CN208225915U - A kind of Frit encapsulation cover plate - Google Patents
A kind of Frit encapsulation cover plate Download PDFInfo
- Publication number
- CN208225915U CN208225915U CN201820409103.7U CN201820409103U CN208225915U CN 208225915 U CN208225915 U CN 208225915U CN 201820409103 U CN201820409103 U CN 201820409103U CN 208225915 U CN208225915 U CN 208225915U
- Authority
- CN
- China
- Prior art keywords
- metal layer
- frit
- cover plate
- encapsulation cover
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Joining Of Glass To Other Materials (AREA)
Abstract
The utility model discloses a kind of Frit encapsulation cover plate, including glass cover-plate and Frit layers, the glass cover-plate and it is Frit layers described between be additionally provided with metal layer, the metal layer and it is described Frit layers to be stacked, positioned at the packaging area of the glass cover-plate, the metal layer has micro-structure, makes the metal layer and the described Frit layers intersection construction with interlayer.The adhesion strength between encapsulation cover plate and frit is increased with this configuration, effectively improves the stability and reliability of packaging effect and packed device.
Description
Technical field
The utility model relates to field of semiconductor package, in particular, being related to a kind of encapsulation for enhancing Frit encapsulation performance
Cover board.
Background technique
Frit encapsulating material has been used on a large scale on semiconductor and OLED screen packaging technology at present, and Frit material with
The bonding force and stability of glass substrate are the important indicators for embodying OLED device product reliability.Due to current OLED cap
The bonding effect of plate and Frit material is poor, therefore reduces the reliability of OLED product.
Summary of the invention
The utility model provides a kind of encapsulation cover plate for enhancing Frit encapsulation performance, by glass cover-plate and Frit layer
Between microstructure design special on one layer of metal layer and metal layer is added, enhance the Frit layers of adhesion strength on glass cover-plate,
And then enhance stability, while metal layer can also be adsorbed or be reacted to the water oxygen penetrated into Frit layers.
The utility model provides a kind of Frit encapsulation cover plate, including glass cover-plate, metal layer, Frit layer, the metal layer
It is located at the packaging area of glass cover-plate with Frit layers.
The metal layer has concaveconvex structure in the contact surface with Frit layers.
The metal layer and the Frit layers of intersection construction with interlayer.
Metal layer can be used as the sacrificial layer in Frit, and the water oxygen penetrated into Frit layers is adsorbed or reacted.
Further, the concaveconvex structure is multiple raised micro-structures.
Further, the section of the raised micro-structure is the geometric figure that upper bottom surface width is greater than bottom surface width.
Further, the raised micro-structure has coronal and support portion, and the cross-sectional width of coronal structure, which is greater than, to be supported
Portion's cross-sectional width
Further, the section of the raised micro-structure is the geometric figure that upper bottom surface width is greater than bottom surface width.This
Kind end face of the metal layer far from the glass cover-plate structure bigger than metal layer and glass cover-plate bed boundary designs, and can preferably make gold
Belong to the transmitting that adhesive force is realized between layer and Frit layers, meanwhile, the toughness of metal layer stress is better than Frit material, can be effective
The stress inside Frit layers and deformation are sponged, Frit layers of internal the case where generating slight crack are substantially improved.
Further, the cross section geometric figure is " T " font or inverted trapezoidal or " mushroom-shaped ".
Further, the thickness of the metal layer is in 1-4um.
Further, Frit layer with a thickness of 6-8um.
Further, the metal layer is materials and its composite layers such as Al, Mo, Cu, Cr.
Further, it is reticular structure that the metal layer, which is the metal layer,.
One layer of metal layer is prepared on glass cover-plate, can preferably make to realize adhesive force between metal layer and Frit layers
Transmitting, meanwhile, metal layer stress performance is better than Frit material, can effectively sponge stress and the deformation inside Frit layers, greatly
It is big to improve Frit layers of internal the case where generating slight crack.The thermal property of metal layer is better than Frit material, can be quickly by part
Heat transfer scatter, encapsulated layer internal stress caused by avoiding local heating uneven.And the micro- knot of metal layer of inverted trapezoidal
Structure can increase the chimeric effect of metal layer Yu Frit layers, increase the adhesion strength between encapsulation cover plate and frit, effectively
Improve the stability and reliability of packaging effect and packed device.
Detailed description of the invention
Fig. 1 is encapsulation cover plate schematic diagram of the present invention；
Fig. 2 is the encapsulation region structural schematic diagram of encapsulation cover plate of the present invention；
Fig. 3 is the structural schematic diagram of one embodiment of the invention；
Fig. 4 is sectional view of the Fig. 3 along dotted line A-A '；
Fig. 5 is the structural schematic diagram of another embodiment of the present invention；
Fig. 6 is sectional view of the Fig. 5 along dotted line A-A '；
Icon: 100- encapsulation cover plate；1- glass substrate；2- metal layer；3-Frit encapsulated layer；4- micro-structure；A-A ' section
Position.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
Embodiment one
As shown in Figure 1, the present invention provides a kind of encapsulation cover plate 100, in conjunction with Fig. 2, metal layer 2 and Frit layer 3 are sequentially formed
On glass substrate 1, metal layer 2 and Frit layer 3 are located at the packaging area of glass cover-plate, and packaging area is located at 1 side of glass substrate
Edge.
In conjunction with Fig. 3 and Fig. 4, the deposited metal layer 2 on glass substrate 1 carries out gridding processing to metal layer 2 and forms micro- knot
Structure 4 coats Frit encapsulated layer 3 on latticed metal layer.
The height of prepared metal layer 2 is in 1-3um, and the thickness of Frit layer 3 is in 6-8um.The metal layer be Al, Mo,
The materials such as Cu, Cr and its composite layer are constituted.
Prepared metal layer 2 is reticular structure.
Embodiment two
Referring to Fig. 5, metal layer 2 is made on cover board 1, prepares convex micro-structure 4, cross section structure tool on the metal layer
Body can be structure as shown in FIG. 6, have coronal structure 41 and support sector 42, and the cross-sectional width of coronal structure is cut greater than support sector
Face width, shown cross section structure are preferably " T " font.Frit seal is carried out between 1 and substrate 4.The protrusion micro-structure is cut
Face is the geometric figure that upper bottom surface width is greater than bottom surface width.End face of this metal layer far from glass cover-plate than metal layer with
The big structure design in glass cover-plate bed boundary, can preferably make the transmitting that adhesive force is realized between metal layer and Frit layers, together
When, the toughness of metal material stress is better than Frit material, can effectively sponge stress and deformation inside Frit layers, change significantly
Kind Frit layers of internal the case where generating slight crack, as reinforcing bar is added in concrete, greatly promote its various performance.Wherein institute
The metal layer height of preparation is in 2-4um, and Frit encapsulated layer thickness is in 6-8um.
The utility model prepares one layer of metal layer on glass cover-plate, can preferably make real between metal layer and Frit layers
The transmitting of existing adhesive force, meanwhile, metal layer stress performance is better than Frit material, can effectively sponge the stress inside Frit layers
And deformation, substantially improve Frit layers of internal the case where generating slight crack.The thermal property of metal layer is better than Frit material, can be quick
By the heat transfer of part or it scatter, encapsulated layer internal stress caused by avoiding local heating uneven.And the gold of inverted trapezoidal
Category layer micro-structure can increase the chimeric effect of metal layer Yu Frit layers, and the adherency increased between encapsulation cover plate and frit is strong
Degree, effectively improves the stability and reliability of packaging effect and packed device.
Basic principles, main features, and advantages of the present invention has been shown and described above.To row
The technical staff of industry should for, the present utility model is not limited to the above embodiments, describes in above embodiments and description
Simply to illustrate that the principles of the present invention, the utility model on the premise of not departing from the spirit and scope of the utility model
It will also have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.
Claims (9)
1. a kind of Frit encapsulation cover plate, including glass cover-plate and Frit layers, it is characterised in that the glass cover-plate and the Frit
Metal layer is additionally provided between layer, and the metal layer and described Frit layer are to be stacked, positioned at the encapsulation of the glass cover-plate
Region, the metal layer have micro-structure, make the metal layer and the described Frit layers intersection construction with interlayer.
2. encapsulation cover plate according to claim 1, which is characterized in that the metal layer has recessed with Frit layers of contact surface
Male structure.
3. encapsulation cover plate according to claim 1, which is characterized in that the micro-structure that the metal layer includes includes coronal
And support portion.
4. encapsulation cover plate according to claim 1, which is characterized in that the section of the micro-structure is that upper bottom surface width is greater than
The geometric figure of bottom surface width.
5. encapsulation cover plate according to claim 4, which is characterized in that under the section upper bottom surface width of the micro-structure is greater than
The geometric figure of bottom width is " T " font or inverted trapezoidal.
6. encapsulation cover plate according to claim 1, which is characterized in that the thickness of the metal layer is in 1-4um.
7. encapsulation cover plate according to claim 1, which is characterized in that described Frit layers with a thickness of 6-8um.
8. encapsulation cover plate according to claim 1, which is characterized in that the metal layer is Al, Mo, Cu, Cr layers.
9. encapsulation cover plate according to claim 1, which is characterized in that the metal layer is reticular structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820409103.7U CN208225915U (en) | 2018-03-26 | 2018-03-26 | A kind of Frit encapsulation cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820409103.7U CN208225915U (en) | 2018-03-26 | 2018-03-26 | A kind of Frit encapsulation cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208225915U true CN208225915U (en) | 2018-12-11 |
Family
ID=64503927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820409103.7U Active CN208225915U (en) | 2018-03-26 | 2018-03-26 | A kind of Frit encapsulation cover plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208225915U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321306A (en) * | 2018-03-26 | 2018-07-24 | 苏州福莱威封装技术有限公司 | A kind of Frit encapsulation cover plates and preparation method thereof |
| CN110137373A (en) * | 2019-05-13 | 2019-08-16 | 昆山国显光电有限公司 | Array substrate and display panel |
-
2018
- 2018-03-26 CN CN201820409103.7U patent/CN208225915U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321306A (en) * | 2018-03-26 | 2018-07-24 | 苏州福莱威封装技术有限公司 | A kind of Frit encapsulation cover plates and preparation method thereof |
| CN110137373A (en) * | 2019-05-13 | 2019-08-16 | 昆山国显光电有限公司 | Array substrate and display panel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208225915U (en) | A kind of Frit encapsulation cover plate | |
| CN105304685B (en) | Display panel and manufacturing method thereof | |
| CN105036060A (en) | MEMS device and manufacturing method thereof | |
| CN108321306A (en) | A kind of Frit encapsulation cover plates and preparation method thereof | |
| CN106298838A (en) | A kind of AMOLED panel and the preparation method of this AMOLED panel | |
| JP2015502015A5 (en) | ||
| CN207139126U (en) | A kind of special-shaped preformed soldering | |
| CN203844314U (en) | Metal clad plate used for elevator interior walls | |
| CN204885142U (en) | Palau IC encapsulates lug | |
| CN209723267U (en) | A kind of metal/block stone composite material prefabricated component for island protection | |
| CN101929592A (en) | Vacuum heat-preservation thermal-insulation hollow board | |
| CN208889649U (en) | Carrier and the chip-packaging structure for using the carrier | |
| CN201038148Y (en) | Packaging frame for three-electrode tube | |
| JP2022061342A5 (en) | ||
| CN205810780U (en) | A kind of TSV chip package based on dew core plastic package process | |
| CN207073252U (en) | A kind of laminated flooring | |
| CN206091881U (en) | Polygon diamond compact piece base member | |
| CN206139706U (en) | Punching die | |
| CN201246108Y (en) | Ball teeth-shaped diamond composite sheet substrate | |
| CN201709984U (en) | Shatterproof goblet | |
| CN207860904U (en) | A kind of novel fresh flower bucket | |
| RU2012148791A (en) | GAS TURBINE SHOVEL AND METHOD FOR APPLYING BINDING AND PROTECTIVE LAYERS ON THE GAS TURBINE SHOVEL SURFACE | |
| CN204662769U (en) | Precast wall panel structure | |
| CN203034641U (en) | External heat preservation wall body of external wall with argil plate | |
| CN206401309U (en) | It is a kind of to strengthen the encapsulating structure of heat dispersion |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |