CN208333522U - A kind of measurement jig for glass and silicon wafer - Google Patents
A kind of measurement jig for glass and silicon wafer Download PDFInfo
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- CN208333522U CN208333522U CN201821059276.7U CN201821059276U CN208333522U CN 208333522 U CN208333522 U CN 208333522U CN 201821059276 U CN201821059276 U CN 201821059276U CN 208333522 U CN208333522 U CN 208333522U
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- measurement jig
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Abstract
The utility model relates to jig technical fields, more particularly, to a kind of measurement jig for glass and silicon wafer, including substrate and pillar；Herringbone protrusion is provided on the upper surface of the substrate, several slots are provided in the herringbone protrusion, the pillar is inserted into the slot, and the free end of the pillar be it is arc-shaped, the diameter of the pillar and height are gradually increased with the area of glass or silicon wafer respectively.This programme can be placed glass or silicon wafer of different sizes, be met its measurement request, facilitate worker operation by using different size of pillar.
Description
Technical field
The utility model relates to jig technical fields, more particularly, to a kind of measurement jig for glass and silicon wafer.
Background technique
Currently, when being measured to glass, silicon wafer, it is general to require by the way of supported at three point, in actual use,
Generally multiple brackets can be made according to the difference of workpiece size size, complete the measurement of variety classes workpiece, increase jig cost,
Simultaneously repeatedly take different brackets, be unfavorable for the operation of staff.
Utility model content
One of the utility model is designed to provide a kind of measurement jig for glass and silicon wafer, existing at least to solve
There is one of technical problem present in technology.
To achieve the goals above, the utility model provides following technical scheme；
Measurement jig provided by the utility model for glass and silicon wafer, including substrate and pillar；
It is provided with herringbone protrusion on the upper surface of the substrate, is provided with several slots in the herringbone protrusion,
The pillar is inserted into the slot, and the free end of the pillar is arc-shaped, the diameter and height difference of the pillar
It is gradually increased with the area of glass or silicon wafer.
In the above-mentioned technical solutions, further, the lower surface of the substrate is provided with smooth layer.
In any of the above-described technical solution, further, the upper surface of the herringbone protrusion is provided with smooth layer.
In any of the above-described technical solution, further, the pillar includes cylindrical column and bulb；The cylinder
One end of column is inserted into the slot, and the other end is connected with the bulb.
In any of the above-described technical solution, further, the pillar is made of silica gel material integrated molding.
In any of the above-described technical solution, further, several locating slots, the positioning are additionally provided on the substrate
Positioning bumping post is detachably provided in slot.
In any of the above-described technical solution, further, several described locating slots are randomly distributed on the substrate,
For keeping out contact by the positioning bumping post to glass of different shapes or silicon wafer.
In any of the above-described technical solution, further, the quantity of the locating slot is and described fixed at least provided with two
Position bumping post is identical as the quantity of the locating slot.
In any of the above-described technical solution, further, the height of the pillar is 5-16mm；And/or
The diameter of the pillar is 6-15mm.
In any of the above-described technical solution, further, the angular range between two supporting legs of the herringbone protrusion is
119 ° to 121 °.
By adopting the above technical scheme, the utility model has the following beneficial effects:
Measurement jig provided by the utility model for glass and silicon wafer is provided with herringbone on the upper surface of the substrate
Shape is raised, is provided with several slots in the herringbone protrusion, and the pillar is inserted into the slot, and the pillar
Free end be it is arc-shaped, the diameter of the pillar and height are gradually increased with the area of glass or silicon wafer respectively, can be by making
With different size of pillar, glass or silicon wafer of different sizes are placed, meets its measurement request, facilitates worker operation.
Measurement jig provided by the utility model for glass and silicon wafer, it is rectangular and circular to can satisfy needles of various sizes
The measurement demand of glass or silicon slice workpiece.
The additional aspect and advantage of the utility model will become obviously in following description section, or practical new by this
The practice of type is recognized.
Detailed description of the invention
It below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic perspective view provided by the embodiment of the utility model for glass and the measurement jig of silicon wafer；
Fig. 2 is the viewing angle constructions schematic diagram shown in FIG. 1 for glass and the measurement jig of silicon wafer；
Fig. 3 is another viewing angle constructions schematic diagram shown in FIG. 1 for glass and the measurement jig of silicon wafer；
Fig. 4 is the signal of the embodiment provided by the embodiment of the utility model for glass and the measurement jig of silicon wafer
Figure；
Fig. 5 is showing for another embodiment provided by the embodiment of the utility model for glass and the measurement jig of silicon wafer
It is intended to；
Fig. 6 is the angle of the herringbone protrusion provided by the embodiment of the utility model for glass and the measurement jig of silicon wafer
Schematic diagram.
Appended drawing reference:
10- substrate；101- herringbone protrusion；102- locating slot；11- pillar；12- positions bumping post；
20- glass.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work belongs to practical
Novel protected range.It should be noted that in the absence of conflict, the feature in embodiments herein and embodiment can
To be combined with each other.
It is in the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
Explanation is further explained to the utility model below with reference to specific embodiment.
Fig. 1 is the schematic perspective view provided by the embodiment of the utility model for glass and the measurement jig of silicon wafer；
Fig. 2 is the viewing angle constructions schematic diagram shown in FIG. 1 for glass and the measurement jig of silicon wafer；Fig. 3 is shown in FIG. 1 for glass
Another viewing angle constructions schematic diagram of the measurement jig of glass and silicon wafer；Fig. 4 be it is provided by the embodiment of the utility model for glass and
The schematic diagram of one embodiment of the measurement jig of silicon wafer；Fig. 5 is provided by the embodiment of the utility model for glass and silicon wafer
Measurement jig another embodiment schematic diagram；Fig. 6 is provided by the embodiment of the utility model for glass and silicon wafer
Measure the angle schematic diagram of the herringbone protrusion of jig.
Embodiment one
Glass or silicon wafer can be directed to, wherein round piece measures size range: diameter range 60-300mm；It is rectangular
Workpiece calibration size range is；Side length 50-300mm.
As shown in figs 1 to 6, the measurement jig provided in this embodiment for glass and silicon wafer, including substrate 10 and pillar
11；
It is provided with herringbone protrusion 101 on the upper surface of the substrate 10, is provided in the herringbone protrusion 101 several
A slot, the pillar 11 are inserted into the slot, and the free end of the pillar 11 be it is arc-shaped, the pillar 11 it is straight
Diameter and height are gradually increased with the area of glass 20 or silicon wafer respectively.It can be placed big by using different size of pillar 11
Small different glass 20 or silicon wafer, meet its measurement request, facilitate worker operation.
On the basis of the above embodiments, the lower surface of the substrate 10 is provided with smooth layer.
Further, the upper surface of the herringbone protrusion 101 is provided with smooth layer.
In this embodiment, smooth layer can be formed by the grinding process to substrate 10, meanwhile, flatness
Error requirements are within ± 15 μm.Guarantee respective flatness, improves precision when measurement.
In an optional embodiment of above-described embodiment, the pillar 11 includes cylindrical column and bulb；Institute
The one end for stating cylindrical column is inserted into the slot, and the other end is connected with the bulb.
Optionally, the pillar 11 is made of silica gel material integrated molding.
In this embodiment, pillar 11 is made by the integrated molding of silica gel material Precision Machining, bulb is in glass 20
Or silicon wafer contact supports, and prevents plowing from glass 20 or silicon wafer, improves the reliability of product.
On the basis of any of the above-described embodiment, as shown in Figure 1, Figure 4 and Figure 5, if being additionally provided on the substrate 10
A locating slot 102 is done, positioning bumping post 12 is detachably provided in the locating slot 102.
Further, several described locating slots 102 are randomly distributed on the substrate 10, for not similar shape
The glass 20 or silicon wafer of shape keep out contact by the positioning bumping post 12.
It should be noted that the quantity of the locating slot 102 is at least provided with two, and the positioning bumping post 12 with it is described
The quantity of locating slot 102 is identical.
In this embodiment it is possible to for the area of different glass 20 or silicon wafer to glass 20 of different shapes or silicon wafer work
Part carries out the setting of 102 position of locating slot, to facilitate positioning bumping post 12 to keep out glass 20 or silicon chip edge, meanwhile, positioning
Bumping post 12 can be formed using the soft materials Precision Machining of nylon material, avoid 20 edge of gouge glass or silicon chip edge.
Based on any of the above embodiments, the height of the pillar 11 is 5-16mm；And/or
The diameter of the pillar 11 is 6-15mm.
In this embodiment, different diameter and height can be selected according to different 20 areas of glass, pillar 11.
Based on any of the above embodiments, as shown in fig. 6, folder between two supporting legs of the herringbone protrusion 101
Angular region is 119 ° to 121 °.It is more stable to the support of glass 20 or silicon wafer to guarantee the support angle of three supporting points.
In a specific embodiment of the utility model, as shown in Fig. 1-Fig. 3, Fig. 5 and Fig. 6, for a circle
20 workpiece of shape glass is illustrated, and the diameter of round piece is 60mm, and it is convex to be provided with herringbone on the upper surface of the substrate 10
101 are played, the angle between two supporting legs of the herringbone protrusion 101 is 120 °, and the lower surface of the substrate 10 is provided with smoothly
Layer, the upper surface of the herringbone protrusion 101 are provided with smooth layer, and the error requirements of the flatness of smooth layer are within ± 15 μm
Several slots are provided in the herringbone protrusion 101, the pillar 11 is inserted into the slot, and the pillar 11
Free end be it is arc-shaped, the pillar 11 include cylindrical column and bulb；One end insertion of the cylindrical column is described to insert
In slot, the other end is connected with the bulb, and the pillar 11 is made of silica gel material integrated molding, the diameter of the pillar 11
It is highly gradually increased respectively with the area of glass 20 or silicon wafer, the height of the pillar 11 is 6mm, the diameter of the pillar 11
For 8mm.Glass 20 or silicon wafer of different sizes can be placed, its measurement request is met by using different size of pillar 11,
Facilitate worker operation, several locating slots 102 are additionally provided on the substrate 10, are removably disposed in the locating slot 102
There is positioning bumping post 12, there are two the quantity of the locating slot 102, and the quantity of the positioning bumping post 12 and the locating slot 102
It is identical, to facilitate positioning bumping post 12 to keep out 20 edge of glass, meanwhile, positioning bumping post 12 can be using the soft of nylon material
Material Precision Machining forms, and avoids 20 edge of gouge glass or silicon chip edge.
In another specific embodiment of the utility model, as shown in Fig. 1-Fig. 3, Fig. 4 and Fig. 6, for one
20 workpiece of square glass is illustrated, and the side length of rectangular shape workpiece is 80mm, is provided with herringbone on the upper surface of the substrate 10
Shape protrusion 101, the angle between two supporting legs of the herringbone protrusion 101 is 121 °, and the lower surface of the substrate 10 is provided with
Smooth layer, the upper surface of the herringbone protrusion 101 are provided with smooth layer, and the error requirements of the flatness of smooth layer are at ± 15 μm
Within be provided with several slots in the herringbone protrusion 101, the pillar 11 is inserted into the slot, and the pillar
11 free end be it is arc-shaped, the pillar 11 include cylindrical column and bulb；Institute is inserted into one end of the cylindrical column
It states in slot, the other end is connected with the bulb, and the pillar 11 is made of silica gel material integrated molding, the pillar 11
Diameter and height are gradually increased with the area of glass 20 or silicon wafer respectively, and the height of the pillar 11 is 8mm, the pillar 11
Diameter is 10mm.Glass 20 or silicon wafer of different sizes can be placed, its measurement is met by using different size of pillar 11
It is required that facilitate worker operation, it is additionally provided with several locating slots 102 on the substrate 10, in the locating slot 102 removably
It is provided with positioning bumping post 12, there are three the quantity of the locating slot 102, and the positioning bumping post 12 and the locating slot 102
Quantity is identical, to facilitate positioning bumping post 12 to keep out 20 edge of glass, meanwhile, positioning bumping post 12 can be using nylon material
Soft materials Precision Machining forms, and avoids 20 edge of gouge glass or silicon chip edge.
In a specific embodiment of the utility model, as shown in Fig. 1-Fig. 3, Fig. 5 and Fig. 6, for a circle
20 workpiece of shape glass is illustrated, and the diameter of round piece is 300mm, and it is convex to be provided with herringbone on the upper surface of the substrate 10
101 are played, the angle between two supporting legs of the herringbone protrusion 101 is 120 °, and the lower surface of the substrate 10 is provided with smoothly
Layer, the upper surface of the herringbone protrusion 101 are provided with smooth layer, and the error requirements of the flatness of smooth layer are within ± 15 μm
Several slots are provided in the herringbone protrusion 101, the pillar 11 is inserted into the slot, and the pillar 11
Free end be it is arc-shaped, the pillar 11 include cylindrical column and bulb；One end insertion of the cylindrical column is described to insert
In slot, the other end is connected with the bulb, and the pillar 11 is made of silica gel material integrated molding, the diameter of the pillar 11
Highly be gradually increased respectively with the area of glass 20 or silicon wafer, the height of the pillar 11 is 16mm, the pillar 11 it is straight
Diameter is 15mm.Glass 20 or silicon wafer of different sizes can be placed by using different size of pillar 11, meet its measurement and want
It asks, facilitates worker operation, several locating slots 102 are additionally provided on the substrate 10, are removably set in the locating slot 102
It is equipped with positioning bumping post 12, there are two the quantity of the locating slot 102, and the number of the positioning bumping post 12 and the locating slot 102
Measure it is identical, to facilitate positioning bumping post 12 to keep out 20 edge of glass, meanwhile, positioning bumping post 12 can be soft using nylon material
Property material Precision Machining forms, and avoids 20 edge of gouge glass or silicon chip edge.
Specifically, in the prior art, when being measured to glass, silicon wafer, the general side for requiring to use supported at three point
Formula generally can make multiple brackets according to the difference of workpiece size size, complete the survey of variety classes workpiece in actual use
Amount increases jig cost, at the same repeatedly take different brackets, be unfavorable for the operation of staff, and the utility model provides
The measurement jig for glass and silicon wafer, herringbone protrusion, the herringbone protrusion are provided on the upper surface of the substrate
On be provided with several slots, the pillar is inserted into the slot, and the free end of the pillar be arc-shaped, the branch
The diameter and height of column are gradually increased with the area of glass or silicon wafer respectively, can be placed by using different size of pillar
Glass or silicon wafer of different sizes, meets its measurement request, facilitates worker operation.
Measurement jig provided by the utility model for glass and silicon wafer, it is rectangular and circular to can satisfy needles of various sizes
The measurement demand of glass or silicon slice workpiece.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.In addition, it will be appreciated by those of skill in the art that although some implementations described herein
Example includes certain features included in other embodiments rather than other feature, but the group of the feature of different embodiments is desirable
Taste within the scope of the utility model and form different embodiments.For example, in claims above, institute
Claimed embodiment it is one of any can in any combination mode come using.It is disclosed in the background technology part
Information is merely intended to deepen the understanding to the general background technology of the utility model, and is not construed as recognizing or with any shape
Formula implies that the information constitutes the prior art known to those skilled in the art.
Claims (10)
1. a kind of measurement jig for glass and silicon wafer, which is characterized in that including substrate and pillar；
It is provided with herringbone protrusion on the upper surface of the substrate, is provided with several slots in the herringbone protrusion, it is described
Pillar is inserted into the slot, and the free end of the pillar be it is arc-shaped, the diameter of the pillar and height are respectively with glass
The area of glass or silicon wafer is gradually increased.
2. the measurement jig according to claim 1 for glass and silicon wafer, which is characterized in that
The lower surface of the substrate is provided with smooth layer.
3. the measurement jig according to claim 1 for glass and silicon wafer, which is characterized in that
The upper surface of the herringbone protrusion is provided with smooth layer.
4. the measurement jig according to claim 1 for glass and silicon wafer, which is characterized in that
The pillar includes cylindrical column and bulb；One end of the cylindrical column is inserted into the slot, the other end with
The bulb is connected.
5. the measurement jig according to claim 4 for glass and silicon wafer, which is characterized in that
The pillar is made of silica gel material integrated molding.
6. the measurement jig according to claim 1 for glass and silicon wafer, which is characterized in that
It is additionally provided with several locating slots on the substrate, positioning bumping post is detachably provided in the locating slot.
7. the measurement jig according to claim 6 for glass and silicon wafer, which is characterized in that
Several described locating slots are randomly distributed on the substrate, for passing through institute to glass of different shapes or silicon wafer
That states positioning bumping post keeps out contact.
8. the measurement jig according to claim 6 for glass and silicon wafer, which is characterized in that
The quantity of the locating slot is at least provided with two, and the positioning bumping post is identical as the quantity of the locating slot.
9. the measurement jig according to any one of claim 1 to 8 for glass and silicon wafer, which is characterized in that
The height of the pillar is 5-16mm；And/or
The diameter of the pillar is 6-15mm.
10. the measurement jig according to any one of claim 1 to 8 for glass and silicon wafer, which is characterized in that
Angular range between two supporting legs of the herringbone protrusion is 119 ° to 121 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821059276.7U CN208333522U (en) | 2018-07-04 | 2018-07-04 | A kind of measurement jig for glass and silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821059276.7U CN208333522U (en) | 2018-07-04 | 2018-07-04 | A kind of measurement jig for glass and silicon wafer |
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| Publication Number | Publication Date |
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| CN208333522U true CN208333522U (en) | 2019-01-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108592976A (en) * | 2018-07-04 | 2018-09-28 | 常州天寅智造科技股份有限公司 | A kind of measurement jig for glass and silicon chip |
-
2018
- 2018-07-04 CN CN201821059276.7U patent/CN208333522U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108592976A (en) * | 2018-07-04 | 2018-09-28 | 常州天寅智造科技股份有限公司 | A kind of measurement jig for glass and silicon chip |
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