CN208195964U - A kind of solder ball - Google Patents
A kind of solder ball Download PDFInfo
- Publication number
- CN208195964U CN208195964U CN201820564616.5U CN201820564616U CN208195964U CN 208195964 U CN208195964 U CN 208195964U CN 201820564616 U CN201820564616 U CN 201820564616U CN 208195964 U CN208195964 U CN 208195964U
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- China
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- layer
- tin ball
- help
- tin
- ontology
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Abstract
The utility model discloses a kind of solder balls, belong to scolding tin field, it is intended to provide a kind of solder ball that can be improved scolding tin quality, it is uneven in fusion process to solve scaling powder and metal, cause the problem of product short circuit, its drip irrigation device is as follows, a kind of solder ball, tin ball ontology including pouring forming, the tin ball body central is equipped with core wire, the core wire peripheral hardware helps layer, it is described that layer is helped to be externally provided with wear-resistant alloy layer, it is described help layer be located at core wire circumferential direction Circle-Array show it is several be staggered help soldered ball, it is described help between soldered ball staggeredly to wear help weld-ring；The tin ball body outer wall is upper parallel to help weld-ring layer equipped with several, and the tin ball body outer wall lower circumference array has drainage piece.The utility model is suitable for solder ball.
Description
Technical field
The utility model relates to a kind of scolding tin, in particular to a kind of solder ball.
Background technique
Scolding tin is that two o'clock or multiple spot metallic conductor is made to be firmly combined and reach conductive using heating tool.Tin ball is in scolding tin
A kind of product, tin ball, which can be divided into, to be had slicker solder ball and is the welding for wiring board without two kinds of slicker solder ball.Pure tin manufacture, it is wet
Lubricant nature, good fluidity, Yi Shangxi.Solder joint is bright, full, is not in the bad phenomenons such as rosin joint.Enough anti-oxidant members are added
Element, oxidation resistance are strong.Pure tin manufacture, scruff is few, reduces unnecessary waste.
Tin ball is chiefly used in the processing of circuit board, and still, common solder ball was being merged due to scaling powder with metal
It is uneven in journey, it be easy to cause metallic solution to splash, causes product short-circuit, bad shadow is generated to the stability of product quality
It rings.
Utility model content
The purpose of the utility model is to provide a kind of solder ball, have the advantages that can be improved scolding tin quality.
The above-mentioned technical purpose of the utility model has the technical scheme that
A kind of solder ball, the tin ball ontology including pouring forming, the tin ball body central is equipped with core wire, outside the core wire
It is described that layer is helped to be externally provided with wear-resistant alloy layer equipped with helping layer, it is described to help layer to be located at core wire circumferential direction Circle-Array to show several friendships
Mistake setting helps soldered ball, it is described help staggeredly to wear between soldered ball help weld-ring；
The tin ball body outer wall is upper parallel to help weld-ring layer, the tin ball body outer wall lower circumference array equipped with several
There is drainage piece.
By using above-mentioned technical proposal, help layer that tin ball ontology is enable sufficiently uniformly to mix with scaling powder in welding
It closes, the splashing for the metallic solution that tin ball ontology generates in the welding process is reduced, to improve the welding stability of product.Tin ball
Scaling powder residue is generated after ontology fusing, drainage piece can generate guide functions to scaling powder residue, the residue of scaling powder is made to exist
Stratiform attachment is formed around solder joint, to improve the connectivity robustness at solder joint.
Further, adjacent described help between weld-ring layer offers annular groove, weld-ring layer and the annular groove of helping
Junction is in arc transition.
By using above-mentioned technical proposal, the release of annular groove being provided with conducive to stress reduces tin ball ontology and is welding
The generation for phenomenon of bursting apart in termination process, while the generation of tin ball ontology welding slag splash phenomena in welding process can also be reduced.It helps
The junction of weld-ring layer and annular groove reduces junction and the possibility that stress is concentrated occurs in a manner of arc transition.
Further, the tin ball ontology upper center offers locating slot, the groove depth and tin ball ontology of the locating slot
Axis it is parallel.
By using above-mentioned technical proposal, during the welding of tin ball ontology, locating slot can be inserted into for solder bump pin,
So that tin ball ontology is aligned and cover solder joint with solder joint, reduces at solder joint that there is a situation where rosin joints.
Further, arc groove is offered in the middle part of the tin ball ontology lower end, is equipped in the arc groove suitable with locating slot
The fixture block matched.
By using above-mentioned technical proposal, the setting of arc groove makes tin ball ontology be not susceptible to roll, and facilitates tin ball ontology
Packaging and transport, while being not susceptible to move after being aligned when planting ball with solder joint, reduce at solder joint that there is a situation where rosin joints.
Further, be equipped with Reduction of Students' Study Load layer in the tin ball ontology, the Reduction of Students' Study Load layer be located at help layer and wear-resistant alloy layer it
Between, Reduction of Students' Study Load hole is evenly equipped on the Reduction of Students' Study Load layer.
By using above-mentioned technical proposal, during the welding of tin ball ontology, generation when Reduction of Students' Study Load hole can alleviate welding
Pressure, reduce tin ball ontology welding when splashing.
Further, the tin ball ontology, which is located in annular groove, offers clamping slot, and the clamping slot is opposite along axis
Setting.
By using above-mentioned technical proposal, packed since tin ball ontology is typically successively placed in packing box,
Be inconvenient to take when in use in this way, and clamp the setting of slot, facilitates clamping of the clip to tin ball ontology, and then facilitate tin
Ball ontology takes out from packing box.
Further, each seamed edge for helping weld-ring layer is in arc transition.
By using above-mentioned technical proposal, help each seamed edge of weld-ring layer that can reduce tin ball ontology in a manner of arc transition
The generation for phenomenon of bursting apart in the welding process, while being also used to reduce the hair of tin ball ontology welding slag splash phenomena in welding process
It is raw.In addition, help at each seamed edge of weld-ring layer during the transport and preservation of tin ball ontology and be not susceptible to be broken, Neng Goubao
Hold the integrality of tin ball ontology.
Further, the tin ball body outer wall is coated with anti oxidation layer.
By using above-mentioned technical proposal, anti oxidation layer makes tin ball body surface be not easy directly to contact with air and generate oxygen
Change film, so that tin ball ontology is saved for a long time and keep the good stability of tin ball body interior, to reduce because of oxidation
Caused by rejection rate.
In conclusion the utility model has the following beneficial effects:
It helps layer 1. using and helps weld-ring layer, reached and reduced the metallic solution that tin ball ontology generates in the welding process
Splashing effect；
2. using drainage piece, achieve the effect that improve the connectivity robustness at solder joint；
3. using annular groove, the splashing for reducing the metallic solution that tin ball ontology generates in the welding process is reached
Effect.
Detailed description of the invention
Fig. 1 is in the present embodiment for embodying core wire, helping the connection relationship between layer, Reduction of Students' Study Load layer and wear-resistant alloy layer
Schematic diagram；
Fig. 2 is in the present embodiment for embodying the structural schematic diagram for helping weld-ring and helping soldered ball；
Fig. 3 is in the present embodiment for embodying the microstate schematic diagram of solder joint and stratiform attachment.
In figure, 1, tin ball ontology；11, core wire；12, layer is helped；121, soldered ball is helped；122, weld-ring is helped；13, antifriction alloy
Layer；14, weld-ring layer is helped；15, drainage piece；16, annular groove；161, slot is clamped；17, locating slot；18, arc groove；181, fixture block；
19, Reduction of Students' Study Load layer；191, Reduction of Students' Study Load hole；2, stratiform is adhered to；3, solder joint.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
Wherein identical components are presented with like reference characters.It should be noted that word used in the following description
Language "front", "rear", "left", "right", "up" and "down" refer to the direction in attached drawing, word " bottom surface " and " top surface ", "inner" and
"outside" refers respectively to the direction towards or away from geometric center of specific component.
A kind of solder ball, as shown in Figure 1, including the tin ball ontology 1 for pouring forming, tin ball ontology 1 is successively outside from center
For core wire 11, help layer 12, Reduction of Students' Study Load layer 19 and wear-resistant alloy layer 13.
As depicted in figs. 1 and 2, help layer 12 be located at the circumferential Circle-Array of core wire 11 show it is several be staggered help soldered ball
121, help staggeredly to wear helping weld-ring 122 between soldered ball 121.Tin ball 1 outer wall of ontology is upper parallel to help weld-ring layer 14 equipped with several,
1 outer wall lower circumference array of tin ball ontology has drainage piece 15.Help layer 12 enable tin ball ontology 1 welding when sufficiently with help weldering
Agent uniformly mixes, and the splashing for the metallic solution that tin ball ontology 1 generates in the welding process is reduced, so that the welding for improving product is steady
It is qualitative.Tin ball ontology 1 generates scaling powder residue after melting, drainage piece 15 can generate guide functions to scaling powder residue, make to help
The microstate schematic diagram that the residue of solder flux forms stratiform attachment 2(stratiform attachment 2 around solder joint 3 is as shown in Figure 3), to mention
Connectivity robustness at high solder joint 3.
As shown in Figure 1, adjacent help between weld-ring layer 14 offers annular groove 16, weld-ring layer 14 and annular groove 16 are helped
Junction is in arc transition.The release of annular groove 16 being provided with conducive to stress reduces tin ball ontology 1 and collapses in the welding process
The generation of phenomenon is split, while the generation of 1 welding slag splash phenomena of tin ball ontology in welding process can also be reduced.Help weld-ring layer 14 with
The junction of annular groove 16 reduces junction and the possibility that stress is concentrated occurs in a manner of arc transition.Help weld-ring layer 14
Each seamed edge is in arc transition.
It was being welded as shown in Figure 1, helping each seamed edge of weld-ring layer 14 that can reduce tin ball ontology 1 in a manner of arc transition
The generation for phenomenon of bursting apart in journey, while being also used to reduce the generation of 1 welding slag splash phenomena of tin ball ontology in welding process.In addition,
During the transport and preservation of tin ball ontology 1, helps at each seamed edge of weld-ring layer 14 and be not susceptible to be broken, be able to maintain tin ball
The integrality of ontology 1.
It is helped between layer 12 and wear-resistant alloy layer 13 as shown in Figure 1, Reduction of Students' Study Load layer 19 is located at, is evenly equipped with Reduction of Students' Study Load on layer 19 of lightening the burden
Hole 191.During tin ball ontology 1 welds, Reduction of Students' Study Load hole 191 can alleviate the pressure generated when welding, reduce tin ball ontology 1
Splashing when welding.
As shown in Figure 1,1 upper center of tin ball ontology offers locating slot 17, groove depth and the tin ball ontology 1 of locating slot 17
Axis is parallel.Tin ball ontology 1 weld during, locating slot 17 can be inserted into for solder bump pin, enable tin ball ontology 1 with
Solder joint 3, which is aligned, simultaneously covers solder joint 3, reduces at solder joint 3 that there is a situation where rosin joints.
As shown in Figure 1, offering arc groove 18 in the middle part of 1 lower end of tin ball ontology, it is equipped in arc groove 18 suitable with locating slot 17
The fixture block 181 matched.The setting of arc groove 18 makes tin ball ontology 1 be not susceptible to roll, and facilitates the packaging and transport of tin ball ontology 1,
It is not susceptible to move after being aligned when planting ball with solder joint 3 simultaneously, there is a situation where rosin joints at reduction solder joint 3.
As shown in Figure 1, being packed since tin ball ontology 1 is typically successively placed in packing box, using in this way
When be inconvenient to take, therefore, tin ball ontology 1 be located in annular groove 16 offer clamping slot 161, clamp 161 edge of slot
Axis is oppositely arranged, and to facilitate clamping of the clip to tin ball ontology 1, and then tin ball ontology 1 is facilitated to take out from packing box.
As shown in Figure 1,1 outer wall of tin ball ontology is coated with anti oxidation layer (not shown), anti oxidation layer makes tin ball ontology 1
Surface is not easy directly to contact with air and generate oxidation film, so that tin ball ontology 1 is saved for a long time and keeps in tin ball ontology 1
The good stability in portion, thus rejection rate caused by reducing because of oxidation.
This specific embodiment is only the explanation to the utility model, is not limitations of the present invention, ability
Field technique personnel can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but
As long as all by the protection of Patent Law in the scope of the claims of the utility model.
Claims (8)
1. a kind of solder ball, the tin ball ontology (1) including pouring forming, it is characterized in that: the tin ball ontology (1) center is equipped with weldering
Core (11), core wire (11) peripheral hardware helps layer (12), described that layer (12) is helped to be externally provided with wear-resistant alloy layer (13), described to help
Layer (12) be located at the circumferential Circle-Array of core wire (11) show it is several be staggered help soldered ball (121), it is described help soldered ball (121) it
Between staggeredly wear and help weld-ring (122)；
The tin ball ontology (1) outer wall is upper parallel to be helped weld-ring layer (14) equipped with several, the tin ball ontology (1) outer wall lower part circle
All arrays have drainage piece (15).
2. a kind of solder ball according to claim 1, it is characterized in that: adjacent described help between weld-ring layer (14) offers ring
Connected in star (16), the junction for helping weld-ring layer (14) and annular groove (16) is in arc transition.
3. a kind of solder ball according to claim 2 is determined it is characterized in that: the tin ball ontology (1) upper center offers
Position slot (17), the groove depth of the locating slot (17) are parallel with the axis of tin ball ontology (1).
4. a kind of solder ball according to claim 3, it is characterized in that: offering circle in the middle part of the tin ball ontology (1) lower end
Arc slot (18), the arc groove (18) is interior to be equipped with the fixture block (181) being adapted to locating slot (17).
5. a kind of solder ball according to claim 4, it is characterized in that: Reduction of Students' Study Load layer (19) is equipped in the tin ball ontology (1),
The Reduction of Students' Study Load layer (19), which is located at, helps between layer (12) and wear-resistant alloy layer (13), and Reduction of Students' Study Load hole is evenly equipped on the Reduction of Students' Study Load layer (19)
(191)。
6. a kind of solder ball according to claim 5, it is characterized in that: the tin ball ontology (1) is located at annular groove (16)
Clamping slot (161) is inside offered, the clamping slot (161) is oppositely arranged along axis.
7. a kind of solder ball according to claim 6, it is characterized in that: each seamed edge for helping weld-ring layer (14) is in circular arc mistake
It crosses.
8. a kind of solder ball according to claim 7, it is characterized in that: the tin ball ontology (1) outer wall be coated with it is anti-oxidant
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820564616.5U CN208195964U (en) | 2018-04-19 | 2018-04-19 | A kind of solder ball |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820564616.5U CN208195964U (en) | 2018-04-19 | 2018-04-19 | A kind of solder ball |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208195964U true CN208195964U (en) | 2018-12-07 |
Family
ID=64523688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820564616.5U Expired - Fee Related CN208195964U (en) | 2018-04-19 | 2018-04-19 | A kind of solder ball |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208195964U (en) |
-
2018
- 2018-04-19 CN CN201820564616.5U patent/CN208195964U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181207 Termination date: 20190419 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |