CN208336606U - A kind of encapsulation type splicing component and electronic product - Google Patents
A kind of encapsulation type splicing component and electronic product Download PDFInfo
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- CN208336606U CN208336606U CN201820929062.4U CN201820929062U CN208336606U CN 208336606 U CN208336606 U CN 208336606U CN 201820929062 U CN201820929062 U CN 201820929062U CN 208336606 U CN208336606 U CN 208336606U
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Abstract
The utility model discloses a kind of encapsulation type splicing component and electronic products, the component includes the first splice and the second splice, the first vertical plug division is provided on first splice, the second vertical plug division is provided on second splice, first splice and the second splice are mutually inserted connection by the first vertical plug division and the second vertical plug division, and first vertical plug division the first grafting block and the second slot grafting of the second vertical plug division surround vertical splicing gap, the open-topped encapsulating pond for encapsulating is formed between first splice and the second splice, connection encapsulating pond is offered on second splice and splices the glue hole in gap.Glue is passed through in vertical splicing gap by the glue hole on encapsulating pond and the second splice, it ensure that the residual that will not have air in potting process, ensure that encapsulating quality, and do not need to be potted in vacuum environment, encapsulating difficulty and cost are reduced, encapsulating efficiency is improved.
Description
Technical field
The utility model relates to technical field of electronic products, in particular to a kind of encapsulation type splicing component.The utility model
Further relate to a kind of electronic product comprising the encapsulation type splicing component.
Background technique
Many electronic products are usually fitted together by multiple components, and splicing component can have dress in the place of splicing
With gap, to the higher electronic product of certain protection level requirements, the mode that splicing component generallys use encapsulating is sealed.
The gap of splicing component is too small to lead to assembly difficulty, if increasing gap, although assembly is easy, due to cooperation
Gap is deeper, and depth-to-width ratio is big, under normal pressure when encapsulating product, only by the gravity deficiency of glue to allow glue to be filled into seam well
In gap.In the solidification process of glue, glue is since gravity can sink the bubble floating of gap bottom, in addition environment temperature
Variation, glue curing rear surface occur bulge influence product appearance, in addition bubble, which does not eject, can bury waterproof failure
Hidden danger.In order to solve the problems, such as glue fill, need by the way of vacuum encapsulation, since product is in vacuum environment,
Casting glue is filled into fit clearance, to ensure that encapsulating quality.But the disadvantages of the method are as follows due to need by
Product, which is placed in vacuum environment, to be implemented, complex process, and equipment investment cost is high, and productive temp time is long, production effect
Rate is low.
In conclusion how to reduce encapsulating difficulty and cost under the premise of guaranteeing encapsulating quality, encapsulating efficiency is improved,
Become those skilled in the art's urgent problem to be solved.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of encapsulation type splicing component, to guarantee encapsulating quality
Under the premise of, encapsulating difficulty and cost are reduced, encapsulating efficiency is improved.
Another of the utility model is designed to provide a kind of electronic product comprising the encapsulation type splicing component, with
Under the premise of guaranteeing encapsulating quality, encapsulating difficulty and cost are reduced, improves encapsulating efficiency.
In order to achieve the above objectives, the utility model the following technical schemes are provided:
A kind of encapsulation type splicing component, including the first splice and the second splice are provided on first splice
First vertical plug division is provided with the second vertical plug division, first splice and described second on second splice
Splice is mutually inserted connection by the described first vertical plug division and the second vertical plug division, and described first is vertical slotting
First grafting block of socket part and the second slot grafting of the described second vertical plug division surround vertical splicing gap, and described first spells
The open-topped encapsulating pond for encapsulating is formed between fitting and second splice, is offered on second splice
It is connected to the glue hole in the encapsulating pond and the splicing gap.
Preferably, in above-mentioned encapsulation type splicing component, the width in the vertical splicing gap is 1mm~1.5mm.
Preferably, in above-mentioned encapsulation type splicing component, the first vertical plug division and the second vertical grafting
The quantity in portion equal at least two and cooperation grafting is corresponded, the first grafting block of each first vertical plug division and every
The vertical splicing gap, each vertical splicing are respectively formed between second slot of a second vertical plug division
Gap passes through corresponding glue hole respectively and is connected to the encapsulating pond.
Preferably, in above-mentioned encapsulation type splicing component, each vertical splicing gap corresponds to multiple logical glue
Hole, and the glue hole is vertically sequentially arranged.
Preferably, in above-mentioned encapsulation type splicing component, the glue hole is along the vertical of the vertical splicing gap
The slotted hole of extension.
Preferably, in above-mentioned encapsulation type splicing component, the described second vertical plug division is arranged in the glue hole
On second grafting block.
Preferably, in above-mentioned encapsulation type splicing component, the bottom in the vertical splicing gap is not less than the logical glue
The lower edge in hole, the bottom in the encapsulating pond are not higher than the lower edge of the glue hole.
The utility model additionally provides a kind of electronic product, including the encapsulation type splicing component as described in any of the above item.
Preferably, further include circuit board in above-mentioned electronic product, first splice be shell, described second
Splice is connector, and the circuit board is fixed on the shell, and the PIN needle and the circuit board of the connector are electrical
Connection.
Preferably, in above-mentioned electronic product, positioning column is provided on the shell, be provided on the circuit board with
The location hole of the positioning column corresponding matching.
Compared with prior art, the utility model has the beneficial effects that
In encapsulation type splicing component provided by the utility model, the first splice and the second splice are vertical slotting by first
Socket part and the second vertical plug division are mutually inserted connection, and the grafting block of the first vertical plug division and the second vertical plug division are inserted
Slot grafting surrounds vertical splicing gap, and the open-topped filling for encapsulating is also formed between the first splice and the second splice
Jiao Chi offers connection encapsulating pond on the second splice and splices the glue hole in gap.When being potted, glue is injected and is filled
In glue pond, glue is gradually filled in encapsulating pond from bottom to top, and during encapsulating, glue in encapsulating pond passes through the
Glue hole on two splices is passed through in vertical splicing gap, and glue liquid level is gradually increasing from the bottom in vertical splicing gap, will
Air in vertical splicing gap is squeezed out from top, glue is filled up vertical splicing gap, between final encapsulating pond and vertical splicing
Glue in gap converges to form a complete encapsulating surface at top, and ensure that will not have the residual of air in potting process.
The encapsulation type splicing component can guarantee glue vertically splicing gap in filling quality, and do not need in vacuum environment into
Therefore row encapsulating reduces encapsulating difficulty and cost, improve encapsulating efficiency.
Therefore the encapsulation type splicing component that electronic product provided by the utility model uses in the utility model is being protected
While having demonstrate,proved encapsulating quality, encapsulating difficulty and cost are reduced, improves encapsulating efficiency.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is a kind of decomposition diagram of encapsulation type splicing component provided by the embodiment of the utility model；
Fig. 2 is a kind of splicing top view of encapsulation type splicing component provided by the embodiment of the utility model；
Fig. 3 is a kind of side view of second splice of encapsulation type splicing component provided by the embodiment of the utility model；
Fig. 4 is a kind of encapsulating position view of encapsulation type splicing component provided by the embodiment of the utility model；
Fig. 5 is the structural schematic diagram of the Section A-A in Fig. 2；
Fig. 6 is the potting process schematic diagram of the encapsulation type splicing component in Fig. 5；
Fig. 7 is the second potting process schematic diagram of the encapsulation type splicing component in Fig. 5；
Fig. 8 is the third potting process schematic diagram of the encapsulation type splicing component in Fig. 5.
Wherein, 1 for the first splice, 11 be the first vertical plug division, 111 be the first slot, 112 be the first grafting block,
12 it is positioning column, 2 be the second splice, 21 be the second vertical plug division, 211 be the second slot, 212 is the second grafting block, 213
It is PIN needle for glue hole, 22,3 be circuit board, 31 be location hole, 4 be vertical splicing gap, 5 be encapsulating pond, 6 is injected rubber hose；
Solid line the end of a thread in figure 5-8 is the direction that glue injects in encapsulating pond, and dotted arrow is the side of glue outflow
To.
Specific embodiment
The core of the utility model is there is provided a kind of encapsulation type splicing component, by the air in vertical splicing gap from top
Portion squeezes out, and glue is filled up vertical splicing gap, final encapsulating pond is converged to be formed at top with the glue in vertical splicing gap
One complete encapsulating surface, ensure that will not have the residual of air in potting process.Under the premise of encapsulating quality, filling is reduced
Difficulty and cost are sealed, encapsulating efficiency is improved.
The utility model additionally provides a kind of electronic product comprising the encapsulation type splicing component, ensure that encapsulating quality
Under the premise of, encapsulating difficulty and cost are reduced, encapsulating efficiency is improved.
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-Fig. 8 is please referred to, the utility model embodiment provides a kind of encapsulation type splicing component comprising mutually splicing
The first splice 1 and the second splice 2.Wherein, the first vertical plug division 11 is provided on the first splice 1, first is vertical
Plug division 11 has the first slot 111 and the first grafting block 112, is provided with the second vertical plug division 21 on the second splice 2, the
Two vertical plug divisions 21 have the second slot 211 and the second grafting block 212；First splice 1 and the second splice 2 pass through first
Vertical plug division 11 and the second vertical plug division 21 are mutually inserted connection.
Specifically, the second slot 211 of the first grafting block 112 and the second vertical plug division 21 of the first vertical plug division 11
Cooperate grafting, the first slot 111 of the first vertical plug division 11 and the second grafting block 212 cooperation of the second vertical plug division 21 are inserted
It connects, and after the first grafting block 112 of the first vertical plug division 11 and 211 grafting of the second slot of the second vertical plug division 21, encloses
At vertical splicing gap 4, the open-topped encapsulating pond for encapsulating is also formed between the first splice 1 and the second splice 2
5, the glue hole 213 in connection encapsulating pond 5 and vertical splicing gap 4 is offered on the second splice 2.
The potting operation of the encapsulation type splicing component is as follows: as shown in Fig. 2, Fig. 4-Fig. 8, when being potted, passing through note
Sebific duct 6 injects glue in encapsulating pond 5 from the position top opening a in encapsulating pond 5, and glue under gravity and injection pressure due to first filling out
It is charged to the position b in encapsulating pond 5, is then dispersed around, when glue is filled to the position c, i.e., glue is filled to glue hole 213
Lower edge where height and position when, glue can be flowed into vertical splicing gap by the glue hole 213 on the second splice 2
In 4.With the continuous filling of glue, the vertical glue liquid level spliced in gap 4 is gradually raised from bottom, and the glue of filling can be with
The air of bottom is discharged, ensure that there will not be the residual of air in potting process.Glue is filled up into vertical splicing gap 4, most
Converge to form a complete encapsulating surface at top with the glue in vertical splicing gap 4 in whole encapsulating pond 5.Other fit clearances
Fill due to the effect realization of glue surface tension while being not in the exudation of a large amount of glue in place.
As it can be seen that the encapsulation type splicing component can guarantee filling quality of the glue in vertically splicing gap 4, and do not need
It is potted in vacuum environment, therefore, reduces encapsulating difficulty and cost, can disposably encapsulating formed, improve encapsulating
Efficiency.
Further, in the present embodiment, vertically the width in splicing gap 4 is 1mm~1.5mm, compared to existing filling
Envelope mode increases the width in vertical splicing gap 4, keeps encapsulating operation more smooth, and will not occur because gap increases
The encapsulatings quality problems such as bubble.The fit clearance of 2 remaining position of first splice 1 and the second splice can for 0.1mm~
0.15mm guarantees protection effect, and is not in the infiltration of glue.
As shown in Figure 1-Figure 3, in the present embodiment, the quantity of the first vertical plug division 11 and the second vertical plug division 21
Equal at least two, more preferably two, and the first vertical plug division 11 and the second vertical plug division 21 correspond cooperation and insert
It connects, between the first grafting block 112 of each first vertical plug division 11 and the second slot 211 of each second vertical plug division 21
It is respectively formed a vertical splicing gap 4, each vertical splicing gap 4 passes through corresponding glue hole 213 and encapsulating pond 5 respectively
Connection.
It is carried out by least two first vertical plug divisions 11 and the second vertical plug division 21 mating, can be improved
The splicing fastness of one splice 1 and the second splice 2.Certainly, it under the cooperation there are other location structures, can also only set
Set a first vertical plug division 11 and the second vertical plug division 21.When using two, two the first vertical 11 Hes of plug division
Second vertical plug division 21 is symmetrical arranged, and splicing stress and positioning are more uniform.
As depicted in figs. 1 and 2, two the first vertical plug divisions 11 two the first grafting blocks 112 be symmetrical arranged and direction
Inside, two the first slots 111 are accordingly towards inside；Correspondingly, the second grafting block 212 of two the second vertical plug divisions 21
Be symmetrical arranged and towards outside, two the second slots 211 are accordingly towards outside.When the first splice 1 and the second splice 2 are inserted
After connecing, therefore the inside that the vertical plug division 21 of the second of the second splice 2 is located at the first splice 1 glue hole 213 is arranged
On the second splice 2 for being located inside, pass through the encapsulating pond 5 between the first splice 1 and the second splice 2 logical
Glue hole 213 is connected to vertical splicing gap 4.
Further, in the present embodiment, either only one vertically splices gap 4 or is provided with multiple vertical spellings
Gap 4 is connect, each vertical corresponding multiple glue holes 213 in splicing gap 4, and multiple glue holes 213 are vertically sequentially arranged.This
Sample, glue can be entered in vertical splicing gap 4 by the glue hole 213 being vertically sequentially arranged, and increase the process face of glue
Product, glue filling are more smooth.Certainly, the acceptable only corresponding glue hole 213 in each vertical splicing gap 4, the glue hole
213 are located at the lower position in vertical splicing gap 4, facilitate the gas discharge in vertical splicing gap 4.Fig. 3 gives each
The case where vertical splicing gap 4 corresponds to two glue hole 213, certainly, determines glue hole 213 according to actual size and space
Quantity.
Further, in the present embodiment, glue hole 213 is the vertically extending slotted hole for vertically splicing gap 4,
The more convenient glue of slotted hole passes through.Specifically, a length of 3mm~4mm of slotted hole, width are 1.5mm~2mm, semi-circular portions
Radius is 0.5mm~1mm.It is highly preferred that the size of the slotted hole in the present embodiment are as follows: a length of 3.6mm, width 1.6mm, semicircle
Partial radius is 0.8mm.Certainly, the size of glue hole 213 according to the actual situation depending on, it is not limited to cited by the present embodiment
Size range.
In addition, glue hole 213 can also be the other shapes of through-holes such as circular hole, rectangular opening, elliptical aperture, as long as can be realized
The circulation of glue.
As shown in Figures 2 and 3, in the present embodiment, the second grafting of the second vertical plug division 21 is arranged in glue hole 213
On block 212, and close to the end face of the first splice 1, since the second grafting block 212 splices gap 4 closer to vertical,
Glue hole 213 is arranged on the second grafting block 212, glue can be made rapidly to be passed through in vertical splicing gap 4.Certainly logical glue
The other positions in the second vertical plug division 21 also can be set in hole 213, position on the inside of such as U-lag where the second slot 211
It sets, as long as can be realized the connection in encapsulating pond 5 and vertical splicing gap 4.
As shown in Figure 5-Figure 8, it is completely exhausted out in order to further ensure vertically splicing the gas in gap 4, in the present embodiment
In, the vertical bottom for splicing gap 4 is not less than the lower edge of glue hole 213, and the bottom in encapsulating pond 5 is not higher than glue hole 213
Lower edge.So set, glue could pass through glue hole 213 into vertically after being first filled in the bottom certain altitude in encapsulating pond 5
Splice in gap 4, directly filled since the vertically bottom in splicing gap 4, avoids glue and fall from vertical splicing gap 4
To bottom, so as to empty the gas in gap.
As depicted in figs. 1 and 2, based on encapsulation type splicing component described in any of the above embodiment, the utility model is real
It applies example and additionally provides a kind of electronic product, which includes the encapsulation type splicing group as described in any of the above embodiment
Part.The electronic product can be the other pairs of higher electronic products of protection level requirements such as automobile electronics.Since electronics produces
Product use the encapsulation type splicing component in the utility model, thereby it is ensured that filling of the glue in vertically splicing gap 4
Quality, and do not need to be potted in vacuum environment, therefore, reduces encapsulating difficulty and cost, can disposable encapsulating at
Type improves encapsulating efficiency, ensure that the protection quality of electronic product.
Further, in the present embodiment, electronic product further includes circuit board 3, and the first splice 1 is shell, and second spells
Fitting 2 is connector, and shell and connector are preferably injection molding structure, and circuit board 3 is fixed on shell, connection
The PIN needle and circuit board 3 of device pass through welding electrical connection.The top and side of shell are uncovered structure, and the side of the opening is set
It is equipped with the first vertical plug division 11, accordingly, the side of connector is provided with the second vertical plug division 21, and connector and shell are inserted
After connecing, the semi-finished product of upper surface opening are formed, for carrying out encapsulating operation from top.
Certainly, for different electronic products, the first splice 1 and the second splice 2 can be any component, as long as energy
Splicing is enough realized by the splicing construction in the utility model.
In the present embodiment, it is provided with positioning column 12 on shell, location hole 31, circuit board 3 are correspondingly arranged on circuit board 3
It is fixed on shell by positioning column 12 and the positioning of location hole 31, improves positioning accuracy, ease of assembly.Certainly, circuit board 3
It can directly be fixed by screws on shell.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new
Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest scope consistent with features of novelty.
Claims (10)
1. a kind of encapsulation type splicing component, which is characterized in that including the first splice (1) and the second splice (2), described first
It is provided with the first vertical plug division (11) on splice (1), is provided with the second vertical plug division on second splice (2)
(21), first splice (1) and second splice (2) pass through the described first vertical plug division (11) and described second
Vertical plug division (21) is mutually inserted connection, and the first grafting block (112) of the first vertical plug division (11) and described the
The second slot (211) grafting of two vertical plug divisions (21) surrounds vertical splicing gap (4), first splice (1) and institute
It states and also forms the open-topped encapsulating pond (5) for encapsulating between the second splice (2), opened on second splice (2)
Equipped with the glue hole (213) for being connected to the encapsulating pond (5) and vertical splicing gap (4).
2. encapsulation type splicing component according to claim 1, which is characterized in that the width of vertical splicing gap (4)
For 1mm~1.5mm.
3. encapsulation type splicing component according to claim 1, which is characterized in that the first vertical plug division (11) and institute
It states the quantity equal at least two of the second vertical plug division (21) and corresponds cooperation grafting, each first vertical grafting
Second slot (211) of the first grafting block (112) in portion (11) and each second vertical plug division (21) it
Between be respectively formed the vertical splicing gap (4), each vertical splicing gap (4) is respectively by corresponding described
Glue hole (213) is connected to the encapsulating pond (5).
4. encapsulation type splicing component according to claim 3, which is characterized in that each vertical splicing gap (4) is right
Multiple glue holes (213) are answered, and the glue hole (213) is vertically sequentially arranged.
5. encapsulation type splicing component according to claim 1-4, which is characterized in that the glue hole (213) is
Along the vertically extending slotted hole of vertical splicing gap (4).
6. encapsulation type splicing component according to claim 1-4, which is characterized in that the glue hole (213) sets
It sets on the second grafting block (212) of the described second vertical plug division (21).
7. encapsulation type splicing component according to claim 1-4, which is characterized in that the vertical splicing gap
(4) bottom is not less than the lower edge of the glue hole (213), and the bottom of the encapsulating pond (5) is not higher than the glue hole
(213) lower edge.
8. a kind of electronic product, which is characterized in that including the described in any item encapsulation type splicing components of such as claim 1-7.
9. electronic product according to claim 8, which is characterized in that further include circuit board (3), first splice
It (1) is shell, second splice (2) is connector, and the circuit board (3) is fixed on the shell, the connector
PIN needle (22) and the circuit board (3) be electrically connected.
10. electronic product according to claim 9, which is characterized in that it is provided on the shell positioning column (12), it is described
The location hole (31) with the positioning column (12) corresponding matching is provided on circuit board (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820929062.4U CN208336606U (en) | 2018-06-14 | 2018-06-14 | A kind of encapsulation type splicing component and electronic product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820929062.4U CN208336606U (en) | 2018-06-14 | 2018-06-14 | A kind of encapsulation type splicing component and electronic product |
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| CN208336606U true CN208336606U (en) | 2019-01-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109725282A (en) * | 2019-03-11 | 2019-05-07 | 苏州寻息电子科技有限公司 | Totally-enclosed encapsulating beacon and its dosing technology |
-
2018
- 2018-06-14 CN CN201820929062.4U patent/CN208336606U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109725282A (en) * | 2019-03-11 | 2019-05-07 | 苏州寻息电子科技有限公司 | Totally-enclosed encapsulating beacon and its dosing technology |
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