CN208297971U - A kind of micro-capacitance sensor operating control device - Google Patents

Abstract

The utility model discloses a kind of micro-capacitance sensor operating control devices, including power module, AC module, COM module, host CPU module, HMI module, DI module, DO module and the TRIP module being plugged on motherboard；The output end of power module is connected to other each modules, to provide working power for other each modules, wherein AC module and COM module pass through high-speed bus and host CPU module progress communication interaction, HMI module carries out communication interaction by low speed bus and host CPU module, and DI module, DO module and TRIP module carry out communication interaction by ION bus and host CPU module.Utility model device connects various micro- sources accesses by COM module, uses high-speed bus, and three kinds of buses of low speed bus and ION bus realize the reliable and stable transmission between different modules of device data.

Description

A kind of micro-capacitance sensor operating control device

Technical field

The utility model relates to a kind of micro-capacitance sensor operating control devices, belong to micro-capacitance sensor control technology field.

Background technique

The development of energy industry, is faced with the challenge and restriction of environment and resource development, and development is cleaned, is efficient renewable The energy and relevant system integration technology are the task of top priority of energy industry development.As effective supplement of centralization power generation, divide Cloth power generation and its Automatic System Inteqration technology just reach its maturity, with cost continuous decline and policy level it is strong Support, distributed generation technology will have wide application market.The appearance of micro-capacitance sensor realizes the reliable, high of distributed energy The access of effect.Central control unit+the grid connection interface device of most of micro-capacitance sensor operating control device use at present+control dress on the spot The mode set, this solution is relatively reasonable for larger micro-capacitance sensor, but for it is small or compared with For small micro-capacitance sensor, according to above-mentioned solution, system structure is relative complex, and operation control device uses more, construction Higher with O&M cost, economy is general.

Utility model content

The purpose of the utility model is to overcome deficiencies in the prior art, propose a kind of micro-capacitance sensor operation control dress It sets, various micro- source accesses may be implemented and stablizing for data is transmitted.

In order to solve the above technical problems, the utility model provides a kind of micro-capacitance sensor operating control device, characterized in that packet Include the power module being plugged on motherboard, AC module, COM module, host CPU module, HMI module, DI module, DO module and TRIP module；

The output end of power module is connected to other each modules, to provide working power for other each modules, AC module, COM module, HMI module, DI module, DO module and TRIP module are connect with host CPU module, wherein AC module and COM mould Part carries out communication interaction by high-speed bus and host CPU module, and HMI module is communicated by low speed bus with host CPU module Interaction, DI module, DO module and TRIP module carry out communication interaction by ION bus and host CPU module；

AC module is used to acquire power network line voltage or/and current-mode analog quantity signal is transferred to host CPU module；COM module Input terminal connect each micro- source PCS and energy storage PCS, to realize the access in each micro- source, DI module for receive power network line open into Amount signal is transferred to host CPU module, and DO module is exported to power network line switch or stored up for receiving the host CPU module amount of outputing signal Energy PCS, TRIP module is for receiving intake signal or the output amount of outputing signal；HMI module provides multiple communication interface with even Connect peripheral hardware.

Preferably, the 110/220V exchange of input is converted to each module by power module needs DC24V and DC5V to be used.

Preferably, COM module includes serial interface and Ethernet interface, and wherein serial interface is used to access micro- source PCS, with Too network interface is used to access energy storage PCS.

Preferably, HMI module is provided with serial interface, Ethernet interface, optic electric interface.

Preferably, HMI module provides clock synchronization interface, connect with exterior I RIGB signal, by clock synchronization bus and CPU module, COM module, DI module, DO module are connected with TRIP module, to provide time synchronization function for each module.

Preferably, HMI module also provides liquid crystal display, key, indicator light and debugging interface.

Compared with prior art, the utility model beneficial effect achieved is: utility model device passes through COM module Various micro- source accesses are connected, solve the problems, such as that single device accesses micro- source and energy storage negligible amounts, the micro-capacitance sensor reduced uses The quantity of operating control device reduces operation control system framework complexity.Device is according to the difference for acquiring data communication rates And the size of data volume will control and data/address bus divided, use high-speed bus, low speed bus and ION bus, three Kind of bus realizes the reliable and stable transmission between different modules of device data, the case where improving device overall performance Under, it ensure that data are completely reliably transmitted between modules.

Detailed description of the invention

Fig. 1 is the circuit diagram of the utility model micro-capacitance sensor operating control device；

Fig. 2 is the circuit diagram of COM module in utility model device；

Fig. 3 is the circuit diagram of HMI module in utility model device；

Fig. 4 is the circuit diagram of CPU module in utility model device.

Specific embodiment

The utility model is further described with reference to the accompanying drawing.Following embodiment is only used for clearly illustrating this The technical solution of utility model, and cannot be used as a limitation the limitation protection scope of the utility model.

A kind of micro-capacitance sensor operating control device of the utility model, including be plugged on motherboard power module, AC module, COM module, host CPU module, HMI module, DI module, DO module and TRIP module；

The output end of power module is connected to other each modules, to provide working power, AC module, COM mould for each module Part, HMI module, DI module, DO module and TRIP module are connect with host CPU module, and wherein AC module and COM module pass through High-speed bus and host CPU module carry out communication interaction, and HMI module is led to by low speed bus and host CPU module and COM module Letter interaction, DI module, DO module and TRIP module carry out communication interaction by ION bus and host CPU module；Three kinds of bus realities Showed the transmission reliable and stable between different modules of device data ensure that in the case where improving device overall performance Data are completely reliably transmitted between modules.

AC module is used to acquire power network line voltage or/and current-mode analog quantity signal is transferred to host CPU module；COM module Input terminal connect each micro- source PCS to realize the access in each micro- source, DI module is for receiving the transmitting of power network line intake signal To host CPU module, DO module is exported for receiving the host CPU module amount of outputing signal to power network line switch or energy storage PCS, TRIP Module is for receiving intake signal or the output amount of outputing signal；HMI module provides multiple communication interface to connect peripheral hardware.

In the utility model, AC module, COM module, HMI module, DI module, DO module and TRIP module module can divide Existing related function module not can be used, assisted by the incidence relation between module each in device as defined in the utility model Make, realizes micro-capacitance sensor operation control.

Power module provides working power for other each modules, and each module in Fig. 1 passes through motherboard and power module Connection (motherboard not drawn in the figure), power module by external 110/220V, be converted to each module need DC24V to be used and DC5V provides the power supply of work to other modules in Fig. 1.

Include CT/PT mutual inductor in AC module, high voltage or current-mode analog quantity signal are converted into low voltage signal input In CPU module, to be AD converted to it.In the specific implementation process, the current and voltage signals of access device will be needed to access The ac terminal row of AC module is upper, and AC module could support up 14 tunnel voltage and current signals in the present embodiment, specific electricity Pressure and electric current number are selected according to actual requirement of engineering.

COM module realizes that CPU module and FPGA module pass through by CPU module in the prior art and FPGA module LocalBus interface is attached communication, and CPU module is mainly used to realize logic control, and FPGA module is mainly used to extension and connects Mouthful to connect peripheral hardware, serial interface and Ethernet interface are expanded by FPGA module in the present embodiment, wherein serial interface use To access micro- source PCS(energy accumulation current converter), Ethernet interface is used to access energy storage PCS, in the specific implementation process serial ports mould Block and Ethernet interface module can be respectively connected to different PCS, this does not influence the data access of device, prop up depending on PCS itself The connection type held is serial ports connection or Ethernet interface connection.FPGA expands what the interface type come was accessed according to needs Micro- source interface type determines.FPGA module can also be attached by low speed bus and HMI module, will need number to be shown It is shown according to being transmitted in the PNL module of HMI module.

HMI module realizes that CPU module and FPGA module pass through by CPU module in the prior art and FPGA module The connection of LocaBus interface is communicated；CPU module is mainly used to realize logic control, and FPGA module is mainly used to expansion interface To connect peripheral hardware.HMI module has expanded serial interface (such as RS232), Ethernet interface, optical electrical by FPGA module and has connect Mouthful.By FPGA expand come clock synchronization module connect with exterior I RIGB signal, connect by clock synchronization bus with other each modules Time synchronization function is provided for module each in device；In project implementing process, IRIGB signal is connect by the clock synchronization of HMI module Mouthful, FPGA module is reached, CPU module, COM module, DI module, DO module are then sent to by the clock synchronization bus that FPGA module controls With TRIP module.

It is connect by first Ethernet interface of CPU module with monitoring and Energy Management System in HMI module；Pass through CPU Second Ethernet interface connect with PNL module, PNL module provides liquid crystal display, key, indicator light and debugging interface.PNL Module can provide man-machine interface, be used for fixed value adjusting, and event is checked, function is moved back in pressing plate throwing, while can be straight by indicator light The operating status of the reaction unit of sight.FPGA module is connected by low speed bus and CPU module and COM module in HMI module It connects, by CPU module and COM module monitoring data to display, CPU mould in HMI module is transmitted to by LocalBus interface Block, then shown by the liquid crystal display that Ethernet interface interface is sent to PNL module.

The CPU module is the core module of device, is realized by CPU module in the prior art and FPGA module, CPU module is connected by LocaBus interface with FPGA module and is communicated.Switching value information is connect by DI module and TRIP module Enter, the FPGA module of CPU module is then reached by ION bus；Analog signals are accessed by AC module, low-pass filtered device It inputs A/D module after being filtered to be AD converted, the digital quantity signal after conversion similarly reaches FPGA module, then passes through LocalBus interface is sent to CPU module, and CPU module carries out logical process after receiving these data, after CPU module processing On-off model, then by the ION bus of FPGA module control, again return to reach DO module and TRIP module carry out it is defeated Out.

CPU module contains 64MByte program FLASH and 4GByte data FLASH memory space in the CPU module, 4GByte data FLASH is respectively used to storage program and log, event and recorder data.

The use of COM module reduces the complexity of micro-capacitance sensor communication network, reduces communication connection conversion links, mentions The high reliability of micro battery operation control, reduces the cost of micro-capacitance sensor operation control, with good economic efficiency.

Utility model device connects various micro- source accesses by COM module, solves single device and accesses micro- source and energy storage The problem of negligible amounts, the micro-capacitance sensor reduced use the quantity of operating control device, and it is complicated to reduce operation control system framework Degree.Device is according to the difference of acquisition data communication rates and the size of data volume will control and data/address bus is divided, and adopts With high-speed bus, low speed bus and ION bus, it is reliable and stable between different modules that three kinds of buses realize device data Transmission, in the case where improving device overall performance, ensure that data are completely reliably transmitted between modules.

High-speed bus described in the utility model and low speed bus use the difference channel of LVDS in the prior art to realize, The ION bus is realized using CAN bus.

The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art For art personnel, without deviating from the technical principle of the utility model, several improvements and modifications can also be made, these change It also should be regarded as the protection scope of the utility model into modification.

Claims (6)

1. a kind of micro-capacitance sensor operating control device, characterized in that including the power module, AC module, COM mould being plugged on motherboard Part, host CPU module, HMI module, DI module, DO module and TRIP module；

The output end of power module is connected to other each modules, to provide working power, AC module, COM mould for other each modules Part, HMI module, DI module, DO module and TRIP module are connect with host CPU module, and wherein AC module and COM module pass through High-speed bus and host CPU module carry out communication interaction, and HMI module carries out communication interaction, DI by low speed bus and host CPU module Module, DO module and TRIP module carry out communication interaction by ION bus and host CPU module；

AC module is used to acquire power network line voltage or/and current-mode analog quantity signal is transferred to host CPU module；COM module it is defeated Enter end and connect each micro- source PCS and energy storage PCS, to realize the access in each micro- source, DI module is for receiving power network line intake letter It number is transferred to host CPU module, DO module is exported for receiving the host CPU module amount of outputing signal to power network line switch or energy storage PCS, TRIP module are for receiving intake signal or the output amount of outputing signal；HMI module provides multiple communication interface to connect Peripheral hardware.

2. a kind of micro-capacitance sensor operating control device according to claim 1, characterized in that power module is by the 110/ of input 220V exchange, which is converted to each module, needs DC24V and DC5V to be used.

3. a kind of micro-capacitance sensor operating control device according to claim 1, characterized in that COM module includes serial interface And Ethernet interface, wherein serial interface is used to access micro- source PCS, and Ethernet interface is used to access energy storage PCS.

4. a kind of micro-capacitance sensor operating control device according to claim 1, characterized in that HMI module is provided with serial ports and connects Mouth, Ethernet interface, optic electric interface.

5. a kind of micro-capacitance sensor operating control device according to claim 1, characterized in that HMI module provides clock synchronization interface, It connect with exterior I RIGB signal, is connected by clock synchronization bus and CPU module, COM module, DI module, DO module and TRIP module It connects, to provide time synchronization function for each module.

6. a kind of micro-capacitance sensor operating control device according to claim 1, characterized in that HMI module also provides liquid crystal Display screen, key, indicator light and debugging interface.