CN208154705U - Semiconductor refrigeration desktop air conditioner - Google Patents
Semiconductor refrigeration desktop air conditioner Download PDFInfo
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- CN208154705U CN208154705U CN201820683751.1U CN201820683751U CN208154705U CN 208154705 U CN208154705 U CN 208154705U CN 201820683751 U CN201820683751 U CN 201820683751U CN 208154705 U CN208154705 U CN 208154705U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 82
- 238000005057 refrigeration Methods 0.000 title abstract description 12
- 238000004378 air conditioning Methods 0.000 claims description 59
- 238000010438 heat treatment Methods 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 208000002925 dental caries Diseases 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 230000003447 ipsilateral effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
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Abstract
The utility model provides a semiconductor refrigeration desktop air conditioner, which comprises a shell and a semiconductor refrigeration piece positioned in the shell, wherein the refrigeration piece divides the inner cavity of the shell into a first cavity and a second cavity; the first cavity is communicated with the first cavity, the first air inlet and the first air outlet are respectively communicated with the first cavity, airflow passing through the first air inlet flows through the semiconductor refrigeration sheet to be subjected to heat exchange, and is discharged through the first air outlet, and the first air inlet and the first air outlet are positioned on different surfaces; the air flow passing through the second air inlet is subjected to heat exchange and discharged through the second air outlet, and the second air inlet and the second air outlet are located on different surfaces. Through the utility model discloses can make the wind that blows off from first air outlet can not be by in flowing backwards to first air intake, can make the wind that blows off from the second air outlet can not be by in flowing backwards to the second air intake, avoid the air current short circuit effectively, can also reduce desktop air conditioner's volume effectively, the structure is more compact.
Description
Technical field
The utility model belongs to air-conditioning technical field, and in particular to a kind of semiconductor refrigerating desktop air-conditioning.
Background technique
As the improvement of people's living standards, the market demand of desktop air-conditioning (personal air-conditioning) is increasing.Compare market
On desktop air-conditioning, it is mostly close using semiconductor refrigerating air-out mode, the disengaging of cold wind the same side can be attributed to, hot wind is same
Side disengaging, the mode of upper entering and lower leaving or bottom in and top out.This kind of structure air duct is complicated, and resistance is bigger.And air inlet and the outlet mouth
Layout be likely to result in airflow circulating short circuit.
Such as the structure in CN105465931A, from air channel structure, patent wind needs are turned to, Er Qiefeng
Road is very long.From the point of view of the form of air current composition, the patent also for air flow shortcircuit is avoided, just lengthen air duct, make air inlet and
Air outlet is a good distance away.Here it is cold end or hot end inlet and outlets the side the drawbacks of.
Due to desktop air-conditioning in the prior art in order to avoid air flow shortcircuit and by Duct design obtain it is very long, increase desktop
The volume of air-conditioning, the technical problems such as that there are structures is not compact, takes up a large area, therefore the utility model researching and designing go out a kind of half
Conductor refrigeration desktop air-conditioning.
Utility model content
Therefore, the technical problem to be solved by the present invention is to overcome desktop air-conditioning in the prior art that can not avoid
The volume of air-conditioning can also be reduced when air flow shortcircuit and occupied area, make the compact-sized defect not taken up space, to provide one
Kind semiconductor refrigerating desktop air-conditioning.
The utility model provides a kind of semiconductor refrigerating desktop air-conditioning comprising shell and partly leads positioned at the shell is intracorporal
Body cooling piece, and enclosure interior cavity is divided into mutually isolated the first cavity and the second cavity by the semiconductor chilling plate；
The air-conditioning further includes the first air inlet and the first air outlet being connected to respectively with first cavity, by described
The heating face that the air-flow that first air inlet enters in the first cavity flows through the semiconductor chilling plate exchange heat and passes through described the
The discharge of one air outlet, and first air inlet is located on different faces from first air outlet；
The air-conditioning further includes the second air inlet and the second air outlet being connected to respectively with second cavity, by described
The chill surface that the air-flow that second air inlet enters in the second cavity flows through the semiconductor chilling plate exchange heat and passes through described the
The discharge of two air outlets, and second air inlet is located on different faces from second air outlet.
Preferably,
The semiconductor chilling plate lateral arrangement in the shell, first cavity be located at the shell it is intracorporal on
Portion, second cavity are located at the intracorporal lower part of the shell；
And in the upper and lower surfaces of the semiconductor chilling plate：
The upper surface of the semiconductor chilling plate is heating face, and air-flow enters first sky by first air inlet
It is intracavitary and heated and from first air outlet be discharged, the lower surface be chill surface, air-flow pass through second air inlet
Freezed in into second cavity and is discharged from second air outlet.
Preferably,
First air inlet is set in the first side of the shell, and first air outlet is set to the shell
Second side on, and the first side is opposite with the second side；
Second air inlet is set on the third side of the shell, and second air outlet is set to the shell
The 4th side on, and the third side is opposite with the 4th side.
Preferably,
The first side and the 4th side are located on the same side of the desktop air-conditioning, the second side and
The third side is located on the same side of the desktop air-conditioning.
Preferably,
The distance between the bottom of first air inlet and the semiconductor chilling plate are greater than second air outlet
The distance between the top and the semiconductor chilling plate；The top of second air inlet and the semiconductor chilling plate it
Between distance be greater than the distance between first air outlet bottom and the semiconductor chilling plate.
Preferably,
It further include the first auxiliary air inlet opening, first auxiliary air inlet opening is set on the face adjacent with the first side
And at the position adjacent with the first side, and first auxiliary air inlet opening is connected to first cavity；And/or
It further include the second auxiliary air inlet opening, second auxiliary air inlet opening is set on the face adjacent with the second side
And at the position adjacent with the second side, and second auxiliary air inlet opening is connected to second cavity.
Preferably,
The first aerofoil fan, the first axle are additionally provided in the shell and positioned at the position of first air outlet
The axis direction of flow fan is parallel with the arranged direction of the semiconductor chilling plate；
The second aerofoil fan, second axis are additionally provided in the shell and positioned at the position of second air outlet
The axis direction of flow fan is parallel with the arranged direction of the semiconductor chilling plate.
Preferably,
The first radiator, one end of first radiator and the semiconductor system are additionally provided in first cavity
Cold upper surface connects, the other end extends to the top of the shell upward or presets spacing with housing tip interval first
Position；
The second radiator, one end of second radiator and the semiconductor system are additionally provided in second cavity
Cold lower surface connects, the other end extends to the bottom end of the shell downward or presets spacing with housing bottom interval second
Position.
Preferably,
The enclosure interior and it is located at below second radiator and is additionally provided with water receiver.
Preferably,
First air inlet is additionally provided with the first blinds, is additionally provided with the second blinds, at first air outlet
Two air inlets are additionally provided with third blinds, are additionally provided with the 4th blinds at the second air outlet.
Preferably,
First blinds and the third blinds are fixedly provided on the shell, second blinds and described
Four blinds are movably set on the shell.
A kind of semiconductor refrigerating desktop air-conditioning provided by the utility model has the advantages that：
1. the utility model by by the semiconductor chilling plate of semiconductor refrigerating desktop air-conditioning be arranged in shell and up and down
Two cavitys separated, and be located on different faces from the first air inlet of the first cavity connection and the first air outlet respectively, with
And be located on different faces from the second air inlet of the second cavity connection and the second air outlet respectively, it enables to from the first outlet air
The wind of mouth blowout will not be flowed backward in the first air inlet, efficiently avoid air flow shortcircuit, and by being located at different faces
The first air inlet and the first air outlet, additionally it is possible to the length for reducing desktop air-conditioning (is to avoid gas in respect to the background art
Flow short-circuit and will highly draw very long), to effectively reduce the volume on desktop air-conditioning top, can also similarly to go out from second
The wind of air port blowout will not be flowed backward in the second air inlet, efficiently avoid air flow shortcircuit, and different by being located at
Second air inlet and the second air outlet in face, additionally it is possible to which the length for reducing desktop air-conditioning (is to avoid in respect to the background art
Air flow shortcircuit and will highly draw very long), so that the volume of desktop air-conditioning lower part is effectively reduced, to can synthetically keep away
Exempt from air-flow occur short circuit while can also be unlikely to obtain Duct design it is very long, efficiently reduce desktop air-conditioning volume and account for
Ground area, structure are more compact；
2. the utility model is by the way that the distance between the bottom of the first air inlet and the semiconductor chilling plate to be greater than
The distance between described second air outlet the top and the semiconductor chilling plate；The top of second air inlet with it is described
The distance between semiconductor chilling plate is greater than the distance between first air outlet bottom and the semiconductor chilling plate, energy
It enough effectively reduces the air-flow blown out from second air outlet of the same side and is inhaled into the probability into the first air inlet, prevent
Interference in air flow is generated, simultaneously effective reduces the air-flow blown out from first air outlet of the same side and is inhaled into the second air inlet
Probability at mouthful, prevents interference in air flow；
3. the utility model is by the first auxiliary air inlet opening for being arranged on the adjacent face of first side, and in second side
The second auxiliary air inlet opening being arranged on adjacent face can be entered the wind together with the first air inlet by the first auxiliary air inlet opening, from
And doing farther away from the second air outlet or by the area of the first air inlet for can doing the first air inlet is smaller, further
The case where wind that ground reduces the second air outlet enters in the first air inlet and generates interference in air flow, can similarly pass through second
Auxiliary air inlet opening is entered the wind together with the second air inlet, so as to by the second air inlet do farther away from the first air outlet or
The area of second air inlet is done smaller, the wind for further reducing the first air outlet is entered in the second air inlet and produced
The case where raw interference in air flow.
Detailed description of the invention
Fig. 1 is the front internal structure chart of the semiconductor refrigerating desktop air-conditioning of the utility model；
Fig. 2 is the left view structure chart of Fig. 1；
Fig. 3 is the right view structure chart of Fig. 1；
Fig. 4 is the schematic cross-section in the direction A-A of Fig. 1.
Appended drawing reference is expressed as in figure：
1, shell；11, the first cavity；12, the second cavity；2, semiconductor chilling plate；31, the first air inlet；32, first goes out
Air port；33, the second air inlet；34, the second air outlet；35, the first auxiliary air inlet opening；36, the second auxiliary air inlet opening；41, first
Side；42, second side；43, third side；44, the 4th side；51, the first aerofoil fan；52, the second aerofoil fan；61,
First radiator；62, the second radiator；7, water receiver；81, the first blinds；82, the second blinds；83, third blinds；84, the 4th
Blinds.
Specific embodiment
As shown in Figs 1-4, the utility model provides a kind of semiconductor refrigerating desktop air-conditioning comprising shell 1 and be located at institute
The intracorporal semiconductor chilling plate 2 of shell is stated, and the semiconductor chilling plate 2 is arranged in the shell 1 and (is preferably laterally located at shell
Medium position), and enclosure interior cavity is divided into mutually isolated the first cavity 11 (being preferably placed at top) and the second cavity
12 (being preferably placed at lower part)；
Further include the first air inlet 31 and the first air outlet 32 being connected to respectively with first cavity 11, passes through described
The heating face (preferably upper surface) that the air-flow that one air inlet 31 enters in the first cavity 11 flows through the semiconductor chilling plate 2 is changed
Heat is simultaneously discharged by first air outlet 32, and first air inlet 31 is located at different faces from first air outlet 32
On；
Further include the second air inlet 33 and the second air outlet 34 being connected to respectively with second cavity 12, passes through described
The chill surface (preferably lower surface) that the air-flow that two air inlets 33 enter in the second cavity 12 flows through the semiconductor chilling plate 2 is changed
Heat is simultaneously discharged by second air outlet 34, and second air inlet 33 is located at different faces from second air outlet 34
On；
The utility model by by the semiconductor chilling plate lateral arrangement of semiconductor refrigerating desktop air-conditioning in shell and on
Two cavitys of lower separation, and be located on different faces from the first air inlet of the first cavity connection and the first air outlet respectively,
And be located on different faces from the second air inlet of the second cavity connection and the second air outlet respectively, it enables to go out from first
The wind of air port blowout will not be flowed backward in the first air inlet, efficiently avoid air flow shortcircuit, and different by being located at
First air inlet and the first air outlet in face, additionally it is possible to which the length for reducing desktop air-conditioning (is to avoid in respect to the background art
Air flow shortcircuit and will highly draw very long), to effectively reduce the volume on desktop air-conditioning top, can also similarly make from second
The wind of air outlet blowout will not be flowed backward in the second air inlet, efficiently avoid air flow shortcircuit, and by being located at difference
Face the second air inlet and the second air outlet, additionally it is possible to the length for reducing desktop air-conditioning (is to keep away in respect to the background art
Exempt from air flow shortcircuit and will highly draw very long), to effectively reduce the volume of desktop air-conditioning lower part, thus synthetically can be
Avoid air-flow occur short circuit while can also be unlikely to obtain Duct design it is very long, efficiently reduce desktop air-conditioning volume and
Occupied area, structure are more compact.
Since previous desktop air-conditioning (for semiconductor refrigerating) majority is all to go out from following air inlet from above
Wind, if up and down air port distance is inadequate and the influence of indoor air flow, the phenomenon that may result in air flow shortcircuit appearance, i.e. portion
It separates wind or whole outlet air is all directly entered return air inlet repetitive cycling.
And cold and hot air duct is straight air duct here, the air port in left side is cold wind import and hot-blast outlet, right side cold wind respectively
Outlet and hot wind inlet, and cold wind is downward (cold end is in lower layer), hot wind is upward (hot end is on upper layer).So alleviating to a certain extent
The phenomenon that air flow shortcircuit.In order to further avoid, positive (i.e. right side in Fig. 1) and the back side (i.e. left side in Fig. 1) into
Wind air grille quantity reduce (including cold wind import and hot wind inlet), and side increase air inlet (including cold wind import and
Hot wind inlet), avoid the interference in air flow of the same side.
Preferably,
And in the upper and lower surfaces of the semiconductor chilling plate 2：
The upper surface of the semiconductor chilling plate is heating face, and air-flow enters described first by first air inlet 31
It is heated and is discharged from first air outlet 32 in cavity 11, the lower surface is chill surface, and air-flow passes through described second
Air inlet 33 enters in second cavity 12 and is freezed and be discharged from second air outlet 34.The utility model is efficient
The principle that the density that thermal current is utilized in ground is small, cold airflow density is big, so that the air-flow in the first cavity is by heating wheat flour
Temperature increases and enters upper layer cavity (the first cavity) after heat, eventually enters into and is discharged in the first air outlet, into the second cavity
Interior air-flow temperature after chill surface freezes reduces and enters lower layer's cavity (the second cavity), eventually enters into the second air outlet
In be discharged, realize refrigeration and heating.
Preferably,
First air inlet 31 is set in the first side 41 of the shell, and first air outlet 32 is set to institute
It states in the second side 42 of shell, and the first side 41 is opposite with the second side 42；
Second air inlet 33 is set on the third side 43 of the shell, and second air outlet 34 is set to institute
It states on the 4th side 44 of shell, and the third side 43 is opposite with the 4th side 44.
This be first air inlet of the utility model and the preferred arrangement of the first air outlet and the second air inlet and
The preferred arrangement of second air outlet enables to the first air inlet and the first air outlet to be located at two sides being disposed opposite to each other
On, i.e., as shown in Figure 1, the first air inlet is located at (first side) on upper right side, the first air outlet is located on the side of upper left (
Two side faces), it can effectively further avoid the wind blown out at the first air outlet from flowing back into the first air inlet again and gas occurs
The case where flow short-circuit, while it is also possible that the second air inlet and the second air outlet are located on two sides being disposed opposite to each other, i.e.,
As shown in Figure 1, the second air inlet is located on lower left side (third side), the second air outlet is located at (the 4th side in lower right sides
Face), it can effectively further avoid that the wind blown out at the second air outlet flows back into the second air inlet again and that air-flow occurs is short
The case where road, synthetically can further reduce the probability generation that short circuit occurs for air-flow.
Preferably,
The first side 41 and the second side 42 are all set in 2 upper end of semiconductor chilling plate, and described
One side 41 and the second side 42 are corresponding with first cavity 11 respectively；
The third side 43 and the 4th side 44 are all set in 2 lower end of semiconductor chilling plate, and described
Three sides 43 and the 4th side 44 are corresponding with second cavity 12 respectively.
This is the first side, second side, the optimum position relationship of third side and the 4th side of the utility model, energy
It is enough by the first air inlet air inlet for being located in first side, into exchanged heat in the first cavity, by positioned at second
The first air outlet on side；Can by the second air inlet air inlet for being located on third side, into the second cavity
It is exchanged heat and then by the second air outlet on the 4th side.
Preferably,
The first side 41 is located on the same side of the desktop air-conditioning with the 4th side 44, described second side
Face 42 and the third side 43 are located on the same side of the desktop air-conditioning.As shown in Figure 1, i.e. first side and the 4th side
Face is located on the right side of desktop air-conditioning shown in figure, and second side and third side are located at desktop air-conditioning shown in figure
On right side, i.e., by the hot end outlet air of top and the cold end outlet air of lower section is mutually separated comes, prevent towards side blowing hot-air simultaneously
And cold wind, the effect of bad refrigeration or heating is generated, and the desktop air-conditioning main body of the utility model is rectangular parallelepiped structure, is being needed
When blowing a cold wind over to user, only the second air outlet need to be now placed in by the second air outlet (cold end air outlet) against user
Influence of first air inlet of top to the second air outlet is smaller, will not influence refrigeration effect, is able to satisfy the refrigeration demand of user；
Similarly when needing to user's blowing hot-air, only the need to be now placed in by the first air outlet (hot end air outlet) against user
Influence of second air inlet to the first air outlet below one air outlet is smaller, will not influence heating effect, is able to satisfy user's
Heating needs.
Preferably,
The distance between the bottom of first air inlet 31 and the semiconductor chilling plate 2 are greater than second outlet air
Mouth the distance between 34 the tops and the semiconductor chilling plate 2；The top of second air inlet 33 and the semiconductor
The distance between cooling piece 2 is greater than the distance between 32 bottom of the first air outlet and the semiconductor chilling plate 2.
But as it appears from the above, although influence of first air inlet to the second air outlet for being located at the same side is smaller, it is same to be located at
Influence of second air inlet of side to the first air outlet is smaller, but still have interference in air flow the case where, in order to reduce
This air-flow hands over mixed situation, and the distance between the bottom of the first air inlet and the semiconductor chilling plate are set greater than
The distance between described second air outlet the top and the semiconductor chilling plate；The top of second air inlet with it is described
The distance between semiconductor chilling plate is set greater than between first air outlet bottom and the semiconductor chilling plate
Distance can effectively reduce the air-flow blown out from second air outlet of the same side and be inhaled into the general of the first air inlet
Rate, prevents interference in air flow, simultaneously effective reduce from first air outlet of the same side blow out air-flow and be inhaled into
The probability of second air inlet, prevents interference in air flow.
Preferably,
It further include the first auxiliary air inlet opening 35, first auxiliary air inlet opening 35 is set to adjacent with the first side 41
Face on and the position adjacent with the first side 41 at, and first auxiliary air inlet opening 35 and first cavity 11 connect
It is logical；And/or
It further include the second auxiliary air inlet opening 36, second auxiliary air inlet opening 36 is set to adjacent with the second side 42
Face on and the position adjacent with the second side 42 at, and second auxiliary air inlet opening 36 and second cavity 12 connect
It is logical.
It is set by the first auxiliary air inlet opening being arranged on the adjacent face of first side, and on the adjacent face of second side
The second auxiliary air inlet opening set can be entered the wind together with the first air inlet by the first auxiliary air inlet opening, so as to by first
It is smaller that air inlet was done do farther away from the second air outlet or by the area of the first air inlet, further reduces second
The case where wind of air outlet enters in the first air inlet and generates interference in air flow, similarly can by the second auxiliary air inlet opening with
Second air inlet is entered the wind together, so as to by the second air inlet do farther away from the first air outlet or by the second air inlet
Area do smaller, the wind for further reducing the first air outlet enters in the second air inlet and generates interference in air flow
Situation.
Preferably,
It is additionally provided with the first aerofoil fan 51 in the shell 1 and positioned at the position of first air outlet 32, it is described
The axis direction of first aerofoil fan 51 is parallel with the arranged direction of the semiconductor chilling plate 2；
It is additionally provided with the second aerofoil fan 52 in the shell 1 and positioned at the position of second air outlet 34, it is described
The axis direction of second aerofoil fan 52 is parallel with the arranged direction of the semiconductor chilling plate 2.
The utility model is compared with the background art design the smaller straight air duct of volume, and inlet and outlet is in two sides
Desktop air-conditioning, small (compared with normal temperature laboratory air) using hot wind density, the big principle of cold wind density designs cold and hot air duct,
Also air flow shortcircuit is avoided, in order to further prevent air flow shortcircuit, the side of inlet and outlet is additionally provided with grid air inlet (i.e. the first He
Second auxiliary air inlet opening), it is entered the wind as supplement.Reduce air-conditioning duct resistance to a certain extent, smaller blower can be used (i.e.
Axial flow blower), with respect to the background art in centrifugal blower for noise have certain improvement, save electric energy, various ways are kept away
The phenomenon that exempting from air flow shortcircuit.Noise abatement is generated, power saving, indoor air circulation is more efficient, the more comfortable beneficial effect of human body.
The utility model passes through a kind of new desktop air-conditioning air supply mode, air duct of the desktop air-conditioning by air inlet/outlet, wind
Mouth position, air duct is simple, no turning, only the resistance of radiator, because duct resistance is small, can choose the axis stream wind of very little
Fan can reduce noise, realize that noise abatement, power saving improve the purpose of indoor air circulation efficiency.
Preferably,
The first radiator 61, one end of first radiator 61 and described half are additionally provided in first cavity 11
The upper surface of conductor cooling piece 2 connects, the other end extends to the top of the shell upward or pre- with housing tip interval first
If the position of spacing；
The second radiator 62, one end of second radiator 62 and described half are additionally provided in second cavity 12
The lower surface of conductor cooling piece 2 connects, the other end extends to the bottom end of the shell downward or pre- with housing bottom interval second
If the position of spacing.I.e. upper layer is hot-side heat dissipation device, and lower layer is cold end radiator.
The heat transfer effect of semiconductor chilling plate generation can be increased by the first and second radiators, improve chill surface air-flow
With the heat transfer effect between heating face air-flow, preferably the first and second radiators are fin radiator.The utility model desktop is empty
Tune main structure is cuboid, is divided into upper layer and lower layer, and one block semiconductor cold plate of centre setting, upper layer is hot-side heat dissipation device, under
Layer is cold end radiator.Upper layer and two completely separated air ducts of lower layer, upper air duct the inside includes mainly radiator, axis stream
Fan, air outlet and air inlet.Air port blinds is set before fan outlet, and air inlet is also provided with air port blinds.Understructure is same
Upper layer, more drip trays, the drip tray can take out, water poured out.Upper layer air duct is hot wind, and lower layer air duct is cold wind.
Preferably,
Water receiver 7 is additionally provided with inside the shell 1 and below second radiator 62.Pass through water receiver energy
Enough collect the cooled condensed water generated in refrigeration evaporator end.
Preferably,
It is additionally provided with the first blinds 81 at first air inlet 31, is additionally provided with the 200th at first air outlet 32
It is additionally provided with third blinds 83 at leaf 82, the second air inlet 33, is additionally provided with the 4th blinds 84 at the second air outlet 34.Pass through hundred
The mode of leaf can carry out guiding role, and setting by the first and second auxiliary air inlet opening above-mentioned to air inlet and the outlet
It sets, so that increasing by row's blinds air inlet in the two sides of two air inlets of air-conditioning, reduces on the positive (right side i.e. in figure of air-conditioning
Face) and the back side (left side i.e. in figure) blinds air inlet, can further decrease in this way generated between ipsilateral air-flow it is dry
It disturbs.
Preferably,
First blinds 81 and the third blinds 83 are fixedly provided on the shell 1, second blinds 82
It is movably set on the shell 1 with the 4th blinds 84.It is since air inlet is put by the blinds fixed setting of two air inlets
The effect of action-oriented is little, fixed direction should select to guarantee as far as possible not with the air-flow of the air outlet of the same side occur interference or
Reduce interference, the blinds activity setting of two air outlets can be brought into refrigeration cold wind or heating by controlling the swing of blinds
The swing flap of hot wind acts on, and improves comfort level.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.The above is only the preferred embodiment of the utility model, it is noted that for the art
For those of ordinary skill, without deviating from the technical principle of the utility model, several improvements and modifications can also be made,
These improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (11)
1. a kind of semiconductor refrigerating desktop air-conditioning, it is characterised in that：
Including shell (1) and it is located at the intracorporal semiconductor chilling plate of the shell (2), the semiconductor chilling plate (2) will be in shell
Portion's cavity is divided into mutually isolated the first cavity (11) and the second cavity (12)；
The air-conditioning further includes the first air inlet (31) and the first air outlet (32) being connected to respectively with first cavity (11),
The heating face of the semiconductor chilling plate (2) is flowed through by the air-flow that first air inlet (31) enters in the first cavity (11)
It is exchanged heat and is discharged by first air outlet (32), and first air inlet (31) and the first air outlet (32) position
In on different faces；
The air-conditioning further includes the second air inlet (33) and the second air outlet (34) being connected to respectively with second cavity (12),
The chill surface of the semiconductor chilling plate (2) is flowed through by the air-flow that second air inlet (33) enters in the second cavity (12)
It is exchanged heat and is discharged by second air outlet (34), and second air inlet (33) and the second air outlet (34) position
In on different faces.
2. semiconductor refrigerating desktop air-conditioning according to claim 1, it is characterised in that：
For semiconductor chilling plate (2) lateral arrangement in the shell (1), first cavity (11) is located at the shell
(1) top, second cavity (12) in are located at the intracorporal lower part of the shell；
And in the upper and lower surfaces of the semiconductor chilling plate (2)：
The upper surface of the semiconductor chilling plate is heating face, and air-flow enters first sky by first air inlet (31)
Heat in chamber (11) and be discharged from first air outlet (32), the lower surface is chill surface, and air-flow passes through described the
Two air inlets (33) enter in second cavity (12) and are freezed and be discharged from second air outlet (34).
3. semiconductor refrigerating desktop air-conditioning according to claim 2, it is characterised in that：
First air inlet (31) is set in the first side (41) of the shell, and first air outlet (32) is set to
In the second side (42) of the shell, and the first side (41) is opposite with the second side (42)；
Second air inlet (33) is set on the third side (43) of the shell, and second air outlet (34) is set to
On 4th side (44) of the shell, and the third side (43) is opposite with the 4th side (44).
4. semiconductor refrigerating desktop air-conditioning according to claim 3, it is characterised in that：
The first side (41) and the 4th side (44) are located on the same side of the desktop air-conditioning, described second side
Face (42) and the third side (43) are located on the same side of the desktop air-conditioning.
5. semiconductor refrigerating desktop air-conditioning according to claim 4, it is characterised in that：
The distance between bottom and the semiconductor chilling plate (2) of first air inlet (31) are greater than second outlet air
Mouthful (34) are topmost the distance between with the semiconductor chilling plate (2)；The top of second air inlet (33) with it is described
The distance between semiconductor chilling plate (2) be greater than the first air outlet (32) bottom and the semiconductor chilling plate (2) it
Between distance.
6. semiconductor refrigerating desktop air-conditioning according to claim 3, it is characterised in that：
It further include the first auxiliary air inlet opening (35), first auxiliary air inlet opening (35) is set to and the first side (41) phase
On adjacent face and at the position adjacent with the first side (41), and first auxiliary air inlet opening (35) and first sky
Chamber (11) connection；And/or
It further include the second auxiliary air inlet opening (36), second auxiliary air inlet opening (36) is set to and the second side (42) phase
On adjacent face and at the position adjacent with the second side (42), and second auxiliary air inlet opening (36) and second sky
Chamber (12) connection.
7. semiconductor refrigerating desktop air-conditioning according to claim 1 to 6, it is characterised in that：
The first aerofoil fan (51), institute are additionally provided in the shell (1) and positioned at the position of first air outlet (32)
The axis direction for stating the first aerofoil fan (51) is parallel with the length extending direction of the semiconductor chilling plate (2)；
The second aerofoil fan (52), institute are additionally provided in the shell (1) and positioned at the position of second air outlet (34)
The axis direction for stating the second aerofoil fan (52) is parallel with the length extending direction of the semiconductor chilling plate (2).
8. semiconductor refrigerating desktop air-conditioning according to claim 1 to 6, it is characterised in that：
Be additionally provided with the first radiator (61) in first cavity (11), one end of first radiator (61) with it is described
The upper surface of semiconductor chilling plate (2) connects, the other end extend to upward the shell top or with housing tip interval
The position of one default spacing；
Be additionally provided with the second radiator (62) in second cavity (12), one end of second radiator (62) with it is described
The lower surface of semiconductor chilling plate (2) connects, the other end extend to downward the shell bottom end or with housing bottom interval
The position of two default spacing.
9. semiconductor refrigerating desktop air-conditioning according to claim 8, it is characterised in that：
The shell (1) is internal and is additionally provided with water receiver (7) below second radiator (62).
10. semiconductor refrigerating desktop air-conditioning according to claim 1 to 6, it is characterised in that：
It is additionally provided with the first blinds (81) at first air inlet (31), is additionally provided with second at first air outlet (32)
Third blinds (83) is additionally provided at blinds (82), the second air inlet (33), the second air outlet is additionally provided with the 400th at (34)
Leaf (84).
11. semiconductor refrigerating desktop air-conditioning according to claim 10, it is characterised in that：
First blinds (81) and the third blinds (83) are fixedly provided on the shell (1), second blinds
(82) it is movably set on the shell (1) with the 4th blinds (84).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820683751.1U CN208154705U (en) | 2018-05-08 | 2018-05-08 | Semiconductor refrigeration desktop air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820683751.1U CN208154705U (en) | 2018-05-08 | 2018-05-08 | Semiconductor refrigeration desktop air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208154705U true CN208154705U (en) | 2018-11-27 |
Family
ID=64389823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820683751.1U Active CN208154705U (en) | 2018-05-08 | 2018-05-08 | Semiconductor refrigeration desktop air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208154705U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108518778A (en) * | 2018-05-08 | 2018-09-11 | 珠海格力电器股份有限公司 | Semiconductor refrigeration desktop air conditioner |
| CN110056952A (en) * | 2019-05-05 | 2019-07-26 | 青岛海尔空调器有限总公司 | A kind of exhaust apparatus, air conditioner indoor unit and air-conditioning |
-
2018
- 2018-05-08 CN CN201820683751.1U patent/CN208154705U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108518778A (en) * | 2018-05-08 | 2018-09-11 | 珠海格力电器股份有限公司 | Semiconductor refrigeration desktop air conditioner |
| CN108518778B (en) * | 2018-05-08 | 2023-09-19 | 珠海格力电器股份有限公司 | Semiconductor refrigeration desktop air conditioner |
| CN110056952A (en) * | 2019-05-05 | 2019-07-26 | 青岛海尔空调器有限总公司 | A kind of exhaust apparatus, air conditioner indoor unit and air-conditioning |
| CN110056952B (en) * | 2019-05-05 | 2021-12-21 | 重庆海尔空调器有限公司 | Air outlet device, air conditioner indoor unit and air conditioner |
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