CN208438157U - It is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system - Google Patents
It is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system Download PDFInfo
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- CN208438157U CN208438157U CN201820754826.0U CN201820754826U CN208438157U CN 208438157 U CN208438157 U CN 208438157U CN 201820754826 U CN201820754826 U CN 201820754826U CN 208438157 U CN208438157 U CN 208438157U
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- semiconductor devices
- manufacturing semiconductor
- reducing manufacturing
- polishing system
- wafer polishing
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Abstract
The wafer polishing system of defect when the utility model discloses a kind of for reducing manufacturing semiconductor devices, its structure includes polishing grinding pan, preheating device, hydraulic cylinder, display screen, the top of polishing grinding pan is equipped with preheating device, preheating device has included hot device, heat-conductive plate, current collector, spring, iron block, electromagnet, catheter, controller, temperature detector, the lower section for playing hot device is equipped with heat-conductive plate, the utility model it is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system, structure is equipped with preheating device, shell is driven to move down by telescopic rod by hydraulic cylinder, allow heat-conductive plate and contact wafers, it is powered by controller by electromagnet and iron block is moved to the left absorption, current collector, which is moved to the left to be followed by being powered, has allowed hot device to start to generate heat, passing through temperature detector temperature sensor and having adjusted hot device final temperature ensures that chip is two-sided Temperature difference it is small, it is big and be easy damaged situation to avoid the two-sided temperature difference of chip.
Description
Technical field
The utility model be it is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system, belong to chip system
Make technical field.
Background technique
It is more and more harsher to the machining accuracy and surface quality requirements of semiconductor wafer in the production of semiconductor wafer,
In semiconductor wafer after polishing, surface can retain the particles such as the particle that abrasive dust and grinding wheel fall off, and only pass through deionized water
It rinses and the method for dry air drying can not be removed all, this will form multiple in subsequent polishing process at particle
It reflects, seriously affects wafer surface quality, during grinding wafer, porous ceramics sucker utilizes vacuum suction chip, thereon
As wafer orientation face, surface shape directly influences the shape after grinding wafer on surface.
Prior art discloses lack when application No. is: 201220564271.6 one kind for reducing manufacturing semiconductor devices
Sunken wafer polishing system, comprising: polishing block, polishing pad, the rubbing head that can be moved up and down, throwing that can be moved up and down
Photo etching supply part, apparatus for cleansing semiconductor wafer；Polishing pad is tightly attached to polishing block upper surface；Rubbing head is set on polishing pad
Side, to keep polishing target；Polishing agent supply part is set to the top of polishing pad and is located at the side of rubbing head；Semiconductor die
Piece cleaning device is set to the side of polishing block, is used for cleaning polishing target；Apparatus for cleansing semiconductor wafer includes rinse bath, cleaning
Cleaning agent injecting-unit is equipped in slot；Apparatus for cleansing semiconductor wafer further includes cleaning agent supply part, cleaning agent supply part
It is communicated with cleaning agent injecting-unit, but the prior art chip carries out being easy to produce hot temperature when polishing grinding, since chip is double
The case where temperature difference in face is big, and chip is caused to be easily damaged.
Utility model content
In view of the deficienciess of the prior art, the utility model aim is to provide one kind for reducing manufacturing semiconductor devices
When defect wafer polishing system, to solve to be easy to produce hot temperature when existing chip carries out polishing grinding, since chip is two-sided
The problem of the case where temperature difference is big, and chip is caused to be easily damaged.
To achieve the goals above, the utility model is achieved through the following technical solutions: it is a kind of for reducing system
The wafer polishing system of defect when manufacturing semiconductor device, structure includes polishing grinding pan, support rod, preheating device, telescopic rod, cold
But pipe, coolant liquid switch valve, hydraulic cylinder, display screen, scram button, operator, support frame, cabinet, maintenance door, foot prop, it is described
The top of polishing grinding pan is equipped with preheating device, and the upper surface insertion of the telescopic rod is installed on the lower surface of hydraulic cylinder, the throwing
Tarry matter disk is installed on the upper surface of cabinet, and the coolant liquid switch valve is located at the upper left side of support rod, the maintenance door insertion peace
Front end face loaded on cabinet, the lower surface of the cabinet are mutually welded with the upper surface of foot prop, and the insertion of support frame as described above is installed on
The front end face of the lower surface of operator, the operator is equipped with display screen, and the scram button is installed on the lower right of display screen,
The preheating device has included hot device, heat-conductive plate, movable plate, current collector, spring, iron block, electromagnet, shell, catheter, control
The lower section of device processed, temperature detector, micro pump, liquid case, described hot device is equipped with heat-conductive plate, the left side of the movable plate and iron block
Right side mutually weld, the left side of the movable plate is equipped with current collector, and the current collector is located at the lower section of spring, described
Iron block is installed on the right of electromagnet, and the electromagnet is electrically connected with the controller, and the inside of the shell is equipped with catheter, described
The left side insertion of temperature detector has been installed on the right side of hot device, and the upper surface of the liquid case is equipped with micro pump, described miniature
Water pump is electrically connected with the controller, and the catheter insertion is installed on the left side of liquid case.
Further, the support rod is parallel with hydraulic cylinder.
Further, the cooling tube is installed on the right of support rod.
Further, the perpendicular welding in the upper surface of the shell and the lower surface of telescopic rod.
Further, the support rod is cylindrical structure.
Further, the support rod uses steel alloy, pressure resistance.
Further, the maintenance door uses stainless steel, anti-to get rusty.
Beneficial effect
The utility model it is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system, structure is equipped with pre-
Thermal drives shell to move down, heat-conductive plate and contact wafers is allowed, by controller by electromagnetism by hydraulic cylinder by telescopic rod
Iron block is moved to the left absorption by Tie Tong electricity, and current collector, which is moved to the left to be followed by being powered, has allowed hot device to start to generate heat, and passes through temperature detector
Temperature sensor has simultaneously adjusted hot device final temperature and ensures that the two-sided temperature difference of chip is small, and it is big and be easy to avoid the two-sided temperature difference of chip
Damaged situation.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon:
Fig. 1 be the utility model it is a kind of for reducing manufacturing semiconductor devices when defect the structure of wafer polishing system show
It is intended to；
Fig. 2 is a kind of the schematic diagram of the section structure of preheating device of the utility model.
In figure: polishing grinding pan -1, support rod -2, preheating device -3, telescopic rod -4, cooling tube -5, coolant liquid switch valve -6,
Hydraulic cylinder -7, scram button -9, operator -10, support frame -11, cabinet -12, maintenance door -13, foot prop -14, rises display screen -8
It is hot device -301, heat-conductive plate -302, movable plate -303, current collector -304, spring -305, iron block -306, electromagnet -307, outer
Shell -308, catheter -309, controller -310, temperature detector -311, micro pump -312, liquid case -313.
Specific embodiment
To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below
In conjunction with specific embodiment, the utility model is further described.
Please refer to Fig. 1, Fig. 2, the utility model provide it is a kind of for reducing manufacturing semiconductor devices when defect chip throw
Photosystem technical solution: its structure includes that polishing grinding pan 1, support rod 2, preheating device 3, telescopic rod 4, cooling tube 5, coolant liquid are opened
Valve 6, hydraulic cylinder 7, display screen 8, scram button 9, operator 10, support frame 11, cabinet 12, maintenance door 13, foot prop 14 are closed, it is described
The top of polishing grinding pan 1 is equipped with preheating device 3, and the upper surface insertion of the telescopic rod 4 is installed on the lower surface of hydraulic cylinder 7, institute
The upper surface that polishing grinding pan 1 is installed on cabinet 12 is stated, the coolant liquid switch valve 6 is located at the upper left side of support rod 2, the maintenance
13 insertion of door is installed on the front end face of cabinet 12, and the lower surface of the cabinet 12 is mutually welded with the upper surface of foot prop 14, the branch
The insertion of support 11 is installed on the lower surface of operator 10, and the front end face of the operator 10 is equipped with display screen 8, and the emergency stop is pressed
Button 9 is installed on the lower right of display screen 8, and the preheating device 3 has included hot device 301, heat-conductive plate 302, movable plate 303, movement
It is contact 304, spring 305, iron block 306, electromagnet 307, shell 308, catheter 309, controller 310, temperature detector 311, miniature
The lower section of water pump 312, liquid case 313, described hot device 301 is equipped with heat-conductive plate 302, the left side of the movable plate 303 and iron block
306 right side is mutually welded, and the left side of the movable plate 303 is equipped with current collector 304, and the current collector 304 is located at bullet
The lower section of spring 305, the iron block 306 are installed on the right of electromagnet 307, and the electromagnet 307 is electrically connected with controller 310,
The inside of the shell 308 is equipped with catheter 309, and the left side insertion of the temperature detector 311 has been installed on the right end of hot device 301
The upper surface in face, the liquid case 313 is equipped with micro pump 312, and the micro pump 312 is electrically connected with controller 310, described to lead
Liquid pipe 309 is embedded in the left side for being installed on liquid case 313, and the support rod 2 is parallel with hydraulic cylinder 7, and the cooling tube 5 is installed on
The right of support rod 2, the upper surface of the shell 308 and the perpendicular welding in lower surface of telescopic rod 4, the support rod 2 are circle
Column structure, the support rod 2 use steel alloy, pressure resistance, and the maintenance door 13 uses stainless steel, anti-to get rusty.
Hydraulic cylinder 7 described in this patent is that hydraulic energy is changed into mechanical energy, does straight reciprocating motion or pendulum motion
Hydraulic actuator, spring 305 be it is a kind of utilize elasticity come work machine components.
Carry out using when allow telescopic rod 4 that shell 308 is driven to move down by hydraulic cylinder 7, allow heat-conductive plate 302 and chip
Contact allows electromagnet 307 to be powered and iron block 306 is moved to the left absorption, after current collector 304 is moved to the left by controller 310
Connecting electricity has allowed hot device 301 to start to generate heat, and passing through 311 temperature sensor of temperature detector and having adjusted hot 301 final temperature of device ensures crystalline substance
The two-sided temperature difference of piece is small, while controller 310 starts micro pump 312 and the liquid in liquid case 313 is allowed to flow by catheter 309
It is dynamic, partial heat absorption cycle is flowed into lower cooling, inside is avoided to generate high temperature.
The utility model solves chip and carries out being easy to produce hot temperature when polishing grinding, since the two-sided temperature difference of chip is big,
The problem of the case where causing chip to be easily damaged, the utility model are combined with each other by above-mentioned component, and the utility model is a kind of
The wafer polishing system of defect when for reducing manufacturing semiconductor devices, structure are equipped with preheating device 3, are allowed by hydraulic cylinder 7
Telescopic rod 4 drives shell 308 to move down, and allows heat-conductive plate 302 and contact wafers, allows electromagnet 307 to be powered by controller 310
Iron block 306 is moved to the left absorption, current collector 304, which is moved to the left to be followed by being powered, has allowed hot device 301 to start to generate heat, and passes through temperature-sensitive
311 temperature sensor of device has simultaneously adjusted hot 301 final temperature of device and ensures that the two-sided temperature difference of chip is small, avoids the two-sided temperature difference of chip
Situation that is big and being easy breakage.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, for
For those skilled in the art, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and without departing substantially from this
In the case where the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent elements of the claims
All changes are embraced therein.It should not treat any reference in the claims as limiting related right
It is required that.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (5)
1. it is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system, it is characterised in that: its structure include throw
Tarry matter disk (1), support rod (2), preheating device (3), telescopic rod (4), cooling tube (5), coolant liquid switch valve (6), hydraulic cylinder
(7), display screen (8), scram button (9), operator (10), support frame (11), cabinet (12), maintenance door (13), foot prop (14),
The top of the polishing grinding pan (1) is equipped with preheating device (3), and the upper surface insertion of the telescopic rod (4) is installed on hydraulic cylinder (7)
Lower surface, the polishing grinding pan (1) is installed on the upper surface of cabinet (12), and the coolant liquid switch valve (6) is located at support rod
(2) upper left side, maintenance door (13) insertion are installed on the front end face of cabinet (12), the lower surface of the cabinet (12) and foot
The upper surface of frame (14) is mutually welded, and the insertion of support frame as described above (11) is installed on the lower surface of operator (10), the operator
(10) front end face is equipped with display screen (8), and the scram button (9) is installed on the lower right of display screen (8), the preheating device
(3) included hot device (301), heat-conductive plate (302), movable plate (303), current collector (304), spring (305), iron block (306),
Electromagnet (307), shell (308), catheter (309), controller (310), temperature detector (311), micro pump (312), liquid case
(313), the lower section of described hot device (301) is equipped with heat-conductive plate (302), the left side and iron block (306) of the movable plate (303)
Right side mutually weld, the left side of the movable plate (303) is equipped with current collector (304), and the current collector (304) is located at
The lower section of spring (305), the iron block (306) are installed on the right of electromagnet (307), the electromagnet (307) and controller
(310) it is electrically connected, the inside of the shell (308) is equipped with catheter (309), and peace is inserted into the left side of the temperature detector (311)
Loaded on the right side for playing hot device (301), the upper surface of the liquid case (313) is equipped with micro pump (312), the micro pump
(312) it is electrically connected with controller (310), catheter (309) insertion is installed on the left side of liquid case (313).
2. it is according to claim 1 it is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system, it is special
Sign is: the support rod (2) is parallel with hydraulic cylinder (7).
3. it is according to claim 1 it is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system, it is special
Sign is: the cooling tube (5) is installed on the right of support rod (2).
4. it is according to claim 1 it is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system, it is special
Sign is: the perpendicular welding in lower surface of the upper surface and telescopic rod (4) of the shell (308).
5. it is according to claim 1 it is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system, it is special
Sign is: the support rod (2) is cylindrical structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820754826.0U CN208438157U (en) | 2018-05-21 | 2018-05-21 | It is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820754826.0U CN208438157U (en) | 2018-05-21 | 2018-05-21 | It is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208438157U true CN208438157U (en) | 2019-01-29 |
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ID=65091165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820754826.0U Active CN208438157U (en) | 2018-05-21 | 2018-05-21 | It is a kind of for reducing manufacturing semiconductor devices when defect wafer polishing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208438157U (en) |
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2018
- 2018-05-21 CN CN201820754826.0U patent/CN208438157U/en active Active
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