect with the second reducer pipe, the air inlet connection of the second reducer pipe and blower, the air outlet of blower is connect with discharge pipe, discharge pipe is connect with gas-liquid heat-exchange, and gas-liquid heat-exchange is connect with cool air hose, and the end of cool air hose is cooling tuyere；Inlet and outlet are provided on the gas-liquid heat-exchange, water inlet is connect by circulating pump and pipeline with water tank, and water tank is connect with water outlet.A kind of radiator of semiconductor device described in the utility model, using water cooling and the air-cooled type of cooling combined, water route is far from semiconductor device, the short circuit accident caused by without condensation, leak, good heat dissipation effect.
Description
Technical field
The utility model relates to technical field of semiconductors, and in particular to a kind of radiator of semiconductor device.
Background technique
Currently, the development trend of semiconductor devices is that chip size is increasing, and power is higher and higher.Semiconductor devices function
The raising of rate provides powerful support to the manufacture and development of large-capacity power electronic device.But, with semiconductor devices
The increase of power, calorific value also sharply increase, this just inevitably brings heat dissipation problem.The failure of electronic component occurs
Rate is the raising with operating temperature and has exponent relation growth.Effective cooling measure is taken, the temperature of semiconductor devices is made
It is maintained at comparatively safe range, is the key that guarantee that semiconductor devices works normally.
It is well known that water cooling is the most effective type of cooling in all types of cooling, however for semiconductor and
Speech is related to circuit, and water is cooling to be easy to produce condensation, leak danger, and it is cooling to be generally not used for semiconductor.
Utility model content
The purpose of this utility model is that in view of the drawbacks of the prior art and insufficient, provide that a kind of structure is simple, design is closed
The radiator of reason, semiconductor device easy to use.
In order to achieve the above purposes, the technical solution adopted by the utility model is:, and it includes semiconductor chip, radiating block, dissipates
Hot-flow flue, radiating ribs, the first reducer pipe, duct set, the second reducer pipe, blower, discharge pipe, gas-liquid heat-exchange, cool air hose, cooling
Tuyere, water inlet, water outlet, circulating pump, water tank；The semiconductor core on piece is provided with radiating block, is provided in radiating block
Several heat dissipation wind channels arranged side by side are radiating ribs between heat dissipation wind channel, and one end of radiating block is connected with the first reducer pipe, and the other end is set
It is equipped with cooling tuyere, the first reducer pipe is connect with duct set, and duct set is connect with the second reducer pipe, the second reducer pipe and blower
Air inlet connection, the air outlet of blower are connect with discharge pipe, and discharge pipe is connect with gas-liquid heat-exchange, gas-liquid heat-exchange and cool air hose
Connection, the end of cool air hose are cooling tuyere；Inlet and outlet are provided on the gas-liquid heat-exchange, water inlet passes through
Circulating pump and pipeline are connect with water tank, and water tank is connect with water outlet.
Preferably, the semiconductor chip is connect with radiating block by silica gel.
Preferably, the radiating block is connect with the first reducer pipe welded type.
Preferably, first reducer pipe is connect by flange and screw with duct set.
Preferably, first reducer pipe is circumference reducer pipe.
The working principle of the utility model are as follows: the heat of semiconductor chip is through silica gel uniform conductive to radiating block, radiating block
It is upper by radiating ribs by conduct heat away to heat dissipation wind channel, due to the effect of blower, by hot wind through the first reducer pipe, duct set,
Second reducer pipe, blower, discharge pipe are sent to gas-liquid heat-exchange, after carrying out heat exchange with the recirculated water of circulating pump output, through cold wind
Pipe cools down radiating block by cooling tuyere, radiating block is made to play good heat spreading function, radiating block both ends to cooling tuyere
Formed hot wind go out --- cold wind into circulating air duct；Gas-liquid heat-exchange and water route part are mountable outside semiconductor device, do not have
There are leak, condensation to influence circuit-line problem.
After adopting the above structure, the utility model is the beneficial effects are as follows: a kind of semiconductor described in the utility model
The radiator of device, using water cooling and the air-cooled type of cooling combined, water route is far from semiconductor device, from without solidifying
Short circuit accident caused by dew, leak, good heat dissipation effect, the utility model have structure is simple, setting is reasonable, cost of manufacture is low etc.
Advantage.
Detailed description of the invention
Fig. 1 is the structure chart of the utility model；
Fig. 2 is the combination three-dimensional structure diagram of the utility model radiating block, the first reducer pipe and duct set.
Description of symbols:
Semiconductor chip 1, radiating block 2, heat dissipation wind channel 3, radiating ribs 4, the first reducer pipe 5, duct set 6, the second reducer pipe
7, blower 8, discharge pipe 9, gas-liquid heat-exchange 10, cool air hose 11, cooling tuyere 12, water inlet 13, water outlet 14, circulating pump 15,
Water tank 16, flange 17, screw 18.
Specific embodiment
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, is also possible to obtain other drawings based on these drawings.
Referring to such as Fig. 1 --- shown in Fig. 2, present embodiment adopts the following technical scheme that it includes semiconductor chip
1, radiating block 2, heat dissipation wind channel 3, radiating ribs 4, the first reducer pipe 5, duct set 6, the second reducer pipe 7, blower 8, discharge pipe 9, gas
Liquid heat exchanger 10, cool air hose 11, cooling tuyere 12, water inlet 13, water outlet 14, circulating pump 15, water tank 16；The semiconductor
Radiating block 2 is connected with by silica gel on chip 1, the heat of semiconductor chip 1 is through silica gel uniform conductive to radiating block 2, radiating block 2
Several heat dissipation wind channels 3 arranged side by side are inside provided with, are radiating ribs 4 between heat dissipation wind channel 3, pass through radiating ribs 4 on radiating block 2 for heat
It is dissipated into heat dissipation wind channel 3.
One end of the radiating block 2 is welded with the first reducer pipe 5, and the first reducer pipe 5 is circumference reducer pipe, adapts to heat dissipation
The connection of the nose circle of the square end and duct set 6 of block 2, the other end are provided with cooling tuyere 12, and the first reducer pipe 5 passes through 17 He of flange
Screw 18 is connect with duct set 6 with duct set 6, and duct set 6 is connect with the second reducer pipe 7, the second reducer pipe 7 and blower 8 into
Air port connection, the air outlet of blower 8 connect with discharge pipe 9, and discharge pipe 9 is connect with gas-liquid heat-exchange 10, and blower 8 is by heat dissipation wind channel
Hot wind in 3 is sent through the first reducer pipe 5, duct set 6, the second reducer pipe 7, blower 8, discharge pipe 9 to gas-liquid heat-exchange 10.
The gas-liquid heat-exchange 10 is connect with cool air hose 11, and the end of cool air hose 11 is cooling tuyere 12；The gas
Water inlet 13 and water outlet 14 are provided on liquid heat exchanger 10, water inlet 13 is connect by circulating pump 15 and pipeline with water tank 16,
Water tank 16 is connect with water outlet 14, after the recirculated water that hot wind and circulating pump 15 export carries out heat exchange by gas-liquid heat-exchange 10,
Through cool air hose 11 to cooling tuyere 12, radiating block 2 is cooled down by cooling tuyere 12, radiating block 2 is made to play good heat dissipation
Effect, 2 both ends of radiating block formed hot wind go out --- cold wind into circulating air duct.
The gas-liquid heat-exchange 10 and water route part is mountable outside semiconductor device, influences without leak, condensation
Circuit-line problem.
After adopting the above structure, present embodiment is the beneficial effects are as follows: one described in present embodiment
The radiator of kind of semiconductor device, using water cooling and the air-cooled type of cooling combined, water route far from semiconductor device, thus
There is no short circuit accident caused by condensation, leak, good heat dissipation effect, present embodiment is simple with structure, setting is reasonable, system
Make the advantages such as cost is low.
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above.This
The technical staff of industry is retouched in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
That states only illustrates the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model
It will also have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.This is practical new
Type is claimed range and is defined by the appending claims and its equivalent thereof.
Claims (5)
1. a kind of radiator of semiconductor device, it is characterised in that: it includes semiconductor chip, radiating block, heat dissipation wind channel, dissipates
Hot muscle, the first reducer pipe, duct set, the second reducer pipe, blower, discharge pipe, gas-liquid heat-exchange, cool air hose, cooling tuyere, water inlet
Mouth, water outlet, circulating pump, water tank；The semiconductor core on piece is provided with radiating block, is provided in radiating block several arranged side by side
Heat dissipation wind channel is radiating ribs between heat dissipation wind channel, and one end of radiating block is connected with the first reducer pipe, and the other end is provided with cooling wind
Mouth, the first reducer pipe are connect with duct set, and duct set is connect with the second reducer pipe, and the air inlet of the second reducer pipe and blower connects
It connects, the air outlet of blower is connect with discharge pipe, and discharge pipe is connect with gas-liquid heat-exchange, and gas-liquid heat-exchange is connect with cool air hose, cold
The end of air hose is cooling tuyere；Inlet and outlet are provided on the gas-liquid heat-exchange, water inlet passes through circulating pump
It is connect with pipeline with water tank, water tank is connect with water outlet.
2. a kind of radiator of semiconductor device according to claim 1, it is characterised in that: the semiconductor chip
It is connect with radiating block by silica gel.
3. a kind of radiator of semiconductor device according to claim 1, it is characterised in that: the radiating block and
The connection of one reducer pipe welded type.
4. a kind of radiator of semiconductor device according to claim 1, it is characterised in that: first reducer pipe
It is connect by flange and screw with duct set.
5. a kind of radiator of semiconductor device according to claim 1, it is characterised in that: first reducer pipe
To have an area of reducer pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821284477.7U CN208489184U (en) | 2018-08-10 | 2018-08-10 | A kind of radiator of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821284477.7U CN208489184U (en) | 2018-08-10 | 2018-08-10 | A kind of radiator of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208489184U true CN208489184U (en) | 2019-02-12 |
Family
ID=65247043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821284477.7U Active CN208489184U (en) | 2018-08-10 | 2018-08-10 | A kind of radiator of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208489184U (en) |
-
2018
- 2018-08-10 CN CN201821284477.7U patent/CN208489184U/en active Active
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