CN208157849U - Diode laser matrix light source module group - Google Patents
Diode laser matrix light source module group Download PDFInfo
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- CN208157849U CN208157849U CN201820638121.2U CN201820638121U CN208157849U CN 208157849 U CN208157849 U CN 208157849U CN 201820638121 U CN201820638121 U CN 201820638121U CN 208157849 U CN208157849 U CN 208157849U
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- light source
- source module
- mould group
- diode
- matrix light
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Abstract
The utility model discloses a kind of diode laser matrix light source module groups, including laser diode, mould group pedestal and collimating mirror, the laser diode is arranged on mould group pedestal in array, collimation ring is equipped between the collimating mirror and laser diode, the collimating mirror is pressed on collimation ring by compressing piece, and the compression piece is fixed on mould group pedestal.Diode laser matrix light source module group described in the utility model realizes the luminous Accurate collimation function of laser diode, improve the collimating effect consistency of the array of totally ten six laser diode units, entire light source module group is provided with matched location hole, temperature sensor fixing hole and circuit board mounting structure, with versatility, it is radiated using semiconductor heat-dissipating stick combination radiating fin, meets the cooling requirements of laser diode light source.
Description
Technical field
The utility model relates to a kind of diode laser matrix light source module groups.
Background technique
Laser diode has started to start to apply in each optical field as light source.But directly luminous by laser diode
The angle of divergence is larger, it usually needs increases collimating mirror before laser diode, diverging light is made to be converted to directional light, and collimating mirror and swash
The precision of the relative position of optical diode is difficult to control, and usually makes collimating effect very poor.Not due to single laser diode power
Height usually wants more progress arrays to be used in conjunction with, in the prior art, the laser collimation effect in diode laser matrix
Consistency is poor, it cannot be guaranteed that the collimating effect of entire array.In addition, diode laser matrix calorific value is big, common radiator is difficult
To meet its cooling requirements, limits and be generalized to normal domestic market by the optical articles of light source of laser.
Utility model content
It is proposed in view of the above problems, the utility model provide a kind of diode laser matrix light source module group.This is practical new
The technological means that type uses is as follows：
A kind of diode laser matrix light source module group, including laser diode, mould group pedestal and collimating mirror, the laser two
Pole pipe is arranged on mould group pedestal in array, and collimation ring, the collimating mirror are equipped between the collimating mirror and laser diode
It being pressed on collimation ring by compressing piece, the compression piece is fixed on mould group pedestal, and the mould group pedestal is equipped with mounting hole,
The laser diode, collimation ring and collimating mirror are installed in mounting hole, and the compression on piece is equipped with corresponding with collimating mirror
Through-hole, the through-hole edge are equipped with the compression protrusion for being directed toward through hole center.
Further, the mould group pedestal is equipped with for light source module group to be navigated to location hole and use in other structures
In the threaded hole of fixed temperature sensor, the mould group pedestal is equipped with the groove for installing power supply circuit plate.
Further, the compression piece is fixed by screws on mould group pedestal, each collimating mirror and at least two screws
It is adjacent.
Further, the inner wall of the collimation ring is ladder-like, and it is small to collimate internal diameter of the ring close to the part of laser diode
Internal diameter in the part close to collimating mirror.
Further, the back side of the mould group pedestal is inserted with multiple semiconductor refrigerating sticks, the semiconductor refrigerating stick
Refrigeration end is inserted into the back side of mould group pedestal, and the release end of heat of the semiconductor refrigerating stick is located at the outside of mould group pedestal.
Further, the release end of heat of the semiconductor refrigerating stick is equipped with radiating fin.
Further, the release end of heat of the semiconductor refrigerating stick is connected with heat-radiating rod, and the heat-radiating rod is equipped with radiating fin
Piece.
Further, Heat Conduction Material is equipped between the refrigeration end of the semiconductor refrigerating stick and mould group pedestal.
Further, the material of the mould group pedestal and collimation ring is aluminium alloy, and the material for compressing piece is stainless steel.
Compared with the prior art, diode laser matrix light source module group described in the utility model has the following advantages that：
1, the luminous Accurate collimation function of laser diode is realized；
2, the collimating effect consistency of the array of totally 16 laser diode units is improved；
3, entire light source module group is provided with matched location hole, temperature sensor fixing hole and circuit board mounting structure, tool
There is versatility；
4, it is radiated using semiconductor heat-dissipating stick combination radiating fin, meets the cooling requirements of laser diode light source.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic perspective view of the utility model embodiment.
Fig. 2 is the partial sectional view of Fig. 1.
Fig. 3 is the decomposing state figure of Fig. 1.
Fig. 4 is the collimated light path schematic diagram of laser diode described in the utility model embodiment.
Fig. 5 is the back side dimensional structure diagram of the utility model embodiment.
Fig. 6 is the structural schematic diagram of semiconductor refrigerating stick described in the utility model embodiment.
Fig. 7 is the structural schematic diagram of semiconductor refrigerating stick and heat-radiating rod described in the utility model embodiment.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
As shown in Figures 1 to 5, a kind of diode laser matrix light source module group, including laser diode 1,2 and of mould group pedestal
Collimating mirror 3, the laser diode 1 are arranged in array, and collimation ring 4 is equipped between the collimating mirror 3 and laser diode 1,
The collimating mirror 3 is pressed on collimation ring 4 by compressing piece 5, and the compression piece 5 is fixed on mould group pedestal 2.The present embodiment
In, multiple collimating mirrors 3 are pressed on mould group pedestal 2 by the compression piece 5 of an entirety, and the compression piece 5 is fixed by screw
On mould group pedestal 2, each collimating mirror 3 is adjacent at least two screws, guarantees to compress effect.Specifically, it is set on mould group pedestal
There is the mounting hole for installing laser diode 1, laser diode 1, collimation ring 4 and collimating mirror 3 are mounted in mounting hole, institute
It states and compresses piece 5 equipped with through-hole corresponding with collimating mirror, the through-hole edge is equipped with the compression protrusion 13 for being directed toward through hole center,
Collimating mirror 3 is compressed by compressing piece 5 and compressing protrusion 13, while compressing collimation ring 4 and laser diode 1.
The mould group pedestal 2 is equipped with the location hole 6 for navigating to light source module group in other structures and is used to fix
The threaded hole 7 of temperature sensor.The groove 8 for installing power supply circuit plate is additionally provided on the mould group pedestal 2.Location hole and recessed
The setting of slot enhances versatility.
The collimation ring 4 be cylindrical annular, it is described collimation ring 4 inner wall be it is ladder-like, collimate ring 4 close to laser diode
The internal diameter of 1 part is less than the internal diameter close to the part of collimating mirror 3.Stair-stepping setting, both ensure that collimation ring 4 intensity and
Suitable installation dimension, and sufficient space is reserved for light source, it steps down for the laser beam that laser diode 1 issues.
As shown in Figure 5 and Figure 6, the back side of the mould group pedestal 2 is inserted with multiple semiconductor refrigerating sticks 9, the semiconductor
The refrigeration end 11 of cooling rod 9 is inserted into the back side of mould group pedestal 2, and the release end of heat 12 of the semiconductor refrigerating stick 9 is located at mould group pedestal 2
Outside.Heat Conduction Material is equipped between the refrigeration end and mould group pedestal of the semiconductor refrigerating stick, the Heat Conduction Material can be
Heat-conducting silicone grease or thermal conductive silicon rubber mat.In order to enhance refrigeration and heat dissipation effect, the release end of heat of the semiconductor refrigerating stick 9 is equipped with heat dissipation
Fin, as another preferred solution, the release end of heat of the semiconductor refrigerating stick 9 are connected with heat-radiating rod 10, in the heat-radiating rod 10
Equipped with radiating fin, as shown in Figure 7.Radiating fin can also be respectively provided in the release end of heat of heat-radiating rod 10 and semiconductor refrigerating stick 9.
Semiconductor refrigerating stick 9 is PN junction semiconductor refrigerating stick, is made of P-type semiconductor and N-type semiconductor.In the outside of radiating fin,
Radiator fan can also be set as needed.
The material of the mould group pedestal 2 and collimation ring 4 is aluminium alloy, guarantees that laser diode 1 is thermally conductive to cooling system
Ability, the material for compressing piece 5 are stainless steel.
Finally it should be noted that：The above various embodiments is only to illustrate the technical solution of the utility model, rather than limits it
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand：It is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (9)
1. a kind of diode laser matrix light source module group, including laser diode, mould group pedestal and collimating mirror, it is characterised in that：
The laser diode is arranged on mould group pedestal in array, and collimation ring is equipped between the collimating mirror and laser diode,
The collimating mirror is pressed on collimation ring by compressing piece, and the compression piece is fixed on mould group pedestal, on the mould group pedestal
Equipped with mounting hole, the laser diode, collimation ring and collimating mirror are installed in mounting hole, and the compression on piece is equipped with and standard
The corresponding through-hole of straight mirror, the through-hole edge are equipped with the compression protrusion for being directed toward through hole center.
2. diode laser matrix light source module group according to claim 1, it is characterised in that：The mould group pedestal is equipped with
Location hole for navigating to light source module group in other structures and the threaded hole for being used for fixed temperature sensor, the mould group base
Seat is equipped with the groove for installing power supply circuit plate.
3. diode laser matrix light source module group according to claim 2, it is characterised in that：The compression piece passes through screw
It is fixed on mould group pedestal, each collimating mirror is adjacent at least two screws.
4. diode laser matrix light source module group according to claim 1, it is characterised in that：It is described collimation ring inner wall be
Ladder-like, internal diameter of the collimation ring close to the part of laser diode is less than the internal diameter close to the part of collimating mirror.
5. diode laser matrix light source module group according to claim 1, it is characterised in that：The back side of the mould group pedestal
It is inserted with multiple semiconductor refrigerating sticks, the back side of the refrigeration end insertion mould group pedestal of the semiconductor refrigerating stick, the semiconductor
The release end of heat of cooling rod is located at the outside of mould group pedestal.
6. diode laser matrix light source module group according to claim 5, it is characterised in that：The semiconductor refrigerating stick
Release end of heat is equipped with radiating fin.
7. diode laser matrix light source module group according to claim 5, it is characterised in that：The semiconductor refrigerating stick
Release end of heat is connected with heat-radiating rod, and the heat-radiating rod is equipped with radiating fin.
8. diode laser matrix light source module group according to claim 5, it is characterised in that：The semiconductor refrigerating stick
Heat Conduction Material is equipped between refrigeration end and mould group pedestal.
9. diode laser matrix light source module group according to claim 5, it is characterised in that：The mould group pedestal and collimation
The material of ring is aluminium alloy, and the material for compressing piece is stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820638121.2U CN208157849U (en) | 2018-04-29 | 2018-04-29 | Diode laser matrix light source module group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820638121.2U CN208157849U (en) | 2018-04-29 | 2018-04-29 | Diode laser matrix light source module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208157849U true CN208157849U (en) | 2018-11-27 |
Family
ID=64377347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820638121.2U Active CN208157849U (en) | 2018-04-29 | 2018-04-29 | Diode laser matrix light source module group |
Country Status (1)
| Country | Link |
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| CN (1) | CN208157849U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108679485A (en) * | 2018-04-29 | 2018-10-19 | 中国华录集团有限公司 | Diode laser matrix light source module group |
| WO2020135497A1 (en) * | 2018-12-26 | 2020-07-02 | Xiamen Chaoxuan Photoelectric Technology Co., Ltd. | System and device with laser array illumination |
| US11362476B2 (en) | 2016-09-12 | 2022-06-14 | Guangyi (Xiamen) Technology Co., Ltd. | System and device with laser array illumination |
-
2018
- 2018-04-29 CN CN201820638121.2U patent/CN208157849U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11362476B2 (en) | 2016-09-12 | 2022-06-14 | Guangyi (Xiamen) Technology Co., Ltd. | System and device with laser array illumination |
| CN108679485A (en) * | 2018-04-29 | 2018-10-19 | 中国华录集团有限公司 | Diode laser matrix light source module group |
| WO2020135497A1 (en) * | 2018-12-26 | 2020-07-02 | Xiamen Chaoxuan Photoelectric Technology Co., Ltd. | System and device with laser array illumination |
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