CN208224983U - A kind of cpu heat - Google Patents
A kind of cpu heat Download PDFInfo
- Publication number
- CN208224983U CN208224983U CN201820917415.9U CN201820917415U CN208224983U CN 208224983 U CN208224983 U CN 208224983U CN 201820917415 U CN201820917415 U CN 201820917415U CN 208224983 U CN208224983 U CN 208224983U
- Authority
- CN
- China
- Prior art keywords
- main body
- water channel
- water
- cover board
- partition wall
- Prior art date
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000005192 partition Methods 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 206010020843 Hyperthermia Diseases 0.000 abstract description 7
- 230000036031 hyperthermia Effects 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005457 optimization Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- Thermotherapy And Cooling Therapy Devices (AREA)
Abstract
The utility model discloses a kind of cpu heats, including cover board, main body, the opening on main body top is arranged in main body top end opening, cover board, and cover board is bonded and seals with main body, partition wall is provided in main body, water channel is formed between partition wall, the water channel divides multi-turn, and water channel is annular, one end of the water channel is located at the center of main body, the other end is located at body side, and the both ends of water channel are respectively water inlet, water outlet.The phenomenon that the utility model can use the biggish water of specific heat capacity and go to radiate, and annular heat dissipation water route contacts heat source well, reduces flow resistance, avoid localized hyperthermia.
Description
Technical field
The utility model relates to radiating device technical field more particularly to a kind of cpu heats.
Background technique
With the continuous improvement of calculated performance, the heat of the energy consumption of central processing unit (CPU) chip and generation is also increasingly
Greatly, the heat dissipation of chip becomes the problem of current large-scale or supercomputer industry is paid close attention to the most.Conventional wind-cooling heat dissipating technology phase
To comparative maturity, but the energy consumption of blower brought by high heat flux density chip wind-cooling heat dissipating increases severely and noise problem, seriously
Hinder the raising of computer performance.
Current many radiators enter the disengaging structure flowed out from the other end using fluid from radiator one end, cause close
Heat dissipation at cooling fluid inlet is preferable, and exit heat dissipation is poor, and overall performance is poor for heat convection ability, and flow resistance
Greatly.Existing radiator heat convection ability is poor, and localized hyperthermia's phenomenon easily occurs, influences equipment performance.
Summary of the invention
The utility model in view of the deficiencies of the prior art, develops a kind of cpu heat, can solve radiator heat convection
Ability is poor, and the phenomenon that can reduce flow resistance, avoid localized hyperthermia.
The technical solution of the utility model solution technical problem are as follows: on the one hand, the embodiments of the present invention provide one
The opening on main body top, cover board and main body is arranged in kind cpu heat, including cover board, main body, main body top end opening, cover board
It is bonded and seals, partition wall is provided in main body, form water channel between partition wall, the water channel divides multi-turn, and water channel is annular, the water
The one end in road is located at the center of main body, the other end is located at body side, and the both ends of water channel are respectively water inlet, water outlet.
As optimization, the center of cover board is arranged in the water inlet, and the side of main body is arranged in water outlet.
As optimization, the main body top end opening, main body is interior to be arranged a cavity, and cavity is round or rectangular.
As optimization, the partition wall is open annular, the opposite end connection of adjacent partition wall opening.
As optimization, water (flow) direction is opposite between the adjacent water channel.
As optimization, the main material is copper or aluminium.
The effect provided in utility model content is only the effect of embodiment, rather than whole effects that utility model is all
Fruit, above-mentioned technical proposal have the following advantages that or the utility model has the advantages that
1. the utility model can use the biggish water of specific heat capacity and go to radiate, annular heat dissipation water route contacts heat well
The phenomenon that source reduces flow resistance, avoids localized hyperthermia.
2. the center temperature drop of another chip is maximum, improves by setting water inlet in the center of radiator, water outlet in side
Radiating efficiency.
3. enhancing heat convection ability by the way that water (flow) direction between adjacent water channel is arranged on the contrary, realizing convection current, improve
Heat transfer effect between adjacent water channel, the phenomenon that reduce the overall temperature difference of water channel, avoid localized hyperthermia.
Detailed description of the invention
Fig. 1 is a kind of front view of embodiment of the utility model.
Fig. 2 is cross-sectional view of the Fig. 1 along the direction A-A.
Specific embodiment
In order to clearly illustrate the technical characterstic of this programme, below by specific embodiment, and its attached drawing is combined, to this
Utility model is described in detail.Following disclosure provides many different embodiments or example is used to realize the utility model
Different structure.In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.This
Outside, the utility model can in different examples repeat reference numerals and/or letter.This repetition is in order to simplified and clear
Purpose itself does not indicate the relationship between discussed various embodiments and/or setting.It should be noted that illustrated in the accompanying drawings
Component be not drawn necessarily to scale.The utility model be omitted the description to known assemblies and treatment technology and process to avoid
It is unnecessarily limiting the utility model.
Fig. 1, Fig. 2 are an embodiment of the present invention, as shown, a kind of cpu heat, including cover board 2, main body
3, the opening on 3 top of main body is arranged in 3 top end opening of main body, cover board 2, and cover board 2 is bonded and seals with main body 3, sets in main body 3
It is equipped with partition wall 4, forms water channel 5 between partition wall 4, the water channel 5 divides multi-turn, and water channel 5 is annular, and one end of the water channel 5 is located at
The center of main body 3, the other end are located at 3 side of main body, and the both ends of water channel 5 are respectively water inlet 1, water outlet 6.The utility model can
To go to radiate using the biggish water of specific heat capacity, annular heat dissipation water route contacts heat source well, reduces flow resistance, avoids
The phenomenon that localized hyperthermia.
The center of cover board 2 is arranged in the water inlet 1, and the side of main body 3 is arranged in water outlet 6.By the way that water inlet 1 is arranged
In the center of radiator, water outlet 6 in side, the center temperature drop of another chip is maximum, improves radiating efficiency.
3 top end opening of main body, main body 3 is interior to be arranged a cavity, and cavity is round or rectangular.
The partition wall 4 is open annular, the opposite end connection that adjacent partition wall 4 is open.
Water (flow) direction is opposite between the adjacent water channel 5.By the way that water (flow) direction between adjacent water channel 5 is arranged on the contrary, realizing
Convection current, enhances heat convection ability, improves the heat transfer effect between adjacent water channel 5, reduces the whole temperature of water channel 5
Difference, the phenomenon that avoiding localized hyperthermia.
3 material of main body is copper or aluminium.
Although above-mentioned be described in conjunction with specific embodiment of the attached drawing to utility model, not to the utility model
The limitation of protection scope, based on the technical solution of the present invention, those skilled in the art do not need to pay creativeness
The various modifications or changes that working can make are still within the scope of the present invention.
Claims (6)
1. a kind of cpu heat, including cover board (2), main body (3), main body (3) top end opening, cover board (2) are arranged in main body (3)
The opening on top, cover board (2) are bonded and seal with main body (3), are provided in main body (3) partition wall (4), shape between partition wall (4)
At water channel (5), it is characterized in that: the water channel (5) divides multi-turn, water channel (5) is annular, and one end of the water channel (5) is located at main body
(3) center, the other end are located at main body (3) side, and the both ends of water channel (5) are respectively water inlet (1), water outlet (6).
2. a kind of cpu heat according to claim 1, characterized in that the water inlet (1) is arranged in cover board (2)
Center, water outlet (6) are arranged in the side of main body (3).
3. a kind of cpu heat according to claim 1, characterized in that main body (3) top end opening, main body (3) are interior
One cavity is set, and cavity is round or rectangular.
4. a kind of cpu heat according to claim 1, characterized in that the partition wall (4) be open annular, it is adjacent every
The opposite end connection of wall (4) opening.
5. a kind of cpu heat according to claim 1, characterized in that water (flow) direction phase between the adjacent water channel (5)
Instead.
6. a kind of cpu heat according to claim 1, characterized in that main body (3) material is copper or aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820917415.9U CN208224983U (en) | 2018-06-13 | 2018-06-13 | A kind of cpu heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820917415.9U CN208224983U (en) | 2018-06-13 | 2018-06-13 | A kind of cpu heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208224983U true CN208224983U (en) | 2018-12-11 |
Family
ID=64505433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820917415.9U Active CN208224983U (en) | 2018-06-13 | 2018-06-13 | A kind of cpu heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208224983U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108563311A (en) * | 2018-06-13 | 2018-09-21 | 郑州云海信息技术有限公司 | A kind of cpu heat |
-
2018
- 2018-06-13 CN CN201820917415.9U patent/CN208224983U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108563311A (en) * | 2018-06-13 | 2018-09-21 | 郑州云海信息技术有限公司 | A kind of cpu heat |
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