CN208127140U - A kind of automobile polished semiconductor device - Google Patents
A kind of automobile polished semiconductor device Download PDFInfo
- Publication number
- CN208127140U CN208127140U CN201820623342.2U CN201820623342U CN208127140U CN 208127140 U CN208127140 U CN 208127140U CN 201820623342 U CN201820623342 U CN 201820623342U CN 208127140 U CN208127140 U CN 208127140U
- Authority
- CN
- China
- Prior art keywords
- fixed
- polished
- synchronous motor
- sucker
- fixed frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The utility model discloses a kind of automobile polished semiconductor devices, including sliding bottom, fixed link is fixed with inside the sliding bottom, and sliding bottom lower end is equipped with the first synchronous motor, and fixed link lower end is provided with cabinet, the first fixed frame is installed on the left of first synchronous motor, and first is fixed with the second fixed frame on the right side of synchronous motor, first fixed frame lower end is fixed with movable frame, the sucker upper end is fixed with semiconductor to be polished, and sucker lower end is equipped with sucker fixed link, spring is provided with outside the sucker fixed link, and spring upper end is connected with sucker, and lower spring end is provided with pedestal, sanding belt is installed outside first driving wheel, and the second driving wheel is fixed with inside sanding belt, the ball fixing piece is internally provided with ball, and ball is externally connected to the second fixed frame.For the automobile polished semiconductor device using simply, the work that can be quickly polished to semiconductor greatly improves processing efficiency.
Description
Technical field
The utility model relates to automobile semiconductor processing technical field, specially a kind of automobile polished semiconductor
Device.
Background technique
Semiconductor refers to material of the electric conductivity between conductor and insulator under room temperature.Semiconductor is in radio, TV
It has a wide range of applications on machine and thermometric.If diode is exactly the device using semiconductor fabrication.Semiconductor refers to that one kind is led
It can electrically be controlled, range can be from insulator to the material between conductor.No matter from the perspective of science and technology or economic development,
The importance of semiconductor is all very huge.
It is generally used for the process that automotive semiconductor is polished, general using artificially being polished, artificial polishing adds
Work inefficiency, and the quality polished cannot guarantee well, influence whether the subsequent quality of production.
Utility model content
The purpose of this utility model is to provide a kind of automobile polished semiconductor devices, to solve in above-mentioned background technique
What is proposed manually polishes semiconductor inefficiency currently on the market, and the quality polished cannot guarantee well, will affect
The problem of to subsequent production quality.
To achieve the above object, the utility model provides the following technical solutions：A kind of automobile polished semiconductor device, packet
Sliding bottom is included, fixed link is fixed with inside the sliding bottom, and sliding bottom lower end is equipped with the first synchronous motor, and solid
Fixed pole lower end is provided with cabinet, and the first fixed frame is equipped on the left of first synchronous motor, and solid on the right side of the first synchronous motor
Surely there is the second fixed frame, first fixed frame lower end is fixed with movable frame, and the box house is equipped with attachment base, and cabinet
Lower end is provided with bracket, and the attachment base upper end is fixed with pedestal, and attachment base lower end is provided with the second synchronous motor, and even
Attachment base fixing piece is installed, the pedestal upper end is fixed with semiconductor to be polished, and chassis interior is equipped with suction outside joint chair
Disk is equipped with cylinder inside second fixed frame, and is equipped with the first driving wheel inside the second fixed frame, and on the right side of cylinder
It is connected with cylinder block, the second fixed frame is installed outside the cylinder block, and ball fixing piece is installed outside cylinder block, it is described
Sucker upper end is fixed with semiconductor to be polished, and sucker lower end is equipped with sucker fixed link, setting outside the sucker fixed link
There is spring, and spring upper end is connected with sucker, and lower spring end is provided with pedestal, is equipped with and beats outside first driving wheel
Grinding belt, and the second driving wheel is fixed with inside sanding belt, the ball fixing piece is internally provided with ball, and ball external connection
There is the second fixed frame.
Preferably, the direction of rotation of first synchronous motor and the second synchronous motor is on the contrary, and the first synchronous motor
Central point and the second synchronous motor central point are on the same line.
Preferably, the pedestal upper surface is blind hole structure, and its blind hole structure is evenly distributed on the inside of pedestal.
It preferably, is curved groove structure inside second fixed frame, and the nearly cylinder block end of its groove structure is opening
Structure, and the second fixed frame curved groove structure is about the distribution symmetrical above and below of ball fixing piece center line.
Preferably, the inside of the ball fixing piece is circular perforations structure, and its perforation structure inside diameter is greater than rolling
The outer dia of pearl, and the width of ball fixing piece matches with the second fixed frame hatch frame.
Compared with prior art, the utility model has the beneficial effects that：The automobile polished semiconductor device uses simply,
The work that can be quickly polished to semiconductor, greatly improves processing efficiency.First synchronous motor of the device and second is together
Step motor can drive the semiconductor to be polished on pedestal to be rotated simultaneously, rotate semiconductor to be polished, mention
High grinding effect, and the blind hole structure on pedestal plays the role of fixing sucking disk, such sucker can inhale semiconductor to be polished
It is attached live, the case where preventing semiconductor to be polished from deviating, the arc groove in the second fixed frame plays the role of fixed ball,
Will pass through the effect of cylinder control cylinder block movement routine.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model pedestal overlooking structure diagram；
Fig. 3 is enlarged structure schematic diagram at A in the utility model Fig. 1；
Fig. 4 is enlarged structure schematic diagram at B in the utility model Fig. 1；
Fig. 5 is the second fixed frame of the utility model side structure schematic view；
Fig. 6 is enlarged structure schematic diagram at C in the utility model Fig. 5；
Fig. 7 is the utility model ball fixing piece overlooking structure diagram.
In figure：1, sliding bottom, 2, fixed link, the 3, first fixed frame, the 4, first synchronous motor, 5, movable frame, 6, pedestal,
7, attachment base, 8, cabinet, the 9, second synchronous motor, 10, bracket, the 11, second fixed frame, 12, cylinder, 13, cylinder block, 14, company
Joint chair fixing piece, 15, sucker, 16, semiconductor to be polished, 17, sucker fixed link, 18, spring, the 19, first driving wheel, 20, beat
Grinding belt, the 21, second driving wheel, 22, ball fixing piece, 23, ball.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-7 is please referred to, the utility model provides a kind of technical solution：A kind of automobile polished semiconductor device, including
Sliding bottom 1 is fixed with fixed link 2 inside sliding bottom 1, and 1 lower end of sliding bottom is equipped with the first synchronous motor 4, and solid
2 lower end of fixed pole is provided with cabinet 8, and the first fixed frame 3 is equipped on the left of the first synchronous motor 4, and solid on the right side of the first synchronous motor 4
Surely there is the second fixed frame 11, the direction of rotation of the first synchronous motor 4 and the second synchronous motor 9 is on the contrary, and the first synchronous motor 4
Central point and 9 central point of the second synchronous motor are on the same line, the first synchronous motor 4 electricity synchronous with second of this structure
Machine 9 drives semiconductor 16 to be polished to be rotated with the pedestal 6 on attachment base 7 respectively, allows semiconductor to be polished 16 in quilt
It is rotated during polishing, improves the effect that semiconductor 16 to be polished is polished, 3 lower end of the first fixed frame is fixed with movement
Frame 5 is equipped with attachment base 7 inside cabinet 8, and 8 lower end of cabinet is provided with bracket 10, and 7 upper end of attachment base is fixed with pedestal 6, and
7 lower end of attachment base is provided with the second synchronous motor 9, and attachment base fixing piece 14 is equipped with outside attachment base 7,6 upper end of pedestal
It is fixed with semiconductor 16 to be polished, and sucker 15 is installed inside pedestal 6,6 upper surface of pedestal is blind hole structure, and its blind hole knot
Structure is evenly distributed on the inside of pedestal 6, and the blind hole on the pedestal 6 of this structure plays the role of accommodating sucker 15, such sucker 15
Can will semiconductor 16 be polished the case where fixing, preventing semiconductor 16 to be polished from deviating, improve fixed wait polish
The effect of semiconductor 16 is equipped with cylinder 12 inside second fixed frame 11, and is equipped with the first transmission inside the second fixed frame 11
Wheel 19, and cylinder block 13 is connected on the right side of cylinder 12, it is curved groove structure inside the second fixed frame 11, and its groove structure
Nearly 13 end of cylinder block is hatch frame, and 11 curved groove structure of the second fixed frame about 22 center line of ball fixing piece above and below
Symmetrical, the second fixed frame 11 of this structure plays the role of fixed spring 18, and spring 18 can be fixed along second
11 groove of frame is slided, and the groove inside such second fixed frame 11 just plays the role of fixed 13 movement routine of cylinder block,
Second fixed frame 11 is installed outside cylinder block 13, and ball fixing piece 22 is installed outside cylinder block 13,15 upper end of sucker is solid
Need semiconductor 16 of being polished calmly, and 15 lower end of sucker is equipped with sucker fixed link 17, is provided with spring outside sucker fixed link 17
18, and 18 upper end of spring is connected with sucker 15, and 18 lower end of spring is provided with pedestal 6, is equipped with outside the first driving wheel 19
Sanding belt 20, and the second driving wheel 21 is fixed with inside sanding belt 20, ball fixing piece 22 is internally provided with ball 23, and ball
23 are externally connected to the second fixed frame 11, and the inside of ball fixing piece 22 is circular perforations structure, and straight inside its perforation structure
Diameter is greater than the outer dia of ball 23, and the width of ball fixing piece 22 matches with 11 hatch frame of the second fixed frame, this
The ball fixing piece 22 of structure can fix ball 23, and ball 23 is avoided to deviate in 11 inside grooves of the second fixed frame
The case where.
Working principle：When using the automobile polished semiconductor device, the device is first placed on suitable place, so
The semiconductor to be polished 16 polished will be needed to be placed on pedestal 6 afterwards, then presses semiconductor 16 to be polished, semiconductor to be polished
16 can be pressed downward sucker 15, and such sucker 15 can adsorb semiconductor 16 to be polished, and prevent semiconductor 16 to be polished from occurring
The case where offset, and spring 18 plays the role of buffering, avoids semiconductor 16 to be polished in the grinding process on sucker 15
Sucker fixed link 17 strikes on pedestal 6, controls sliding bottom 1 by external device again later and moves down, and makes first to synchronize
The lower end of motor 4 can be fixed on semiconductor 16 to be polished, and then start the first synchronous motor 4 electricity synchronous with second simultaneously again
Machine 9, the first synchronous motor 4 and the second synchronous motor 9 drive semiconductor 16 to be polished to be rotated simultaneously, then again by external
Driving equipment drive the first driving wheel 19 rotated, then the first driving wheel 19 will drive sanding belt 20 and be rotated, it
Sanding belt 20 can treat the work that polishing semiconductor 16 is polished afterwards, may then pass through cylinder 12 and control on cylinder block 13
Movable frame 5 is moved, and such movable frame 5 treats polishing 16 different zones of semiconductor in the process of moving and polishes, directly
It polishes and completes to semiconductor 16 to be polished, to complete a series of work.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art
Say, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (5)
1. a kind of automobile polished semiconductor device, including sliding bottom (1), it is characterised in that：The sliding bottom (1) is internal
It is fixed with fixed link (2), and sliding bottom (1) lower end is equipped with the first synchronous motor (4), and fixed link (2) lower end is provided with
Cabinet (8), the first synchronous motor (4) left side are equipped with the first fixed frame (3), and fixed on the right side of the first synchronous motor (4)
Have the second fixed frame (11), the first fixed frame (3) lower end is fixed with movable frame (5), the internal company of being equipped with of the cabinet (8)
Joint chair (7), and cabinet (8) lower end is provided with bracket (10), attachment base (7) upper end is fixed with pedestal (6), and attachment base
(7) lower end is provided with the second synchronous motor (9), and is equipped with attachment base fixing piece (14), the pedestal outside attachment base (7)
(6) upper end is fixed with semiconductor to be polished (16), and is equipped with sucker (15) inside pedestal (6), second fixed frame (11)
Inside is equipped with cylinder (12), and is equipped with the first driving wheel (19) inside the second fixed frame (11), and on the right side of cylinder (12)
It is connected with cylinder block (13), is equipped with the second fixed frame (11) outside the cylinder block (13), and installation outside cylinder block (13)
Have ball fixing piece (22), sucker (15) upper end is fixed with semiconductor to be polished (16), and sucker (15) lower end is equipped with
Sucker fixed link (17), the sucker fixed link (17) is external to be provided with spring (18), and spring (18) upper end is connected with sucker
(15), and spring (18) lower end is provided with pedestal (6), is equipped with sanding belt (20) outside first driving wheel (19), and
It is fixed with the second driving wheel (21) inside sanding belt (20), the ball fixing piece (22) is internally provided with ball (23), and rolls
Pearl (23) is externally connected to the second fixed frame (11).
2. a kind of automobile polished semiconductor device according to claim 1, it is characterised in that：First synchronous motor
(4) with the direction of rotation of the second synchronous motor (9) on the contrary, and the first synchronous motor (4) central point and the second synchronous motor (9)
Central point is on the same line.
3. a kind of automobile polished semiconductor device according to claim 1, it is characterised in that：Pedestal (6) upper end
Face is blind hole structure, and its blind hole structure is evenly distributed on the inside of pedestal (6).
4. a kind of automobile polished semiconductor device according to claim 1, it is characterised in that：Second fixed frame
(11) internal is curved groove structure, and the nearly cylinder block of its groove structure (13) end is hatch frame, and the second fixed frame
(11) curved groove structure is about the distribution symmetrical above and below of ball fixing piece (22) center line.
5. a kind of automobile polished semiconductor device according to claim 1, it is characterised in that：The ball fixing piece
(22) inside is circular perforations structure, and its perforation structure inside diameter is greater than the outer dia of ball (23), and ball
The width of fixing piece (22) matches with the second fixed frame (11) hatch frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820623342.2U CN208127140U (en) | 2018-04-28 | 2018-04-28 | A kind of automobile polished semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820623342.2U CN208127140U (en) | 2018-04-28 | 2018-04-28 | A kind of automobile polished semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208127140U true CN208127140U (en) | 2018-11-20 |
Family
ID=64187699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820623342.2U Expired - Fee Related CN208127140U (en) | 2018-04-28 | 2018-04-28 | A kind of automobile polished semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208127140U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112872996A (en) * | 2021-04-06 | 2021-06-01 | 孙桂玉 | Stamping and polishing device for double-sided wiring duct board |
-
2018
- 2018-04-28 CN CN201820623342.2U patent/CN208127140U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112872996A (en) * | 2021-04-06 | 2021-06-01 | 孙桂玉 | Stamping and polishing device for double-sided wiring duct board |
| CN112872996B (en) * | 2021-04-06 | 2023-01-10 | 秉正(广州)电气设备有限公司 | Stamping and polishing device for double-sided wiring duct board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181120 Termination date: 20200428 |