CN208445031U - Earphone base package assembly and electronic equipment - Google Patents

Abstract

A kind of earphone base package assembly, with circuit board assembly connection, earphone base package assembly includes earphone base, circuit board and sealing element, earphone base includes top surface and the side that connect with top surface angle, circuit board is bonded with side, and sealing element is set to the joint place of side and circuit board, and appears top surface.Earphone base package assembly provided by the present application achievees the purpose that seal waterproof and sealing element is arranged in the joint place of earphone base and circuit board, and, sealing element is only around in the side of earphone base, top surface or bottom surface without covering earphone base, to will not influence the thickness of earphone base package assembly, be conducive to the slimming of housing unit and electronic equipment.The application also provides a kind of electronic equipment.

Description

Earphone base package assembly and electronic equipment

Technical field

This application involves communication technique field more particularly to a kind of earphone base package assembly and electronic equipments.

Background technique

The electronic equipment for having earphone base on the market at present, since battery cover (bottom case) is much by 3D glass or composite plate Material 3D hot pressing is made into, and such structure of battery corer is simple, surfacing, can not make complicated structure, therefore be difficult to mate to The structure of earphone base carries out waterproof and dustproof design, therefore the dustproof and waterproof problems demand of earphone base solves.

Utility model content

Present applicant proposes a kind of earphone base package assembly and electronic equipments, to solve the above problems.

In a first aspect, the application provides a kind of earphone base package assembly, with circuit board assembly connection, earphone base package assembly Including earphone base, circuit board and sealing element, earphone base includes top surface and the side that connect with top surface angle, circuit board and side Fitting, sealing element is set to the joint place of side and circuit board, and appears top surface.

Second aspect, the application provide a kind of electronic equipment, including such as first aspect offer earphone base package assembly and Circuit board, earphone base package assembly and circuit board assembly connection.

Compared to the prior art, earphone base package assembly provided by the embodiments of the present application passes through in earphone base and circuit board Joint place setting sealing element and achieving the purpose that seals waterproof, also, sealing element is only around in the side of earphone base, without covering The top surface or bottom surface of lid earphone base are conducive to the slim of electronic equipment to will not influence the thickness of earphone base package assembly Change.

These aspects or other aspects of the application can more straightforward in the following description.

Detailed description of the invention

In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached Figure.

Fig. 1 is the schematic perspective view (assembled state) for the earphone base package assembly that the application first embodiment provides.

Fig. 2 is schematic perspective view (the unassembled shape for the earphone base package assembly that the application first embodiment provides State).

Fig. 3 is the schematic perspective view of the sealing element for the earphone base package assembly that the application second embodiment provides.

Fig. 4 is the front schematic view for the electronic equipment that the application 3rd embodiment provides.

Fig. 5 is the sectional perspective of the earphone base package assembly position for the electronic equipment that the application 3rd embodiment provides Structural schematic diagram.

Fig. 6 is the side view of sectional perspective structure shown in fig. 5.

Fig. 7 is the decomposition diagram of sectional perspective structure shown in fig. 5.

Specific embodiment

In order to make those skilled in the art more fully understand application scheme, below in conjunction in the embodiment of the present application Attached drawing, the technical scheme in the embodiment of the application is clearly and completely described.Obviously, described embodiment is only Some embodiments of the present application, instead of all the embodiments.Based on the embodiment in the application, those skilled in the art are not having Every other embodiment obtained under the premise of creative work is made, shall fall in the protection scope of this application.

First embodiment

Referring to Fig. 1, in some embodiments, earphone base package assembly 100 and 20 assembly connection of circuit board.

Circuit board 20 can be the circuit board of earphone base 10, be also possible to that the circuit of other elements here is just arranged Plate, such as mainboard etc..The size of circuit board 20 is unlimited, and size is only to illustrate in figure.

Referring to Fig. 2, circuit board 20 is equipped with mounting groove 21,20 medial surface of circuit board forms the cell wall 210 of mounting groove 21.Peace The internal diameter of tankage 21 and the outer diameter of earphone base 10 are equal, and earphone base 10 is mounted in mounting groove 21.

In the present embodiment, the mounting groove 21 of circuit board 20 encloses rectangular, for placing substantially rectangular parallelepiped structure Earphone base package assembly 100.

In other embodiments, the mounting groove of other shapes can be used with the earphone base group with correspondingly-shaped in circuit board 20 Assembling structure 100 matches.

Incorporated by reference to Fig. 1 and Fig. 2, earphone base package assembly 100 includes earphone base 10 and sealing element 30, and earphone base 10 includes Top surface 11 and the side 12 being connect with 11 angle of top surface.Circuit board 20 and side 12 are bonded, sealing element 30 be set to side 12 with 20 joint places of circuit board, and appear top surface 11.

Earphone base 10 includes main body 19 and the earphone jack 13 set on main body 19, and earphone base 10 has plug orientation and ear The central axes direction in machine transplanting of rice hole 13 is identical.

Top surface 11 is parallel with plug orientation, and the top for the earphone jack 13 being located in diagram.Earphone base 10 further includes bottom Face 14, bottom surface 14 and top surface 11 are away from each other, and are substantially parallel.

Earphone base 10 further includes aperture face 15, and aperture face 15 is located at one end of earphone base 10, and shape is unlimited, for opening up ear Machine transplanting of rice hole 13 and be arranged.

Side 12 is the surface for connecting top surface 11 and bottom surface 14, aperture face 15.Earphone jack 13 is set to side 12 and aperture Within the scope of the enclosing in face 15.Side 12 include the first binding face 121, the second binding face 122 and third binding face 123, first Binding face 121 connects top surface 11 and bottom surface 14, and the second binding face 122 is parallel with the first binding face 121 and mutually deviates from.Third patch Conjunction face 123 connects top surface 11 and bottom surface 14, and is also connected with the first binding face 121 and the second binding face 122.First binding face 121, the second binding face 122 and third binding face 123 are connect with 11 angle of top surface, in the present embodiment, angle connection Specific angle is 90 degree, and transition is realized by chamfering in junction.

The first binding face 121, the second binding face 122 of earphone base 10 are respectively formed with support portion 40.Support portion 40 can be with It is to extend out from the inside of earphone jack 13 across the first binding face 121, the second binding face 122, is also possible to direct shape At the first binding face 121, the second binding face 122 and formed.Support portion 40 is from the outwardly extending stretching side of the first binding face 121 To vertical with the first binding face 121.

The quantity of support portion 40 can be 1,2 or other numbers, and particular number can be according to the position of support portion 40 It sets and the first binding face 121, the area of the second binding face 122, length designs.The specific structure of support portion 40 can basis Its position and change.In the present embodiment, support portion 40 includes supporting surface 401, and supporting surface 401 is from the first binding face 121 Extend stretching direction and top surface 11 is substantially parallel.Supporting surface 401 and the first binding face 121 are vertical, can be placed in supporting surface It is in contact between 401 circuit board 20 and earphone base 10 with contact area as big as possible, is conducive to waterproof sealing.

Further, fastener 41 can also be set on support portion 40.In the present embodiment, fastener 41 in the form of sheets, The supporting surface 401 in self-supporting portion 40 extends to 11 direction of top surface.The length of extension and the thickness of circuit board 20 are essentially identical.Engaging The quantity of part 41 can be 1,2 or other numbers.In other embodiments, fastener 41 is also possible to be provided with branch Through slot, counterbore on support part 40 etc., for cooperating with circuit board 20.

Circuit board 20 further includes holding section 22, and holding section 22 is used for and fastener 41 cooperates, more firmly will Circuit board 20 and earphone base 10 are cooperated.In the present embodiment, holding section 22 is through first surface 201 and second surface 202 through slot can be matched with fastener 41, and fastener 41 passes through holding section 22, realize the detent to circuit board 20.At it In his embodiment, the structure of holding section 22 is also possible to other forms, as long as can be with 41 shape of fastener on earphone base 10 At matching relationship.

After circuit board 20 and the connection of earphone base 10 and fitting, the cell wall 210 of mounting groove 21 and side 12 are bonded.

Sealing element 30 is arranged around side 12, avoids aperture face 15, and is located at side 12 and the circuit board 20 of earphone base 10 Joint place so that between earphone base 10 and circuit board 20 formed water proof and dust proof liquid-proof sealing matching relationship.

As long as the joint place of side 12 and circuit board 20 can be arranged in sealing element 30.Sealing element 30 and 11 nothing of top surface Fitting, package relationship, so that top surface 11 reveals, it is possible to reduce the thickness at 11 top surface 11 of earphone base is conducive to produce The slimming of product develops.

Sealing element 30 can be made of flexible water material, such as silica gel, can also have sealing waterproof using other The material of performance.The shape of sealing element 30 can be essentially identical with the shape of earphone base 10.

Sealing element 30 includes medial surface 31, circuit board binding face 32 and top end surface 33, and each surface has corresponding Bonding position, to realize sealing waterproof.Medial surface 31 fits in the side 12 of earphone base 10.

Circuit board binding face 32 and medial surface 31 vertically connect, for being bonded circuit board 20.Specifically, circuit board 20 includes The second surface 202 that the first surface 201 and first surface 201 of bearer circuit are away from each other, and connection 201 He of first surface The joint face 204 of second surface 202.The first surface 201 of circuit board binding face 32 and circuit board 20, second surface 202 are affixed It closes.It is upper and lower two that circuit board binding face 32, which is divided to, respectively from the top of circuit board 20 and the fitting of first surface 201 and from circuit The lower section of plate 20 and second surface 202 are bonded.

Top end surface 33 is concordant with the top surface 11 of earphone base 10, i.e. the height of sealing element 30 does not exceed the height of top surface 11 Degree so that the region to top surface 11 will not be closed, and is located at same level, the cooperation of convenient and other structures with top surface 11.

Specifically, the substantially step surface of top end surface 33, including first end face 331 and second end face 332, first end face There is height fall between 331 and second end face 332, forms step surface.From the point of view of visual angle in figure, second end face 332 is lower than first End face 331.Wherein, the height of first end face 331 is concordant with the height of top surface 11, and first end face 331 is close to top surface 11, and second End face 332 is farther out from top surface 11.

Second end face 332 is equipped with waterproof rib position 3321, and waterproof rib position 3321 is moved towards along the shape of sealing element 30 and is arranged, Waterproof rib position 3321 is formed by the protrusion of surface of second end face 332.The item number of waterproof rib position 3321 is unlimited, such as can be 1 Item, 2,3 etc., depending on the width of top end surface 33.Multi layer waterproof rib position 3321 is spaced apart from each other, and plays multi layer waterproof function Can, it can projection-depression-projection-depression configuration in this way and further decrease liquid, dust enters earphone base group Probability inside assembling structure 100.

Similarly, sealing element 30 further includes bottom end face 34, and bottom end face 34 is concordant with the bottom surface 14 of earphone base 10, thus The region to bottom surface 14 will not be closed, and is located at same level, the cooperation of convenient and other structures with bottom surface 14.

Similarly, waterproof rib position can also be arranged as top end surface 33 in bottom end face 34, and illustrating, which can be found in, prevents The description of water rib position 3321, details are not described herein again.

Sealing element 30 is arranged in after the junction of circuit board 20 and earphone base 10, and sealing element 30 is fitted in earphone base 10 Side 12, circuit board 20 first surface 201 and second surface 202.

In the present embodiment, sealing element 30 includes the first sealing strip 37 and the second sealing strip 38 being oppositely arranged.First is close The structure of strip of paper used for sealing 37 and the second sealing strip 38 is essentially identical, and the two sides of circuit board 20 are symmetrically disposed in about circuit board 20, point It is not bonded from the two sides up and down of circuit board 20 with circuit board 20 and side 12.

First sealing strip 37 is compared with the second sealing strip 38 closer to top surface 11, and the first sealing strip 37 fits in circuit board 20 First surface 201 and side 12.Specifically, the medial surface 31 of the first sealing strip 37 is pasted along the first binding face 121, third The sequence of conjunction face 123 and the second binding face 122 is arranged around side 12, the shape of enclosing and the profile phase of earphone base 10 Together.Meanwhile first sealing strip 37 circuit binding face 32 be fitted in circuit board 20 first surface 201 be arranged.First sealing strip 37 avoid aperture face 15 and earphone base jack 13, top surface 11 and bottom surface 14.

Second sealing strip 38 is compared with the first sealing strip 37 closer to bottom surface 14, and the second sealing strip 38 fits in circuit board 20 Second surface 202 and side 12.

Second sealing strip 38 pastes as the first sealing strip 38, and along the first binding face 121 of earphone base 10, third The sequence of conjunction face 123 and the second binding face 122 is arranged around side 12, the shape of enclosing and the profile phase of earphone base 10 Together, and aperture face 15 and earphone base jack 13, top surface 11 and bottom surface 14 are avoided.

First seal 37 and second seal 38 can be independent from each other two parts, be also possible to be connected to one Structure.For example, sealing element 30 can also include interconnecting piece 39, interconnecting piece 39 is located at the entrance side of plug orientation, is located at aperture 15 side of face for connecting first seal 37 and second seal 38, while also acting as fitting and wrapping up the company of circuit board 20 The effect of junction 204 improves the waterproof seal of joint face 204 and other structures junction.

To sum up, earphone base package assembly 100 provided in this embodiment passes through in the joint place of earphone base 10 and circuit board 20 Setting sealing element 30 and achieving the purpose that seals waterproof, also, sealing element 30 is only around in the side of earphone base 10 12, without The top surface 11 or bottom surface 14 of covering earphone base 10 are conducive to product to will not influence the thickness of earphone base package assembly 100 Slimming.

Second embodiment

Referring to Fig. 3, earphone base package assembly provided in this embodiment uses another sealing element 30a, sealing element 30a Top end surface 33a wider, not set multi layer waterproof rib position.

In other embodiments, further, bottom end face 34a can be identical with the structure of top end surface 33a, does not set Set multi layer waterproof rib position.

To sum up, in the present embodiment, top end surface 33a is flat, can tie later with other in being assembled to housing unit Structure is bonded completely, to realize the waterproof sealing effect of multiple junctions.

3rd embodiment

Fig. 4 to fig. 6 is please referred to, electronic equipment 300 provided in this embodiment includes the earphone base provided such as first embodiment Package assembly 100 and circuit board 20.

Electronic equipment 300 further includes housing unit 200, and housing unit 200 includes the first shells 51 and the second shells 61.Ear Base package assembly 100 and circuit board 20 are installed on together on housing unit 200.Housing unit 200 is further and other structures (such as display screen unit, camera module, sensor module etc.) has collectively constituted electronic equipment 300.

First shells 51 includes frame 510 and lid 511, and frame 510 is connected with 511 angle of lid, such as the two is 90 Angle connection is spent, and uses arc transition.Frame 510 can be bottom frame when electronic equipment is uprightly placed, top frame, Side frame etc..

Frame 510 includes aperture 5101,13 aligned fit of earphone jack of aperture 5101 and earphone base 10, the use of lid 511 In covering top surface 11.

Sealing element 30 is around earphone base 10, and to increase waterproof seal, sealing element 30 includes top end surface 33, lid 511 at least will directly be bonded with top end surface 33 to realize waterproof sealing.

Further, lid 511 is also directly bonded with the fitting or part completely of top surface 11.Fitting refers to lid completely 511 fit in top surface 11 completely, and part fitting refers to that lid 511 and a part of top surface 11 are bonded.This depends on the table of lid 511 Surface construction.

Further, earphone base package assembly 200 further includes the second shells 61, and the second shells 61 and the first shells 51 are mutually Earphone base package assembly 200 is mounted between the first shells 51 and the second shells 61 by cooperation.

Referring to Fig. 7, the second shells 61 includes loading plate 611 and protrusion 612, protrusion 612 and loading plate 611 are vertical Connection, after assembling, loading plate 611 and lid 511 is substantially parallel and top surface 11 is also substantially parallel, to be firmly installed Earphone base package assembly 100.

Protrusion 612 include two protrusions 6120, about jack rest area 610 central axes be symmetrical arranged, spacing with The width in the aperture face 15 of earphone base 10 is equal, and earphone base 10 is clamped between two protrusions 6120.

The position of jack rest area 610 is corresponding with earphone jack 13, is formed with first in the two sides of jack rest area 610 and holds The bottom end face 34 of section 6111, the first loading end 6111 and sealing element 30 is bonded completely, to realize the second shells 61 and close Waterproof sealing between sealing 30.

Further, the second loading end 6112, the second loading end 6112 are also formed in the inside of the first loading end 6111 It can be bonded with 14 part of bottom surface of earphone base 10 or be bonded completely, this depends on the size of the second loading end 6112.

To sum up, electronic equipment 300 provided in this embodiment includes the first shells 51, and the first shells 51 and sealing element 30 are complete Fitting, so that realizing waterproof sealing between the first shells 51 and earphone base package assembly 100.In this way, passing through the (sealing of a material Part 30) inside of earphone base package assembly 100, earphone base package assembly 100 and other structures (such as the first shells can be realized 51) waterproof sealing between will not influence the thickness of earphone base package assembly 100 moreover, 30 sealing structure materials of sealing element are less Degree, will not influence the thickness of electronic equipment 300.

It further, is also in this way, sealing element 30 can be realized simultaneously earphone base package assembly 100 for the second shells 61 Waterproof sealing between two structures (such as the first shells 51 and second shells 61).

In the present embodiment, electronic equipment can be the various handheld devices such as tablet computer.As used herein " communication terminal " (or referred to as " terminal ") include, but are not limited to be configured to connect via Wireline (such as via public friendship Change telephone network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection and/or another data connection/ Network) and/or via (for example, being directed to the digital tv network of cellular network, WLAN (WLAN), such as DVB-H network Network, satellite network, AM-FM broadcasting transmitter and/or another communication terminal) wireless interface receives/send signal of communication Device.Be configured to can be referred to as by the communication terminal of radio interface communication " wireless communication terminal ", " wireless terminal " with And/or " electronic equipment ".The example of electronic equipment includes, but are not limited to satellite or cellular phone；It can be with combination cellular radio PCS Personal Communications System (PCS) terminal of phone and data processing, fax and communication ability；It may include radio electricity Words, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or global positioning system (GPS) receive The PDA of device；And conventional laptop and/or palmtop receiver or other electronic devices including radiotelephone transceiver.

The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously The limitation to the application the scope of the patents therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art For, without departing from the concept of this application, various modifications and improvements can be made, these belong to the guarantor of the application Protect range.Therefore, the scope of protection shall be subject to the appended claims for the application patent.

Claims (14)

1. a kind of earphone base package assembly, with circuit board assembly connection, which is characterized in that the earphone base package assembly includes ear Base and sealing element, the earphone base include top surface and the side that connect with the top surface angle, the circuit board with it is described Side fitting, the sealing element is set to the joint place of the side Yu the circuit board, and appears the top surface.

2. earphone base package assembly as described in claim 1, which is characterized in that the sealing element includes top end surface, described Top end surface and the either flush.

3. earphone base package assembly as claimed in claim 2, which is characterized in that the top end surface includes first end face and Biend, the first end face and the either flush, the second end face and the first end face form step surface, and described the Biend is additionally provided with waterproof rib position.

4. earphone base package assembly as described in claim 1, which is characterized in that the earphone base includes bottom surface, the bottom surface It is away from each other with the top surface, the sealing element also appears the bottom surface.

5. earphone base package assembly as claimed in claim 4, which is characterized in that the sealing element includes bottom end face, described Bottom end face is concordant with the bottom surface.

6. earphone base package assembly as described in claim 1, which is characterized in that the earphone base includes aperture face and is opened in The earphone jack in the aperture face, the side are connect with the aperture face, the earphone jack be set to the side with it is described Within the scope of the enclosing in aperture face, the sealing element is arranged around the side, and avoids the aperture face.

7. earphone base package assembly as claimed in claim 6, which is characterized in that the side includes the first patch being disposed opposite to each other Conjunction face and the second binding face, and the third binding face of connection first binding face and second binding face, the aperture Face and the third binding face are located at the both ends in the headset plugging direction of the earphone base；The sealing element is around first patch Conjunction face, second binding face and third binding face setting.

8. earphone base package assembly as described in claim 1, which is characterized in that the sealing element includes the relatively described circuit board Symmetrically arranged first sealing strip and the second sealing strip, first sealing strip and second sealing strip are respectively from the circuit The two sides of plate are bonded with the circuit board and the side.

9. earphone base package assembly as claimed in claim 8, which is characterized in that the sealing element further includes interconnecting piece, described Interconnecting piece connects first sealing strip and second sealing strip.

10. a kind of electronic equipment, which is characterized in that including earphone base package assembly as described in any one of claims 1 to 9 and Circuit board, the earphone base package assembly and the circuit board assembly connection.

11. electronic equipment as claimed in claim 10, which is characterized in that the electronic equipment further includes the first shells, described Sealing element includes top end surface, and first shells is bonded completely with the top end surface.

12. electronic equipment as claimed in claim 11, which is characterized in that first shells is also and described in the earphone base Top surface is bonded completely or part is bonded.

13. electronic equipment as claimed in claim 11, which is characterized in that the electronic equipment further includes the second shells, described Sealing element further includes bottom end face, and the bottom end face and the top end surface are located at the opposite two sides of the earphone base, Second shells is bonded completely with the bottom end face.

14. electronic equipment as claimed in claim 13, which is characterized in that the earphone base further includes bottom surface, the bottom surface with The top surface is away from each other, and second shells is also bonded with the bottom surface completely or part is bonded.