CN208220105U - Solid wooden compound floor and mold for processing solid wooden compound floor - Google Patents
Solid wooden compound floor and mold for processing solid wooden compound floor Download PDFInfo
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- CN208220105U CN208220105U CN201820400721.5U CN201820400721U CN208220105U CN 208220105 U CN208220105 U CN 208220105U CN 201820400721 U CN201820400721 U CN 201820400721U CN 208220105 U CN208220105 U CN 208220105U
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Abstract
A kind of solid wooden compound floor and mold, the solid wooden compound floor include: substrate layer and the decorative layer for being fixed at the substrate layer upper surface, and the decorative layer includes the edge trim layer of the outer profile close to solid wooden compound floor；The edge trim layer forms chamfering or fillet to substrate layer bending.Edge trim layer is covered in the surface of substrate layer, because making solid wooden compound floor have preferable appearance without being exposed to substrate layer outside.Also, also so that substrate layer is able to maintain that stable characteristic without destroying substrate layer, the service life of solid wooden compound floor will not be reduced.
Description
Technical field
The utility model relates to house fitting-up fields, and in particular to a kind of solid wooden compound floor and compound for processing solid wood
The mold on floor.
Background technique
Solid wooden compound floor generally comprises substrate layer and the decorative layer positioned at substrate layer upper surface.Decorative layer generally select compared with
Good high-quality timber, to retain solid wooden floor board wood grain grace, natural characteristic.
In the prior art, for make solid wooden compound floor have better aesthetic feeling, it will usually on the surface of solid wooden compound floor
(decorative layer position) processes chamfering.Chamfering is generally formed by direct Tool in Cutting, and the depth of chamfering is generally on the left side 1mm
It is right.If decorative layer has biggish thickness (such as 2.0mm), the chamfering processed is formed in decorative layer completely, be will not influence
The appearance of solid wooden compound floor.
But if the thinner thickness (such as 0.4mm) of decorative layer, when utilizing Tool in Cutting chamfering just inevitably
It is cut to substrate layer.At this point, substrate layer influences solid wood compoundly outside being exposed to when solid wooden compound floor is mated formation on the ground
The appearance of plate.Also, the cutting of cutter can also destroy substrate layer, reduce the service life of solid wooden compound floor.
Utility model content
The utility model solves the problems, such as it is to cut to form chamfering on solid wooden compound floor using cutter, it is possible to cut
Reality can be also reduced to the substrate layer of solid wooden compound floor so that substrate layer is exposed to the appearance of solid wooden floor board after influencing to be laid with outside
The service life of wood composite floor.
In order to solve the above technical problems, the technical program provides a kind of solid wooden compound floor, including substrate layer and fixation are set
The decorative layer in the substrate layer upper surface is set, the decorative layer includes the edge trim of the outer profile close to solid wooden compound floor
Layer；The edge trim layer forms chamfering or fillet to substrate layer bending.
Optionally, along the thickness direction of the solid wooden compound floor, the distance at the chamfering or fillet both ends is greater than described
The thickness of decorative layer.
Optionally, the thickness of the decorative layer is between 0.1mm-3.5mm.
Optionally, the substrate layer is wood based panel, glued board, density board, resin plate, the one of which in wood-plastic board.
Optionally, the decorative layer is layer of wood, bamboo matter layer, recombinates layer of wood, recombinates the one of which in bamboo matter layer.
In order to solve the above technical problems, the technical program also provide it is a kind of for processing the mold of solid wooden compound floor, institute
Stating solid wooden compound floor includes substrate layer and the decorative layer for being fixed at the substrate layer upper surface, and the decorative layer includes leaning on
The edge trim layer of the outer profile of nearly solid wooden compound floor；The mold has holding tank, and it is fixed that the notch of the holding tank is suitable for
The justice outer profile；When the solid wooden compound floor is press-fit into the holding tank, the internal perisporium of the holding tank is suitable for
It is bonded with the edge trim layer, the edge trim layer is made to form chamfering or fillet to substrate layer bending.
Optionally, the internal perisporium is tilted to the notch.
Optionally, internal perisporium includes circumferentially arranged multiple side walls, and the side wall is a plane or an arc surface.
Optionally, the groove depth of the holding tank is between 0.05mm-3.0mm.
Compared with prior art, the technical solution of the utility model has the advantage that
Solid wooden compound floor blank is processed into solid wooden compound floor during, obtained by the way that determination is to be processed
The outer profile of solid wooden compound floor is determined the global shape of solid wooden compound floor.By applying direction to edge decorative layer
Substrate layer active force can make edge trim layer towards substrate layer bending, thus the outer edge in solid wooden compound floor upper surface
Region forms chamfering or fillet.Cause is outer without being exposed to substrate layer, and solid wooden compound floor is made to have preferable appearance.And
And substrate layer also is destroyed without cutting, so that substrate layer is able to maintain that stable characteristic, the use of solid wooden compound floor will not be reduced
Service life.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model solid wooden compound floor in the prior art；
Fig. 2 is solid wooden compound floor blank and mould in the utility model specific embodiment solid wooden compound floor process
Structural schematic diagram when tool separates；
Fig. 3 is in the utility model specific embodiment solid wooden compound floor process, and mold is to solid wooden compound floor base
Material applies structural schematic diagram when active force；
Fig. 4 is the processing method flow chart of the utility model specific embodiment solid wooden compound floor；
Fig. 5 is the structural schematic diagram of the utility model specific embodiment solid wooden compound floor；
Fig. 6 is structural schematic diagram of the mold shown in Fig. 2 on the direction A；
Fig. 7 is solid wooden compound floor blank and mould in another embodiment solid wooden compound floor process of the utility model
Structural schematic diagram when tool separates；
Fig. 8 is the structural schematic diagram of another embodiment solid wooden compound floor of the utility model.
Specific embodiment
Referring to Fig.1, a kind of solid wooden compound floor 1 in the prior art, including substrate layer 2 and decorative layer 3, decorative layer 3 are solid
The upper surface of substrate layer 2 is set calmly.When solid wooden compound floor 1 is layed in ground, decorative layer 3 is the surface on floor, human body
Suitable for walking about in decorative layer 3.Since decorative layer 3 forms the surface on floor, thus more good timber can be selected, to retain
Solid wooden floor board wood grain grace, natural characteristic.And substrate layer 2 is located under decorative layer 3, is not easy to be discovered by human body, it is main
Effect is that solid wooden compound floor 1 is made to have stable structure, prevents to deform.Therefore, selected by decorative layer 3 and substrate layer 2
Material is different.
In the prior art, for make solid wooden compound floor 1 have better aesthetic feeling, it will usually in the table of solid wooden compound floor 1
Face processes chamfering 1a (or fillet), and chamfering 1a is generally formed by direct Tool in Cutting, and the depth of chamfering 1a is generally on the left side 1mm
It is right.When the thickness of decorative layer 3 is less than the depth of chamfering 1a, during cutting forms chamfering 1a, cutter is inevitable
Substrate layer 2 can be cut to (shown in Fig. 1).At this point, substrate layer 2 is exposed to outside when solid wooden compound floor 1 is mated formation on the ground,
As decorative layer 3 and the difference of material selected by substrate layer 2, the appearance on floor after being laid with will affect.Also, the cutting of cutter
Substrate layer 2 can be also destroyed, the service life of solid wooden compound floor 1 is reduced.
It is understandable to enable the above objects, features, and advantages of the utility model to become apparent, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.
Referring to Fig. 2, Fig. 3, a kind of processing method of solid wooden compound floor provides solid wooden compound floor blank 10, solid wood is multiple
Closing floor blank 10 includes substrate layer 11 and decorative layer 12, and decorative layer 12 is fixed at the upper surface of substrate layer 11.Solid wood is multiple
Floor blank 10 is closed for being processed to solid wooden compound floor, to mat formation on ground to be fitted up.For the reality for obtaining processing
Wood composite floor has preferable appearance, needs to make the outer edge region on solid wooden compound floor surface on it to form chamfering or circle
Angle.
In conjunction with referring to Fig. 4, the method that solid wooden compound floor blank is processed into solid wooden compound floor is as follows:
Step S101: the outer profile of obtained solid wooden compound floor to be processed is determined.
The outer profile area defined of solid wooden compound floor is that single solid wooden compound floor is shown when being layed in ground
The shape (not including male tenon and female groove) shown.For different house types, different customer demand, it usually needs design has difference
The solid wooden compound floor of shape (i.e. different outer profiles), to meet the needs of different house types, the demand of different clients.Also, it is real
The position of chamfering or fillet is outer profile position on wood composite floor, by determining the outer profile of solid wooden compound floor,
Think that following process chamfering or fillet are prepared.Wherein, the decorative layer 12 of solid wooden compound floor blank include be located at outer profile in,
And close to the edge trim layer 12a of outer profile.
Step S102: applying the active force towards substrate layer to edge decorative layer, so that edge trim layer is rolled over to substrate layer
Bending is at chamfering or fillet.
After the outer profile of obtained solid wooden compound floor to be processed is determined, solid wooden compound floor global shape quilt
It determines.By applying edge decorative layer 12a towards 11 active force of substrate layer, edge trim layer 12a can be made towards substrate layer
11 bendings.If the edge trim layer 12a after bending is plane, can be in the outer edge region shape of solid wooden compound floor upper surface
At chamfering；If the edge trim layer 12a after bending is cambered surface, can be in the outer edge region of solid wooden compound floor upper surface
Form fillet.
In the present embodiment, solid wooden compound floor on it the chamfering of the outer edge region on surface or fillet by edge trim layer
12a bending is formed.Therefore, substrate layer 11 will not be made to be exposed to outer, makes solid wooden compound floor that there is preferable appearance.Also,
It does not cut and destroys substrate layer 11, so that substrate layer 11 is able to maintain that stable characteristic, the use of solid wooden compound floor will not be reduced
Service life.
Specifically, the substrate layer 11 in solid wooden compound floor blank 10 is chosen as wood based panel, glued board, density board, resin
Any of them in plate, wood-plastic board.Decorative layer 12 in solid wooden compound floor blank 10 is layer of wood, bamboo matter layer, recombination
Any of them in layer of wood, recombination bamboo matter layer.
Referring to Fig. 5, in the present embodiment, after edge trim layer 12a forms chamfering or fillet to 11 bending of substrate layer, to reality
Wood composite floor blank 10 carries out cutting processing, male tenon 13 (or pin thread) and female groove 14 (or female thread) is formed, finally to process shape
At solid wooden compound floor 10a.Thus the marginal position of the solid wooden compound floor 10a processed surface decoration layer 12 on it
(position edge trim layer 12a) has chamfering or fillet, and solid wooden compound floor 10a is made to have better aesthetic feeling.Meanwhile it filling
Decorations layer 12 is covered in substrate layer 11, substrate layer 11 will not be made to be exposed to outer, solid wooden compound floor 10a is made to have preferable appearance.
Also, it will not influence the service life of solid wooden compound floor 10a.
It should be appreciated that in other variations, can also edge trim layer 12a to 11 bending of substrate layer formed chamfering or
Before fillet, cutting processing is carried out to solid wooden compound floor blank 10, forms male tenon 13 (or pin thread) and female groove 14 (or female thread).This
When, after edge trim layer 12a forms chamfering or fillet to 11 bending of substrate layer, solid wooden compound floor 10a can be accessed.
With continued reference to Fig. 2, Fig. 3, during processing to solid wooden compound floor blank 10, mold 20 is also provided,
Apply the active force towards substrate layer 11 to edge decorative layer 12a using mold 20.Specifically, mold 20 has holding tank 21,
Holding tank 21 has notch 21a, the bottom wall 21b opposite with notch 21a and the internal perisporium 21c around bottom wall 21b.Wherein, notch
21a defines the outer profile of obtained solid wooden compound floor 10a to be processed, and internal perisporium 21c defines to be processed obtain
Chamfering or the shape of fillet in solid wooden compound floor 10a.That is, finally processing the big of obtained solid wooden compound floor 10a
Small and shape is determined by the holding tank 21 of mold.
Therefore, it before processing solid wooden compound floor blank 10, needs according to obtained solid wooden compound floor to be processed
10a, it is reasonable to select mold 20, make the shape of holding tank 21 and obtained solid wooden compound floor 10a to be processed in mold 20
Shape match.
In the present embodiment, the method using mold processing solid wooden compound floor blank is as follows:
As shown in Fig. 2, solid wooden compound floor blank 10 and mold 20 are arranged face-to-face, and make solid wooden compound floor blank
Holding tank 21 of the decorative layer 12 towards mold.
As shown in figure 3, applying at least one of which in solid wooden compound floor blank 10 and mold 20 towards another
Active force so that a part of solid wooden compound floor blank 10 is press-fit into holding tank 21.When solid wooden compound floor blank
After 10 are press-fit into holding tank 21, edge trim layer 12a fits with internal perisporium 21c, and internal perisporium 21c is to edge decorative layer 12a
Apply active force, makes edge trim layer 12a towards 11 bending of substrate layer, to form chamfering or fillet.
Specifically, active force can be applied to composite floor board blank 10 and mold 20 by press machine (such as hydraulic press).
For example, composite floor board blank 10 is fixed in operating table surface, press machine controls mold 20 and transports towards composite floor board blank 10
It is dynamic, so that a part of composite floor board blank 10 is press-fit into holding tank 21, apply internal perisporium 21c to edge decorative layer 12a
Add active force.
With continued reference to Fig. 3, decorative layer 12 further includes the flower layer 12b in the surrounded region edge trim layer 12a.When
After in the indentation to holding tank 21 of solid wooden compound floor blank 10, edge trim layer 12a fits with internal perisporium 21c, flower
Layer 12b and bottom wall 21b fits.That is, a part of decorative layer (edge trim layer 12a) in the surrounded region of outer profile
It fits with internal perisporium 21c, another part decorative layer (flower layer 12b) fits with bottom wall 21b.
In general, the area of flower layer 12b is much larger than the area of edge trim layer 12a, as center decorative layer 12b
When fitting with bottom wall 21b, the contact area between flower layer 12b and bottom wall 21b is larger, and mold 20 is not easy to continue towards reality
Wood composite floor blank 10 moves, so that edge trim layer 12a will not be destroyed, will not largely influence edge trim layer
The shape of 12a.
In the present embodiment, using mold 20, during solid wooden compound floor blank 10 is pressed to holding tank 21, to solid wood
Composite floor board blank 10 is heated, and the temperature of solid wooden compound floor blank 10 is controlled between 70 DEG C -220 DEG C.This temperature
Under substrate layer 11 and decorative layer 12 be easy softening, thus be conducive to edge trim layer 12 occur bending deformation, formed chamfering or
Fillet.Wherein, heating to solid wooden compound floor blank 10 can be by the way of heat transfer, if composite floor board blank 10 is solid
Due to operating table surface, then by being heated to operating table surface, can control the temperature of operating table surface 70 DEG C -220 DEG C it
Between.To conduct heat to solid wooden compound floor blank 10.
It should be appreciated that the difference of the material according to selected by substrate layer 11 and decorative layer 12, controls solid wooden compound floor base
The temperature of material 10 is also slightly different.For example, solid wooden compound floor blank 10 preferable for heat resistance, can control opposite
Higher temperature, between 180 DEG C -220 DEG C；The solid wooden compound floor blank 10 poor for heat resistance, can control
Relatively low temperature, between 70 DEG C -100 DEG C；The solid wooden compound floor blank 10 moderate for heat resistance, can control
The temperature in rather moderate is made, between 100 DEG C -180 DEG C.
In addition, during solid wooden compound floor blank 10 is pressed to holding tank 21, control solid wood is compound using mold 20
Active force between floor blank 10 and mold 20, the specific pressure controlled between mold 20 and solid wooden compound floor blank 10 exist
Between 0.3MPa-10.0MPa.It prevents from damaging solid wooden compound floor blank 10 because pressure is excessive, causes to scrap；Meanwhile it is anti-
It can not only make edge trim layer 12 that bending deformation occur because of too little pressure or deform too small chamfering required by can not being formed
Or fillet.
Likewise, the difference of the material according to selected by substrate layer 11 and decorative layer 12, controls solid wooden compound floor blank
Pressure between 10 and mold 20 is also slightly different.For example, larger for rigidity, on-deformable solid wooden compound floor blank
10, it can control in relatively high pressure, as between 8.0MPa- 10.0MPa.Reality that is smaller for rigidity, being easily deformed
Wood composite floor blank 10 can control in relatively low pressure, as between 0.3MPa-5.0MPa.It is moderate for rigidity
Solid wooden compound floor blank 10 can control the pressure in rather moderate, as between 5.0MPa-8.0MPa.
In addition, keeping the temperature of solid wooden compound floor blank 10 after solid wooden compound floor blank 10 is pressed to holding tank 21
Between 70 DEG C -220 DEG C, keep pressure between mold 20 and solid wooden compound floor blank 10 0.3MPa-10.0MPa it
Between, and make the control of the retention time of temperature and pressure between 1s- 300s.If the retention time is too small, the edge that is bent over
Decorative layer 12a is easy rebound, influences the appearance for the solid wooden compound floor 10a that processing obtains.If the retention time is excessive, reality is influenced
The processing efficiency of wood composite floor blank 10, while it is also possible that solid wooden compound floor blank 10 is crossed is in high temperature, height for a long time
Under the conditions of pressure, cause solid wooden compound floor blank 10 impaired.
In the present embodiment, the internal perisporium 21c of holding tank is tilted to notch 21a.Specifically, as shown in fig. 6, the slot of holding tank
Mouth 21a rectangular shaped, to define that the outer profile of solid wooden compound floor 10a is rectangular shape.Wherein, internal perisporium 21c packet
Four circumferentially arranged side walls are included, the shape of side wall defines the shape of edge trim layer 12a bending deformation.Such as Fig. 2, Fig. 5
Shown, if side wall is plane, solid wooden compound floor 10a forms chamfering at the marginal position on surface on it.Such as Fig. 7, Fig. 8 institute
Show, if side wall is cambered surface, solid wooden compound floor 10a forms fillet at the marginal position on surface on it.
Referring to Fig. 5, decorative layer 12 with a thickness of L1, the distance at the both ends on chamfering through-thickness x is L2.Wherein, L1
≤L2.Wherein, L1≤L2.Referring to Fig. 8, decorative layer 12 with a thickness of L1, the distance at the both ends on fillet through-thickness x is
L2.Wherein, L1≤L2.That is, if with chamfering or fillet are processed in the way of Tool in Cutting in the prior art, necessarily
It can be cut to substrate layer 11, and it is outer to be exposed to substrate layer 11.And the technical program can make decorative layer 12 be covered in base always
Material layer 11 can be avoided substrate layer 11 and be exposed to outside, and will not destroy substrate layer 11.
Specifically, the thickness L1 of decorative layer 12 can be specifically selected between 0.1mm-3.5mm, such as 0.5mm, 1.0mm.?
The distance L2 at angle or the both ends on fillet through-thickness x can be specifically selected between 0.05mm-3.0mm, such as 1.0mm,
2.0mm.To make during processing solid wooden compound floor blank 10 using mold 20, when solid wooden compound floor blank 10 is pressed into extremely
After in holding tank 21, edge trim layer 12a fits with internal perisporium 21c, and flower layer 12b fits with bottom wall 21b.It accommodates
The optional both ends distance L2 in chamfering or fillet through-thickness x of the groove depth of slot 21 is equal, that is, the groove depth of holding tank 21 can
Selected control system is between 0.05mm-3.0mm, such as 1.0mm, 2.0mm.
In the present embodiment, the selection of solid wooden compound floor blank 10 may is that small size solid wooden compound floor blank 10, example
Such as 120mm × 1200mm size, solid wooden compound floor blank 10 at this time can be at one piece of solid wooden compound floor 10a；Alternatively, big
Size solid wooden compound floor blank 10, such as 1220mm × 2440mm size, solid wooden compound floor blank 10 at this time can be at
Muti-piece solid wooden compound floor 10a.If one block of solid wooden compound floor blank 10, which can correspond to, is processed into muti-piece solid wooden compound floor
10a then can use multiple molds 20, while process to same solid wooden compound floor blank 10, be formed simultaneously muti-piece
Solid wooden compound floor 10a, to promote processing efficiency.
In addition, the selection of mold 10 may is that small size mold 10, such as 120mm × 1200mm size, mold at this time
10 have a holding tank 11, can only once process one piece of solid wooden compound floor 10a；Alternatively, large scale mold 10, such as
1220mm × 2440mm size, mold 10 at this time have multiple holding tanks 11, once can process muti-piece solid wood compoundly
Plate 10a promotes processing efficiency.
The present embodiment also provides a kind of solid wooden compound floor 10a, and as shown in Figure 5, Figure 8, solid wooden compound floor 10a includes base
Material layer 11 and the decorative layer 12 for being fixed at 11 upper surface of substrate layer.Wherein, decorative layer 12 includes close to solid wooden compound floor
Edge trim the layer 12a, edge trim layer 12a of the outer profile of 10a form chamfering or fillet to 11 bending of substrate layer.
Decorative layer 12 with a thickness of L1, the distance at chamfering or the both ends on fillet through-thickness x is L2.Wherein, L1≤
L2.Specifically, the thickness L1 of decorative layer 12 can be selected between 0.1mm-3.5mm, such as 0.5mm, 1.0mm.Chamfering or fillet edge
The distance L2 at the both ends on thickness direction x can be selected between 0.05mm-3.0mm, such as 1.0mm, 2.0mm.
In the present embodiment, the substrate layer 11 in wood composite floor blank 10 is chosen as wood based panel, glued board, density board, tree
Any of them in rouge plate, wood-plastic board.Decorative layer 12 in solid wooden compound floor blank 10 is layer of wood, bamboo matter layer, again
Any of them in group layer of wood, recombination bamboo matter layer.
The present embodiment also provide it is a kind of for processing the mold 20 of solid wooden compound floor, as shown in Fig. 2, Fig. 7, mold 20 have
There is holding tank 21, holding tank 21 has notch 21a, the bottom wall 21b opposite with notch 21a and the internal perisporium around bottom wall 21b
21c.Wherein, notch 21a defines the outer profile of obtained solid wooden compound floor 10a to be processed, and internal perisporium 21c defines institute
Chamfering or the shape of fillet in the solid wooden compound floor 10a processed.When the solid wood for processing solid wooden compound floor 10a
When composite floor board blank 10 is press-fit into holding tank 21, the internal perisporium 21c of holding tank 21 is suitable for pasting with edge trim layer 12a
It closes, edge trim layer 12a is made to form chamfering or fillet to 11 bending of substrate layer.
Specifically, the internal perisporium 21c of holding tank is tilted to notch 21a.As shown in fig. 6, the notch 21a of holding tank is in rectangle
Shape, to define that the outer profile of solid wooden compound floor 10a is rectangular shape.Internal perisporium 21c includes circumferentially arranged four
A side wall, the shape of side wall define the shape of edge trim layer 12a bending deformation.If side wall is plane, edge trim layer
12a bending deforms to form chamfering.If side wall is cambered surface, edge trim layer 12a bending deforms to form fillet.
In the present embodiment, the groove depth of holding tank is controlled between 0.05mm-3.0mm, such as 1.0mm, 2.0mm.So that
After in the indentation to holding tank 21 of solid wooden compound floor blank 10, edge trim layer 12a fits with internal perisporium 21c, center dress
Decorations layer 12b and bottom wall 21b fits.The area of flower layer 12b is much larger than the area of edge trim layer 12a, when center fills
When decorations layer 12b and bottom wall 21b fit, mold 20 is not easy to continue to move towards solid wooden compound floor blank 10, prevents edge trim
Layer 12a suffers damage.
Although the utility model discloses as above, the utility model is not limited to this.Anyone skilled in the art,
It does not depart from the spirit and scope of the utility model, can make various changes or modifications, therefore the protection scope of the utility model
It should be defined by the scope defined by the claims..
Claims (9)
1. a kind of solid wooden compound floor, including substrate layer and the decorative layer for being fixed at the substrate layer upper surface, the dress
Decorations layer includes the edge trim layer of the outer profile close to solid wooden compound floor；It is characterized in that, the edge trim layer is to substrate
Layer bending forms chamfering or fillet.
2. solid wooden compound floor as described in claim 1, which is characterized in that along the thickness direction of the solid wooden compound floor,
The chamfering or the distance at fillet both ends are greater than the thickness of the decorative layer.
3. solid wooden compound floor as described in claim 1, which is characterized in that the thickness of the decorative layer is in 0.1mm-3.5mm
Between.
4. solid wooden compound floor as described in claim 1, which is characterized in that the substrate layer is wood based panel, glued board, density
Plate, resin plate, the one of which in wood-plastic board.
5. solid wooden compound floor as described in claim 1, which is characterized in that the decorative layer is layer of wood, bamboo matter layer, recombination
One of which in layer of wood, recombination bamboo matter layer.
6. a kind of for processing the mold of solid wooden compound floor, the solid wooden compound floor includes substrate layer and is fixed at institute
The decorative layer of substrate layer upper surface is stated, the decorative layer includes the edge trim layer of the outer profile close to solid wooden compound floor；Its
It is characterized in that, the mold has holding tank, and the notch of the holding tank is suitable for defining the outer profile；When the solid wood is compound
When floor is press-fit into the holding tank, the internal perisporium of the holding tank is suitable for being bonded with the edge trim layer, makes described
Edge trim layer forms chamfering or fillet to substrate layer bending.
7. mold as claimed in claim 6, which is characterized in that the internal perisporium is tilted to the notch.
8. mold as claimed in claim 6, which is characterized in that the internal perisporium includes circumferentially arranged multiple side walls, institute
Side wall is stated to be a plane or an arc surface.
9. mold as claimed in claim 6, which is characterized in that the groove depth of the holding tank is between 0.05mm-3.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820400721.5U CN208220105U (en) | 2018-03-23 | 2018-03-23 | Solid wooden compound floor and mold for processing solid wooden compound floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820400721.5U CN208220105U (en) | 2018-03-23 | 2018-03-23 | Solid wooden compound floor and mold for processing solid wooden compound floor |
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| Publication Number | Publication Date |
|---|---|
| CN208220105U true CN208220105U (en) | 2018-12-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110295720A (en) * | 2018-03-23 | 2019-10-01 | 长沙菱格木业有限公司 | Solid wooden compound floor processing method, solid wooden compound floor and mold |
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2018
- 2018-03-23 CN CN201820400721.5U patent/CN208220105U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110295720A (en) * | 2018-03-23 | 2019-10-01 | 长沙菱格木业有限公司 | Solid wooden compound floor processing method, solid wooden compound floor and mold |
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