CN208336167U

CN208336167U - A kind of semiconductor packages die bonder

Info

Publication number: CN208336167U
Application number: CN201821130666.9U
Authority: CN
Inventors: 张顺; 陈建雄
Original assignee: FOSHAN BLUE ROCKET ELECTRONICS Co Ltd
Current assignee: FOSHAN BLUE ROCKET ELECTRONICS Co Ltd
Priority date: 2018-07-17
Filing date: 2018-07-17
Publication date: 2019-01-04
Anticipated expiration: 2028-07-17

Abstract

The utility model relates to semiconductor packages bonding device fields, more particularly to a kind of semiconductor packages die bonder, including feeding device and anti-overflow device；The feeding device includes: material box frame, magazine, the fixed cylinder of magazine and magazine sensors in place；The side of the magazine is feeder, and the other side is exit side, and the magazine is arranged inside the material box frame；The anti-overflow device includes: block, link block, rotation axis, elastic component, the first fixed column and the second fixed column；The block is fixed by the rotation axis or what can axially be rotated is installed on the link block；The anti-overflow device is set to the exit side of the material box frame by the link block, and when use state, and the side orthographic projection of the block of the anti-overflow device and the magazine has lap.Effectively frame material can be prevented to overflow, reduce the waste of product cost caused by damage of product, improve productivity while reducing security risk caused by frame material overflows.

Description

A kind of semiconductor packages die bonder

Technical field

The utility model relates to semiconductor packages bonding device fields, more particularly to a kind of half with anti-overflow device Conductor encapsulates die bonder.

Background technique

Demand of the electronic market to high power semiconduction tube increasingly increases in recent years, and the cost of raw material of production constantly increases Add, in order to more save production cost, prevents unnecessary loss, at present the blanking of SS-DT01 and JAF-380 die bonder Portion is not no anti-overflow device, is easy to cause the hidden danger of quality such as deformation, the damage of product during production, make to cost The problems such as being wasted at cost, influencing production efficiency.

Utility model content

In order to overcome the problems, such as that existing semiconductor packages die bonder exists, the utility model provides a kind of with anti- The semiconductor packages die bonder of overflow device.

To reach this purpose, the following technical solution is employed for the utility model:

A kind of semiconductor packages die bonder, including feeding device and anti-overflow device；

The feeding device includes: material box frame, magazine, the fixed cylinder of magazine and magazine sensors in place；

The side of the magazine is feeder, and the other side is exit side, and the magazine is arranged inside the material box frame；Institute State the inside that the fixed cylinder of magazine is set to the material box frame；The magazine sensors in place is set to the outer of the material box frame Side；When the magazine is replaced in the material box frame, the fixed cylinder of the magazine plays fixed function；

The anti-overflow device includes: block, link block, rotation axis, elastic component, the first fixed column and the second fixed column；

The block is fixed by the rotation axis or what can axially be rotated is installed on the link block；Described first is fixed Column is set in the link block；Second fixed column is set in the block；First fixed column and described second Fixed column is connected with each other by the elastic component；

The anti-overflow device is set to the exit side of the material box frame by the link block, and when use state, institute The orthographic projection stated on the block of anti-overflow device and the side surface direction of the magazine has lap.

Preferably, the block includes the first block and the second block；First block and second block pass through Fixed screw is connected with each other.

Preferably, the elastic component is elastic tension spring.

Preferably, the lateral surface setting of second block is fluted；The rotation axis is arranged in the groove.

Preferably, the link block is L-type structure.

Preferably, through-hole is provided in the short side of the link block；The rotation axis is set in the through-hole.

Preferably, the material of the anti-overflow device is stainless steel.

Preferably, the magazine is hollow structure；The magazine side is pan feeding side.

Preferably, the material box frame includes 4 vertical supports and 4 horizontal struts；Lead between two vertical supports The horizontal strut is crossed to be connected with each other.

Preferably, the anti-overflow device is set on the vertical support of the material box frame trailing flank.

The semiconductor packages die bonder can be in an orderly manner to the magazine transportation frame material.But frame material exists It is easy to overflow in the magazine, cause deformation of products, stain, collapse damage and other issues.The anti-overflow device can be effectively It prevents frame material from overflowing, reduces the waste of product cost caused by damage of product, quality dissatisfaction, reduce frame material and overflow Caused by security risk while improve the productivity of product.

Detailed description of the invention

Fig. 1 is the main view of the utility model one embodiment.

Fig. 2 is the side view of the utility model one embodiment.

Fig. 3 is the main view of the anti-overflow device of one embodiment of the utility model.

Fig. 4 is the schematic perspective view of the magazine of one embodiment of the utility model.

Wherein: feeding device 1, anti-overflow device 2, material box frame 11, vertical support 111, horizontal strut 112, magazine 12, material Box fixes cylinder 13, magazine sensors in place 14, block 21, the first block 211, the second block 212, link block 22, rotation axis 23, elastic component 24, the first fixed column 251, the second fixed column 252.

Specific embodiment

Illustrate with reference to the accompanying drawing and the technical solution of the utility model is further illustrated by specific embodiment.

A kind of semiconductor packages die bonder as shown in Figure 1, including feeding device 1 and anti-overflow device 2；

The feeding device 1 includes: material box frame 11, magazine 12, the fixed cylinder 13 of magazine and magazine sensors in place 14；

The side of the magazine 12 is feeder, and the other side is exit side, and the magazine 12 is arranged in the material box frame 11 It is internal；The fixed cylinder 13 of the magazine and the magazine sensors in place 14 are set to the outside of the material box frame 11；The material When box 12 is replaced in the material box frame 11, the fixed cylinder 13 of the magazine plays fixed function；

The anti-overflow device 2 includes: block 21, link block 22, rotation axis 23, elastic component 24,251 and of the first fixed column Second fixed column 252；

The block 21 is fixed by the rotation axis 23 or what can axially be rotated is installed on the link block 22；Described One fixed column 251 is set in the link block 22；Second fixed column 252 is set in the block 21；Described first Fixed column 251 and second fixed column 252 are connected with each other by the elastic component 24；

The anti-overflow device 2 is set to the exit side of the material box frame 11, and use state by the link block 22 When, the block 21 of the anti-overflow device 2 has lap with the orthographic projection in the side surface direction of the magazine 12.

For the semiconductor packages die bonder in feeding, frame material is to enter discharging from the feeder of magazine 12 Portion is that transverse shifting is fed, and when transverse shifting, frame material is easy to overflow in the magazine 12, that is, protrudes from magazine Side, cause deformation of products, stain, collapse damage and other issues.

For this purpose, the application proposes that the exit side of the material box frame 11 is provided with anti-overflow device, it can be by described in rotation Block 21 adjusts the position of the block 21, when use state, the block 21 of anti-overflow device and the side surface direction of magazine 12 On orthographic projection have lap, effectively frame material can be prevented to overflow, reduce damage of product, quality dissatisfaction causes Product cost waste, improve the yield rate of product while reducing security risk caused by frame material overflows；The bullet Property part is fixed in first fixed column 211 and second fixed column 212；The elastic component 24 is the block 21 in institute It states rotation in rotation axis 23 and provides elastic force, keep the block 21 resilient to initial position.

In addition, magazine sensors in place 14 is equipped on the material box frame 11 of semiconductor packages die bonder, for incuding material Box 12 in place, can be in an orderly manner to 12 transportation frame material of magazine, and the product type of the magazine sensors in place 14 is OMRON E2E-X14MD1。

Preferably, the block includes the first block 211 and the second block 212；First block 211 and described second Block 212 is connected with each other by fixed screw.

First block 211 and the second block 212 are suitable for the height of magazine to adjust the length of the block 21；Institute It states there are certain gap between the first block 211 and second block 212, second fixed column 252 is set to described In gap between first block 211 and second block 212, the sky of stretching is provided for the setting of the elastic component 24 Between, second fixed column 252 is connected with each other by the elastic component 24 with first fixed column 251.

Preferably, the elastic component 24 is elastic tension spring.

The elastic component 24 is elastic tension spring, and the block 21 can be rotated with the rotation axis 23, and the elastic tension spring can So that the block 21 has elasticity in the course of rotation, to ensure that protect-ing frame structure material can be being carried out according to the actual situation not The magazine 12 can be overflowed.

Preferably, the lateral surface setting of second block 212 is fluted；The rotation axis 23 is set to the groove It is interior.

Second block, the 212 lateral surface setting is fluted, and the rotation axis 23 is arranged in the groove, the block 21 can be rotated by the rotation axis 23, allow the random adjusting position of the anti-overflow device 2, it is ensured that in the magazine 12 Frame material do not overflow.

Preferably, the link block 22 is L-type structure.

Preferably, through-hole is provided in the short side of the link block 22；The rotation axis 23 is set in the through-hole.

The link block 22 is L-type structure, and is provided with the through-hole through 23 short side of rotation axis, the link block 22 Long side be set on the feeding device 1, play a fixed effect；The rotation axis 23 passes through the link block 22 Short side rotates the anti-overflow device along the rotation axis 23.

Preferably, the material of the anti-overflow device 2 is stainless steel.

The anti-overflow device 2 is made by stainless steel material, and integral hardness is high, long service life, in use process In, it is not easy to it breaks down or deforms, and reduce the production efficiency of product.

Preferably, the magazine 12 is hollow structure；12 side of magazine is pan feeding side.

The magazine 12 as shown in Figure 4 is hollow structure；12 side of magazine is pan feeding side.Frame material need from The side of the material box frame 11 enters, and is arranged in the magazine 12.The hollow structure of the magazine 12 can faster make Frame material is arranged in the magazine 12.

Preferably, the material box frame 11 includes 4 vertical support 111 and 4 horizontal struts 112；Two vertical branch It is connected with each other between column 111 by the horizontal strut 112.

The material box frame 11 is provided with vertical support 111 and horizontal strut 112, is placed on the magazine 12 described On horizontal strut 112, and frame material can enter in the magazine 12 from the side of the material box frame.

Preferably, the anti-overflow device 2 is set on the vertical support 111 of 11 trailing flank of material box frame.

The anti-overflow device 2 is set on the vertical support 111 of 12 trailing flank of material box frame, which is the material The tail end of box 12, the anti-overflow device 2 can effectively prevent frame material from overflowing in the magazine 12.

Technical principle of the utility model has been described above with reference to specific embodiments.These descriptions are intended merely to explain this reality With novel principle, and it cannot be construed to the limitation to scope of protection of the utility model in any way.Based on the explanation herein, Those skilled in the art, which does not need to pay for creative labor, can associate with other specific implementation modes of this utility model, These modes are fallen within the protection scope of the utility model.

Claims

1. a kind of semiconductor packages die bonder, it is characterised in that: including feeding device and anti-overflow device；

The side of the magazine is feeder, and the other side is exit side, and the magazine is arranged inside the material box frame；The material The fixed cylinder of box and the magazine sensors in place are set to the outside of the material box frame；The magazine in the material box frame more When changing, the fixed cylinder of the magazine plays fixed function；

The block is fixed by the rotation axis or what can axially be rotated is installed on the link block；First fixed column is set It is placed in the link block；Second fixed column is set in the block；First fixed column and described second is fixed Column is connected with each other by the elastic component；

The anti-overflow device is set to the exit side of the material box frame by the link block, and when use state, described anti- Orthographic projection in the side surface direction of the block of overflow device and the magazine has lap.

2. a kind of semiconductor packages die bonder according to claim 1, it is characterised in that: the block includes first gear Block and the second block；First block and second block are connected with each other by fixed screw.

3. a kind of semiconductor packages die bonder according to claim 1, it is characterised in that: the elastic component is that elasticity is drawn Spring.

4. a kind of semiconductor packages die bonder according to claim 2, it is characterised in that: the outside of second block Face setting is fluted；The rotation axis is arranged in the groove.

5. a kind of semiconductor packages die bonder according to claim 1, it is characterised in that: the link block is L-type knot Structure.

6. a kind of semiconductor packages die bonder according to claim 4, it is characterised in that: in the short side of the link block It is provided with through-hole；The rotation axis is set in the through-hole.

7. a kind of semiconductor packages die bonder according to claim 1, it is characterised in that: the material of the anti-overflow device Material is stainless steel.

8. a kind of semiconductor packages die bonder according to claim 1, it is characterised in that: the magazine is hollow knot Structure；The magazine side is pan feeding side.

9. a kind of semiconductor packages die bonder according to claim 1, it is characterised in that: the material box frame includes 4 Vertical support and 4 horizontal struts；It is connected with each other between two vertical supports by the horizontal strut.

10. a kind of semiconductor packages die bonder according to claim 8, it is characterised in that: the anti-overflow device is set It is placed on the vertical support of the material box frame trailing flank.