CN208477893U - A kind of silicon substrate drive substrate and OLED display - Google Patents
A kind of silicon substrate drive substrate and OLED display Download PDFInfo
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- CN208477893U CN208477893U CN201820986354.1U CN201820986354U CN208477893U CN 208477893 U CN208477893 U CN 208477893U CN 201820986354 U CN201820986354 U CN 201820986354U CN 208477893 U CN208477893 U CN 208477893U
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Abstract
The utility model embodiment provides a kind of silicon substrate drive substrate and OLED display, it is related to display technology field, wherein, which includes imitation screen body driving chip and digital video chip, and the imitation screen body driving chip is connected with the digital video chip.The utility model substitutes existing silicon substrate drive substrate by imitation screen body driving chip and digital video chip, it can be under the premise of not increasing the driving voltage and pressure voltage of drive substrate entirety, the display brightness of the OLED display using the silicon substrate drive substrate is effectively improved, while reducing the manufacturing process difficulty of silicon substrate drive substrate.
Description
Technical field
The utility model relates to display technology fields, show in particular to a kind of silicon substrate drive substrate and OLED
Device.
Background technique
The silicon substrate OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) used currently on the market
The universal brightness of miniscope is lower, as color monitor only has 70cd/m2, and foreign countries maximum silicon substrate OLED supplier Sony
Miniscope can only also accomplish 200cd/m2, existing silicon substrate OLED minitype displayer is caused to be unable to satisfy such as AR product pair
The requirement of display effect, therefore, how to improve the brightness of silicon substrate OLED minitype displayer is that those skilled in the art are badly in need of solving
The technical issues of.
Utility model content
In view of this, the present invention provides a kind of silicon substrate drive substrate and OLED displays, can effectively solve the problem that
State problem.
On the one hand, the utility model preferred embodiment provides a kind of silicon substrate drive substrate, which includes mould
Quasi- screen body driving chip and digital video chip, the imitation screen body driving chip are connected with the digital video chip.
In the selection of the utility model preferred embodiment, the imitation screen body driving chip include simulation control module and
Shield body and shows processing circuit;
The both ends of the simulation control module show that processing circuit connects with the digital video chip and the screen body respectively
It connects, the screen body shows that processing circuit connection is connect with the digital video chip;
Wherein, the control signal control that the simulation control module is used to be sent according to the digital video chip received
It makes the screen body and shows that processing circuit executes corresponding display movement.
In the selection of the utility model preferred embodiment, the imitation screen body driving chip further includes analog power mould
Block, the analog power module shows that processing circuit is separately connected with the simulation control module and screen body, for the simulation control
Molding block and screen body show that processing circuit provides operating voltage.
In the selection of the utility model preferred embodiment, the screen body show processing circuit include gamma electric voltage module,
Voltage driver, column data shift register, column data drivers, row data shift register, row data driver, pixel battle array
Column and negative pressure generation module;
The input terminal of the gamma electric voltage module is distinguished with the simulation control module and the analog power module respectively
Connection, output end are connect with the voltage driver, the input terminal of the column data drivers and the voltage driver and institute
State the connection of column data shift register, output end is connect with the pixel array, the column data shift register and the number
Digital video signal of the word video chip connection to be sent for receiving the digital video chip, the row data driver
Both ends are separately connected with the row data shift register and the pixel array respectively, the negative pressure generation module and the mould
The output end connection of quasi- power module.
In the selection of the utility model preferred embodiment, the imitation screen body driving chip further includes temperature sensor,
The temperature sensor is connect with the simulation control module.
In the selection of the utility model preferred embodiment, the digital video chip includes digital power module, number
Signal processing circuit and control signal processing circuit;
The digital power module is separately connected with the digital signal processing circuit and the control signal processing circuit,
To provide operating voltage for each module in the digital signal processing circuit and control signal processing circuit.
In the selection of the utility model preferred embodiment, the digital signal processing circuit include digital visual interface,
Decoding digital video processor, digital gamma correction module and saturation degree gradation data processing module, the control signal processing
Circuit includes control communication interface, control register and digital kernel module;
The both ends of the decoding digital video processor are corrected with the digital visual interface and the digital gamma respectively
Module connection, the both ends of the saturation degree gradation data processing module respectively with the digital gamma correction module and the columns
It is connected according to shift register;
The both ends of the control register are connect with the control communication interface and the digital core module respectively, described
The connection of digital core module is connect with the digital power module and the simulation control module.
In the selection of the utility model preferred embodiment, the silicon substrate drive substrate further includes carrier, the imitation screen
Body driving chip and digital video chip are set on the carrier.
On the other hand, the utility model preferred embodiment also provides a kind of OLED display, including OLED display screen and upper
The silicon substrate drive substrate stated, it is separate that the OLED display screen is set to the imitation screen body driving chip in the silicon substrate drive substrate
The side of carrier.
In the selection of the utility model preferred embodiment, the OLED display screen includes:
It is set to the OLED luminescent device of the imitation screen body driving chip side, which includes at least one
A OLED luminescent layer, and connect between each OLED luminescent layer;
The encapsulated layer being set at the position that the OLED luminescent device is not contacted with the imitation screen body driving chip;
It is set to glass cover-plate of the encapsulated layer far from OLED luminescent device side.
The utility model provides a kind of silicon substrate drive substrate and OLED display, by using imitation screen body driving chip and
Digital video chip substitutes the mode of existing monolith silicon substrate drive substrate, can effectively avoid being based on existing drive substrate
When realizing high brightness indicator, the problem of the whole driving voltage and voltage endurance capability for needing to improve drive substrate of appearance, meanwhile,
The silicon substrate drive substrate that the utility model is realized using imitation screen body driving chip and digital video chip, without increasing semiconductor
Manufacturing process difficulty, and product yield is high.
Further, it introduces and simulates in imitation screen body driving chip in the silicon substrate drive substrate provided in the present invention
Control module and analog power module introduce digital power module in digital video module, wherein digital video chip can be adopted
It makes of low-voltage semiconductor process to obtain faster arithmetic speed and smaller power consumption, yield rate can also significantly improve, more sharp
In the micro-display for realizing higher resolution.And imitation screen body driving chip can then use the semiconductor of relatively high voltage
Technique production, so that chip pressure voltage increases, the OLED device of the bigger voltage of needs such as driving lamination OLED shines.
To enable the above objects, features, and advantages of the utility model to be clearer and more comprehensible, preferred embodiment is cited below particularly, and
Cooperate appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the frame structure schematic diagram of silicon substrate drive substrate provided by the embodiment of the utility model.
Fig. 2 is the electrical block diagram of imitation screen body driving chip shown in Fig. 1.
Fig. 3 is digital video chip circuit structure schematic diagram shown in Fig. 1.
Fig. 4 is the electrical block diagram of silicon substrate drive substrate shown in FIG. 1.
Fig. 5 is the schematic diagram of the section structure of OLED display provided by the embodiment of the utility model.
Icon: 10- silicon substrate drive substrate;11- imitation screen body driving chip;110- simulates control module;111- screen body is aobvious
Show processing circuit;1110- gamma electric voltage module;1111- voltage driver;1112- column data shift register;1113- columns
According to driver;1114- row data shift register;1115- row data driver;1116- pixel array;1117- negative pressure generates
Module;112- analog power module;113- temperature sensor;12- digital video chip;120- digital power module;121- number
Word signal processing circuit;1210- digital visual interface;1211- decoding digital video processor;1212- digital gamma straightening die
Block;1213- saturation degree gradation data processing module;122- controls signal processing circuit;1220- controls communication interface;1221-
Control register;1222- digital core module;13- carrier;20-OLED display screen;21-OLED luminescent device;22- encapsulation
Layer;23- glass cover-plate;30-OLED display.
Specific embodiment
Through inventor the study found that existing silicon substrate OLED minitype displayer is generally by silicon substrate drive substrate (silicon substrate core
Piece), organic luminous layer, encapsulated layer constitute.Wherein, silicon substrate drive substrate is generally made of a monolith silicon base chip, and the silicon substrate
Be integrated in chip number and simulation two parts, therefore for number and simulation two parts then need to be respectively connected to digital power and
Analog power.But in actual implementation, (electricity is simulated as since the voltage value of two kinds of power supplys in silicon substrate drive substrate is different
Source voltage is higher than digital power voltage), the numerical portion in silicon base chip above-mentioned and analog portion are using different in addition
Semiconductor technology manufacture, thus, it is supposed that existing semiconductor technology is there are 5V semiconductor technology and 10V semiconductor technology, that
, it is 4V for the maximum voltage value in same silicon base chip, then the production of 5V semiconductor technology can be used in the silicon base chip, but
If the maximum voltage value in same silicon base chip is 8V, which needs to make of 10V semiconductor technology.But
For existing OLED display, to obtain higher brightness, then need to improve the driving voltage in silicon base chip,
And driving voltage is higher, the pressure voltage requirement of silicon base chip is higher, while semiconductor technology is also more difficult to realize, yield is lower, institute
Attainable arithmetic speed is also slower, and power consumption is also bigger.
Based on above-mentioned the above-mentioned problems in the prior art, the present embodiment provides a kind of silicon substrate drive substrate 10 and OLED
Display 30, wherein by by existing silicon substrate drive substrate numerical portion and analog portion separately design so that simulation
Higher driving voltage may be implemented in part, to drive the lamination OLED luminescent device 21 of higher voltage, and numerical portion not by
It influences, to improve the brightness of silicon substrate OLED display 30, reduces the difficulty of semiconductor fabrication process.
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is a part of the embodiment of the utility model, instead of all the embodiments.Usually retouched in attached drawing here
The component of the utility model embodiment stated and shown can be arranged and be designed with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below
The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the range of the utility model protection.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.In the utility model
In description, " first, second, third, fourth etc. is only used for distinguishing description term, and should not be understood as only or imply relatively heavy
The property wanted.
In the description of the present invention, unless otherwise clearly defined and limited, term " setting ", " connected ", " company
Connect " it shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or be integrally connected;It can be machine
Tool connection, is also possible to be electrically connected;It can be directly connected, two members can also be can be indirectly connected through an intermediary
Connection inside part.For the ordinary skill in the art, it can understand that above-mentioned term is practical new at this with concrete condition
Concrete meaning in type.
Specifically, as shown in Figure 1, providing a kind of frame structure of silicon substrate drive substrate 10 for the utility model embodiment
Schematic diagram, the silicon substrate drive substrate 10 include imitation screen body driving chip 11 and digital video chip 12, and the imitation screen body drives
Dynamic chip 11 and the digital video chip 12 connection.
Wherein, due to the analog level voltage of the analog portion of the silicon substrate drive substrate 10 in existing OLED display 30
Higher than the digital level voltage of numerical portion, therefore using above-mentioned imitation screen body driving chip 11 and number view in the present embodiment
Frequency chip 12 substitutes the monolith silicon substrate drive substrate 10 in existing OLED display 30.So that the present embodiment is to the silicon
In the practical manufacturing process of base drive substrate 10, the digital video chip 12 can be made of low-voltage semiconductor process, with
Faster arithmetic speed and smaller power consumption are obtained, yield rate can also significantly improve, and more conducively realization higher resolution is micro- aobvious
Show device;And the imitation screen body driving chip 11 can then be made of the semiconductor technology of higher voltage, so that chip is pressure-resistant
Value increases, and the OLED device of the bigger voltage of needs such as driving lamination OLED obtains higher display brightness, meets AR such as and produce
The requirement to display effect such as product.
Specifically, as shown in Fig. 2, the imitation screen body driving chip 11 includes that simulation control module 110 and screen body are shown
Processing circuit 111;The both ends of the simulation control module 110 are respectively and at the digital video chip 12 and the screen body display
It manages circuit 111 to connect, the screen body shows that processing circuit 111 is connect with the digital video chip 12;Wherein, the simulation
Control module 110 is used to be controlled at the screen body display according to the control signal that the digital video chip 12 received is sent
Reason circuit 111 executes corresponding display movement.It is understood that it is logical to be integrated with signal in the simulation control module 110
Believe interface, data converter, data buffer, gamma electric voltage register, analog voltage register.Negative pressure register etc., this reality
Example is applied to be not particularly limited herein.
Further, the imitation screen body driving chip 11 further includes analog power module 112, the analog power module
112 show that processing circuit 111 is separately connected with the simulation control module 110 and screen body, for 110 He of simulation control module
Shield body and show that processing circuit 111 provides operating voltage, such as analog level of various amplitudes, and analog level is generally positive value.It can
With understanding, in actual implementation, according to being increasing for 21 number of plies of OLED luminescent device in OLED display 30, the mould
The driving voltage and pressure voltage needed in quasi- screen body driving chip 11 needs to increase therewith, needs the semiconductor technology system of more high pressure
Make, but compared in existing silicon substrate drive substrate 10, the utility model only needs to improve the drive in imitation screen body driving chip 11
Dynamic voltage will not increase the semiconductor of digital video chip 12 without will affect the driving voltage in digital video chip 12
Manufacturing process difficulty.
Further, referring to Fig. 1, the screen body shows that processing circuit 111 includes gamma electric voltage module 1110, electricity
Press driver 1111, column data shift register 1112, column data drivers 1113, row data shift register 1114, line number
According to driver 1115, pixel array 1116 and negative pressure generation module 1117.Wherein, the input terminal of the gamma electric voltage module 1110
It is separately connected respectively with the simulation control module 110 and the analog power module 112, output end and the voltage drive
Device 1111 connects, and the input terminal of the column data drivers 1113 is posted with the voltage driver 1111 and column data displacement
The connection of storage 1112, output end are connect with the pixel array 1116, the column data shift register 1112 and the number
Digital video signal of the connection of video chip 12 to be sent for receiving the digital video chip 12, the row data-driven
The both ends of device 1115 are separately connected with the row data shift register 1114 and the pixel array 1116 respectively, the negative pressure
Generation module 1117 is connect with the output end of the analog power module 112.
In detail, the gamma electric voltage module 1110 is for generating the corresponding gamma electric voltage of each grayscale, and passes through described
Voltage driver 1111 is conveyed to the column data drivers 1113, for each pixel unit in the pixel array 1116
Correct RGB luminance level signal is provided.The column data shift register 1112 receives what the digital video module was sent
Digital rgb luminance signal and according to it is described simulation control module 110 control, gradually shift the moving data of each column to just
In true column data drivers 1113.The column data drivers 1113 are used to convert analog rgb brightness for digital RGB signal
Level signal, and it is injected into the storage of each sub-pix point driving unit in the pixel array 1116.The row data displacement is posted
Storage 1114 gradually controls row data driver according to certain scanning sequence according to the control of the simulation control module 110
1115 open the corresponding row in pixel array 1116.There is M row N column pixel driving unit in the pixel array 1116, and
Each pixel driving unit has tri- sub-pix point driving units of RGB again, and each sub-pix point driving unit is in the line number
After opening the row according to driver 1115, the analog rgb level signal that the conveying of column data drivers 1113 comes is received, it is lighted
The OLED luminescent device 21 of corresponding region carries out luminous.The negative pressure generation module 1117 produces the analog power module 112
Negative voltage needed for raw a certain forward voltage is transformed into the cathode in OLED luminescent layer is shone with lighting OLED luminescent layer.
Further, referring to Fig. 2, the imitation screen body driving chip 11 further includes temperature sensor 113, described
Temperature sensor 113 is connect with the simulation control module 110.Wherein, the temperature sensor 113 detects ambient temperature
(such as imitation screen body driving chip 11) converts the temperature change of external environment to after electric signal through the simulation control module
110, which are sent to the digital video chip 12, is handled, and the simulation control module 110 is according to the digital video chip 12
Voltage value in the processing result adjustment imitation screen body driving chip 11 of feedback, to reduce ambient temperature variation to display effect
It influences.
It should be noted herein that temperature sensor 113 in the imitation screen body driving chip 11 can also directly and institute
Temperature data will be based on to realize the transmission of temperature data, then by the digital video chip 12 by stating the connection of digital video chip 12
Processing result be sent to simulation control module 110 and handled and execute corresponding control and operate.
Further, as shown in figure 3, the digital video chip 12 includes digital power module 120, Digital Signal Processing
Circuit 121 and control signal processing circuit 122;The digital power module 120 and the digital signal processing circuit 121 and institute
It states control signal processing circuit 122 to be separately connected, for the digital signal processing circuit 121 and control signal processing circuit 122
In each module operating voltage, such as digital level of various amplitudes are provided, and the digital level is generally positive value.
It should be noted that being replaced in the present embodiment by the digital power module 120 and the analog power module 112
For the general supply module in silicon substrate drive substrate 10 in the prior art, it is same to effectively prevent one general supply module of existing needs
When serve as digital power and analog power, to generate the voltage of all required various amplitudes in chip, so that carrying out
When technique manufactures, needs numerical portion and analog portion in comprehensive silicon base chip to manufacture using different semiconductor technologies, add
The driving voltage of analog portion be higher than the driving voltage of numerical portion again, cause the driving electricity for needing to improve entire drive substrate
The problem of pressure and pressure voltage.
Further, referring to Fig. 3, the digital signal processing circuit 121 includes digital visual interface 1210, number
Word video decoding processor 1211, digital gamma correction module 1212 and saturation degree gradation data processing module 1213, the control
Signal processing circuit 122 includes control communication interface 1220, control register 1221 and digital kernel module 1222.
Wherein, the both ends of the decoding digital video processor 1211 respectively with the digital visual interface 1210 and institute
State digital gamma correction module 1212 connection, the both ends of the saturation degree gradation data processing module 1213 respectively with the number
Word gamma correction module 1212 and the column data shift register 1112 connection;Specifically, the digital visual interface 1210
With the decoding digital video processor 1211 for receiving externally input digital video source, and decoding it is 24
Rgb signal, wherein video format can be but not limited to RGB, MIPI, LVDS, miniLVDS, eDP, HDMI, VGA,
PAL, NTSC, SMPTE etc..The digital gamma rectification module is for decoded to the decoding digital video processor 1211
Rgb signal carries out Gamma correction.The saturation degree gradation data processing module 1213 is used for the digital gamma rectification module
Rgb signal after correction is biased adjustment, to form three digital rgb luminance signals for recently entering each pixel unit,
And it is handled in the column data shift register 1112 being transferred in the imitation screen body drive module.
In addition, it is described control register 1221 both ends respectively with the control communication interface 1220 and the digital core
Module 1222 connects, the connection of digital core module 1222 and the digital power module 120 and the simulation control module
110 connections.In the present embodiment, the control communication interface 1220 and control register 1221 is used for and external control unit outside
Communication with receive with feedback control signal, parsing external control signal, modification control register 1221 value or send control to
Kernel module executes.Wherein, the format for controlling signal can be but not limited to the industries general controls such as I2C, SPI, MCU8080 letter
Number format or other customized control signal formats.The control kernel module is responsible for being passed according to control communication interface 1220
The value of the control command or control register 1221 come works (such as simulation control module 110) to control other all modules,
Complete the normal display of display.
It should be noted that as shown in figure 4, being the silicon substrate drive substrate 10 provided by the embodiment of the utility model
In imitation screen body driving chip 11 and digital video chip 12 schematic diagram of circuit connection structure, wherein about imitation screen body
The function of driving chip 11 and each module in digital video chip 12 can refer to foregoing description, and the present embodiment is no longer superfluous herein
It states.
It is further right, in one embodiment, as shown in figure 5, the silicon substrate drive substrate 10 may also include carrier 13, institute
It states imitation screen body driving chip 11 and digital video chip 12 is set on the carrier 13.Wherein, the carrier 13 is for branch
Support the imitation screen body driving chip 11 and the digital video chip 12 or for realizing the imitation screen body driving chip 11
Electric connection between the digital video chip 12.Optionally, the imitation screen body driving chip 11 and the number view
Frequency chip 12 can be arranged side by side as shown in Figure 5 in the same side of the carrier 13, can also be located at the carrier 13
Front not ipsilateral, that such as imitation screen body driving chip 11 is located at the carrier 13, the digital video chip 12 are located at institute
State the reverse side etc. of carrier 13, the present embodiment is herein with no restrictions.In addition, the carrier 13 can use but be not limited to PCB
(Printed Circuit Board) plate, FPC plate etc..
In addition, difference according to actual needs, drives core to the imitation screen body except realizing above by the carrier 13
Except the support and/or connection of piece 11 and digital video chip 12, in the present embodiment, utilized chip encapsulation technology is gone back by institute
It states imitation screen body driving chip 11 and digital video chip 12 is packaged into an entirety, core is driven to the imitation screen body to reach
The purpose that piece 11 and digital video chip 12 are supported and/or connect.
Based on the description and design to the silicon substrate drive substrate 10, referring to Fig. 4, the utility model embodiment is also
A kind of OLED display 30 is provided, which includes OLED display screen 20 and above-mentioned silicon substrate drive substrate 10, institute
State 11 side far from carrier 13 of imitation screen body driving chip that OLED display screen 20 is set in the silicon substrate drive substrate 10.
Wherein, the OLED display screen 20 includes the OLED photophore for being set to 11 side of imitation screen body driving chip
Part 21, which includes at least one OLED luminescent layer, and is connected between each OLED luminescent layer;It is set to
The encapsulated layer 22 at position that the OLED luminescent device 21 is not contacted with the imitation screen body driving chip 11;It is set to described
Glass cover-plate 23 of the encapsulated layer 22 far from 21 side of OLED luminescent device.It wherein, include sun in the OLED luminescent layer
Pole, cathode and the organic luminous layer between the anode and cathode.
According to actual needs, in order to obtain high brightness, the OLED luminescent device 21 can be n-layer luminescent device (OLED
Luminescent layer), as n >=1, wherein can be connected by separation layer between each OLED luminescent layer, the separation layer is by upper one layer of OLED
The anode of luminescent layer and the cathode of next layer of OLED luminescent layer are electrically connected, and then realize the series connection between each OLED luminescent layer.
It should be noted that the value of n is bigger, the number of plies of OLED luminescent device 21 is more, and required driving voltage is bigger, corresponding
The pressure voltage of imitation screen body driving chip 11 is higher, and needs the semiconductor technology production of more high pressure, but should not influence the number
Word video chip 12.
In conclusion the utility model provides a kind of silicon substrate drive substrate 10 and OLED display 30, passes through and utilize simulation
Screen body driving chip 11 and digital video chip 12 substitute the mode of existing monolith silicon substrate drive substrate 10, can effectively keep away
Exempt from based on existing drive substrate realize high brightness indicator when, the whole driving voltage for needing to improve drive substrate of appearance and
The problem of voltage endurance capability, meanwhile, the silicon that the utility model is realized using imitation screen body driving chip 11 and digital video chip 12
Base drive substrate 10, without increasing semiconductor fabrication process difficulty, and product yield is high.
Further, it is introduced in the silicon substrate drive substrate 10 provided in the present invention in imitation screen body driving chip 11
Control module 110 and analog power module 112 are simulated, introduces digital power module 120 in digital video module, wherein number
Video chip 12 can use low-voltage semiconductor process production to obtain faster arithmetic speed and smaller power consumption, yield rate
It can significantly improve, more conducively realize the micro-display of higher resolution.And imitation screen body driving chip 11 then can be using opposite
The semiconductor technology of higher voltage makes, so that chip pressure voltage increases, the bigger voltage of needs such as driving lamination OLED
OLED device shines.
Obviously, those skilled in the art should be understood that the function of above-mentioned the utility model embodiment can be with general
Computing device realize that they can be concentrated on a single computing device, or be distributed in multiple computing devices and formed
Network on, optionally, the existing program code or algorithm that they can be can be performed with computing device be realized, it is thus possible to
It is stored in storage device and is performed by computing device, or they are fabricated to each integrated circuit modules,
Or single integrated circuit module is maked multiple modules or steps in them to realize.In this way, the function of the utility model
It is able to achieve and is not limited to any specific hardware and software combination.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of silicon substrate drive substrate, which is characterized in that the silicon substrate drive substrate includes imitation screen body driving chip and number view
Frequency chip, the imitation screen body driving chip include that simulation control module and screen body show processing circuit;The imitation screen body drives
Dynamic chip and the digital video chip are electrically connected.
2. silicon substrate drive substrate according to claim 1, which is characterized in that the imitation screen body driving chip includes simulation
Control module and screen body show processing circuit;
The both ends of the simulation control module show that processing circuit is connect with the digital video chip and the screen body respectively, institute
It states screen body and shows that processing circuit is connect with the digital video chip;Wherein, the simulation control module is received for basis
The control signal that sends of the digital video chip control the screen body and show that processing circuit executes corresponding display movement.
3. silicon substrate drive substrate according to claim 2, which is characterized in that the imitation screen body driving chip further includes mould
Quasi- power module, the analog power module and the simulation control module and shield body display processing circuit and be separately connected, with for
The simulation control module and screen body show that processing circuit provides operating voltage.
4. silicon substrate drive substrate according to claim 3, which is characterized in that the screen body shows that processing circuit includes gamma
Voltage module, voltage driver, column data shift register, column data drivers, row data shift register, row data-driven
Device, pixel array and negative pressure generation module;
The input terminal of the gamma electric voltage module is separately connected with the simulation control module and the analog power module respectively,
Output end is connect with the voltage driver, the input terminal of the column data drivers and the voltage driver and the columns
It is connect according to shift register connection, output end with the pixel array, the column data shift register and the digital video
Digital video signal of the chip connection to be sent for receiving the digital video chip, the both ends point of the row data driver
It is not separately connected with the row data shift register and the pixel array, the negative pressure generation module and the analog power
The output end of module connects.
5. silicon substrate drive substrate according to claim 2, which is characterized in that the imitation screen body driving chip further includes temperature
Sensor is spent, the temperature sensor is connect with the simulation control module.
6. silicon substrate drive substrate according to claim 4, which is characterized in that the digital video chip includes digital power
Module, digital signal processing circuit and control signal processing circuit;
The digital power module is separately connected with the digital signal processing circuit and the control signal processing circuit, with for
Each module in the digital signal processing circuit and control signal processing circuit provides operating voltage.
7. silicon substrate drive substrate according to claim 6, which is characterized in that the digital signal processing circuit includes number
Video interface, decoding digital video processor, digital gamma correction module and saturation degree gradation data processing module, the control
Signal processing circuit includes control communication interface, control register and digital kernel module;
The both ends of the decoding digital video processor respectively with the digital visual interface and the digital gamma correction module
Connection, the both ends of the saturation degree gradation data processing module are moved with the digital gamma correction module and the column data respectively
Bit register connection;
The both ends of the control register are connect with the control communication interface and the digital core module respectively, the number
Kernel module connection is connect with the digital power module and the simulation control module.
8. silicon substrate drive substrate according to claim 1, which is characterized in that the silicon substrate drive substrate further includes carrier,
The imitation screen body driving chip and digital video chip are set on the carrier.
9. a kind of OLED display, which is characterized in that including described in any one of OLED display screen and the claims 1-8
Silicon substrate drive substrate, the OLED display screen are set to the imitation screen body driving chip in the silicon substrate drive substrate far from carrier
Side.
10. OLED display according to claim 9, which is characterized in that the OLED display screen includes:
It is set to the OLED luminescent device of the imitation screen body driving chip side, which includes at least one
OLED luminescent layer, and connect between each OLED luminescent layer;
The encapsulated layer being set at the position that the OLED luminescent device is not contacted with the imitation screen body driving chip;
It is set to glass cover-plate of the encapsulated layer far from OLED luminescent device side.
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CN201820986354.1U CN208477893U (en) | 2018-06-26 | 2018-06-26 | A kind of silicon substrate drive substrate and OLED display |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108630145A (en) * | 2018-06-26 | 2018-10-09 | 江苏集萃有机光电技术研究所有限公司 | A kind of silicon substrate drive substrate and OLED display |
CN112102770A (en) * | 2020-11-03 | 2020-12-18 | 上海视涯技术有限公司 | Drive chip, display screen and display device |
CN112331143A (en) * | 2020-11-26 | 2021-02-05 | 中国科学院微电子研究所 | Segmented adjustable gamma correction method for silicon-based OLED micro-display |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108630145A (en) * | 2018-06-26 | 2018-10-09 | 江苏集萃有机光电技术研究所有限公司 | A kind of silicon substrate drive substrate and OLED display |
CN112102770A (en) * | 2020-11-03 | 2020-12-18 | 上海视涯技术有限公司 | Drive chip, display screen and display device |
WO2022095328A1 (en) * | 2020-11-03 | 2022-05-12 | 上海视涯技术有限公司 | Driver chip, display screen, and display apparatus |
US11663953B2 (en) | 2020-11-03 | 2023-05-30 | Seeya Optronics Co., Ltd. | Driver chip, display screen, and display device |
CN112331143A (en) * | 2020-11-26 | 2021-02-05 | 中国科学院微电子研究所 | Segmented adjustable gamma correction method for silicon-based OLED micro-display |
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