CN208298860U - A kind of LED packaging and die bonding lacquer disk(-sc) - Google Patents
A kind of LED packaging and die bonding lacquer disk(-sc) Download PDFInfo
- Publication number
- CN208298860U CN208298860U CN201820702597.8U CN201820702597U CN208298860U CN 208298860 U CN208298860 U CN 208298860U CN 201820702597 U CN201820702597 U CN 201820702597U CN 208298860 U CN208298860 U CN 208298860U
- Authority
- CN
- China
- Prior art keywords
- lacquer disk
- disk
- die bonding
- led packaging
- bulge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The utility model discloses a kind of LED packaging and die bonding lacquer disk(-sc)s, including lacquer disk(-sc), the lacquer disk(-sc) includes the edge for being located at the disk body of bottom and being distributed upwards along disk body, the surface of the lacquer disk(-sc) inner tray is partially cavity upwards, the cavity is provided centrally with the groove extended within disc surfaces, the groove surrounding is provided with the bulge A higher than disc surfaces, it is to be provided with the notch be laterally connected among the bulge A, it is fixed with the boss to raise upward by the cavity of proximal edge, the boss height is lower than brim height.LED packaging and die bonding lacquer disk(-sc) provided by the utility model, when cleaning for every eight hours, lacquer disk(-sc) can all have remaining glue, reduce the volume of lacquer disk(-sc), and making it, lacquer disk(-sc) capacity reduces in process of production, reduce because of waste caused by cleaning lacquer disk(-sc).
Description
Technical field
The utility model belongs to LED die bond apparatus field, is specifically related to a kind of LED packaging and die bonding lacquer disk(-sc).
Background technique
LED encapsulation process is made of die bond-bonding wire-dispensing-light splitting, and LED die bond glue is general in the actual production process
Primary for the primary cleaning for every eight hours of addition in every 2 hours, longer using the time, the easier failure of die bond glue leads to the dead lamp of LED,
And during die bond dispensing, often there is the unstable abnormal generation of more glue, few glue, glue amount, influence LED packaging effect, pass through
The study found that the structure of lacquer disk(-sc), directly affects die bond process for dispensing glue.
Utility model content
The utility model main purpose is to provide a kind of LED packaging and die bonding glue to solve the shortcomings of the prior art
Disk.
A kind of LED packaging and die bonding lacquer disk(-sc), including lacquer disk(-sc), the lacquer disk(-sc) include positioned at the disk body of bottom and upward along disk body
The edge of distribution, the surface of the lacquer disk(-sc) inner tray are partially cavity upwards, and being provided centrally with for the cavity extends to disk body
Groove within surface, the groove surrounding are provided among bulge A, the bulge A higher than disc surfaces to be provided with
The notch be laterally connected is fixed with the boss to raise upward by the cavity of proximal edge, and the boss height is high lower than edge
Degree.
Preferably, the bottom centre of the disk body is provided with the opening through disk body upper and lower surface, and the open communication arrives
Groove.
Preferably, the length of the groove is greater than the length of opening.
Preferably, the boss is connected with bulge B far from the another side at edge, and the height of bulge B is lower than bulge A
Height.
Preferably, the boss surface is provided with annular groove.
It is furthermore preferred that ring bump A is distributed in the surrounding of the opening, the disk body is annular.
Preferably, the boss quantity is 2, is symmetrically placed.
It is furthermore preferred that described be open is connected to the propeller of crystal-bonding adhesive, the propeller is provided with sealing ring, the edge
It is provided with cover board, the outlet on the cover board is connected to rubber hose, and crystal-bonding adhesive is advanced to plastic emitting by the impelling sheet of the propeller
Guan Zhong.
It is furthermore preferred that the both ends of the groove can just be placed on impelling sheet.
The utility model has the following beneficial effects:
1, LED packaging and die bonding lacquer disk(-sc) described in the utility model, when cleaning for every eight hours, lacquer disk(-sc) can all have remaining glue,
The volume for reducing lacquer disk(-sc), making it, lacquer disk(-sc) capacity reduces in process of production, reduces because of waste caused by cleaning lacquer disk(-sc).
2, LED packaging and die bonding lacquer disk(-sc) described in the utility model, under the premise of adding the glue period identical, because of lacquer disk(-sc) after processing
It is few compared with the effective glue consumption of original lacquer disk(-sc), so the more original lacquer disk(-sc) of glue amount service condition of lacquer disk(-sc) is stablized after processing, effectively avoid because
Lacquer disk(-sc) adds the glue unstable abnormal generation of caused more glue, few glue, glue amount not in time.
Detailed description of the invention
Fig. 1 is the sectional view of LED packaging and die bonding lacquer disk(-sc) described in the utility model；
Fig. 2 is the top view of LED packaging and die bonding lacquer disk(-sc) described in the utility model；
Fig. 3 is the schematic diagram that LED packaging and die bonding lacquer disk(-sc) described in the utility model is connected to propulsion tube；
Wherein: the edge 1-, 2- disk body, 3- opening, 4- groove, 5- boss, 6- bulge A, 7- bulge B, 8- notch,
9- cavity, 10- annular groove, 11- propeller, 12- sealing ring, 13- cover board, the outlet 14-, 15- impelling sheet, 16- rubber hose.
Specific embodiment
Be described further below the technical solution of the utility model, but claimed range be not limited to it is described.
Embodiment 1
A kind of LED packaging and die bonding lacquer disk(-sc) as illustrated in figs. 1 and 2, including lacquer disk(-sc), lacquer disk(-sc) include the annular disk positioned at bottom
Body 2 and the edge 1 being distributed upwards along disk body 2 are cavity 9, the cavity in the part of the surface of lacquer disk(-sc) inner tray 2 up
9 are provided centrally with the groove 4 extended within 2 surface of disk body, and the bottom centre of the disk body 2 is provided on disk body 2
The opening 3 of lower surface, the opening 3 are communicated to groove 4, and 3 length of being open is less than the length of groove 4, and the groove 4 is symmetrical
Setting, 4 surrounding of groove are provided with the ring bump A6 higher than 2 surface of disk body, and bulge A6 in a ring, is evenly distributed on
The surrounding of opening 3, to be provided with the notch 8 be laterally connected, the glue of crystal-bonding adhesive can be imported and be exported for the centre bulge A6,
By the cavity 9 of proximal edge 1 be fixed with 5,2 boss 5 of raise upward 2 boss be it is symmetrically placed, the boss 5 is high
Degree is connected with bulge B7 far from the another side at edge 1 lower than 1 height of edge, in boss 5, and the height of bulge B7 is lower than protuberance
The height of object A6 is provided with annular groove 10 on 5 surface of boss, and in lacquer disk(-sc) work, the glue of crystal-bonding adhesive can remain in above.
A kind of LED packaging and die bonding lacquer disk(-sc) as described in Figure 3 establishes lacquer disk(-sc) to come, the opening of disk body in lacquer disk(-sc) work
3 are connected to the propeller 11 of crystal-bonding adhesive, and the propeller 11 is provided with sealing ring 12, opening 3 is enveloped, the side of the lacquer disk(-sc)
Edge 1 is provided with cover board 13, the outlet 14 of colloid is provided on cover board 13, which is connected to rubber hose 16, the propulsion
Crystal-bonding adhesive is advanced in rubber hose 16 by the impelling sheet 15 of device 11, completes the work of plastic emitting, and the both ends of the groove 4 on disk body are just
Impelling sheet 15 can be placed, impelling sheet is facilitated to release glue.
In the present embodiment, there are bulge A6, bulge B7 and boss 5 in lacquer disk(-sc), and relatively reduce lacquer disk(-sc) has
Working area is imitated, while boss surface being provided with annular groove 10, can make lacquer disk(-sc) when dispensing latter stage, have glue residual
It stays, easy cleaning, the notch be laterally connected is provided among bulge A, enhance the mobility of glue, facilitate dispensing.Therefore
Under disk body volume unanimous circumstances, when adding glue amount the same, the effective operation region of the lacquer disk(-sc) in the present embodiment is small, therefore adds glue
Period is elongated, and the service condition of glue amount is more stable, can to avoid add glue not in time caused by more glue, few glue, glue amount it is unstable, abnormal
Occur, and has glue residual in annular groove, the cleaning and replacement of aspect glue.
It, cannot the above content is specific preferred embodiment further detailed description of the utility model is combined
Assert that the specific implementation of the utility model is only limited to these instructions.For those skilled in the art of the present invention
For, without departing from the concept of the premise utility, several equivalent substitute or obvious modifications, and performance can also be made
Or purposes is identical, all shall be regarded as belonging to the protection scope of the utility model.
Claims (9)
1. a kind of LED packaging and die bonding lacquer disk(-sc), including lacquer disk(-sc), which is characterized in that the lacquer disk(-sc) includes the disk body and edge positioned at bottom
The edge that is distributed upwards of disk body, the surface of the lacquer disk(-sc) inner tray be upwards partially cavity, the cavity is provided centrally with
The groove within disc surfaces is extended to, the groove surrounding is provided with bulge A, the bulge A higher than disc surfaces
Centre is fixed with the boss to raise upward, the boss height by the cavity of proximal edge to be provided with the notch be laterally connected
Lower than brim height.
2. LED packaging and die bonding lacquer disk(-sc) according to claim 1, which is characterized in that the bottom centre of the disk body is provided with
Through the opening of disk body upper and lower surface, the open communication to groove.
3. LED packaging and die bonding lacquer disk(-sc) according to claim 1, which is characterized in that the length of the groove is greater than opening
Length.
4. LED packaging and die bonding lacquer disk(-sc) according to claim 1, which is characterized in that another side of the boss far from edge
It is connected with bulge B, the height of bulge B is lower than the height of bulge A.
5. LED packaging and die bonding lacquer disk(-sc) according to claim 1, which is characterized in that the boss surface is provided with annular groove.
6. LED packaging and die bonding lacquer disk(-sc) according to claim 2, which is characterized in that annular is distributed in the surrounding of the opening
Bulge A, the disk body are annular.
7. LED packaging and die bonding lacquer disk(-sc) according to claim 1, which is characterized in that the boss quantity is 2, is symmetrical
It places.
8. LED packaging and die bonding lacquer disk(-sc) according to claim 2, which is characterized in that the opening is connected to pushing away for crystal-bonding adhesive
Into device, the propeller is provided with sealing ring, and the edge is provided with cover board, and the outlet on the cover board is connected to rubber hose,
Crystal-bonding adhesive is advanced in rubber hose by the impelling sheet of the propeller.
9. LED packaging and die bonding lacquer disk(-sc) according to claim 8, which is characterized in that the both ends of the groove can just be put
In impelling sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820702597.8U CN208298860U (en) | 2018-05-11 | 2018-05-11 | A kind of LED packaging and die bonding lacquer disk(-sc) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820702597.8U CN208298860U (en) | 2018-05-11 | 2018-05-11 | A kind of LED packaging and die bonding lacquer disk(-sc) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208298860U true CN208298860U (en) | 2018-12-28 |
Family
ID=64704427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820702597.8U Expired - Fee Related CN208298860U (en) | 2018-05-11 | 2018-05-11 | A kind of LED packaging and die bonding lacquer disk(-sc) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208298860U (en) |
-
2018
- 2018-05-11 CN CN201820702597.8U patent/CN208298860U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181228 Termination date: 20210511 |