CN208452044U - The plastic package die of semiconductor integrated circuit - Google Patents
The plastic package die of semiconductor integrated circuit Download PDFInfo
- Publication number
- CN208452044U CN208452044U CN201820723105.3U CN201820723105U CN208452044U CN 208452044 U CN208452044 U CN 208452044U CN 201820723105 U CN201820723105 U CN 201820723105U CN 208452044 U CN208452044 U CN 208452044U
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- CN
- China
- Prior art keywords
- block
- ontology
- side bumper
- intermediate block
- integrated circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to a kind of plastic package die of semiconductor integrated circuit, including a rectangular block-shaped body, and the both sides block being detachably secured on ontology and an intermediate block, the side bumper block and the intermediate block are by pin and screw is dual is fixed on ontology；On the body, intermediate block is located among the block of both sides and side bumper block and centre block are equidistant, and workpiece to be processed is placed in the strip groove formed between side bumper block and centre block for the both sides block and intermediate block fixation parallel to each other.The plastic package die of the semiconductor integrated circuit of the utility model due to be it is split type, difficulty of processing is decomposed, and the labor intensity of processor is reduced, and reduces technical limitation.
Description
[technical field]
The utility model relates to semiconductor processing technology field more particularly to a kind of plastic sealed moulds of semiconductor integrated circuit
Tool.
[background technique]
Semiconducter IC integrated circuit is mainstay of the national economy product.It is quite extensive when the use of IC integrated circuit, it can be with
Say it is ubiquitous.Plastic package die therein, either traditional plastic package die or MGP plastic sealed mould or even automatic plastic sealed mould
Tool, the product produced all is that nowadays demand is very big.
But the plastic package die of semiconducter IC integrated antenna package, which is substantially, to have specific characteristics, and fabrication cycle is long, manufacture work
The deficiencies of skill is complicated, technology and the amount of labour are big has seriously affected the demand of production.In the manufacture of mold, (installation is solid for diaphragm capsule
The part of sizing chamber mold insert) it is a kernel component, all plastic package dies can all be used, and processing capacity is also very big, it is desirable that
Precision be also it is very high, the thickness deviation of bottom will be controlled less than 0.005mm, and flatness will also control within 0.005mm.This
A requirement brings very big difficulty to manufacturer, and simultaneous processing cost is also very high.
In view of the above deficiency, in order to can with high precision, low require, simply, easily manufacture semiconductor integrated circuit
Plastic package die (such as above-mentioned diaphragm capsule), it is necessary to a kind of plastic package die of completely new semiconductor integrated circuit is provided.
[utility model content]
For overcome existing semiconductor integrated circuit plastic package die problems, the utility model provides a kind of novel
The plastic package die of the semiconductor integrated circuit of structure.
The scheme that the utility model solves technical problem is to provide a kind of plastic package die of semiconductor integrated circuit, including one
Rectangular block-shaped body, and the both sides block being detachably secured on ontology and an intermediate block, the side bumper block and the centre
Block is by pin and screw is dual is fixed on ontology；The both sides block and intermediate block fixation parallel to each other on the body,
Intermediate block is located among both sides blocks and side bumper block and centre block are equidistant, and workpiece to be processed is placed on side bumper block
In the strip groove formed between intermediate block.
Preferably, ontology corresponds to side bumper block and the position of intermediate block is provided with multiple ontology pin holes and ontology screw
Hole, ontology pin hole and ontology screw hole are arranged in pairs, and array distribution is into strips.
Preferably, multiple side bumper block pin holes and multiple side bumper block screw holes, side bumper block pin are set on each side bumper block
Hole is also arranged in pairs with side bumper block screw hole, and into strips, position corresponds to the ontology pin hole and ontology screw on ontology for distribution
Hole.
Preferably, the side bumper block pin hole runs through side bumper block, and the side bumper block screw hole is penetrated from the lower part of side bumper block,
Not through side bumper block.
Preferably, multiple intermediate block pin holes and multiple intermediate block screw holes, intermediate block are set on intermediate block
Pin hole is also arranged in pairs with intermediate block screw hole, and into strips, position is corresponding to the ontology pin hole on ontology and originally for distribution
Body screw hole.
Preferably, intermediate block pin hole runs through intermediate block, and intermediate block screw hole is penetrated from the lower part of intermediate block,
Not through intermediate block.
Compared with prior art, the plastic package die of the semiconductor integrated circuit of the utility model is entirely split type structure,
Emptied in a bulk of raw material compared to the prior art it is intermediate be processed into the mode of part for, can be added using light sheet
Work saves raw material.Since ontology, side bumper block and intermediate block are substantially square profiles processing, exist compared to the prior art
Slotting in one block of material, it is many that the processing is simple.
The ontology of the utility model is a square plate, and processing easily, can guarantee that precision exists using general-purpose grinder
Within 0.002mm, the high-precision requirement in use is fully met.
Being connected and fixed using pin and screw between the side bumper block of the utility model, intermediate block and ontology, because being flat
Plate processing, so pin hole, screw hole machined are also simple and convenient.
On the whole, the plastic package die of the semiconductor integrated circuit of the utility model due to be it is split type, difficulty of processing obtains
To decomposition, the labor intensity of processor is reduced, reduces technical limitation, either master craftsman or new employee, it can be fine
Completion.
[Detailed description of the invention]
Fig. 1 is the plastic package die schematic perspective view of the utility model semiconductor integrated circuit；
Fig. 2 is the plastic package die exploded perspective schematic diagram of the utility model semiconductor integrated circuit；
Fig. 3 is the plastic package die usage state diagram of the utility model semiconductor integrated circuit.
[specific embodiment]
In order to make the purpose of this utility model, technical solution and advantage are more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to solve
The utility model is released, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can
To be directly to another element or may be simultaneously present centering elements.
It is only each other relatively it should also be noted that, the positional terms such as left and right, upper and lower in the utility model embodiment
Concept or be reference with the normal operating condition of product, and should not be regarded as restrictive.
Referring to Fig. 1, the plastic package die 10 of the semiconductor integrated circuit of the utility model includes a rectangular block-shaped body
101, and the both sides block 102 being detachably secured on ontology 101 and an intermediate block 103, the side bumper block 102 and it is described in
Between block 103 is by pin and screw is dual is fixed on ontology 101.
The both sides block 102 with it is intermediate block 103 is parallel to each other is fixed on ontology 101, intermediate block 103 is located at two
Among side bumper block 102 and side bumper block 102 and centre block 103 are equidistant.Workpiece to be processed be placed on side bumper block 102 with
In the strip groove 106 formed between intermediate block 103.Side bumper block 102 can be according to being placed in it at a distance from intermediate block 103
On the width of workpiece be adjusted.
Referring to Fig. 2, ontology 101 corresponds to side bumper block 102 and the position of intermediate block 103 is provided with multiple ontology pins
Hole 1011 and ontology screw hole 1012, ontology pin hole 1011 and ontology screw hole 1012 are arranged in pairs, and array distribution is into strips.
Specifically, every four pairs of ontology pin holes 1011 of setting and ontology screw hole 1012.
Four side bumper block pin holes 1021 and four side bumper block screw hole (not shown), side are set on each side bumper block 102
Block pin hole 1021 is also arranged in pairs with side bumper block screw hole, and into strips, position corresponds to the ontology pin on ontology 101 for distribution
Nail hole 1011 and ontology screw hole 1012.Wherein, side bumper block pin hole 1021 runs through side bumper block 102.For beauty, side bumper block spiral shell
Wire hole is penetrated from the lower part of side bumper block 102, but not through side bumper block 102.
Similarly, four intermediate block pin holes 1031 and four intermediate block screw hole (figures are set on intermediate block 103
Do not show), intermediate block pin hole 1031 is also arranged in pairs with intermediate block screw hole, and into strips, position corresponds to ontology for distribution
Ontology pin hole 1011 and ontology screw hole 1012 on 101.Wherein, intermediate block pin hole 1031 runs through intermediate block 103.
For beauty, intermediate block screw hole is penetrated from the lower part of intermediate block 103, but not through intermediate block 103.
Referring to Fig. 3, when in use, two side bumper blocks 102 and intermediate block 103 are first placed on flat ontology
On 101, when placement, ensures that all screw hole and pin hole site are corresponding.Then, all side bumper block pins are passed through with pin 104
Nail hole 1021 and intermediate block pin hole 1031 are inserted into ontology pin hole 1011, carry out preliminary precise positioning.Finally, using
Screw 105 is screwed into all side bumper block screw hole and intermediate block from the lower section of ontology 101 after ontology screw hole 1012
In screw hole, carries out screw-threaded coupling and fix, it is ensured that assembly is secured.But all screw holes are not through side bumper block 102 and middle apron
Block 103 and it is naked be exposed on the external, to guarantee external not showing screw hole, not reservation or revocation material in beautiful and use.
In this way, the plastic package die 10 of entire semiconductor integrated circuit is completed, it can be in side bumper block 102 and intermediate block
Workpiece to be processed 20 is placed in 103 strip groove 106.After use, side bumper block 102 and intermediate block can also be reversely dismantled
103 are repaired or replaced any accessory.
Compared with prior art, the plastic package die 10 of the semiconductor integrated circuit of the utility model is entirely split type knot
Structure, emptied in a bulk of raw material compared to the prior art it is intermediate be processed into the mode of part for, use light sheet
Raw material are saved in processing.Since ontology 101, side bumper block 102 and intermediate block 103 are substantially square profiles processing, compared to existing
There is in technology in a block of material fluting the processing is simple and is very much.
The ontology 101 of the utility model is a square plate, and processing easily, can guarantee precision using general-purpose grinder
Within 0.002mm, the high-precision requirement in use is fully met.
Being connected and fixed using pin 104 between the side bumper block 102 of the utility model, intermediate block 103 and ontology 101 and
Screw 105, because being plate processing, so pin hole, screw hole machined are also simple and convenient.
On the whole, the plastic package die 10 of the semiconductor integrated circuit of the utility model is due to being split type, difficulty of processing
It is decomposed, reduces the labor intensity of processor, reduce technical limitation, either master craftsman or new employee, it can be very
Good completion.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modification within the principle of utility model, equivalent replacement and improvement etc. should all include the protection scope of the utility model
Within.
Claims (6)
1. a kind of plastic package die of semiconductor integrated circuit, including a rectangular block-shaped body, and be detachably secured on ontology
Both sides block and an intermediate block, it is characterised in that: the side bumper block and the intermediate block are dual solid by pin and screw
It is scheduled on ontology；On the body, intermediate block is located among the block of both sides for the both sides block and the fixation parallel to each other of intermediate block
And side bumper block and intermediate block are equidistant, workpiece to be processed is placed on the bar shaped formed between side bumper block and intermediate block
In slot.
2. the plastic package die of semiconductor integrated circuit as described in claim 1, it is characterised in that: ontology correspond to side bumper block and
The position of intermediate block is provided with multiple ontology pin holes and ontology screw hole, and ontology pin hole and ontology screw hole are set in pairs
It sets, array distribution is into strips.
3. the plastic package die of semiconductor integrated circuit as claimed in claim 2, it is characterised in that: be arranged on each side bumper block more
A side bumper block pin hole and multiple side bumper block screw holes, side bumper block pin hole are also arranged in pairs with side bumper block screw hole, are scattered in
Strip, position correspond to the ontology pin hole and ontology screw hole on ontology.
4. the plastic package die of semiconductor integrated circuit as claimed in claim 3, it is characterised in that: the side bumper block pin hole passes through
Side bumper block is worn, the side bumper block screw hole is penetrated from the lower part of side bumper block, not through side bumper block.
5. the plastic package die of semiconductor integrated circuit as claimed in claim 2, it is characterised in that: be arranged on intermediate block multiple
Intermediate block pin hole and multiple intermediate block screw holes, intermediate block pin hole are also arranged in pairs with intermediate block screw hole,
Into strips, position corresponds to the ontology pin hole and ontology screw hole on ontology for distribution.
6. the plastic package die of semiconductor integrated circuit as claimed in claim 5, it is characterised in that: intermediate block pin hole runs through
Intermediate block, intermediate block screw hole is penetrated from the lower part of intermediate block, not through intermediate block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820723105.3U CN208452044U (en) | 2018-05-16 | 2018-05-16 | The plastic package die of semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820723105.3U CN208452044U (en) | 2018-05-16 | 2018-05-16 | The plastic package die of semiconductor integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208452044U true CN208452044U (en) | 2019-02-01 |
Family
ID=65151253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820723105.3U Active CN208452044U (en) | 2018-05-16 | 2018-05-16 | The plastic package die of semiconductor integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208452044U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115091552A (en) * | 2022-07-29 | 2022-09-23 | 昆山普尔菲精密模具有限公司 | Easy-to-machine label punching die |
-
2018
- 2018-05-16 CN CN201820723105.3U patent/CN208452044U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115091552A (en) * | 2022-07-29 | 2022-09-23 | 昆山普尔菲精密模具有限公司 | Easy-to-machine label punching die |
| CN115091552B (en) * | 2022-07-29 | 2024-02-09 | 昆山普尔菲精密模具有限公司 | Label punching die easy to process |
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| GR01 | Patent grant |