CN208471885U - Lift induction heating apparatus and glass bending molding machine - Google Patents
Lift induction heating apparatus and glass bending molding machine Download PDFInfo
- Publication number
- CN208471885U CN208471885U CN201820649443.7U CN201820649443U CN208471885U CN 208471885 U CN208471885 U CN 208471885U CN 201820649443 U CN201820649443 U CN 201820649443U CN 208471885 U CN208471885 U CN 208471885U
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- component
- heating
- heating plate
- thermal insulation
- insulation board
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Abstract
The utility model discloses a kind of lift induction heating apparatus and glass bending molding machine, the lift induction heating apparatus, the driving assembly to move up and down including the first heating component, the second heating component and the first heating component of driving;First heating component includes the first heating plate and the first thermal insulation board being arranged in the first heating plate;Second heating component includes the second heating plate being oppositely arranged with the first heating plate and the second thermal insulation board being arranged in below the second heating plate;First heating plate and the second heating plate include the copper pipe plate of helical disk;Lift induction heating apparatus further includes the pressure sensitive component for detecting lower pressure and the Thickness sensitivity component for detecting mold thickness.The first heating plate and the second heating plate, Thickness sensitivity component and pressure sensitive component of copper pipe of the utility model by setting including helical disk, according to the size of the mold thickness detected and lower pressure, the down stroke and lower pressure for controlling the first heating component, make the present apparatus be suitable for the mold of different outer dimensions.
Description
Technical field
The utility model relates to glass bending forming fields, and in particular to a kind of lift induction heating apparatus.
Background technique
Glass product applies in multiple industries such as building, electronics, communication, household, as a kind of translucent material due to glass
Glass material has good thermoplasticity, and glass can be placed progress hot bending processing in a mold by way of hot bending, be moulded
Cause the product of a variety of moulding.In the prior art, the mode of the general resistance-type heating of glass bending molding machine, but because of its heating
Time, longer efficiency was lower, is slowly inductively heated technology and is replaced.In the prior art, induction copper band for heating is generally adopted
With the tubular structure of stacking coiling, also need to be pushed into mold from bottom to top in tubular induction copper band in process, heating
Process is relative complex, can not be compatible with the mold of other larger sizes.
Utility model content
The main purpose of the utility model is to propose a kind of lift induction heating apparatus, it is intended to it solves in the prior art,
Existing induction heating apparatus can not be compatible with the problem of process requirements of the product of sizes.
To achieve the above object, the utility model proposes a kind of lift induction heating apparatus, including the first heating component,
Second heating component of the relatively described first heating component setting drives first heating component towards or away from described second
The driving assembly of heating component movement;First heating component includes the first heating plate and is arranged in first heating plate
Back to the first thermal insulation board on the side of second heating component;Second heating component includes and described first heats
The second heating plate that plate is oppositely arranged and the side back to first heating component that second heating plate is set
Second thermal insulation board;First heating plate and the second heating plate respectively include the copper pipe of helical disk;The copper pipe also be used for
Apply the high frequency device connection that high-frequency ac loads to copper pipe;The lift induction heating apparatus further includes for detecting driving group
The pressure sensitive component for the lower pressure that part applies to mold and Thickness sensitivity component for detecting mold thickness;The pressure
Inductive component is arranged in second heating component.
Preferably, the lift induction heating apparatus further include for accommodate first heating component and second plus
The furnace chamber of hot component, the opposite sides of the furnace chamber are respectively arranged with progressive die mouth and out die orifice, the progressive die mouth and out die orifice
Side is also respectively provided with for promoting and the first former pushing mechanism and the second former pushing mechanism of ejection die.
Preferably, the Thickness sensitivity component includes the CCD component that progressive die mouth side is arranged in.
Preferably, the Thickness sensitivity component includes the ranging component being arranged in above the progressive die mouth.
Preferably, the lift induction heating apparatus further includes that setting is heat-insulated in first heating plate and described first
The first coldplate between plate, and the second coldplate being arranged between second heating plate and second thermal insulation board,
First coldplate is connected to cooling component respectively with the cooling line being arranged in the second coldplate.
Preferably, the cooling component is also connected to the copper pipe.
Preferably, the lift induction heating apparatus further includes being separately positioned on first thermal insulation board lower surface and institute
State the temperature sensor of the second thermal insulation board upper surface, and the infrared radiation thermometer being arranged in the furnace chamber.
The utility model also proposes a kind of glass bending molding machine, including above-mentioned lift induction heating apparatus;It is described
Lift induction heating apparatus including the first heating component, the second heating component of the relatively described first heating component setting, drives
Move the driving assembly that first heating component is moved towards or away from second heating component;The first heating component packet
It includes the first heating plate and the heat-insulated back to first on the side of second heating component of first heating plate is set
Plate;Second heating component includes the second heating plate being oppositely arranged with first heating plate and is arranged described second
Second thermal insulation board of the side back to first heating component of heating plate;First heating plate and the second heating plate difference
Copper pipe including helical disk;The copper pipe is also connect with for applying the high frequency device that high-frequency ac loads to copper pipe;The liter
Drop formula induction heating apparatus further includes the pressure sensitive component and use for detecting the lower pressure that driving assembly applies to mold
In the Thickness sensitivity component of detection mold thickness;The pressure sensitive component is arranged in second heating component.
The first heating plate and the second heating plate of copper pipe of the utility model by setting including helical disk, driving first
The driving assembly of heating plate movement, and Thickness sensitivity component and pressure sensitive component for detecting mold thickness, according to thickness
The lower pressure that the mold thickness and pressure sensitive component detection that degree detection components detect arrive, controls the first heating component (first
Heating plate) down stroke and lower pressure size, so that the present apparatus is suitable for the mold of different outer dimensions.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the utility model lift induction heating apparatus;
Fig. 2 is the structural schematic diagram of another embodiment of the utility model lift induction heating apparatus;
Fig. 3 is the structural schematic diagram of the utility model lift induction heating apparatus another embodiment.
Drawing reference numeral explanation:
Label | Title | Label | Title |
1 | Copper pipe | 10 | First heating component |
11 | First heating plate | 12 | First thermal insulation board |
13 | First coldplate | 20 | Second cooling component |
21 | Second heating plate | 22 | Second thermal insulation board |
23 | Second coldplate | 30 | Driving assembly |
40 | Furnace chamber | 41 | Progressive die mouth |
50 | Former pushing mechanism | 51 | Progressive die platform |
Specific embodiment
The embodiments of the present invention are described more fully below, the example of embodiment is shown in the accompanying drawings, wherein from beginning extremely
Last phase indicates identical element or element with the same function with label.Embodiment below with reference to attached drawing description is to show
Example property, it is intended to for explaining the utility model, and should not be understood as limiting the present invention, based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts,
It fall within the protection scope of the utility model.
In order to solve the above technical problems, the utility model proposes a kind of lift induction heating apparatuses, and referring to Fig.1, the liter
Drop formula induction heating apparatus includes the first heating component 10, the second heating component 20 of opposite first heating component 10 setting, drives
The driving assembly 30 that dynamic first heating component 10 is moved towards or away from the second heating component 20;First heating component 10 includes the
One heating plate 11 and be arranged in the first heating plate 11 back to the first thermal insulation board 12 on the side of the second heating component 20;The
Two heating components 20 include the second heating plate 21 being oppositely arranged with the first heating plate 11 and are arranged in the second heating plate 21
Back to the second thermal insulation board 22 of the side of the first heating component 10;First heating plate 11 and the second heating plate 21 respectively include spiral shell
The copper pipe 1 of capstan;Copper pipe 1 is also connect with for applying the high frequency device that high-frequency ac loads to copper pipe 1;Lift induction heating
Device further includes pressure sensitive component for detecting the lower pressure that driving assembly 30 applies to mold and for detecting mold
The Thickness sensitivity component of thickness;Pressure sensitive component is arranged in the second heating component 20.
In the present embodiment, the first heating plate 11 includes being provided with the ceramic wafer of spiral spacer on one side and being arranged in spiral
The copper pipe 1 of helical disk in interval, spiral spacer can prevent contacting with each other between copper pipe 1.The both ends of copper pipe 1 also with high frequency
Device connection, so that high frequency device applies cycling alternating load to copper pipe 1, to generate the alternating magnetic field of high frequency.First thermal insulation board 12 is preferably
The fluted ceramic wafer of upper and lower surface band to reduce the contact area between lower surface and the first heating plate 11, and then is reduced
The conduction of heat.The upper surface of first thermal insulation board 12 is connect with moving parts, the preferred lead screw of moving parts, is added to control first
The movement travel of hot component 10.And guide rod and guide sleeve are additionally provided between thermal insulation board and moving parts, prevent the first heating group
Part 10 rotates during the motion.Second heating component 20 is arranged in the lower section of the first heating component 10, and with the first heating group
Part 10 is parallel.Second heating plate 21 and the second thermal insulation board 22 the structure material with the first heating plate 11 and the first thermal insulation board 12 respectively
It is identical.Second heating plate 21 is oppositely arranged with the first heating plate 11, and the second thermal insulation board 22 is stacked in the first heating plate 11
Lower surface.Pressure sensitive component includes the pressure sensor that the lower surface of the second thermal insulation board 22 is arranged in.When the first heating component
10 from moving parts driving when being moved downward and applying pressure to the second heating component 20, pressure sensor and detects pressure
Variation.Thickness detection mechanism preferably uses CCD to module, can detect that into the first heating component 10 and the second heating component
The thickness of mold between 20.
The first heating plate 11 and the second heating plate 21 of copper pipe 1 of the utility model by setting including helical disk are driven
The driving assembly 30 of dynamic first heating plate 11 movement, and Thickness sensitivity component and pressure sensitive group for detecting mold thickness
Part, according to Thickness sensitivity component detection to mold thickness and the lower pressure that arrives of pressure sensitive component detection, the first heating of control
The down stroke of component 10 (the first heating plate 11) and the size of lower pressure, make the present apparatus be suitable for the mould of different outer dimensions
Tool.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, lift induction heating apparatus further includes for holding
Receive the furnace chamber 40 of the first heating component 10 and the second heating component 20, the opposite sides of furnace chamber 40 is respectively arranged with progressive die mouth 41
Die orifice out, the side of progressive die mouth 41 and out die orifice are also respectively provided with for promoting and the first former pushing mechanism 50 of ejection die
With the second former pushing mechanism 50.In the present embodiment, squarely is arranged in burner hearth, is internally provided with the heat-barrier materials such as asbestos, outside is set
It is equipped with thermal insulation material.Progressive die mouth 41 and out die orifice is respectively set in its opposite sides, die orifice is also set respectively in progressive die mouth 41 and out
It is equipped with the cylinder of a group and driving gate group switch.In the present embodiment, driving assembly 30 is arranged in roof of the furnace, progressive die mouth 41
The progressive die platform 51 and depanning platform contour with the second heating component 20 are also respectively provided at die orifice out.First former pushing mechanism
50 are arranged on progressive die platform 51, including horizontally disposed first cylinder of push rod, and what is connect with push rod push away tringle.Push away tringle
The inside of furnace chamber 40 is set and is arranged through furnace chamber 40, for promoting mold from progressive die mouth 41 and being released from die orifice out.The
Two former pushing mechanisms 50 are arranged in depanning platform, including horizontally disposed second cylinder, driving direction and the first cylinder and driving
The direction of motion of component 30 is vertical, for releasing the mold after depanning from side.Furthermore the side of burner hearth is additionally provided with observation
Window.Upper furnace keeps the temperature mold for accommodating the first heating component 10 and the second heating component 20, prevents dissipating for heat
It loses to reduce the consumption of energy, reaches energy-efficient effect.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, Thickness sensitivity component includes being arranged in progressive die mouth 41
The CCD component of side.In the present embodiment, CCD component includes the CCD camera being arranged on progressive die platform 51, can by figure to
Measuring technique detects the thickness of progressive die tool automatically, so that driving assembly 30 controls the stroke of the first heating component 10.To adapt to
The mold of different-thickness improves the ease of use of this lift induction heating apparatus.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, Thickness sensitivity component includes being arranged in progressive die mouth 41
The ranging component of top.Thickness sensitivity component includes the top detector that progressive die mouth 41 is arranged in this embodiment, herein preferably
Laser ranging head or ultrasonic distance measurement probe, detection direction is straight down.When progressive die platform 51 does not have mold, detector can
Detect the distance between progressive die platform 51, after mold enters progressive die platform 51, detector test to mould upper surface with
The range difference of the distance of progressive die platform 51, the two is the thickness of mold.This your utility model passes through in the upper of progressive die platform 51
Side's setting laser ranging head or ultrasonic distance measurement probe, can detect that the thickness of mold, so that the control of driving assembly 30 first adds
The stroke of hot component 10.To adapt to the mold of different-thickness, the ease of use of this lift induction heating apparatus is improved.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, lift induction heating apparatus further includes that setting exists
The first coldplate 13 between first heating plate 11 and the first thermal insulation board 12, and setting are heat-insulated in the second heating plate 21 and second
The cooling line being arranged in the second coldplate 23 between plate 22, the first coldplate 13 and the second coldplate 23 respectively with cooling group
Part connection.In the present embodiment, the first coldplate 13 and the second coldplate 23 include the steel plate for being internally provided with water route, length and width
It is consistent with the first heating plate 11 and the second heating plate 21 respectively, and it is separately positioned on the first heating plate 11 and the first thermal insulation board 12
Between and the second heating plate 21 and the second thermal insulation board 22 between.The internal watercourses of first coldplate 13 and the second coldplate 23
Also it is connect respectively with water cooling component.Water cooling component includes the cooling water pump for accelerating water route internal water circulation.In the present embodiment, lead to
It crosses between the first heating plate 11 and the first thermal insulation board 12 and is respectively set between the second heating plate 21 and the second thermal insulation board 22
The first coldplate 13 and the second coldplate 23 connecting with cooling component can reduce mold and conduct to the heat of driving assembly 30,
The thermal deformation for reducing driving assembly 30 in driving assembly 30 improves the motion accuracy and service life of driving assembly 30.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, cooling component is also connected to copper pipe 1.In this implementation
In example, the cooling pump of cooling component is also connect with copper pipe 1, since there are certain resistance for copper pipe 1, is applied load in copper pipe 1
When, certain heat can be issued.The fever that copper pipe 1 can be reduced by the way that copper pipe 1 to be connected to cooling component improves making for heating plate
With service life and intensity.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, lift induction heating apparatus further includes setting respectively
The temperature sensor in 22 upper surface of 12 lower surface of the first thermal insulation board and the second thermal insulation board is set, and is arranged in red in furnace chamber 40
Outer temperature measurer.In the present embodiment, the inside that furnace chamber 40 is arranged in infrared radiation thermometer is used to monitor the whole temperature inside furnace chamber 40
Degree.The preferred resistance temperature detector of temperature sensor, temperature sensor setting 12 lower surface of the first thermal insulation board and second every
22 upper surface of hot plate, can be due to the temperature of the top and bottom of detection mold, to adjust the first heating plate 11 and the second heating
The output power of plate 21 makes the temperature of workpiece upper and lower surface be consistent the internal stress for reducing workpiece in forming process.
The utility model also proposes a kind of glass bending molding machine, including above-mentioned lift induction heating apparatus;Lifting
Formula induction heating apparatus, including the first heating component 10, the second heating component 20 of opposite first heating component 10 setting, driving
The driving assembly 30 that first heating component 10 is moved towards or away from the second heating component 20;First heating component 10 includes first
Heating plate 11 and be arranged in the first heating plate 11 back to the first thermal insulation board 12 on the side of the second heating component 20;The
Two heating components 20 include the second heating plate 21 being oppositely arranged with the first heating plate 11 and are arranged in the second heating plate 21
Back to the second thermal insulation board 22 of the side of the first heating component 10;First heating plate 11 and the second heating plate 21 respectively include spiral
The copper pipe 1 of disk;Copper pipe 1 is also connect with for applying the high frequency device that high-frequency ac loads to copper pipe 1;Lift induction heating dress
Setting further includes pressure sensitive component for detecting the lower pressure that driving assembly 30 applies to mold and for detecting mold thickness
The Thickness sensitivity component of degree;Pressure sensitive component is arranged in the second heating component 20.
In the present embodiment, the first heating plate 11 includes being provided with the ceramic wafer of spiral spacer on one side and being arranged in spiral
The copper pipe 1 of helical disk in interval, spiral spacer can prevent contacting with each other between copper pipe 1.The both ends of copper pipe 1 also with high frequency
Device connection, so that high frequency device applies cycling alternating load to copper pipe 1, to generate the alternating magnetic field of high frequency.First thermal insulation board 12 is preferably
The fluted ceramic wafer of upper and lower surface band to reduce the contact area between lower surface and the first heating plate 11, and then is reduced
The conduction of heat.The upper surface of first thermal insulation board 12 is connect with moving parts, the preferred lead screw of moving parts, is added to control first
The movement travel of hot component 10.And guide rod and guide sleeve are additionally provided between thermal insulation board and moving parts, prevent the first heating group
Part 10 rotates during the motion.Second heating component 20 is arranged in the lower section of the first heating component 10, and with the first heating group
Part 10 is parallel.Second heating plate 21 and the second thermal insulation board 22 the structure material with the first heating plate 11 and the first thermal insulation board 12 respectively
It is identical.Second heating plate 21 is oppositely arranged with the first heating plate 11, and the second thermal insulation board 22 is stacked in the first heating plate 11
Lower surface.Pressure sensitive component includes the pressure sensor that the lower surface of the second thermal insulation board 22 is arranged in.When the first heating component
10 from moving parts driving when being moved downward and applying pressure to the second heating component 20, pressure sensor and detects pressure
Variation.Thickness detection mechanism preferably uses CCD to module, can detect that into the first heating component 10 and the second heating component
The thickness of mold between 20.
The first heating plate 11 and the second heating plate 21 of copper pipe 1 of the utility model by setting including helical disk are driven
The driving assembly 30 of dynamic first heating plate 11 movement, and Thickness sensitivity component and pressure sensitive group for detecting mold thickness
Part, according to Thickness sensitivity component detection to mold thickness and the lower pressure that arrives of pressure sensitive component detection, the first heating of control
The down stroke of component 10 (the first heating plate 11) and the size of lower pressure, make the present apparatus be suitable for the mould of different outer dimensions
Tool.
Furthermore multiple lift induction heating apparatuses side by side, mold can be set along disengaging mould direction inside furnace chamber 40
It circulates in lift induction heating apparatus and step-up temperature, cooling and stage is completed by lift induction heating apparatus
Mold down-pressing forming tool, to reduce the machining stress of inside workpiece, and improve the processing efficiency of workpiece.
Therefore above part for being only the utility model or preferred embodiment, either text or attached drawing cannot all limit
The range of the utility model protection processed is illustrated under all designs with one entirety of the utility model using the utility model
Equivalent structure transformation made by book and accompanying drawing content, or directly/be used in other related technical areas indirectly and be included in this
In the range of utility model protection.
Claims (8)
1. a kind of lift induction heating apparatus, which is characterized in that including the first heating component, relatively described first heating component
The driving group that the second heating component, driving first heating component being arranged are moved towards or away from second heating component
Part;
First heating component include the first heating plate and be arranged in first heating plate back to it is described second heating
The first thermal insulation board on the side of component;Second heating component includes that second be oppositely arranged with first heating plate adds
Hot plate and be arranged in second heating plate the side back to first heating component the second thermal insulation board;Described first
Heating plate and the second heating plate respectively include the copper pipe of helical disk;The copper pipe is also born with for applying high-frequency ac to copper pipe
The high frequency device of load connects;
The lift induction heating apparatus further includes the pressure sensitive for detecting the lower pressure that driving assembly applies to mold
Component and Thickness sensitivity component for detecting mold thickness;The pressure sensitive component is arranged in second heating component
On.
2. lift induction heating apparatus as described in claim 1, which is characterized in that further include adding for accommodating described first
The furnace chamber of hot component and the second heating component, the opposite sides of the furnace chamber is respectively arranged with progressive die mouth and out die orifice, described
The side of progressive die mouth and out die orifice is also respectively provided with for promoting and the first former pushing mechanism and the second module driving machine of ejection die
Structure.
3. lift induction heating apparatus as claimed in claim 2, which is characterized in that the Thickness sensitivity component includes setting
CCD component in progressive die mouth side.
4. lift induction heating apparatus as claimed in claim 2, which is characterized in that the Thickness sensitivity component includes setting
Ranging component above the progressive die mouth.
5. lift induction heating apparatus as described in claim 1, which is characterized in that further include setting in first heating
The first coldplate between plate and first thermal insulation board, and setting second heating plate and second thermal insulation board it
Between the second coldplate, the cooling line being arranged in first coldplate and the second coldplate is connected to cooling component respectively.
6. lift induction heating apparatus as claimed in claim 5, which is characterized in that the cooling component also with the copper pipe
Connection.
7. lift induction heating apparatus as claimed in claim 2, which is characterized in that further include being separately positioned on described first
The temperature sensor of thermal insulation board lower surface and second thermal insulation board upper surface, and the infrared measurement of temperature being arranged in the furnace chamber
Instrument.
8. a kind of glass bending molding machine, which is characterized in that including the lift sense as described in any one of claims 1 to 7
Answer heating device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820649443.7U CN208471885U (en) | 2018-05-02 | 2018-05-02 | Lift induction heating apparatus and glass bending molding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820649443.7U CN208471885U (en) | 2018-05-02 | 2018-05-02 | Lift induction heating apparatus and glass bending molding machine |
Publications (1)
Publication Number | Publication Date |
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CN208471885U true CN208471885U (en) | 2019-02-05 |
Family
ID=65220091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201820649443.7U Expired - Fee Related CN208471885U (en) | 2018-05-02 | 2018-05-02 | Lift induction heating apparatus and glass bending molding machine |
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CN (1) | CN208471885U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108516666A (en) * | 2018-05-02 | 2018-09-11 | 深圳市创世纪机械有限公司 | Lift induction heating apparatus |
CN110981169A (en) * | 2019-12-27 | 2020-04-10 | 苏州康柏思信息科技有限公司 | Processing device for 3D curved glass and using method thereof |
CN114275999A (en) * | 2022-02-17 | 2022-04-05 | 苏州众可为智能科技有限公司 | Electromagnetic heating temperature equalizing platform |
-
2018
- 2018-05-02 CN CN201820649443.7U patent/CN208471885U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108516666A (en) * | 2018-05-02 | 2018-09-11 | 深圳市创世纪机械有限公司 | Lift induction heating apparatus |
CN108516666B (en) * | 2018-05-02 | 2024-01-12 | 深圳市创世纪机械有限公司 | Lifting induction heating device |
CN110981169A (en) * | 2019-12-27 | 2020-04-10 | 苏州康柏思信息科技有限公司 | Processing device for 3D curved glass and using method thereof |
CN114275999A (en) * | 2022-02-17 | 2022-04-05 | 苏州众可为智能科技有限公司 | Electromagnetic heating temperature equalizing platform |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20190205 |