CN208471885U - Lift induction heating apparatus and glass bending molding machine - Google Patents

Lift induction heating apparatus and glass bending molding machine Download PDF

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Publication number
CN208471885U
CN208471885U CN201820649443.7U CN201820649443U CN208471885U CN 208471885 U CN208471885 U CN 208471885U CN 201820649443 U CN201820649443 U CN 201820649443U CN 208471885 U CN208471885 U CN 208471885U
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CN
China
Prior art keywords
component
heating
heating plate
thermal insulation
insulation board
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Expired - Fee Related
Application number
CN201820649443.7U
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Chinese (zh)
Inventor
夏军
罗育银
仝欣
陈作驰
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Shenzhen Create Century Machinery Co Ltd
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Shenzhen Create Century Machinery Co Ltd
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Priority to CN201820649443.7U priority Critical patent/CN208471885U/en
Application granted granted Critical
Publication of CN208471885U publication Critical patent/CN208471885U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of lift induction heating apparatus and glass bending molding machine, the lift induction heating apparatus, the driving assembly to move up and down including the first heating component, the second heating component and the first heating component of driving;First heating component includes the first heating plate and the first thermal insulation board being arranged in the first heating plate;Second heating component includes the second heating plate being oppositely arranged with the first heating plate and the second thermal insulation board being arranged in below the second heating plate;First heating plate and the second heating plate include the copper pipe plate of helical disk;Lift induction heating apparatus further includes the pressure sensitive component for detecting lower pressure and the Thickness sensitivity component for detecting mold thickness.The first heating plate and the second heating plate, Thickness sensitivity component and pressure sensitive component of copper pipe of the utility model by setting including helical disk, according to the size of the mold thickness detected and lower pressure, the down stroke and lower pressure for controlling the first heating component, make the present apparatus be suitable for the mold of different outer dimensions.

Description

Lift induction heating apparatus and glass bending molding machine
Technical field
The utility model relates to glass bending forming fields, and in particular to a kind of lift induction heating apparatus.
Background technique
Glass product applies in multiple industries such as building, electronics, communication, household, as a kind of translucent material due to glass Glass material has good thermoplasticity, and glass can be placed progress hot bending processing in a mold by way of hot bending, be moulded Cause the product of a variety of moulding.In the prior art, the mode of the general resistance-type heating of glass bending molding machine, but because of its heating Time, longer efficiency was lower, is slowly inductively heated technology and is replaced.In the prior art, induction copper band for heating is generally adopted With the tubular structure of stacking coiling, also need to be pushed into mold from bottom to top in tubular induction copper band in process, heating Process is relative complex, can not be compatible with the mold of other larger sizes.
Utility model content
The main purpose of the utility model is to propose a kind of lift induction heating apparatus, it is intended to it solves in the prior art, Existing induction heating apparatus can not be compatible with the problem of process requirements of the product of sizes.
To achieve the above object, the utility model proposes a kind of lift induction heating apparatus, including the first heating component, Second heating component of the relatively described first heating component setting drives first heating component towards or away from described second The driving assembly of heating component movement;First heating component includes the first heating plate and is arranged in first heating plate Back to the first thermal insulation board on the side of second heating component;Second heating component includes and described first heats The second heating plate that plate is oppositely arranged and the side back to first heating component that second heating plate is set Second thermal insulation board;First heating plate and the second heating plate respectively include the copper pipe of helical disk;The copper pipe also be used for Apply the high frequency device connection that high-frequency ac loads to copper pipe;The lift induction heating apparatus further includes for detecting driving group The pressure sensitive component for the lower pressure that part applies to mold and Thickness sensitivity component for detecting mold thickness;The pressure Inductive component is arranged in second heating component.
Preferably, the lift induction heating apparatus further include for accommodate first heating component and second plus The furnace chamber of hot component, the opposite sides of the furnace chamber are respectively arranged with progressive die mouth and out die orifice, the progressive die mouth and out die orifice Side is also respectively provided with for promoting and the first former pushing mechanism and the second former pushing mechanism of ejection die.
Preferably, the Thickness sensitivity component includes the CCD component that progressive die mouth side is arranged in.
Preferably, the Thickness sensitivity component includes the ranging component being arranged in above the progressive die mouth.
Preferably, the lift induction heating apparatus further includes that setting is heat-insulated in first heating plate and described first The first coldplate between plate, and the second coldplate being arranged between second heating plate and second thermal insulation board, First coldplate is connected to cooling component respectively with the cooling line being arranged in the second coldplate.
Preferably, the cooling component is also connected to the copper pipe.
Preferably, the lift induction heating apparatus further includes being separately positioned on first thermal insulation board lower surface and institute State the temperature sensor of the second thermal insulation board upper surface, and the infrared radiation thermometer being arranged in the furnace chamber.
The utility model also proposes a kind of glass bending molding machine, including above-mentioned lift induction heating apparatus;It is described Lift induction heating apparatus including the first heating component, the second heating component of the relatively described first heating component setting, drives Move the driving assembly that first heating component is moved towards or away from second heating component;The first heating component packet It includes the first heating plate and the heat-insulated back to first on the side of second heating component of first heating plate is set Plate;Second heating component includes the second heating plate being oppositely arranged with first heating plate and is arranged described second Second thermal insulation board of the side back to first heating component of heating plate;First heating plate and the second heating plate difference Copper pipe including helical disk;The copper pipe is also connect with for applying the high frequency device that high-frequency ac loads to copper pipe;The liter Drop formula induction heating apparatus further includes the pressure sensitive component and use for detecting the lower pressure that driving assembly applies to mold In the Thickness sensitivity component of detection mold thickness;The pressure sensitive component is arranged in second heating component.
The first heating plate and the second heating plate of copper pipe of the utility model by setting including helical disk, driving first The driving assembly of heating plate movement, and Thickness sensitivity component and pressure sensitive component for detecting mold thickness, according to thickness The lower pressure that the mold thickness and pressure sensitive component detection that degree detection components detect arrive, controls the first heating component (first Heating plate) down stroke and lower pressure size, so that the present apparatus is suitable for the mold of different outer dimensions.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the utility model lift induction heating apparatus;
Fig. 2 is the structural schematic diagram of another embodiment of the utility model lift induction heating apparatus;
Fig. 3 is the structural schematic diagram of the utility model lift induction heating apparatus another embodiment.
Drawing reference numeral explanation:
Label Title Label Title
1 Copper pipe 10 First heating component
11 First heating plate 12 First thermal insulation board
13 First coldplate 20 Second cooling component
21 Second heating plate 22 Second thermal insulation board
23 Second coldplate 30 Driving assembly
40 Furnace chamber 41 Progressive die mouth
50 Former pushing mechanism 51 Progressive die platform
Specific embodiment
The embodiments of the present invention are described more fully below, the example of embodiment is shown in the accompanying drawings, wherein from beginning extremely Last phase indicates identical element or element with the same function with label.Embodiment below with reference to attached drawing description is to show Example property, it is intended to for explaining the utility model, and should not be understood as limiting the present invention, based in the utility model Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, It fall within the protection scope of the utility model.
In order to solve the above technical problems, the utility model proposes a kind of lift induction heating apparatuses, and referring to Fig.1, the liter Drop formula induction heating apparatus includes the first heating component 10, the second heating component 20 of opposite first heating component 10 setting, drives The driving assembly 30 that dynamic first heating component 10 is moved towards or away from the second heating component 20;First heating component 10 includes the One heating plate 11 and be arranged in the first heating plate 11 back to the first thermal insulation board 12 on the side of the second heating component 20;The Two heating components 20 include the second heating plate 21 being oppositely arranged with the first heating plate 11 and are arranged in the second heating plate 21 Back to the second thermal insulation board 22 of the side of the first heating component 10;First heating plate 11 and the second heating plate 21 respectively include spiral shell The copper pipe 1 of capstan;Copper pipe 1 is also connect with for applying the high frequency device that high-frequency ac loads to copper pipe 1;Lift induction heating Device further includes pressure sensitive component for detecting the lower pressure that driving assembly 30 applies to mold and for detecting mold The Thickness sensitivity component of thickness;Pressure sensitive component is arranged in the second heating component 20.
In the present embodiment, the first heating plate 11 includes being provided with the ceramic wafer of spiral spacer on one side and being arranged in spiral The copper pipe 1 of helical disk in interval, spiral spacer can prevent contacting with each other between copper pipe 1.The both ends of copper pipe 1 also with high frequency Device connection, so that high frequency device applies cycling alternating load to copper pipe 1, to generate the alternating magnetic field of high frequency.First thermal insulation board 12 is preferably The fluted ceramic wafer of upper and lower surface band to reduce the contact area between lower surface and the first heating plate 11, and then is reduced The conduction of heat.The upper surface of first thermal insulation board 12 is connect with moving parts, the preferred lead screw of moving parts, is added to control first The movement travel of hot component 10.And guide rod and guide sleeve are additionally provided between thermal insulation board and moving parts, prevent the first heating group Part 10 rotates during the motion.Second heating component 20 is arranged in the lower section of the first heating component 10, and with the first heating group Part 10 is parallel.Second heating plate 21 and the second thermal insulation board 22 the structure material with the first heating plate 11 and the first thermal insulation board 12 respectively It is identical.Second heating plate 21 is oppositely arranged with the first heating plate 11, and the second thermal insulation board 22 is stacked in the first heating plate 11 Lower surface.Pressure sensitive component includes the pressure sensor that the lower surface of the second thermal insulation board 22 is arranged in.When the first heating component 10 from moving parts driving when being moved downward and applying pressure to the second heating component 20, pressure sensor and detects pressure Variation.Thickness detection mechanism preferably uses CCD to module, can detect that into the first heating component 10 and the second heating component The thickness of mold between 20.
The first heating plate 11 and the second heating plate 21 of copper pipe 1 of the utility model by setting including helical disk are driven The driving assembly 30 of dynamic first heating plate 11 movement, and Thickness sensitivity component and pressure sensitive group for detecting mold thickness Part, according to Thickness sensitivity component detection to mold thickness and the lower pressure that arrives of pressure sensitive component detection, the first heating of control The down stroke of component 10 (the first heating plate 11) and the size of lower pressure, make the present apparatus be suitable for the mould of different outer dimensions Tool.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, lift induction heating apparatus further includes for holding Receive the furnace chamber 40 of the first heating component 10 and the second heating component 20, the opposite sides of furnace chamber 40 is respectively arranged with progressive die mouth 41 Die orifice out, the side of progressive die mouth 41 and out die orifice are also respectively provided with for promoting and the first former pushing mechanism 50 of ejection die With the second former pushing mechanism 50.In the present embodiment, squarely is arranged in burner hearth, is internally provided with the heat-barrier materials such as asbestos, outside is set It is equipped with thermal insulation material.Progressive die mouth 41 and out die orifice is respectively set in its opposite sides, die orifice is also set respectively in progressive die mouth 41 and out It is equipped with the cylinder of a group and driving gate group switch.In the present embodiment, driving assembly 30 is arranged in roof of the furnace, progressive die mouth 41 The progressive die platform 51 and depanning platform contour with the second heating component 20 are also respectively provided at die orifice out.First former pushing mechanism 50 are arranged on progressive die platform 51, including horizontally disposed first cylinder of push rod, and what is connect with push rod push away tringle.Push away tringle The inside of furnace chamber 40 is set and is arranged through furnace chamber 40, for promoting mold from progressive die mouth 41 and being released from die orifice out.The Two former pushing mechanisms 50 are arranged in depanning platform, including horizontally disposed second cylinder, driving direction and the first cylinder and driving The direction of motion of component 30 is vertical, for releasing the mold after depanning from side.Furthermore the side of burner hearth is additionally provided with observation Window.Upper furnace keeps the temperature mold for accommodating the first heating component 10 and the second heating component 20, prevents dissipating for heat It loses to reduce the consumption of energy, reaches energy-efficient effect.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, Thickness sensitivity component includes being arranged in progressive die mouth 41 The CCD component of side.In the present embodiment, CCD component includes the CCD camera being arranged on progressive die platform 51, can by figure to Measuring technique detects the thickness of progressive die tool automatically, so that driving assembly 30 controls the stroke of the first heating component 10.To adapt to The mold of different-thickness improves the ease of use of this lift induction heating apparatus.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, Thickness sensitivity component includes being arranged in progressive die mouth 41 The ranging component of top.Thickness sensitivity component includes the top detector that progressive die mouth 41 is arranged in this embodiment, herein preferably Laser ranging head or ultrasonic distance measurement probe, detection direction is straight down.When progressive die platform 51 does not have mold, detector can Detect the distance between progressive die platform 51, after mold enters progressive die platform 51, detector test to mould upper surface with The range difference of the distance of progressive die platform 51, the two is the thickness of mold.This your utility model passes through in the upper of progressive die platform 51 Side's setting laser ranging head or ultrasonic distance measurement probe, can detect that the thickness of mold, so that the control of driving assembly 30 first adds The stroke of hot component 10.To adapt to the mold of different-thickness, the ease of use of this lift induction heating apparatus is improved.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, lift induction heating apparatus further includes that setting exists The first coldplate 13 between first heating plate 11 and the first thermal insulation board 12, and setting are heat-insulated in the second heating plate 21 and second The cooling line being arranged in the second coldplate 23 between plate 22, the first coldplate 13 and the second coldplate 23 respectively with cooling group Part connection.In the present embodiment, the first coldplate 13 and the second coldplate 23 include the steel plate for being internally provided with water route, length and width It is consistent with the first heating plate 11 and the second heating plate 21 respectively, and it is separately positioned on the first heating plate 11 and the first thermal insulation board 12 Between and the second heating plate 21 and the second thermal insulation board 22 between.The internal watercourses of first coldplate 13 and the second coldplate 23 Also it is connect respectively with water cooling component.Water cooling component includes the cooling water pump for accelerating water route internal water circulation.In the present embodiment, lead to It crosses between the first heating plate 11 and the first thermal insulation board 12 and is respectively set between the second heating plate 21 and the second thermal insulation board 22 The first coldplate 13 and the second coldplate 23 connecting with cooling component can reduce mold and conduct to the heat of driving assembly 30, The thermal deformation for reducing driving assembly 30 in driving assembly 30 improves the motion accuracy and service life of driving assembly 30.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, cooling component is also connected to copper pipe 1.In this implementation In example, the cooling pump of cooling component is also connect with copper pipe 1, since there are certain resistance for copper pipe 1, is applied load in copper pipe 1 When, certain heat can be issued.The fever that copper pipe 1 can be reduced by the way that copper pipe 1 to be connected to cooling component improves making for heating plate With service life and intensity.
In another embodiment of the utility model, referring to Fig. 2 and Fig. 3, lift induction heating apparatus further includes setting respectively The temperature sensor in 22 upper surface of 12 lower surface of the first thermal insulation board and the second thermal insulation board is set, and is arranged in red in furnace chamber 40 Outer temperature measurer.In the present embodiment, the inside that furnace chamber 40 is arranged in infrared radiation thermometer is used to monitor the whole temperature inside furnace chamber 40 Degree.The preferred resistance temperature detector of temperature sensor, temperature sensor setting 12 lower surface of the first thermal insulation board and second every 22 upper surface of hot plate, can be due to the temperature of the top and bottom of detection mold, to adjust the first heating plate 11 and the second heating The output power of plate 21 makes the temperature of workpiece upper and lower surface be consistent the internal stress for reducing workpiece in forming process.
The utility model also proposes a kind of glass bending molding machine, including above-mentioned lift induction heating apparatus;Lifting Formula induction heating apparatus, including the first heating component 10, the second heating component 20 of opposite first heating component 10 setting, driving The driving assembly 30 that first heating component 10 is moved towards or away from the second heating component 20;First heating component 10 includes first Heating plate 11 and be arranged in the first heating plate 11 back to the first thermal insulation board 12 on the side of the second heating component 20;The Two heating components 20 include the second heating plate 21 being oppositely arranged with the first heating plate 11 and are arranged in the second heating plate 21 Back to the second thermal insulation board 22 of the side of the first heating component 10;First heating plate 11 and the second heating plate 21 respectively include spiral The copper pipe 1 of disk;Copper pipe 1 is also connect with for applying the high frequency device that high-frequency ac loads to copper pipe 1;Lift induction heating dress Setting further includes pressure sensitive component for detecting the lower pressure that driving assembly 30 applies to mold and for detecting mold thickness The Thickness sensitivity component of degree;Pressure sensitive component is arranged in the second heating component 20.
In the present embodiment, the first heating plate 11 includes being provided with the ceramic wafer of spiral spacer on one side and being arranged in spiral The copper pipe 1 of helical disk in interval, spiral spacer can prevent contacting with each other between copper pipe 1.The both ends of copper pipe 1 also with high frequency Device connection, so that high frequency device applies cycling alternating load to copper pipe 1, to generate the alternating magnetic field of high frequency.First thermal insulation board 12 is preferably The fluted ceramic wafer of upper and lower surface band to reduce the contact area between lower surface and the first heating plate 11, and then is reduced The conduction of heat.The upper surface of first thermal insulation board 12 is connect with moving parts, the preferred lead screw of moving parts, is added to control first The movement travel of hot component 10.And guide rod and guide sleeve are additionally provided between thermal insulation board and moving parts, prevent the first heating group Part 10 rotates during the motion.Second heating component 20 is arranged in the lower section of the first heating component 10, and with the first heating group Part 10 is parallel.Second heating plate 21 and the second thermal insulation board 22 the structure material with the first heating plate 11 and the first thermal insulation board 12 respectively It is identical.Second heating plate 21 is oppositely arranged with the first heating plate 11, and the second thermal insulation board 22 is stacked in the first heating plate 11 Lower surface.Pressure sensitive component includes the pressure sensor that the lower surface of the second thermal insulation board 22 is arranged in.When the first heating component 10 from moving parts driving when being moved downward and applying pressure to the second heating component 20, pressure sensor and detects pressure Variation.Thickness detection mechanism preferably uses CCD to module, can detect that into the first heating component 10 and the second heating component The thickness of mold between 20.
The first heating plate 11 and the second heating plate 21 of copper pipe 1 of the utility model by setting including helical disk are driven The driving assembly 30 of dynamic first heating plate 11 movement, and Thickness sensitivity component and pressure sensitive group for detecting mold thickness Part, according to Thickness sensitivity component detection to mold thickness and the lower pressure that arrives of pressure sensitive component detection, the first heating of control The down stroke of component 10 (the first heating plate 11) and the size of lower pressure, make the present apparatus be suitable for the mould of different outer dimensions Tool.
Furthermore multiple lift induction heating apparatuses side by side, mold can be set along disengaging mould direction inside furnace chamber 40 It circulates in lift induction heating apparatus and step-up temperature, cooling and stage is completed by lift induction heating apparatus Mold down-pressing forming tool, to reduce the machining stress of inside workpiece, and improve the processing efficiency of workpiece.
Therefore above part for being only the utility model or preferred embodiment, either text or attached drawing cannot all limit The range of the utility model protection processed is illustrated under all designs with one entirety of the utility model using the utility model Equivalent structure transformation made by book and accompanying drawing content, or directly/be used in other related technical areas indirectly and be included in this In the range of utility model protection.

Claims (8)

1. a kind of lift induction heating apparatus, which is characterized in that including the first heating component, relatively described first heating component The driving group that the second heating component, driving first heating component being arranged are moved towards or away from second heating component Part;
First heating component include the first heating plate and be arranged in first heating plate back to it is described second heating The first thermal insulation board on the side of component;Second heating component includes that second be oppositely arranged with first heating plate adds Hot plate and be arranged in second heating plate the side back to first heating component the second thermal insulation board;Described first Heating plate and the second heating plate respectively include the copper pipe of helical disk;The copper pipe is also born with for applying high-frequency ac to copper pipe The high frequency device of load connects;
The lift induction heating apparatus further includes the pressure sensitive for detecting the lower pressure that driving assembly applies to mold Component and Thickness sensitivity component for detecting mold thickness;The pressure sensitive component is arranged in second heating component On.
2. lift induction heating apparatus as described in claim 1, which is characterized in that further include adding for accommodating described first The furnace chamber of hot component and the second heating component, the opposite sides of the furnace chamber is respectively arranged with progressive die mouth and out die orifice, described The side of progressive die mouth and out die orifice is also respectively provided with for promoting and the first former pushing mechanism and the second module driving machine of ejection die Structure.
3. lift induction heating apparatus as claimed in claim 2, which is characterized in that the Thickness sensitivity component includes setting CCD component in progressive die mouth side.
4. lift induction heating apparatus as claimed in claim 2, which is characterized in that the Thickness sensitivity component includes setting Ranging component above the progressive die mouth.
5. lift induction heating apparatus as described in claim 1, which is characterized in that further include setting in first heating The first coldplate between plate and first thermal insulation board, and setting second heating plate and second thermal insulation board it Between the second coldplate, the cooling line being arranged in first coldplate and the second coldplate is connected to cooling component respectively.
6. lift induction heating apparatus as claimed in claim 5, which is characterized in that the cooling component also with the copper pipe Connection.
7. lift induction heating apparatus as claimed in claim 2, which is characterized in that further include being separately positioned on described first The temperature sensor of thermal insulation board lower surface and second thermal insulation board upper surface, and the infrared measurement of temperature being arranged in the furnace chamber Instrument.
8. a kind of glass bending molding machine, which is characterized in that including the lift sense as described in any one of claims 1 to 7 Answer heating device.
CN201820649443.7U 2018-05-02 2018-05-02 Lift induction heating apparatus and glass bending molding machine Expired - Fee Related CN208471885U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820649443.7U CN208471885U (en) 2018-05-02 2018-05-02 Lift induction heating apparatus and glass bending molding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820649443.7U CN208471885U (en) 2018-05-02 2018-05-02 Lift induction heating apparatus and glass bending molding machine

Publications (1)

Publication Number Publication Date
CN208471885U true CN208471885U (en) 2019-02-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820649443.7U Expired - Fee Related CN208471885U (en) 2018-05-02 2018-05-02 Lift induction heating apparatus and glass bending molding machine

Country Status (1)

Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108516666A (en) * 2018-05-02 2018-09-11 深圳市创世纪机械有限公司 Lift induction heating apparatus
CN110981169A (en) * 2019-12-27 2020-04-10 苏州康柏思信息科技有限公司 Processing device for 3D curved glass and using method thereof
CN114275999A (en) * 2022-02-17 2022-04-05 苏州众可为智能科技有限公司 Electromagnetic heating temperature equalizing platform

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108516666A (en) * 2018-05-02 2018-09-11 深圳市创世纪机械有限公司 Lift induction heating apparatus
CN108516666B (en) * 2018-05-02 2024-01-12 深圳市创世纪机械有限公司 Lifting induction heating device
CN110981169A (en) * 2019-12-27 2020-04-10 苏州康柏思信息科技有限公司 Processing device for 3D curved glass and using method thereof
CN114275999A (en) * 2022-02-17 2022-04-05 苏州众可为智能科技有限公司 Electromagnetic heating temperature equalizing platform

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Granted publication date: 20190205