CN208142152U - A kind of wafer and MASK are individually picked and placed and precise positioning mechanism - Google Patents

A kind of wafer and MASK are individually picked and placed and precise positioning mechanism Download PDF

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Publication number
CN208142152U
CN208142152U CN201820659882.6U CN201820659882U CN208142152U CN 208142152 U CN208142152 U CN 208142152U CN 201820659882 U CN201820659882 U CN 201820659882U CN 208142152 U CN208142152 U CN 208142152U
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Prior art keywords
wafer
mask
support plate
supporting element
positioning
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CN201820659882.6U
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Chinese (zh)
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潘明元
陈新
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Chengdu Hua Ji Technology Co Ltd
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Chengdu Hua Ji Technology Co Ltd
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Abstract

It is individually picked and placed the utility model discloses a kind of wafer and MASK and precise positioning mechanism, including the lifting shaft vertically gone up and down, wafer support plate, MASK, and positioning carrier, at least three support rods are provided at the top of lifting shaft, it is provided with the first supporting element that one is used to support wafer support plate on each support rod and one is located above first supporting element, it is used to support the second supporting element of MASK, it is provided on positioning carrier for support rod, first supporting element and the second supporting element vertically pass through the first resigning opening of positioning carrier, the second resigning opening that wafer support plate is vertically passed through for the second supporting element is additionally provided on wafer support plate.The utility model has the beneficial effects that:It solves the problems, such as wafer and MASK precise positioning in vacuum environment, also creatively devises double-layer lifting device, realize that wafer and the independent of MASK take, put.

Description

A kind of wafer and MASK are individually picked and placed and precise positioning mechanism
Technical field
The utility model relates to wafer processing techniques field, especially a kind of wafer is individually picked and placed with MASK and precise positioning Mechanism.
Background technique
In semiconductor PVD, CVD technique, it is often necessary to be placed above wafer in vacuum environment of different shapes MASK(Mask plate), by figure specific on MASK, in the film of crystal column surface deposition specific function.For the essence for guaranteeing film Degree, must be requested that wafer and MASK precise positioning.But that there are positioning accuracies is low for existing positioning mechanism, is difficult to quantity-produced technology Problem.
Utility model content
The shortcomings that the purpose of the utility model is to overcome the prior arts, provides a kind of wafer and MASK is individually picked and placed and smart Quasi- positioning mechanism may be implemented during continuous coating, the independent pick-and-place of wafer and MASK and precise positioning, thus in crystalline substance The film that circular surfaces deposit special shape provides necessary condition.
Cooperate wafer manipulator, realize the precise locating function of wafer and MASK in vacuum environment, while guaranteeing wafer It can individually be picked and placed with MASK, be convenient for continuous production
The purpose of this utility model is achieved through the following technical solutions:A kind of wafer and MASK individually picks and places and it is accurate calmly Position mechanism, the lifting shaft including vertically going up and down, wafer support plate, MASK for containing wafer(Mask plate), Yi Jigu It is arranged and is used to support wafer support plate and the positioning carrier of MASK calmly, is provided at the top of lifting shaft horizontally extending Connecting plate is provided at least three support rods being arranged in vertical at the top of connecting plate, is provided on each support rod One the first supporting element for being used to support wafer support plate and one is located above first supporting element, is used to support the of MASK Two supporting elements, wafer support plate is horizontally-supported by the first supporting element, and MASK is horizontally-supported by the second supporting element and is located at wafer support plate Surface, when lifting arm is located at it is high-order when, positioning carrier is located at the lower section of MASK and wafer support plate, and the positioning carries It is provided on disk for support rod, the first supporting element and the second supporting element vertically to pass through the first of positioning carrier and step down and open Mouthful, position carrier on be additionally provided with multiple positioning pins extended in the vertical direction, be provided on the MASK with it is described fixed The first positioning hole matched is sold in position, is provided with the second location hole matched with the positioning pin, wafer on wafer support plate The second resigning opening that wafer support plate is vertically passed through for the second supporting element is additionally provided on plate.When lifting shaft from a high position to Under when dropping to status, support rod is stepped down from first be open in vertical downward movement, the first supporting element first vertically to Under step down opening across the first of positioning carrier, while the first positioning hole of wafer support plate is set on positioning pin, and final Wafer support plate is supported by positioning carrier, support rod continues vertically downward, and the second supporting element is successively passed down through wafer support plate Second the first resigning for stepping down opening and positioning carrier is open, meanwhile, the second vacancy hole of MASK is set on positioning pin, and Final MASK is covered on wafer support plate.Support rod continuation completely disengages wafer support plate and MASK vertically downward.
When work, lifting shaft is risen into highest order, then wafer support plate is placed under elevating mechanism by manipulator Layer, then elevating mechanism declines a distance, then MASK is placed to the upper layer of elevating mechanism by manipulator, can guarantee in this way The independent pick-and-place of wafer and MASK.Pass through the first positioning hole and positioning carrying in the second location hole and MASK on wafer support plate The cooperation of the positioning pin of disk, it is ensured that the location error of wafer and MASK are less than ± 0.1mm.The space reserved between support rod, side Just manipulator disengaging picks and places wafer and MASK.There are four support rods for setting in the present embodiment.Preferably, it is arranged on the MASK There is the third location hole matched with manipulator, the 4th positioning matched with manipulator is provided on the wafer support plate Hole.
The driving device that the lifting axis connection drives it to go up and down, the driving device include the fixation of fixed setting Flange is provided with the through-hole passed through for lifting shaft on mounting flange, and the bottom of mounting flange is successively fixedly installed with straight line mould group The driving motor vertically gone up and down with the sliding block of driving straight line mould group, the bottom of lifting shaft is fixedly connected with a slide block.It is fixed Flange and positioning carrier can be fixedly installed in rack.It is driven and is gone up and down by servo motor, accurately control lifting distance.
Preferably, it is equipped with and is set in outside lifting shaft, for sealing lifting shaft between the sliding block and mounting flange Welding bellows.
The utility model has the following advantages that:
The utility model has well solved the problem of wafer is with MASK precise positioning in vacuum environment, also creatively Double-layer lifting device is devised, realizes that wafer and the independent of MASK take, put.Therefore, wafer is only needed to change, continuous life can be reached The purpose of production substantially increases production efficiency, while having saved cost.By the cooperation of pin hole, wafer and MASK are realized Automatic and accurate positioning function guarantees that position error is less than ± 0.1mm.By the way that double-layer lifting mechanism is arranged, wafer and MASK are realized Independent pick-and-place.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the schematic perspective view of the utility model.
Fig. 3 is integrally-built schematic perspective view after the lifting shaft of the utility model declines.
Fig. 4 is the schematic diagram of wafer support plate and the first supporting element fit structure in the utility model one embodiment.
Fig. 5 is the schematic diagram of MASK and the second supporting element fit structure in the utility model one embodiment.
Fig. 6 is the structural schematic diagram that loading plate is positioned in the utility model one embodiment.
Specific embodiment
The utility model is further described with reference to the accompanying drawing:
As shown in figs 1 to 6, a kind of wafer and MASK are individually picked and placed and precise positioning mechanism, including are vertically gone up and down Lifting shaft 1, wafer support plate 8, MASK for containing wafer(Mask plate)7 and fixed setting and be used to support wafer The positioning carrier 4 of plate 8 and MASK7, the top of lifting shaft 1 are provided with horizontally extending connecting plate 2, connecting plate 2 Top is provided at least three support rods 3 being arranged in vertical, and is provided with one on each support rod 3 and is used to support crystalline substance First supporting element 5 of circle support plate 8 and second supporting element 6 for being located at 5 top of the first supporting element, being used to support MASK7, Wafer support plate 8 is horizontally-supported by the first supporting element 5, and MASK7 is horizontally-supported by the second supporting element 6 and is located at wafer support plate 8 just Top, when lifting arm is located at a high position, positioning carrier 4 is located at the lower section of MASK7 and wafer support plate 8, the positioning carrying It is provided on disk 4 and vertically passes through the first of positioning carrier 4 for support rod 3, the first supporting element 5 and the second supporting element 6 Resigning opening 15 positions and is additionally provided with multiple positioning pins 9 extended in the vertical direction on carrier 4, is arranged on the MASK7 There is the first positioning hole 10 matched with the positioning pin 9, matched with the positioning pin 9 is provided on wafer support plate 8 Two location holes 11 are additionally provided on wafer support plate 8 and vertically step down across the second of wafer support plate 8 for the second supporting element 6 Opening 12.When lifting shaft 1 is lowered down to status from a high position, the vertical downward movement out of first resigning opening 15 of support rod 3, First supporting element 5 passes through the first of positioning carrier 4 vertically down first and steps down opening 15, while wafer support plate 8 First positioning hole 10 is set on positioning pin 9, and finally supports wafer support plate 8 by positioning carrier 4, and support rod 3 continues vertically Downwards, the second supporting element 6 is successively passed down through the second resigning opening 12 of wafer support plate 8 and the first of positioning carrier 4 is stepped down Opening 15, meanwhile, the second vacancy hole of MASK7 is set on positioning pin 9, and final MASK7 is covered on wafer support plate 8.Branch The continuation of strut 3 completely disengages wafer support plate 8 and MASK7 vertically downward.
When work, lifting shaft 1 is risen into highest order, wafer support plate 8 is then placed on by elevating mechanism by manipulator Lower layer, then elevating mechanism declines a distance, then MASK7 is placed to the upper layer of elevating mechanism by manipulator, in this way Guarantee the independent pick-and-place of wafer and MASK7.Pass through the second location hole 11 on wafer support plate 8 and the first positioning hole on MASK7 10 with positioning carrier 4 positioning pin 9 cooperation, it is ensured that the location error of wafer and MASK7 be less than ± 0.1mm.Support rod 3 Between the space reserved, facilitate manipulator disengaging to pick and place wafer and MASK7.There are four support rods 3 for setting in the present embodiment.It is preferred that , the third location hole 13 matched with manipulator is provided on the MASK7, be provided on the wafer support plate 8 with The 4th location hole 14 that manipulator matches.
The connection of lifting shaft 1 drives the driving device of its lifting, and the driving device includes consolidating for fixed setting Determine flange 17, the through-hole passed through for lifting shaft 1 is provided on mounting flange 17, the bottom of mounting flange 17 is successively fixedly installed with The driving motor 19 that the sliding block of straight line mould group 18 and driving straight line mould group 18 is vertically gone up and down, the bottom of lifting shaft 1 and cunning Block is fixedly connected.Mounting flange 17 and positioning carrier 4 can be fixedly installed on rack(It is not shown in the figure)On.By servo motor Driving lifting, accurately controls lifting distance.
Preferably, it is equipped with and is set in outside lifting shaft 1, for sealing lifting between the sliding block and mounting flange 17 The welding bellows 20 of axis 1.
Positioning carrier 4 is mounted on the surface of elevating mechanism, the intermediate hollow out of carrier 4 is positioned, convenient for elevating mechanism Four support rods 3 are gone up and down.Three positioning pins 9 of disk circumference, position is consistent with the location hole of wafer support plate 8 and MASK7, protects Positioning accuracy after card placement.
Supporting element is mounted on the support rod 3 of elevating mechanism, totally eight in the present embodiment, is divided into upper layer and lower layer, upper layer is used Place MASK7, lower layer is used to place wafer support plate 8.By adjusting the position height of every supporting element, guarantee every layer of supporting element Apparent height is consistent, by adjusting angle, guarantees the gap between supporting element and wafer support plate 8 and MASK7, while guaranteeing upper layer Supporting element, which just can step down to be open from 12 from the second of wafer support plate 8, to be passed through.
MASK7 is circular flat plate structure, intermediate according to coating process needs, processes different pattern.MASK7 surrounding processing the A positioning hole 10 and third location hole 13, first positioning hole 10 and the positioning pin 9 positioned on carrier 4 cooperate, guarantee and wafer Position precision, the positioning pin 9 of third location hole 13 and mechanical paw on hand cooperates, and guarantees essence when manipulator picks and places MASK7 Degree.
Wafer support plate 8 is circular flat plate structure, intermediate to process wafer carrying table top according to wafer size.The processing of wafer surrounding Second location hole 11 and the 4th location hole 14, third location hole 13 and positioning carrier 4 on positioning pin 9 cooperate, guarantee with The position precision of MASK7, the 4th location hole 14 cooperates with the positioning pin 9 of mechanical paw on hand, when guaranteeing that manipulator picks and places wafer Precision.Meanwhile the second resigning of 8 surrounding of wafer support plate processing opening 12, position is consistent with the second supporting element 6, guarantees placement When MASK7, the second supporting element 6 will not interfere with wafer support plate 8.

Claims (4)

1. a kind of wafer and MASK are individually picked and placed and precise positioning mechanism, it is characterised in that:Including the liter vertically gone up and down It drop axis, the wafer support plate for containing wafer, MASK and fixed setting and is used to support the positioning of wafer support plate and MASK and holds Load plate is provided with horizontally extending connecting plate at the top of lifting shaft, and at least three are provided at the top of connecting plate along hanging down Histogram is provided with the first supporting element and one that one is used to support wafer support plate on each support rod to the support rod of setting Above first supporting element, it is used to support the second supporting element of MASK, wafer support plate is horizontally-supported by the first supporting element, MASK is horizontally-supported by the second supporting element and is located at the surface of wafer support plate, when lifting arm is located at a high position, positions carrier Positioned at the lower section of MASK and wafer support plate, it is provided on the positioning carrier for support rod, the first supporting element and second Support member vertically pass through positioning carrier first step down opening, position carrier on be additionally provided with it is multiple vertically The positioning pin of extension is provided with the first positioning hole matched with the positioning pin on the MASK, is arranged on wafer support plate There is the second location hole matched with the positioning pin, is additionally provided on wafer support plate and is vertically passed through for the second supporting element The second of wafer support plate, which is stepped down, to be open.
2. a kind of wafer according to claim 1 and MASK are individually picked and placed and precise positioning mechanism, it is characterised in that:It is described MASK on be provided with the third location hole matched with manipulator, be provided on the wafer support plate and matched with manipulator The 4th location hole.
3. a kind of wafer according to claim 1 and MASK are individually picked and placed and precise positioning mechanism, it is characterised in that:It is described Lifting axis connection drive its go up and down driving device, the driving device include fixed setting mounting flange, fixation The through-hole passed through for lifting shaft is provided on orchid, the bottom of mounting flange is successively fixedly installed with straight line mould group and driving straight line mould The driving motor that the sliding block of group is vertically gone up and down, the bottom of lifting shaft is fixedly connected with a slide block.
4. a kind of wafer according to claim 3 and MASK are individually picked and placed and precise positioning mechanism, it is characterised in that:It is described Sliding block and mounting flange between the welding bellows being set in outside lifting shaft, for sealing lifting shaft is installed.
CN201820659882.6U 2018-05-04 2018-05-04 A kind of wafer and MASK are individually picked and placed and precise positioning mechanism Active CN208142152U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820659882.6U CN208142152U (en) 2018-05-04 2018-05-04 A kind of wafer and MASK are individually picked and placed and precise positioning mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820659882.6U CN208142152U (en) 2018-05-04 2018-05-04 A kind of wafer and MASK are individually picked and placed and precise positioning mechanism

Publications (1)

Publication Number Publication Date
CN208142152U true CN208142152U (en) 2018-11-23

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108389821A (en) * 2018-05-04 2018-08-10 成都华聚科技有限公司 A kind of wafer individually picks and places and precise positioning mechanism with MASK
CN109624109A (en) * 2019-02-20 2019-04-16 广州安特激光技术有限公司 A kind of plummer of wafer cutter device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108389821A (en) * 2018-05-04 2018-08-10 成都华聚科技有限公司 A kind of wafer individually picks and places and precise positioning mechanism with MASK
CN109624109A (en) * 2019-02-20 2019-04-16 广州安特激光技术有限公司 A kind of plummer of wafer cutter device

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