CN208157377U - A kind of wafer cleaning and dry gaily decorated basket device - Google Patents
A kind of wafer cleaning and dry gaily decorated basket device Download PDFInfo
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- CN208157377U CN208157377U CN201721500292.0U CN201721500292U CN208157377U CN 208157377 U CN208157377 U CN 208157377U CN 201721500292 U CN201721500292 U CN 201721500292U CN 208157377 U CN208157377 U CN 208157377U
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- gaily decorated
- decorated basket
- wafer
- dry
- clamping
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Abstract
The utility model discloses a kind of wafer cleaning and dry gaily decorated basket devices, including：Gaily decorated basket outline border (3), in the inside of the gaily decorated basket outline border (3), multiple fixing grooves (31) being oppositely arranged are set, the above fixing groove (31) matches with device for clamping wafer, the device for clamping wafer includes the first wafer holder piece (101) and the second wafer holder piece (102), chip (2) are accompanied between the two, at least two faces of the first wafer holder piece (101) are provided with lug boss, and the above second wafer holder piece (102) is sandwiched in so that in upper projecting portion, thus two clamping pieces are stablized without shaking.
Description
Technical field
The utility model belongs to chip technology field, more particularly to a kind of for wafer cleaning and drying process
Reduce the gaily decorated basket of fragment rate.
Background technique
It is well known that 3 cun of INP wafer thicknesses about 100 in semiconductor laser chip manufacturing process flow, after being thinned
μm or so, thin and fragile, and in cleaning, especially multiple chips clean simultaneously, it usually needs chip are placed in the gaily decorated basket, clear
It washes in drying process, the INP chip after being thinned is easily chipping.Currently, in chip manufacture technical field, the cleaning of chip
And the gaily decorated basket of polytetrafluoroethylene material that drying device mostly uses, the usually used wafer cleaning of the prior art and the dry gaily decorated basket its
As shown in figure, the placement location of chip, gap is excessive for pictorial diagram, exceeds wafer thickness manyfold, this just easily leads to presence
Following problems：
(1) in the cleaning-drying process of chip, the gaily decorated basket is held, chip easily shakes shakiness, bumps against (2) chip with gaily decorated basket inner wall
In beaker, when carrying out the cleaning of organic solution, chip is in horizontal positioned, easily flows out (3) and is dried with dryer
Chip operation process, chip are easily stuck in dryer inner wall etc., and the above phenomenon all easily causes chip fragmentation, influence FAB yield.Cause
This, in INP wafer fabrication process process, compact-sized, cleaning and the stable firm gaily decorated basket of drying process are for reducing chip
It is particularly significant to improve product yield for fragment rate.
Utility model content
The purpose of the invention of the present invention is to provide a kind of wafer cleaning and dry gaily decorated basket devices.
It is as follows that the utility model solves the technical solution that above-mentioned technical problem is taken：
A kind of wafer cleaning and dry gaily decorated basket device, including：Gaily decorated basket outline border (3), in the inside of the gaily decorated basket outline border (3)
Multiple fixing grooves (31) being oppositely arranged are set, and the above fixing groove (31) matches with device for clamping wafer, the wafer holder
Device includes the first wafer holder piece (101) and the second wafer holder piece (102), is accompanied between the two chip (2), described first
At least two faces of wafer holder piece (101) are provided with lug boss, and the above second wafer holder piece (102) is sandwiched in convex
In the portion of rising, thus two clamping pieces are stablized without shaking.
It preferably, is circle inside the gaily decorated basket fixture, having a size of three cun, outside is ellipse.
Preferably, device for clamping wafer and gaily decorated basket outline border belong to face contact.
The utility model clean and dry wafer process in, the mobile gaily decorated basket, chip substantially without shaking, can effectively reduce because
The problem of fragment rate caused by shock for chip and the gaily decorated basket.
Other features and advantages of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood and implementing the utility model.The purpose of this utility model and other advantages can pass through
Structure specifically indicated in the written description, claims, and drawings is achieved and obtained.
Detailed description of the invention
The utility model is described in detail with reference to the accompanying drawing, so that the above-mentioned advantage of the utility model is more
It is clear.
Fig. 1 is the utility model wafer cleaning and the dry structural schematic diagram for using gaily decorated basket device；
Fig. 2 is the structural schematic diagram of the utility model wafer cleaning and the dry device for clamping wafer with gaily decorated basket device；
Fig. 3 is the structural schematic diagram of the utility model wafer cleaning and the dry device for clamping wafer with gaily decorated basket device；
Fig. 4 is the utility model wafer cleaning and the dry structural schematic diagram for using gaily decorated basket device；
Fig. 5 is the utility model wafer cleaning and the dry structural schematic diagram for using gaily decorated basket device.
Specific embodiment
The utility model is described in detail combined with specific embodiments below.
As shown in Fig. 1 to 5, the purpose of this utility model is to provide a kind of 3 cun of INP wafer cleanings of reduction and drying processes
The gaily decorated basket device of fragment rate, wherein the contact without shaking can be achieved in chip, device for clamping wafer, gaily decorated basket outline border, and clamping has
Effect reduces by 3 cun of INP chips after being thinned in cleaning and drying process, due to chip placed in the gaily decorated basket it is unstable caused by it is broken
Piece rate.
Specifically, a kind of wafer cleaning and dry gaily decorated basket device, including：Gaily decorated basket outline border (3), in the gaily decorated basket outline border
(3) multiple fixing grooves (31) being oppositely arranged are arranged in inside, and the above fixing groove (31) matches with device for clamping wafer, described
Device for clamping wafer includes the first wafer holder piece (101) and the second wafer holder piece (102), accompanies chip (2) between the two,
At least two faces of the first wafer holder piece (101) are provided with lug boss, and the above second wafer holder piece (102) is pressed from both sides
In with upper projecting portion, thus two clamping pieces are stablized without shaking, in addition, on the lug boss of the first wafer holder piece (101)
It is additionally provided with corresponding hole 1011.
It preferably, is circle inside the gaily decorated basket fixture, having a size of three cun, outside is ellipse.
Preferably, device for clamping wafer and gaily decorated basket outline border belong to face contact.
The utility model clean and dry wafer process in, the mobile gaily decorated basket, chip substantially without shaking, can effectively reduce because
The problem of fragment rate caused by shock for chip and the gaily decorated basket.
Wherein, the above device for clamping wafer, having a size of 3 cun, the non-loosening for chip is fixed, and avoids cleaning and drying
The shaking of process chip.Gaily decorated basket outline border is fitted close, stable firm realization for placing gaily decorated basket clamping device with gaily decorated basket fixture
More wafers are cleaned and dried simultaneously.It is circle inside gaily decorated basket fixture, having a size of three cun, outside is ellipse.Two panels combined type folder
Tool is by wafer holder in centre, and it is firm to stablize, no shaking.Device for clamping wafer and gaily decorated basket outline border belong to face contact (outermost circle
Ring), therefore in cleaning and dry wafer process, the mobile gaily decorated basket, chip can effectively reduce substantially without shaking because of chip and flower
The problem of fragment rate caused by the shock of basket.
Finally it should be noted that：The above descriptions are merely preferred embodiments of the present invention, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (3)
1. a kind of wafer cleaning and dry gaily decorated basket device, including：Gaily decorated basket outline border (3) is set in the inside of the gaily decorated basket outline border (3)
Multiple fixing grooves (31) being oppositely arranged are set, the above fixing groove (31) matches with device for clamping wafer, which is characterized in that described
Device for clamping wafer includes the first wafer holder piece (101) and the second wafer holder piece (102), accompanies chip (2) between the two,
At least two faces of the first wafer holder piece (101) are provided with lug boss, and the above second wafer holder piece (102) is pressed from both sides
In with upper projecting portion, thus two clamping pieces are stablized without shaking.
2. wafer cleaning according to claim 1 and dry gaily decorated basket device, which is characterized in that inside the gaily decorated basket device
For circle, having a size of three cun, outside is ellipse.
3. wafer cleaning according to claim 1 or 2 and dry gaily decorated basket device, which is characterized in that device for clamping wafer
Belong to face contact with gaily decorated basket outline border.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721500292.0U CN208157377U (en) | 2017-11-13 | 2017-11-13 | A kind of wafer cleaning and dry gaily decorated basket device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721500292.0U CN208157377U (en) | 2017-11-13 | 2017-11-13 | A kind of wafer cleaning and dry gaily decorated basket device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208157377U true CN208157377U (en) | 2018-11-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721500292.0U Active CN208157377U (en) | 2017-11-13 | 2017-11-13 | A kind of wafer cleaning and dry gaily decorated basket device |
Country Status (1)
| Country | Link |
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| CN (1) | CN208157377U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172536A (en) * | 2017-11-13 | 2018-06-15 | 苏州长光华芯光电技术有限公司 | A kind of wafer cleaning and dry gaily decorated basket device |
-
2017
- 2017-11-13 CN CN201721500292.0U patent/CN208157377U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172536A (en) * | 2017-11-13 | 2018-06-15 | 苏州长光华芯光电技术有限公司 | A kind of wafer cleaning and dry gaily decorated basket device |
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Legal Events
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215163 No.2 workshop-1-102, No.2 workshop-2-203, zone a, industrial square, science and Technology City, No.189 Kunlunshan Road, high tech Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Changguang Huaxin Optoelectronic Technology Co.,Ltd. Address before: 215163 No.2 factory building, No.189 Kunlunshan Road, high tech Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU EVERBRIGHT PHOTONICS TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |