CN208418202U - Low-thermal resistance high-power LED lamp bead - Google Patents
Low-thermal resistance high-power LED lamp bead Download PDFInfo
- Publication number
- CN208418202U CN208418202U CN201821283073.6U CN201821283073U CN208418202U CN 208418202 U CN208418202 U CN 208418202U CN 201821283073 U CN201821283073 U CN 201821283073U CN 208418202 U CN208418202 U CN 208418202U
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- led lamp
- lamp bead
- thermal resistance
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- low
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- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a kind of low-thermal resistance high-power LED lamp bead, belongs to field of mechanical technique.It is poor that it solves the problems, such as the prior art there is stability.This low-thermal resistance high-power LED lamp bead, including lead frame, chip and tube body, above-mentioned tubular body is cylindrical and one end opening, said chip is connected in lead frame upper end, above-mentioned tubular body, which is covered, has the connection structure that the two can be connected on chip and between tube body and lead frame, it further include the substrate of an aluminum material, aforesaid substrate upper end sticks on chip, and substrate lower end is connected with connection structure.This low-thermal resistance high-power LED lamp bead stability is high.
Description
Technical field
The utility model belongs to field of mechanical technique, is related to a kind of low-thermal resistance high-power LED lamp bead.
Background technique
LED lamp bead is made of the compound containing gallium, arsenic, phosphorus, nitrogen etc..
LED lamp bead is generally used for as indicator light, or composition text or number display.
Existing LED lamp bead includes lead frame, chip and transparent tube body, and the quantity of lead frame is two, said chip
It is connected between two lead frame upper ends, above-mentioned tubular body is also connected to lead frame upper end and tube body covers chip.
LED lamp bead for a long time can be relatively high using temperature at rear chip, causes its stability relatively low in this way.
Summary of the invention
The purpose of this utility model is in view of the above-mentioned problems existing in the prior art, to provide a kind of low thermal resistance and stability is high
Low-thermal resistance high-power LED lamp bead.
The purpose of this utility model can be realized by the following technical scheme:
A kind of low-thermal resistance high-power LED lamp bead, including lead frame, chip and tube body, above-mentioned tubular body is cylindrical and one
End opening, said chip are connected in lead frame upper end, which is characterized in that above-mentioned tubular body cover on chip and tube body and lead frame it
Between there is the two can be connected connection structure, further include the substrate of an aluminum material, aforesaid substrate upper end sticks on chip,
Substrate lower end is connected with connection structure.
This LED lamp bead it is creative lead frame, chip be stably connected with tube body by connection structure together with.Meanwhile
Substrate is also connected in tube body by connection structure.
Since the material of substrate is aluminium.Therefore, temperature mistake at chip can be avoided quickly by heat transfer at chip in this way
It is high.
In above-mentioned low-thermal resistance high-power LED lamp bead, the connection structure includes the fixation being connected at tube body port
Piece forms recessed connecting cavity, is filled with soldering paste, above-mentioned lead frame in above-mentioned connecting cavity between above-mentioned fixinig plate and bottom of the pipe
It is connected on fixinig plate with substrate.
There are two effects for fixinig plate:
First, lead frame is connected thereto；
Secondly, for stopping soldering paste, avoid soldering paste from being excessively entering into tube body.
In above-mentioned low-thermal resistance high-power LED lamp bead, the substrate includes plate body one and plate body two, above-mentioned plate body one with
Plate body two is vertically arranged, and the plate body one is threaded through on fixinig plate, and above-mentioned plate body two is resisted against on the downside of fixinig plate.
In above-mentioned low-thermal resistance high-power LED lamp bead, the plate body one is an integral structure with plate body two.
In above-mentioned low-thermal resistance high-power LED lamp bead, above-mentioned plate body two is covered by soldering paste.
Such structure can be connected to substrate is stable on fixinig plate.
In above-mentioned low-thermal resistance high-power LED lamp bead, there is the through-hole to match with plate body one, institute on the fixinig plate
Through hole is stated with elastic component, the two sides of above-mentioned elastic component are respectively acting on plate body one and fixinig plate, in the effect of elastic component
Lower body one has the trend being resisted against on chip.
Elastic component is elastic due to having, guarantee that substrate can be stablized under the effect of its elastic force and is resisted against on chip.
In above-mentioned low-thermal resistance high-power LED lamp bead, the elastic component includes V-shaped elastic slice, the V-arrangement of above-mentioned elastic slice
Two sides are born against on plate body one and fixinig plate.
In above-mentioned low-thermal resistance high-power LED lamp bead, there is recessed positioning recess, above-mentioned elastic slice on the plate body one
A wherein end V at the positioning recess.
Elastic slice is brass material, has enough elasticity and intensity.Meanwhile it can guarantee bullet under the action of positioning recess
Piece is stable to be connected on fixinig plate.
In above-mentioned low-thermal resistance high-power LED lamp bead, the substrate includes L-shaped ontology one, ontology two and ontology
Three, above-mentioned ontology one overlaps.
In above-mentioned low-thermal resistance high-power LED lamp bead, the ontology one, ontology two and the end of ontology three are concordant.
Ontology one, ontology two and ontology three are brass material, and substrate makes it have sufficient intensity using multiple physical efficiencys
While be also equipped with good elasticity.
Compared with prior art, substrate of this low-thermal resistance high-power LED lamp bead due to being connected with aluminum material in tube body, together
When, substrate stabilization is resisted against on chip.It can guarantee heat energy rapid dispersion at chip in this way, ensure that it has enough low-heat
Resistive, stability is relatively high.
In addition, the setting of elastic slice can guarantee substrate always and have the trend being resisted against on chip, it is further improved
Stability.Moreover, because elastic slice is located at fixinig plate, structure is also compact, has very high practical value.
Detailed description of the invention
Fig. 1 is the schematic cross-sectional view of this low-thermal resistance high-power LED lamp bead.
In figure, 1, lead frame；2, chip；3, tube body；4, substrate；4a, plate body one；4a1, positioning recess；4b, plate body two；
5, fixinig plate；6, soldering paste；7, elastic slice.
Specific embodiment
As shown in Figure 1, this low-thermal resistance high-power LED lamp bead includes lead frame 1, chip 2 and tube body 3, above-mentioned tubular body 3 is in
Cylindric and one end opening, said chip 2 are connected in 1 upper end of lead frame, 3 sets of above-mentioned tubular body on chip 2 and tube body 3 with draw
There is the connection structure that the two can be connected between coil holder 1, further include the substrate 4 of an aluminum material, 4 upper end of aforesaid substrate patch
It leans against on chip 2,4 lower end of substrate is connected with connection structure.
The connection structure includes the fixinig plate 5 being connected at 3 port of tube body, between 3 lower end of above-mentioned fixinig plate 5 and tube body
Recessed connecting cavity is formed, is filled with soldering paste 6 in above-mentioned connecting cavity, above-mentioned lead frame 1 and substrate 4 are connected on fixinig plate 5.
The substrate 4 includes two 4b of one 4a of plate body and plate body, and above-mentioned one 4a of plate body and two 4b of plate body is vertically arranged, the plate
One 4a of body is threaded through on fixinig plate 5, and above-mentioned two 4b of plate body is resisted against 5 downside of fixinig plate.
One 4a of plate body and two 4b of plate body is an integral structure.
Above-mentioned two 4b of plate body is covered by soldering paste 6.
There is the through-hole to match with one 4a of plate body, the through hole has elastic component, above-mentioned elasticity on the fixinig plate 5
The two sides of part are respectively acting on one 4a of plate body and fixinig plate 5, and one 4a of plate body, which has, under the action of the elastic member is resisted against chip
Trend on 2.
The elastic component includes V-shaped elastic slice 7, and the V-arrangement two sides of above-mentioned elastic slice 7 are born against in one 4a of plate body and fixation
On piece 5.
There is recessed positioning recess 4a1, a wherein end V for above-mentioned elastic slice 7 is recessed embedded in positioning on one 4a of plate body
At mouth 4a1.
The substrate 4 includes L-shaped ontology one, ontology two and ontology three, and above-mentioned ontology one overlaps.
The ontology one, ontology two and the end of ontology three are concordant.
This LED lamp bead it is creative lead frame, chip be stably connected with tube body by connection structure together with.Meanwhile
Substrate is also connected in tube body by connection structure.
Since the material of substrate is aluminium.Therefore, temperature mistake at chip can be avoided quickly by heat transfer at chip in this way
It is high.
Claims (10)
1. a kind of low-thermal resistance high-power LED lamp bead, including lead frame, chip and tube body, above-mentioned tubular body is cylindrical and one end
Opening, said chip are connected in lead frame upper end, which is characterized in that above-mentioned tubular body covers on chip and between tube body and lead frame
It further include the substrate of an aluminum material with the connection structure that the two can be connected, aforesaid substrate upper end sticks on chip, base
Plate lower end is connected with connection structure.
2. low-thermal resistance high-power LED lamp bead according to claim 1, which is characterized in that the connection structure includes being connected
Fixinig plate at tube body port forms recessed connecting cavity, fills out in above-mentioned connecting cavity between above-mentioned fixinig plate and bottom of the pipe
Filled with soldering paste, above-mentioned lead frame and substrate are connected on fixinig plate.
3. low-thermal resistance high-power LED lamp bead according to claim 2, which is characterized in that the substrate includes one He of plate body
Plate body two, above-mentioned plate body one are vertically arranged with plate body two, and the plate body one is threaded through on fixinig plate, and above-mentioned plate body two is resisted against solid
On the downside of stator.
4. low-thermal resistance high-power LED lamp bead according to claim 3, which is characterized in that the plate body one is with plate body two
Integral structure.
5. low-thermal resistance high-power LED lamp bead according to claim 4, which is characterized in that above-mentioned plate body two is covered by weldering
In cream.
6. low-thermal resistance high-power LED lamp bead according to claim 5, which is characterized in that have on the fixinig plate and plate
The through-hole that body one matches, the through hole have elastic component, and the two sides of above-mentioned elastic component are respectively acting on plate body one and fix
On piece, plate body one has the trend being resisted against on chip under the action of the elastic member.
7. low-thermal resistance high-power LED lamp bead according to claim 6, which is characterized in that the elastic component includes V-shaped
The V-arrangement two sides of elastic slice, above-mentioned elastic slice are born against on plate body one and fixinig plate.
8. low-thermal resistance high-power LED lamp bead according to claim 7, which is characterized in that have on the plate body one recessed
Positioning recess, the wherein end V of above-mentioned elastic slice is at positioning recess.
9. low-thermal resistance high-power LED lamp bead according to claim 8, which is characterized in that the substrate includes L-shaped sheet
Body one, ontology two and ontology three, above-mentioned ontology one overlap.
10. low-thermal resistance high-power LED lamp bead according to claim 9, which is characterized in that the ontology one, two and of ontology
The end of ontology three is concordant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821283073.6U CN208418202U (en) | 2018-08-09 | 2018-08-09 | Low-thermal resistance high-power LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821283073.6U CN208418202U (en) | 2018-08-09 | 2018-08-09 | Low-thermal resistance high-power LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208418202U true CN208418202U (en) | 2019-01-22 |
Family
ID=65122054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821283073.6U Expired - Fee Related CN208418202U (en) | 2018-08-09 | 2018-08-09 | Low-thermal resistance high-power LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208418202U (en) |
-
2018
- 2018-08-09 CN CN201821283073.6U patent/CN208418202U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190122 Termination date: 20200809 |