CN208391217U - A kind of solder picture tin device suitable for semiconductor packages high-temperature solder chip mounter - Google Patents
A kind of solder picture tin device suitable for semiconductor packages high-temperature solder chip mounter Download PDFInfo
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- CN208391217U CN208391217U CN201820894475.3U CN201820894475U CN208391217U CN 208391217 U CN208391217 U CN 208391217U CN 201820894475 U CN201820894475 U CN 201820894475U CN 208391217 U CN208391217 U CN 208391217U
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- tin
- fixed frame
- semiconductor packages
- chip mounter
- solder
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Abstract
The utility model relates to a kind of solders suitable for semiconductor packages high-temperature solder chip mounter to draw tin device, including fixed frame, driving device is provided in the notched bottoms of fixed frame, driving wheel is provided in the shaft of driving device, transmission wheel is provided on the recess of fixed frame, left plate and right side plate are provided in the left and right sides of fixed frame, it is provided with to wear on transmission wheel and connect on driven shaft, one end of driven shaft is arranged on right side plate by bearing, the other end of driven shaft passes through left plate, and it is provided with driven wheel, strut is provided on the left of the front end of fixed frame, it is mutually fixed on the top of strut with one end of fixed link, friction pulley is provided on the other end, tin bar is provided with by clamping plate on the lower end of fixed frame, clear opening is offered on the axis of tin bar, tin silk on the transmission wheel passes through tin bar clear opening from top to bottom, and tin silk Protrude from the working end setting of tin bar.The utility model is able to achieve the picture tin of automation, improves working efficiency.
Description
Technical field
The utility model relates to a kind of solders to draw tin device, more particularly to a kind of suitable for semiconductor packages high-temperature solder patch
The solder of piece machine draws tin device.
Background technique
It is more complicated to the operation for drawing tin in existing semiconductor packages high-temperature solder chip mounter, it can not achieve automation
Operation, greatly reduce working efficiency, improve cost.
In view of the above shortcomings, the designer, is actively subject to research and innovation, it is a kind of new structural applicable to found
Tin device is drawn in the solder of semiconductor packages high-temperature solder chip mounter, makes it with more the utility value in industry.
Utility model content
In order to solve the above technical problems, the purpose of the utility model is to provide one kind to be suitable for semiconductor packages high-temperature solder
The solder of chip mounter draws tin device.
To achieve the above objectives, the present invention adopts the following technical solutions:
A kind of solder picture tin device suitable for semiconductor packages high-temperature solder chip mounter, including fixed frame, the fixation
The U-shaped structure setting of frame is provided with driving device, the shaft of the driving device in the notched bottoms of the U-shaped fixed frame
On be provided with driving wheel, transmission wheel is provided on the recess of the U-shaped fixed frame, transmission wheel is before driving device
End setting, is provided with left plate and right side plate in the left and right sides of the U-shaped fixed frame, the left plate and right side plate with
Transmission wheel is arranged in same axis, and the transmission is taken turns to be provided with to wear and be connect on driven shaft, and one end of the driven shaft passes through axis
It holds and is arranged on right side plate, the other end of the driven shaft passes through left plate, and is provided with driven wheel, the driven wheel and active
Wheel is synchronised connection by synchronous belt, when the driving of driving device, the transmission wheel synchronous rotation on driven shaft is driven to be arranged, described
It is provided with strut on the left of the front end of fixed frame, mutually fixes on the top of the strut with one end of fixed link, set on the other end
It is equipped with friction pulley, the friction pulley is taken turns the setting that is in contact with transmission, is provided on the lower end of the U-shaped fixed frame by clamping plate
Tin bar, is arranged downwards, and the tin bar is located at the front end setting of transmission wheel, offers clear opening on the axis of the tin bar,
Tin silk on the transmission wheel passes through tin bar clear opening from top to bottom, and tin silk protrudes from the working end setting of tin bar.
Further, a kind of solder suitable for semiconductor packages high-temperature solder chip mounter draws tin device, wherein
If being provided with dry gas heat release hole on the bottom of the U-shaped fixed frame, the gas heat release hole is arranged upward.
Further, a kind of solder suitable for semiconductor packages high-temperature solder chip mounter draws tin device,
In, it is provided with first connecting rod on the strut, second connecting rod, the first connecting rod and second connecting rod are provided on the fixed frame
Between be provided with tension spring.
Further, a kind of solder suitable for semiconductor packages high-temperature solder chip mounter draws tin device,
In, four different molten tin baths of thickness are offered on the transmission wheel, from left to right in the setting that is tapered.
Further again, a kind of solder suitable for semiconductor packages high-temperature solder chip mounter draws tin device,
Wherein, the driving device is stepper motor.
Further again, a kind of solder suitable for semiconductor packages high-temperature solder chip mounter draws tin device,
Wherein, collets are provided on the bottom of the fixed frame, be arranged positioned at the side of tin bar.
Further again, a kind of solder suitable for semiconductor packages high-temperature solder chip mounter draws tin device,
Cooling device is set with it is characterized by: being provided on the tin bar.
Further again, a kind of solder suitable for semiconductor packages high-temperature solder chip mounter draws tin device,
Wherein, the lower end of the fixed frame is provided with plate, and tin rod aperture is offered on the plate, and the periphery of tin rod aperture is provided with insulation
Spring is provided with before block, setting corresponding with the collets of fixed frame bottom, and the two, in being vertically arranged.
According to the above aspect of the present invention, the utility model at least has the following advantages:
The utility model realizes the automatic running of transmission wheel by driving device, while by the way that tin silk to be placed in tin bar
The picture tin operation automated, to realize the operation of automation, effectively improves working efficiency, while being provided on tin bar
Cooling device, it can be ensured that the device works long hours, and effectively improves efficiency, mostly reduces the purpose of cost.
The above description is merely an outline of the technical solution of the present invention, in order to better understand the skill of the utility model
Art means, and can be implemented in accordance with the contents of the specification, below on the preferred embodiment of the present invention and the accompanying drawings in detail
It describes in detail bright as after.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the side view of the utility model.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Embodiment is not intended to limit the scope of the present invention for illustrating the utility model.
In order to make those skilled in the art better understand the scheme of the utility model, below in conjunction with the utility model reality
Attached drawing in example is applied, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described reality
Applying example is only the utility model a part of the embodiment, instead of all the embodiments.Usually describes and show in attached drawing here
The component of the utility model embodiment out can be arranged and be designed with a variety of different configurations.Therefore, below in attached drawing
The detailed description of the embodiments of the present invention of middle offer is not intended to limit the range of claimed invention, and
It is the selected embodiment for being merely representative of the utility model.Based on the embodiments of the present invention, those skilled in the art are not having
Every other embodiment obtained under the premise of creative work is made, is fallen within the protection scope of the utility model.
Embodiment
As shown in Figure 1 and Figure 2, a kind of solder suitable for semiconductor packages high-temperature solder chip mounter draws tin device, including solid
Determine frame 1, the U-shaped structure setting of the fixed frame 1 is provided with driving device 2, institute in the notched bottoms of the U-shaped fixed frame 1
It states and is provided with driving wheel 3 in the shaft of driving device 2, transmission wheel 4, the biography are provided on the recess of the U-shaped fixed frame 1
The front end that defeated wheel 4 is located at driving device 2 is arranged, and is provided with left plate 5 and the right side in the left and right sides of the U-shaped fixed frame 1
Side plate 6, the left plate 5 and right side plate 6 and transmission wheel 4 are arranged in same axis, and the transmission is taken turns to be provided with to wear on 4 and be connect
On driven shaft 7, one end of the driven shaft 7 is arranged on right side plate 6 by bearing, and the other end of the driven shaft 7 passes through a left side
Side plate 5, and it is provided with driven wheel 8, the driven wheel 8, which is synchronised with driving wheel 3 by synchronous belt, to be connect, when driving device 2
Driving drives the transmission wheel 4 on driven shaft 7 to rotate synchronously setting, is provided with strut 11 on the front end left side of the fixed frame 1,
It is mutually fixed on the top of the strut with one end of fixed link, friction pulley 12, the friction pulley 12 and biography is provided on the other end
Defeated wheel 4 is in contact setting, passes through clamping plate 9 on the lower end of the U-shaped fixed frame 1 and is provided with tin bar 10, is arranged downwards, institute
The front end setting that tin bar 10 is located at transmission wheel 4 is stated, offers clear opening on the axis of the tin bar 10, the transmission is taken turns on 4
Tin silk pass through 10 clear opening of tin bar from top to bottom, and tin silk protrudes from the working end setting of tin bar 10.Pass through self-feeding energy
It realizes the operation from animation tin, to realize efficient work, achievees the purpose that reduce cost.
If dry gas heat release hole is provided in the utility model on the bottom of the U-shaped fixed frame 1, the gas heat dissipation
Hole is arranged upward, and the heat convenient for generating tin silk passes through gas heat release hole as early as possible and is discharged, i.e., effectively ensures making for device
With, and device can be enable to work for a long time.
It is provided with first connecting rod on strut 11 described in the utility model, is provided with second connecting rod on the fixed frame 1, institute
It states and is provided with tension spring between first connecting rod and second connecting rod, friction pulley 12 is made to can be carried out adjustment position, to facilitate transmission to take turns
The cooperation of tin silk and friction pulley.
Four different molten tin baths of thickness are offered in transmission wheel described in the utility model 4, are from left to right in be tapered
Setting carries out different selections according to different requirements, improves working efficiency.
Driving device 2 described in the utility model is stepper motor.
It is provided with collets 13 on the bottom of fixed frame described in the utility model, is arranged positioned at the side of tin bar 10, prevents
Only plate and fixed frame touch, it is ensured that the normal work of device, while also can confirm that whether tin silk is fed.
It is provided on tin bar described in the utility model 10 and is set with cooling device 14, tin is realized by cooling device 14
Bar works for a long time, improves working efficiency.
The lower end of fixed frame described in the utility model is provided with plate, and tin rod aperture, tin rod aperture are offered on the plate
Periphery be provided with collets 13, setting corresponding with the collets of fixed frame bottom, and be provided with spring before the two, in perpendicular
Straight setting, it is ensured that plate and the workbench of lower section are mutually in close contact.
The working principle of the utility model is as follows:
When specific works, suitable tin silk is selected first, is then put into tin silk in the clear opening of tin bar, one end of tin silk
The working end of tin bar is protruded from, then by tension spring by friction pulley pull-up, be in contact setting with transmission wheel, finally, starting the dress
It sets, after actuation, the rotation of driving motor drives driven shaft rotation, and the rotation for driving transmission to take turns is fed down into tin silk slowly
In tin bar, and at this point, the working end of tin bar is located above the position for needing picture tin, and the operating platform for drawing tin passes through flat-plate compressed
It closes, being drawn in the operating platform of tin at this time persistently has high temperature, and the tin silk on working end is melted to product, realizes and grasps from animation tin
Make.
The utility model realizes the automatic running of transmission wheel by driving device, while by the way that tin silk to be placed in tin bar
The picture tin operation automated, to realize the operation of automation, effectively improves working efficiency, while being provided on tin bar
Cooling device, it can be ensured that the device works long hours, and effectively improves efficiency, mostly reduces the purpose of cost.
The above is only the preferred embodiment of the utility model, is not intended to limit the utility model, it is noted that
For those skilled in the art, without deviating from the technical principle of the utility model, it can also do
Several improvements and modifications out, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (8)
1. a kind of solder suitable for semiconductor packages high-temperature solder chip mounter draws tin device, it is characterised in that: including fixed frame
(1), the U-shaped structure setting of the fixed frame (1) is provided with driving device in the notched bottoms of the U-shaped fixed frame (1)
(2), it is provided with driving wheel (3) in the shaft of the driving device (2), is provided with biography on the recess of the U-shaped fixed frame (1)
Defeated wheel (4), the transmission wheel (4) are located at the front end setting of driving device (2), the left and right sides of the U-shaped fixed frame (1)
On be provided with left plate (5) and right side plate (6), the left plate (5) and right side plate (6) are set with transmission wheel (4) in same axis
It sets, the transmission is taken turns to be provided with to wear on (4) and be connect on driven shaft (7), and one end of the driven shaft (7) is arranged by bearing on the right side
On side plate (6), the other end of the driven shaft (7) passes through left plate (5), and is provided with driven wheel (8), the driven wheel (8)
It is synchronised with driving wheel (3) by synchronous belt and is connect, when the driving of driving device (2), drives the transmission wheel on driven shaft (7)
(4) setting is rotated synchronously, is provided with strut (11) on the front end left side of the fixed frame (1), on the top of the strut and admittedly
One end of fixed pole is mutually fixed, and is provided on the other end friction pulley (12), and the friction pulley (12) is in contact with transmission wheel (4) and sets
It sets, clamping plate (9) is provided with tin bar (10) on the lower end of the U-shaped fixed frame (1), are arranged downwards, the tin bar
(10) it is located at the front end setting of transmission wheel (4), offers clear opening on the axis of the tin bar (10), the transmission is taken turns on (4)
Tin silk pass through tin bar (10) clear opening from top to bottom, and tin silk protrudes from the working end setting of tin bar (10).
2. a kind of solder suitable for semiconductor packages high-temperature solder chip mounter according to claim 1 draws tin device,
Be characterized in that: the U-shaped fixed frame (1) if bottom on be provided with dry gas heat release hole, the gas heat release hole is towards upper
Side's setting.
3. a kind of solder suitable for semiconductor packages high-temperature solder chip mounter according to claim 1 draws tin device,
It is characterized in that: being provided with first connecting rod on the strut (11), be provided with second connecting rod on the fixed frame (1), described first
Tension spring is provided between connecting rod and second connecting rod.
4. a kind of solder suitable for semiconductor packages high-temperature solder chip mounter according to claim 1 draws tin device,
It is characterized in that: four different molten tin baths of thickness is offered on the transmission wheel (4), from left to right in the setting that is tapered.
5. a kind of solder suitable for semiconductor packages high-temperature solder chip mounter according to claim 1 draws tin device,
Be characterized in that: the driving device (2) is stepper motor.
6. a kind of solder suitable for semiconductor packages high-temperature solder chip mounter according to claim 1 draws tin device,
It is characterized in that: being provided with collets (13) on the bottom of the fixed frame, the side for being located at tin bar (10) is arranged.
7. a kind of solder suitable for semiconductor packages high-temperature solder chip mounter according to claim 1 draws tin device,
It is characterized in that: being provided on the tin bar (10) and be set with cooling device (14).
8. a kind of solder suitable for semiconductor packages high-temperature solder chip mounter according to claim 1 draws tin device,
Be characterized in that: the lower end of the fixed frame is provided with plate, and tin rod aperture is offered on the plate, and the periphery of tin rod aperture is provided with
Spring is provided with before collets (13), setting corresponding with the collets of fixed frame bottom, and the two, in being vertically arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820894475.3U CN208391217U (en) | 2018-06-10 | 2018-06-10 | A kind of solder picture tin device suitable for semiconductor packages high-temperature solder chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820894475.3U CN208391217U (en) | 2018-06-10 | 2018-06-10 | A kind of solder picture tin device suitable for semiconductor packages high-temperature solder chip mounter |
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| Publication Number | Publication Date |
|---|---|
| CN208391217U true CN208391217U (en) | 2019-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820894475.3U Active CN208391217U (en) | 2018-06-10 | 2018-06-10 | A kind of solder picture tin device suitable for semiconductor packages high-temperature solder chip mounter |
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| Country | Link |
|---|---|
| CN (1) | CN208391217U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111683513A (en) * | 2020-06-24 | 2020-09-18 | 安徽富信半导体科技有限公司 | High-temperature chip mounting equipment for processing electronic components and working method thereof |
-
2018
- 2018-06-10 CN CN201820894475.3U patent/CN208391217U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111683513A (en) * | 2020-06-24 | 2020-09-18 | 安徽富信半导体科技有限公司 | High-temperature chip mounting equipment for processing electronic components and working method thereof |
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