CN208188848U - A kind of fingerprint mould group of unconventional thickness - Google Patents
A kind of fingerprint mould group of unconventional thickness Download PDFInfo
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- CN208188848U CN208188848U CN201820562150.5U CN201820562150U CN208188848U CN 208188848 U CN208188848 U CN 208188848U CN 201820562150 U CN201820562150 U CN 201820562150U CN 208188848 U CN208188848 U CN 208188848U
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- thickness
- becket
- fingerprint
- stiffening plate
- mould group
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Abstract
The utility model discloses a kind of fingerprint mould groups of unconventional thickness, it is related to fingerprint mould group field, including becket, fingerprint chip, flexible circuit board, stiffening plate, the fingerprint chip is set to inside the becket, it is equipped with thickening layer between the fingerprint chip and the becket, is equipped with the second stiffening plate on the outside of the stiffening plate；The utility model metal ring thickness and fingerprint mould group thickness can be designed to unconventional thickness, it is not restricted by fingerprint chip thickness, when touch screen cover sheet thickness changes, the thickness of becket can accordingly change, fingerprint key is not caused to sink, to bring better Experience Degree to user.
Description
Technical field:
The utility model relates to fingerprint mould group fields, and in particular to a kind of fingerprint mould group of unconventional thickness.
Background technique:
With the fast development of intelligent terminal, fingerprint mould group is got over its convenient mode of operation and very strong security performance
It is applied on intelligent terminal come more, when cause is limited to the thickness of fingerprint chip, the structure design freedom of fingerprint mould group
Low, the existing design intelligence of fingerprint mould group uses general thickness according to the thickness of fingerprint chip.
Fingerprint mould group mainly includes becket, fingerprint chip, flexible circuit board and stiffening plate at present, as shown in figure 3, fingerprint
Mould group thickness A=3 thickness of metal ring thickness C+ flexible circuit plate thickness 4+ stiffening plate, metal ring thickness C=fingerprint chip thickness B
+ becket main body upper end face thickness D, since fingerprint chip thickness B is generally 0.7mm, flexible circuit plate thickness 4 and stiffening plate 3
Thickness be also general thickness, therefore metal ring thickness C and fingerprint mould group thickness A will also use general thickness, if touch screen
Cover sheet thickness is non-general thickness, it is likely that causes fingerprint key to sink, reduces user experience.
Utility model content:
The technical problem to be solved by the utility model is to provide a kind of fingerprint mould groups of unconventional thickness, so that fingerprint
The thickness of mould group is not influenced by fingerprint chip thickness, so that fingerprint mould group thickness design freedom degree increases, meets different-thickness
Touch screen cover board demand, promoted fingerprint user experience.
The following technical solution is employed for technical problem to be solved in the utility model to realize:
A kind of fingerprint mould group of unconventional thickness, including becket, fingerprint chip, flexible circuit board, stiffening plate, the finger
Line chip is set to inside the becket, thickening layer is equipped between the fingerprint chip and the becket, outside the stiffening plate
Side is equipped with the second stiffening plate.
Further, the becket includes becket main body and becket skirt, and becket main body upper surface is thick
Degree is less than or equal to becket skirt thickness.
Further, the thickening layer with a thickness of 0.1-0.3mm.
Further, the stiffening plate and the second stiffening plate are steel disc.
Further, the shape of the thickening layer is round, rectangle or regular polygon.
Further, the length of second stiffening plate is more than or equal to the length of stiffening plate, less than the length of flexible circuit board
Degree.
Working principle of the utility model is: being equipped with thickening layer 5, becket between the fingerprint chip 2 and the becket 1
1 thickness C=becket main body upper end 5 thickness Es of face thickness D+ thickening layer+2 thickness B of fingerprint chip, when becket main body upper surface
When thickness D, 2 thickness B of fingerprint chip are fixed, different 1 thickness C of becket may be implemented by adjusting 5 thickness E of thickening layer, make
It is high to obtain becket freedom degree in processing, is not only restricted to general thickness, 1 thickness C+ flexible electrical of fingerprint mould group thickness A=becket
4 the+the second stiffening plate of thickness of road 3 thickness of plate+stiffening plate, 6 thickness realizes unconventional thickness by adjusting the thickness of the second stiffening plate 6
The fingerprint mould group of degree.
The beneficial effects of the utility model are: metal ring thickness and fingerprint mould group thickness can be designed to unconventional thickness
Degree, is not restricted by fingerprint chip thickness, and when touch screen cover sheet thickness changes, the thickness of becket can accordingly change, no
Fingerprint key is caused to sink, to bring better Experience Degree to user.
Detailed description of the invention:
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is an embodiment of the present invention partial structural diagram；
Fig. 3 is existing fingerprint modular structure schematic diagram.
Specific embodiment:
In order to be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, under
Face combines and is specifically illustrating, and the utility model is further described.
Embodiment 1:
As shown in Figure 1, a kind of fingerprint mould group of unconventional thickness, including becket 1, fingerprint chip 2, flexible circuit board 3,
Stiffening plate 4, fingerprint chip 2 are set to inside becket 1, thickening layer 5 are equipped between fingerprint chip 2 and becket 1, outside stiffening plate 4
Side is equipped with the second stiffening plate 6.
Becket 1 includes becket main body and becket skirt, and 1 main body upper end face thickness of becket is less than 1 skirt of becket
Side thickness.
Thickening layer 5 with a thickness of 0.1mm.
Stiffening plate 4 and the second stiffening plate 6 are steel disc.
The shape of thickening layer 5 is regular hexagonal.
The length of second stiffening plate 6 is equal to the length of stiffening plate 4, less than the length of flexible circuit board 3.
In implementation process, fingerprint chip 2 is electrically connected with flexible circuit board 3, the mainboard on flexible circuit board 3 and mobile terminal
Electrical connection, the second stiffening plate are connected with stiffening plate by SMT, and thickening layer 5 and fingerprint chip 2 are embedded in inside becket 1, flexible electrical
Road plate 3 is connected with stiffening plate by SMT.
Embodiment 2:
A kind of fingerprint mould group of unconventional thickness, including becket 1, fingerprint chip 2, flexible circuit board 3, stiffening plate 4, refer to
Line chip 2 is set to inside becket 1, and thickening layer 5 is equipped between fingerprint chip 2 and becket 1, is equipped with second on the outside of stiffening plate 4
Stiffening plate 6.
Becket 1 includes 1 skirt of 1 main body of becket and becket, and 1 main body upper end face thickness of becket is equal to becket 1
Skirt thickness.
Thickening layer 5 with a thickness of 0.3mm.
Stiffening plate 4 and the second stiffening plate 6 are steel disc.
The shape of thickening layer 5 is circle.
The length of second stiffening plate 6 is greater than the length of stiffening plate 4, less than the length of flexible circuit board 3.
Embodiment is the same as embodiment 1.
Embodiment 3:
A kind of fingerprint mould group of unconventional thickness, including becket 1, fingerprint chip 2, flexible circuit board 3, stiffening plate 4, refer to
Line chip 2 is set to inside becket 1, and thickening layer 5 is equipped between fingerprint chip 2 and becket 1, is equipped with second on the outside of stiffening plate 4
Stiffening plate 6.
Becket 1 includes 1 skirt of 1 main body of becket and becket, and 1 main body upper end face thickness of becket is equal to becket 1
Skirt thickness.
Thickening layer 5 with a thickness of 0.3mm.
Stiffening plate 4 and the second stiffening plate 6 are steel disc.
The shape of thickening layer 5 is rectangle.
The length of second stiffening plate 6 is greater than the length of stiffening plate 4, less than the length of flexible circuit board 3.
Embodiment is the same as embodiment 1.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (6)
1. a kind of fingerprint mould group of unconventional thickness, including becket, fingerprint chip, flexible circuit board, stiffening plate, feature exist
In the fingerprint chip is set to inside the becket, and thickening layer is equipped between the fingerprint chip and the becket, described
The second stiffening plate is equipped on the outside of stiffening plate.
2. the fingerprint mould group of unconventional thickness according to claim 1, which is characterized in that the becket includes becket
Main body and becket skirt, becket main body upper end face thickness are less than or equal to becket skirt thickness.
3. the fingerprint mould group of unconventional thickness according to claim 1, which is characterized in that the thickening layer with a thickness of
0.1-0.3mm。
4. the fingerprint mould group of unconventional thickness according to claim 1, which is characterized in that the stiffening plate and the second reinforcement
Plate is steel disc.
5. the fingerprint mould group of unconventional thickness according to claim 1, which is characterized in that the shape of the thickening layer is circle
Shape, rectangle or regular polygon.
6. the fingerprint mould group of unconventional thickness according to claim 1, which is characterized in that the length of second stiffening plate
More than or equal to the length of stiffening plate, less than the length of flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820562150.5U CN208188848U (en) | 2018-04-19 | 2018-04-19 | A kind of fingerprint mould group of unconventional thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820562150.5U CN208188848U (en) | 2018-04-19 | 2018-04-19 | A kind of fingerprint mould group of unconventional thickness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208188848U true CN208188848U (en) | 2018-12-04 |
Family
ID=64434451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820562150.5U Active CN208188848U (en) | 2018-04-19 | 2018-04-19 | A kind of fingerprint mould group of unconventional thickness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208188848U (en) |
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2018
- 2018-04-19 CN CN201820562150.5U patent/CN208188848U/en active Active
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