CN208489115U - A kind of capacitor based on nanometer evaporation metal thin film technique - Google Patents

A kind of capacitor based on nanometer evaporation metal thin film technique Download PDF

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Publication number
CN208489115U
CN208489115U CN201820699615.1U CN201820699615U CN208489115U CN 208489115 U CN208489115 U CN 208489115U CN 201820699615 U CN201820699615 U CN 201820699615U CN 208489115 U CN208489115 U CN 208489115U
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CN
China
Prior art keywords
capacitor
nanometer
shell
metal thin
fixedly connected
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Expired - Fee Related
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CN201820699615.1U
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Chinese (zh)
Inventor
程金科
罗学民
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CHANGXING YOUCHANG ELECTRONICS Co Ltd
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CHANGXING YOUCHANG ELECTRONICS Co Ltd
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Abstract

The utility model discloses a kind of capacitors based on nanometer evaporation metal thin film technique, belong to capacitor field, its key points of the technical solution are that, including shell, cover board and capacitor core, capacitor core includes metallized polypropylene film, metallized polypropylene film is fitted tightly over the outer surface of capacitor core, and the third film of metallized polypropylene is double-layer and double-side structure, the top of shell is fixedly connected with cover board, being internally embedded for shell is provided with capacitor core, the inner wall of shell is closely fitted with heat-shrinkable T bush, and the inside of heat-shrinkable T bush, which is run through, is connected with aluminum hull.Capacitor of this kind based on nanometer evaporation metal thin film technique can increase the Antisurge current ability of capacitor by metallized polypropylene film, contact loss be reduced, so as to avoid the problem that capacitor open-circuit or capacity sharp fall.

Description

A kind of capacitor based on nanometer evaporation metal thin film technique
Technical field
The utility model relates to capacitor field, in particular to a kind of capacitor based on nanometer evaporation metal thin film technique.
Background technique
Capacitor based on nanometer evaporation metal thin film technique is a kind of device for accommodating charge, passes through capacitor core, energy Enough there is charge-discharge characteristic and DC current is prevented to pass through, the ability for allowing alternating current to pass through, but the capacitor inside capacitor Amount be easy to cause decaying, so that the reliability of capacitor reduces.
Authorization Notice No. is that the Chinese patent of CN202662458U discloses a kind of capacitor, including shell, rigid insulation Liner, Insulation stopping and capacity cell can play the role of high temperature fuse protection by rigid insulation liner, to prevent short Road and explosive spalling or burning are improved safety and long service life, but the capacity of capacitor is stablized The phenomenon that property is poor, is easy to happen electric leakage.
Authorization Notice No. is that the Chinese patent of CN201514859U discloses a kind of no positioning sleeve AC capacitor, including shell Body, cover assembly and capacitor core can substitute positioning sleeve, insulating base frame by the way that insulating base is arranged in the bottom of capacitor core Product is small, and materials are few, easy to process, and immersion oil is not required in shell, thus achieve the effect that reduce capacitor weight and production cost, but It is that carrying current capacity is poor, so that the reliability of capacitor reduces.
Utility model content
In view of the deficienciess of the prior art, the purpose of the utility model is to provide one kind based on nanometer evaporation metalization it is thin The capacitor of membrane technology, can on polypropylene-base film medium successively AM aluminum metallization, the full film of Nano-Zinc composition metalization, to avoid holding Amount stability is poor and carries the weaker problem of high current ability because layer of metallized film is relatively thin.
The above-mentioned technical purpose of the utility model has the technical scheme that
A kind of capacitor based on nanometer evaporation metal thin film technique, including shell, cover board and capacitor core, capacitor core Including metallized polypropylene film, metallized polypropylene film is fitted tightly over the outer surface of capacitor core, and metallized polyimide third Allyl film is double-layer and double-side structure, and the top of shell is fixedly connected with cover board, and being internally embedded for shell is provided with capacitor core, shell The inner wall of body is closely fitted with heat-shrinkable T bush, and the inside of heat-shrinkable T bush, which is run through, is connected with aluminum hull, and heat-shrinkable T bush is arranged in aluminum hull Between shell;Cover board upper surface is fixedly connected there are two through hole, and lead-out wire there are two connections is run through at the middle part of through hole, and The lower end of two lead-out wires is fixedly connected with capacitor core, and lead-out wire can be bent;
The outer surface of capacitor core is closely fitted with the full film of nanometer aluminum composite metalization, the full film of nanometer aluminum composite metalization Outer surface is fixedly connected with the full film of Nano-Zinc composition metalization;
The outer surface of shell is fixedly connected with sealing strip and sealing strip is laid in vertical, and shell is arranged in sealing strip At abutment joint.
Preferably, the bottom of shell is fixedly connected with bottom plate, and the outer surface of bottom plate is fixedly connected there are two card hole, and two Card hole is symmetrically arranged.
Preferably, the outer surface of bottom plate is fixedly connected with fixation hole, and fixation hole is uniformly arranged around the surface of bottom plate.
Preferably, the outer surface of lead-out wire is socketed with rubber stopper, and rubber plug structure is loose, and the lower end of rubber stopper with Capacitor core connection.
Preferably, the both ends of capacitor core are welded with Welding Sn-Zn material, and Welding Sn-Zn material is in " cylindric " structure, and tin Spelter solder size is consistent with capacitor core size.
Preferably, capacitor core outer surface fixing compact is fitted with non-metallic polypropylene light film, and non-metallic poly- third Alkene light film is arranged between double-layer and double-side metallized polypropylene film.
Preferably, the outer surface of capacitor core is fixedly connected there are two card interface, and two card interfaces are in " semiarc shape " knot Structure.
In conclusion the utility model has the following beneficial effects:
1, capacitor of this kind based on nanometer evaporation metal thin film technique can increase electricity by metallized polypropylene film The Antisurge current ability of container reduces contact loss, so as to avoid asking for capacitor open-circuit or capacity sharp fall Topic.
2, capacitor of this kind based on nanometer evaporation metal thin film technique, by polypropylene-base film medium AM aluminum metallization, It is preferably special with the good electricity of galvanized metal film can to merge metallized film adhesive force of aluminizing for the full film of Nano-Zinc composition metalization Property parameter respective advantage, to avoid capacity stability difference and to carry high current ability weaker because layer of metallized film is relatively thin Problem.
3, capacitor of this kind based on nanometer evaporation metal thin film technique makes shell structure reach closed by sealing strip Effect, can prevent external environment moisture content invade, to reduce air ionization, suppression capacitor capacity attenuation can be reached Effect.
4, capacitor of this kind based on nanometer evaporation metal thin film technique is arranged by non-metallic polypropylene light film double Between layer two-sided metallization polypropylene film, so that internal structure is connected, to have very high self-healing performance, reach volume Effect small, light-weight, loss is low, temperature rise is low, partial discharge performance is excellent.
5, capacitor of this kind based on nanometer evaporation metal thin film technique improves capacitor core pressure resistance by Welding Sn-Zn material, It not will cause short circuit under the impact of instant high-voltage high current, can be avoided arcing punch-through, improve capacitor can By property and service life.
Detailed description of the invention
Fig. 1 is the utility model of the whole structure diagram;
Fig. 2 is the utility model internal structure chart;
Fig. 3 is the utility model floor structure figure;
Fig. 4 is the utility model capacitor core structure chart;
Fig. 5 is the utility model capacitor core unfolding assumption diagram;
Fig. 6 is the utility model metallized polypropylene film structure chart.
In figure, 1, shell;101, sealing strip;102, heat-shrinkable T bush;103, aluminum hull;104, anode foils;105, Cathode Foil; 106, electrolytic paper;107, protective layer;108, adhesive tape;109, bottom plate;1091, card hole;1092, fixation hole;2, cover board;201, run through Hole;202, lead-out wire;203, rubber stopper;3, capacitor core;301, card interface;302, the full film of Nano-Zinc composition metalization;303, Welding Sn-Zn material;304, the full film of nanometer aluminum composite metalization;3041, non-metallic polypropylene light film;305, metallized polypropylene is thin Film.
Specific embodiment
A kind of capacitor based on nanometer evaporation metal thin film technique, as shown in Figure 1, the outer surface of shell 1 is fixedly connected There is sealing strip 101, sealing strip 101 is arranged at the abutment joint of shell 1, makes shell structure reach closed work by sealing strip With, can prevent external environment moisture content invade, to reduce air ionization, the effect of suppression capacitor capacity attenuation can be reached Fruit, the cover board 2 that 1 top of shell is fixedly connected, so that shell 1 reaches closed environment, 2 upper surface of cover board is fixedly connected use Two through holes 201, to place lead-out wire 202.
In utility model, as shown in Fig. 2, the inner wall of shell 1 is closely fitted with heat-shrinkable T bush 102, heat-shrinkable T bush 102 Inside is through aluminum hull 103 is connected with, and heat-shrinkable T bush 102 is to fasten aluminum hull 103, thus prevent aluminum hull 103 from loosening, capacitor core 3 outer surface is fixedly connected with anode foils 104, and the outer surface of anode foils 104 is closely fitted with electrolytic paper 106, electrolytic paper 106 Center outer surface is fixedly connected with Cathode Foil 105, and electrolytic paper 106 is arranged between anode foils 104 and Cathode Foil 105, electrolysis The outer surface of paper 106 is fixedly connected with protective layer 107, and the outer surface of protective layer 107 is bonded with adhesive tape 108 by viscose, protection With to avoid capacitor core 3 occurs for layer 107 the problem of hitting damage, and adhesive tape 108 is used so that the protective layer 107 of pressing closely pastes It closes on capacitor core 3.
In utility model, as shown in figure 3, the bottom of shell 1 is fixedly connected with bottom plate 109, the outer surface of bottom plate 109 is solid There are two card holes 1091 for fixed connection, and two card holes 1091 are symmetrically arranged, and bottom plate 109 is arranged to place shell 1 in bottom plate Two card holes 1091 on 109 surfaces, to facilitate mounting base 109, the fixation hole 1092 that 109 outer surface of bottom plate is fixedly connected is used It to fix bottom plate 109, prevents at work, bottom plate 109 is displaced.
In utility model, as shown in figure 4, being internally embedded for shell 1 is provided with capacitor core 3, the appearance of capacitor core 3 Face is fixedly connected there are two card interface 301, two card interfaces 301 in " semiarc shape " structure, to be clamped capacitor core 3, The effective stability for improving 3 structure of capacitor core.
In utility model, as shown in figure 5, to be closely fitted with nanometer aluminum composite metalization complete for the outer surface of capacitor core 3 Film 304, the outer surface of the full film 304 of nanometer aluminum composite metalization are fixedly connected with the full film 302 of Nano-Zinc composition metalization, pass through steaming Plate nano aluminum, the full film of Nano-Zinc composition metalization so that merged aluminize metallized film adhesive force preferably with galvanized metal The respective advantage of film good electrical parameter, the work field strength than traditional metallization thin film capacitor improve 10-20%, capacitor The Welding Sn-Zn material 303 that 3 both ends of fuse are welded not will cause under the impact of instant high-voltage high current to improve pressure resistance Short circuit effectively prevents arcing punch-through, improves the reliability and service life of capacitor, and 303 ruler of Welding Sn-Zn material Very little size is consistent with 3 size of capacitor core, can reduce occupancy volume.
In utility model, as shown in fig. 6,3 outer surface fixing compact of capacitor core is fitted with non-metallic polypropylene light Film 3041, use so that internal structure connect, have very high self-healing performance, reach it is small in size, light-weight, loss it is low, warm The effect low, partial discharge performance is excellent is risen, the outer surface of capacitor core 3 is closely fitted with metallized polypropylene film 305, gold Categoryization polypropylene film 305 can increase the Antisurge current ability of capacitor, reduce contact loss.
Specific implementation process, firstly, by welding sequence, the mechanical pressure 1-1.2kg of plumb joint, orientation distance 160- 200mm, guarantee welding quality, obtains capacitor core 3 of good performance, then, capacitor core 3 is placed in aluminum hull 103, if It sets the heat-shrinkable T bush 102 inside shell 1 and fastens aluminum hull 103, and fit closely rubber stopper 203 in the upper end of capacitor core 3, So that the phenomenon that avoiding capacitor core 3 from being displaced then welds Welding Sn-Zn material 303, Neng Gouti at the both ends of capacitor core 3 High voltage not will cause short circuit, and 303 size of Welding Sn-Zn material and capacitance core under the impact of instant high-voltage high current Sub 3 sizes are consistent, can reduce occupancy volume, and the outer surface of shell 1 is fixedly connected on sealing strip 101, and the setting of sealing strip 101 exists At the abutment joint of shell 1, use so that 1 structure of shell have the function that it is closed, can improve encapsulation after capacitor in high temperature The card hole 1091 on 109 surface of bottom plate, energy is arranged in place shell 1 in the speed of effective attenuation in high humidity environment, bottom plate 109 Enough facilitate the installation of bottom plate 109.
This specific utility model is only the explanation to the utility model, is not limitations of the present invention, this Field technical staff can according to need after reading this specification to be made not creative contribution to the utility model and repairs Change, but as long as all by the protection of Patent Law in the scope of the claims of the utility model.

Claims (7)

1. a kind of capacitor based on nanometer evaporation metal thin film technique, including shell (1), cover board (2) and capacitor core (3), Capacitor core (3) includes metallized polypropylene film (305), and metallized polypropylene film (305) is fitted tightly over capacitor core (3) outer surface, and metallized polypropylene film (305) is double-layer and double-side structure, it is characterized in that: the top of shell (1) is fixed It is connected with cover board (2), being internally embedded for shell (1) is provided with capacitor core (3), and the inner wall of shell (1) is closely fitted with pyrocondensation Casing (102), the inside of heat-shrinkable T bush (102), which is run through, to be connected with aluminum hull (103), and heat-shrinkable T bush (102) is arranged in aluminum hull (103) between shell (1);Cover board (2) upper surface is fixedly connected there are two through hole (201), and through hole passes through in the middle part of (201) Wearing connection, there are two lead-out wire (202), and the lower end of two lead-out wires (202) is fixedly connected with capacitor core (3), and is drawn Line (202) can be bent;
The outer surface of capacitor core (3) is closely fitted with the full film of nanometer aluminum composite metalization (304), and nanometer aluminum composite metalization is complete The outer surface of film (304) is fixedly connected with the full film of Nano-Zinc composition metalization (302);
The outer surface of shell (1) is fixedly connected with sealing strip (101) and sealing strip (101) is laid in vertical, and sealing strip (101) it is arranged at the abutment joint of shell (1).
2. a kind of capacitor based on nanometer evaporation metal thin film technique according to claim 1, it is characterized in that: shell (1) bottom is fixedly connected with bottom plate (109), and the outer surface of bottom plate (109) is fixedly connected there are two card hole (1091), and two Card hole (1091) is symmetrically arranged.
3. a kind of capacitor based on nanometer evaporation metal thin film technique according to claim 2, it is characterized in that: bottom plate (109) outer surface is fixedly connected with fixation hole (1092), and fixation hole (1092) was uniformly arranged in the surface of bottom plate (109) week It encloses.
4. a kind of capacitor based on nanometer evaporation metal thin film technique according to claim 1, it is characterized in that: lead-out wire (202) outer surface is socketed with rubber stopper (203), and rubber stopper (203) short texture, and the lower end of rubber stopper (203) with Capacitor core (3) connection.
5. a kind of capacitor based on nanometer evaporation metal thin film technique according to claim 1, it is characterized in that: capacitance core The both ends of sub (3) are welded with Welding Sn-Zn material (303), and Welding Sn-Zn material (303) is in " cylindric " structure, and Welding Sn-Zn material (303) size is consistent with capacitor core (3) size.
6. a kind of capacitor based on nanometer evaporation metal thin film technique according to claim 1, it is characterized in that: capacitance core Sub (3) outer surface fixing compact is fitted with non-metallic polypropylene light film (3041), and non-metallic polypropylene light film (3041) It is arranged between double-layer and double-side metallized polypropylene film (305).
7. a kind of capacitor based on nanometer evaporation metal thin film technique according to claim 1, it is characterized in that: capacitance core The outer surface of sub (3) is fixedly connected with that there are two card interface (301), and two card interfaces (301) are in " semiarc shape " structure.
CN201820699615.1U 2018-05-11 2018-05-11 A kind of capacitor based on nanometer evaporation metal thin film technique Expired - Fee Related CN208489115U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820699615.1U CN208489115U (en) 2018-05-11 2018-05-11 A kind of capacitor based on nanometer evaporation metal thin film technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820699615.1U CN208489115U (en) 2018-05-11 2018-05-11 A kind of capacitor based on nanometer evaporation metal thin film technique

Publications (1)

Publication Number Publication Date
CN208489115U true CN208489115U (en) 2019-02-12

Family

ID=65253188

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820699615.1U Expired - Fee Related CN208489115U (en) 2018-05-11 2018-05-11 A kind of capacitor based on nanometer evaporation metal thin film technique

Country Status (1)

Country Link
CN (1) CN208489115U (en)

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Granted publication date: 20190212