CN208375840U - It is a kind of for forming the mold of SIM card lid - Google Patents
It is a kind of for forming the mold of SIM card lid Download PDFInfo
- Publication number
- CN208375840U CN208375840U CN201820974846.9U CN201820974846U CN208375840U CN 208375840 U CN208375840 U CN 208375840U CN 201820974846 U CN201820974846 U CN 201820974846U CN 208375840 U CN208375840 U CN 208375840U
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- mold
- thimble
- upper mold
- lower mold
- chamber
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Abstract
The utility model discloses a kind of for forming the mold of SIM card lid, including upper mold, the upper mold bottom is connected with lower mold, the lower die top offers upper mold channel, the upper mold bottom offers lower mold slots, the lower mold slots are correspondingly arranged with upper mold channel, the upper mold channel and lower mold slot form die cavity, upper mold channel inner wall bottom is fixedly connected with SIM printed words convex block, the upper mold two sides of the bottom offer the first thimble chamber, the lower mold two sides of the bottom offer the second thimble chamber, the second thimble chamber is correspondingly arranged with the first thimble chamber, bottom plate is provided on the downside of the lower mold, thimble is fixedly connected at the top of the bottom plate, the one end of the thimble far from bottom plate extends to the intracavitary portion of the first thimble by the second thimble chamber, the utility model relates to technical field of mold.Printed words can be formed by providing one kind, relatively beautiful, the mold for being used to form SIM card lid with cushion performance.
Description
Technical field
It is specially a kind of for forming the mold of SIM card lid the utility model relates to technical field of mold.
Background technique
Mold is exactly that blank is made to become the tool for having the product of specific shape and size under external force, is widely used in punching
The compression moulding of the products such as sanction, die forging, cold-heading, extruding, metallic sintered products compacting, compression casting and engineering plastics, rubber, ceramics
Or in the forming of injection molding, mold has specific profile or cavity shape, for forming product, but existing SIM card lid
Mold appearance carry out republishing processing after molding, form printed words, it is not beautiful enough, and due to the volume of SIM card lid
It is smaller, therefore the volume of mold is also less big, when dividing mould and molding, since the impact force generated suddenly is easily damaged mould
Tool does not have cushion performance.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of for forming the mold of SIM card lid, provides one
Kind can form printed words, relatively beautiful, the mold for being used to form SIM card lid with cushion performance.
(2) technical solution
In order to achieve the above object, the utility model is achieved by the following technical programs: one kind is for forming SIM card lid
Mold, including upper mold, the upper mold bottom be connected with lower mold, and the lower die top offers upper mold
Slot, the upper mold bottom offer lower mold slots, and the lower mold slots are correspondingly arranged with upper mold channel, the upper mold channel and
Lower mold slot forms die cavity, and upper mold channel inner wall bottom is fixedly connected with SIM printed words convex block, the upper mold two sides of the bottom
The first thimble chamber is offered, the lower mold two sides of the bottom offer the second thimble chamber, the second thimble chamber and the first thimble
Chamber is correspondingly arranged, and bottom plate is provided on the downside of the lower mold, is fixedly connected with thimble at the top of the bottom plate, the thimble is the bottom of far from
One end of plate extends to the intracavitary portion of the first thimble by the second thimble chamber, is fixedly connected with rubber block at the top of the thimble, described
It is connect at the top of rubber block with the first thimble cavity wall top movable, the thimble outer surface and the first thimble chamber and the second thimble chamber
It is flexibly connected, the lower outer mold wall two sides lower end is fixedly connected with the first buffer board, and upper mold outer wall two sides upper end is solid
Surely it is connected with the second buffer board, first buffer board and the second buffer board are correspondingly arranged, fixed at the top of first buffer board
It is connected with spring, the one end of the spring far from the first buffer board is fixedly connected with the second buffer board.
Preferably, the die cavity is symmetrically arranged with 4.
Preferably, the upper mold top center is provided with cast gate.
Preferably, upper mold outer wall two sides are provided with the first locating slot, and the lower outer mold wall two sides are provided with
Two locating slots, first locating slot are correspondingly arranged with the second locating slot.
Preferably, the position of surrounding offers location hole at the top of the upper mold.
Preferably, the upper mold and lower mold are adapted.
(3) beneficial effect
The utility model provides a kind of for forming the mold of SIM card lid.Have it is following the utility model has the advantages that
(1), mold for being used to form SIM card lid, by being connected with lower mold, lower mold top in upper mold bottom
Portion offers upper mold channel, and upper mold bottom offers lower mold slots, and lower mold slots are correspondingly arranged with upper mold channel, upper mold channel
Die cavity is formed with lower mold slot, upper mold channel inner wall bottom is fixedly connected with SIM printed words convex block, has reached formation printed words, compared
Beautiful purpose, after product injection molding, the back side of SIM card lid will form the groove of SIM printed words so that product printed words with
Product itself combines more naturally, beautiful.
(2), mold for being used to form SIM card lid, by offering the first thimble chamber in upper mold two sides of the bottom.Lower die
Tool two sides of the bottom offer the second thimble chamber, and the second thimble chamber is correspondingly arranged with the first thimble chamber, are provided with bottom on the downside of lower mold
Plate, is fixedly connected with thimble at the top of bottom plate, and it is intracavitary that the one end of thimble far from bottom plate by the second thimble chamber extends to the first thimble
Portion, thimble top are fixedly connected with rubber block, connect at the top of rubber block with the first thimble cavity wall top movable, thimble outer surface
It is flexibly connected with the first thimble chamber and the second thimble chamber, lower outer mold wall two sides lower end is fixedly connected with the first buffer board, upper mold
Tool outer wall two sides upper end is fixedly connected with the second buffer board, and the first buffer board and the second buffer board are correspondingly arranged, the first buffer board
Top is fixedly connected with spring, and the one end of spring far from the first buffer board is fixedly connected with the second buffer board, has reached to have and delay
The purpose of punching performance, in thimble carry out activity, when dividing mould, rubber block can weaken the impact force of thimble, be buffered, and spring also can
It is buffered, when mitigation divides mould and molding, the impact force between upper mold and lower mold mitigates between upper mold and lower mold
Collision, prevents mold from damaging.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model upper die structure schematic diagram；
Fig. 3 is the utility model lower die structure schematic diagram.
In figure: 1 upper mold, 2 lower molds, 3 upper mold channels, 4 die cavitys, 5 lower mold slots, 6 first thimble chambers, 7SIM printed words are convex
Block, 8 second thimble chambers, 9 bottom plates, 10 thimbles, 11 rubber blocks, 12 first buffer boards, 13 second buffer boards, 14 springs, 15 first
Locating slot, 16 second locating slots.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: it is a kind of for forming the mold of SIM card lid, including
Upper mold 1,1 bottom of upper mold are connected with lower mold 2, and upper mold channel 3 is offered at the top of lower mold 2, and 1 bottom of upper mold is opened
Equipped with lower mold slots 5, lower mold slots 5 are correspondingly arranged with upper mold channel 3, and upper mold channel 3 and lower mold slots 5 form die cavity 4, upper mold
Tool 3 inner wall bottom of slot is fixedly connected with SIM printed words convex block 7, has reached formation printed words, relatively beautiful purpose.1 bottom of upper mold
Two sides offer the first thimble chamber 6.Lower 2 two sides of the bottom of mold offer the second thimble chamber 8, the second thimble chamber 8 and the first thimble
Chamber 6 is correspondingly arranged, and bottom plate 9 is provided on the downside of lower mold 2, thimble 10 is fixedly connected at the top of bottom plate 9, thimble 10 is far from bottom plate 9
One end extended to inside the first thimble chamber 6 by the second thimble chamber 8, rubber block 11, rubber are fixedly connected at the top of thimble 10
11 top of block is connect with 6 inner wall top movable of the first thimble chamber, 10 outer surface of thimble and the first thimble chamber 6 and the second thimble chamber 8
It is flexibly connected, lower 2 outer wall two sides lower end of mold is fixedly connected with the first buffer board 12, and 1 outer wall two sides upper end of upper mold is fixed to be connected
It is connected to the second buffer board 13, the first buffer board 12 and the second buffer board 13 are correspondingly arranged, are fixedly connected at the top of the first buffer board 12
There is spring 14, the one end of spring 14 far from the first buffer board 12 is fixedly connected with the second buffer board 13, and having reached has resiliency
The purpose of energy.
Die cavity 4 is symmetrically arranged with 4, can disposably form multiple products.
1 top center of upper mold is provided with cast gate, convenient for injection molding.
1 outer wall two sides of upper mold are provided with the first locating slot 15, and lower 2 outer wall two sides of mold are provided with the second locating slot 16,
First locating slot 15 is correspondingly arranged with the second locating slot 16, convenient for positioning.
The position of 1 top surrounding of upper mold offers location hole, convenient for positioning.
Upper mold 1 and lower mold 2 are adapted, and improve precision.
In use, being molded by combining upper mold 1 and lower mold 2 with power facility respectively, passing through glue-injection machine
Injection molding is carried out, after product injection molding, the back side of SIM card lid will form the groove of SIM printed words, move by external
Power facility controls 10 carry out activity of thimble, and when dividing mould, rubber block 11 can weaken the impact force of thimble 10, and spring 14 also will do it slow
Punching.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of for forming the mold of SIM card lid, including upper mold (1), it is characterised in that: upper mold (1) bottom is living
It is dynamic to be connected with lower mold (2), it is offered upper mold channel (3) at the top of the lower mold (2), upper mold (1) bottom offers
Lower mold slots (5), the lower mold slots (5) are correspondingly arranged with upper mold channel (3), the upper mold channel (3) and lower mold slots (5)
It is formed die cavity (4), upper mold channel (3) the inner wall bottom is fixedly connected with SIM printed words convex block (7), upper mold (1) bottom
Two sides offer the first thimble chamber (6), and lower mold (2) two sides of the bottom offer the second thimble chamber (8), second thimble
Chamber (8) is correspondingly arranged with the first thimble chamber (6), is provided with bottom plate (9) on the downside of the lower mold (2), solid at the top of the bottom plate (9)
Surely it is connected with thimble (10), the one end of the thimble (10) far from bottom plate (9) extends to the first thimble by the second thimble chamber (8)
Chamber (6) is internal, is fixedly connected with rubber block (11) at the top of the thimble (10), rubber block (11) top and the first thimble chamber
(6) inner wall top movable connects, and thimble (10) outer surface is flexibly connected with the first thimble chamber (6) and the second thimble chamber (8),
Lower mold (2) the outer wall two sides lower end is fixedly connected with the first buffer board (12), and upper mold (1) the outer wall two sides upper end is solid
Surely it is connected with the second buffer board (13), first buffer board (12) and the second buffer board (13) are correspondingly arranged, and described first is slow
It is fixedly connected with spring (14) at the top of punching (12), the one end of the spring (14) far from the first buffer board (12) and the second buffering
Plate (13) is fixedly connected.
2. according to claim 1 a kind of for forming the mold of SIM card lid, it is characterised in that: the die cavity (4) is symmetrical
It is provided with 4.
3. according to claim 1 a kind of for forming the mold of SIM card lid, it is characterised in that: upper mold (1) top
Portion center is provided with cast gate.
4. according to claim 1 a kind of for forming the mold of SIM card lid, it is characterised in that: the upper mold (1) is outside
Wall two sides are provided with the first locating slot (15), and lower mold (2) the outer wall two sides are provided with the second locating slot (16), and described first
Locating slot (15) is correspondingly arranged with the second locating slot (16).
5. according to claim 1 a kind of for forming the mold of SIM card lid, it is characterised in that: upper mold (1) top
The position of portion's surrounding offers location hole.
6. according to claim 1 a kind of for forming the mold of SIM card lid, it is characterised in that: the upper mold (1) and
Lower mold (2) is adapted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820974846.9U CN208375840U (en) | 2018-06-25 | 2018-06-25 | It is a kind of for forming the mold of SIM card lid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820974846.9U CN208375840U (en) | 2018-06-25 | 2018-06-25 | It is a kind of for forming the mold of SIM card lid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208375840U true CN208375840U (en) | 2019-01-15 |
Family
ID=64964438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820974846.9U Active CN208375840U (en) | 2018-06-25 | 2018-06-25 | It is a kind of for forming the mold of SIM card lid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208375840U (en) |
-
2018
- 2018-06-25 CN CN201820974846.9U patent/CN208375840U/en active Active
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