CN208113143U - Electronic device - Google Patents
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- Publication number
- CN208113143U CN208113143U CN201820415116.5U CN201820415116U CN208113143U CN 208113143 U CN208113143 U CN 208113143U CN 201820415116 U CN201820415116 U CN 201820415116U CN 208113143 U CN208113143 U CN 208113143U
- Authority
- CN
- China
- Prior art keywords
- electronic device
- sealing element
- hole
- shell
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 claims abstract description 85
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 239000011496 polyurethane foam Substances 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 239000006260 foam Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000002985 plastic film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000006247 magnetic powder Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000011122 softwood Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
This application discloses a kind of electronic devices, including：Shell, the shell rim open up through-hole；Sealing element, it is unilateral to be fixed on the shell, and the sealing element seals the through-hole；Wherein, the force-applied unilateral opening of the sealing element, and gap is formed with the shell, the gap is connected with the through-hole, to exclude the moisture inside the electronic device.Using the above structure, since sealing element is unilateral is fixed on shell, therefore when needing to open through-hole removal electronic device inner moisture, it can exert a force to sealing element, seal loading and unilateral opening, to form gap with shell, the through-hole on the gap and shell is interconnected, so that the moisture inside electronic device can pass sequentially through the gap and through-hole is expelled to outside electronic device.After moisture is discharged, the power being applied on sealing element is removed, or the power for applying opposite direction to sealing element has the function that dustproof and waterproof so that sealing element reseals through-hole.
Description
Technical field
This application involves technical field of electronic equipment, more particularly to a kind of electronic device.
Background technique
With the extension of use time, electronic device internal components temperature is in a temperature for the electronic devices such as mobile phone, Ipad
Constantly change in range, such as to charge to electronic device hot or persistently see video/play games etc. and cause inside electronic device
Temperature is very high.And do not use or environment that room temperature is very low under, the internal temperature of electronic device is lower, and then changes electronics
Air condition inside device generates some steam inside electronic device.Or electronic device is accidentally and contact with moisture, causes
Lack steam to penetrate into inside electronic device.At present without the structure for excluding moisture inside electronic device, instead in order to which waterproof is by complete machine
What is sealed is very tight, cannot exclude after leading to internal generation moisture, the device close apart from moisture is caused to easily corrode and be damaged.
Summary of the invention
The application provides a kind of electronic device, can reduce the moisture inside electronic device.
The application use a technical solution be：A kind of electronic device is provided, including：
Shell, the shell rim open up through-hole；
Sealing element, it is unilateral to be fixed on the shell, and the sealing element seals the through-hole；
Wherein, the force-applied unilateral opening of the sealing element, and gap, the gap and the through-hole are formed with the shell
It is connected, to exclude the moisture inside the electronic device.
Electronic device in the application opens up through-hole on the edge of shell, and has opened up the position of through-hole inside housings
Sealing element is set, and specific sealing element is fixed on shell to be unilateral, so that electronic device is at most of time inner seal liner
In the state of sealing through-hole, play the role of dustproof and waterproof.Using the above structure, shell is fixed on to be unilateral due to sealing element
On, therefore when needing to open through-hole removal electronic device inner moisture, it can exert a force to sealing element, seal loading is simultaneously
Unilateral opening, to form gap with shell, the through-hole on the gap and shell is interconnected, so that inside electronic device
Moisture can pass sequentially through the gap and through-hole is expelled to outside electronic device.After moisture is discharged, removes and be applied to sealing element
On power, or to sealing element apply opposite direction power reach the work of dustproof and waterproof so that sealing element reseals through-hole
With.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram of one embodiment of the application electronic device；
Fig. 2 is the structural schematic diagram of another embodiment of the application electronic device；
Fig. 3 is the structural schematic diagram of one embodiment of the application sealing element；
Fig. 4 is the structural schematic diagram of the another embodiment of the application electronic device；
Fig. 5 is the structural schematic diagram of the application electronic device another embodiment；
Fig. 6 is the structural schematic diagram of one embodiment of the application electronic device；
Fig. 7 is the structural schematic diagram of another embodiment of the application electronic device；
Fig. 8 is the structural schematic diagram of the another embodiment of the application electronic device；
Fig. 9 is the structural schematic diagram of the application electronic device another embodiment.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description.It is understood that specific embodiment described herein is only used for explaining the application, rather than to the limit of the application
It is fixed.It also should be noted that illustrating only part relevant to the application for ease of description, in attached drawing and not all knot
Structure.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Term " first ", " second ", " third " in the application are used for description purposes only, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second ", " are defined as a result,
Three " feature can explicitly or implicitly include at least one of the features.In the description of the present application, the meaning of " plurality " is extremely
It is two few, such as two, three etc., unless otherwise specifically defined.The directional instruction of institute is (all in the embodiment of the present application
Such as up, down, left, right, before and after ...) it is only used for explaining in the phase under a certain particular pose (as shown in the picture) between each component
To positional relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith
Become.In addition, term " includes " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The process, method, system, product or equipment of a series of steps or units are not limited to listed step or unit, and
It is optionally further comprising the step of not listing or unit, or optionally further comprising for these process, methods, product or equipment
Intrinsic other step or units.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1 and Fig. 2, electronic device 100 provided by the present application can be mobile phone, IPad, intelligent wearable device, number
Audio/video player, electronic reader, handheld game machine and vehicle electronic device, digital camera, printer and flash disk etc..
It includes shell 10 and fixed sealing element 20 on the housing 10 that the electronic device, which includes 100,.
Specifically, shell 10 is the shell of electronic device 100, such as can be positive with electronic device 100 in an embodiment
Glass cover-plate perhaps the back side dorsal shield also or be the center that there is partial denudation outside electronic device 100, this does not do specifically
It limits.The edge through-hole 12 of shell 10, the channel which passes through as the discharge of 100 inner moisture of electronic device.
Sealing element 20 is located at the inside of electronic device 100, unilateral fixation on the housing 10, when sealing element 20 is not by outer
The masterpiece used time is close to the through-hole 12 on shell 10, and through-hole 12 is sealed, dustproof and waterproof is played the role of.Specifically, sealing
Part 12 can be strip, circle, ellipse or other rule/irregular shapes, this is not specifically limited.Below with sealing
Part 20 be rectangle for explained.As shown in figure 3, sealing element 20 include tetra- side a, b, c and d, wherein sealing element 20 with
Shell 10 is unilateral be fixedly connected refer to a, b, c and d tetra- in only one of them while be fixedly connected with shell 10, other sides are equal
To abut on the housing 10.
Such as one in embodiment, only the side d is fixedly connected sealing element 20 with shell 10, and specific connection type, which can be, passes through glue
Adhesion coating is fixed on the housing 10, is perhaps clamped also by other component or is fixed by fasteners such as screws,
This is not particularly limited.It should be understood that using the above structure, when sealing element 20 is from the outside or inside of electronic device 100
When by thrust or pulling force, the side d of sealing element 20 is still fixed on the housing 10, at the same sealing element 20 other are three outlying
It is mobile from through-hole 12, so that forming gap namely the unilateral opening of sealing element 20 between 20 generation deflections of sealing and shell 10, such as
Shown in Fig. 4, which is interconnected with the inside of through-hole 12 and electronic device 100, so that inside electronic device 100
Moisture can pass sequentially through the outside that the through-hole 12 on the gap and shell 10 is expelled to electronic device 100.On the contrary, working as sealing element
20 no longer stress or the power by opposite direction, then sealing element 20 is restored back to original position, so that other three sides are tightly attached to shell
On 10, it is again sealed off through-hole 12, to play the role of dustproof and waterproof.
It should be understood that sealing element 20 can deflect when stress, do not stressing or by opposite direction
Power when be restored to original position.It specifically, sealing element 20 is thin slice, and is soft material member.In specific different embodiment, sealing element
20 material is different, carries out explaining illustration below by way of different embodiments.
In one embodiment, which further includes card needle 30, can be used for passing through from the outside of electronic device 100 logical
Sealing element 20 is supported in hole 12, with unilateral opening sealing element 20, is discharged so that sealing element 20 generates to be formed between deflection and shell 10
The channel of moisture.After the discharge of rewetting gas, card needle 30 is removed from sealing element 20, then sealing element 20 is restored to original position.Specifically,
In this embodiment, sealing element 20 can be made of the material that softwood matter can support external force to squeeze simultaneously, such as close
Sealing 20 can be silica gel piece or flexible polyurethane foam piece etc..
Referring to figure 5-8, in another embodiment, which further includes calutron 40, and calutron 40 closes on
Sealing element 20 is arranged, that is, is fixed on the lower section of sealing element 20, and sealing element 20 is diskette.Using such structure, electromagnetic installing
Attraction is generated to diskette when setting 40 energization, so that the one side of sealing element 20 in addition to being fixed on shell 10, other outlying shrinkings away from theshell
Body 10 is mobile, so that diaphragm seal 20 deflects far from through-hole 12.Then sealing element 20 and shell 10 generate gap, with unilateral opening
Through-hole 12 forms the channel of discharge moisture.It should be understood that calutron 40 not be close to sealing element 20 be arranged, but with it is close
Sealing 20 has pre-determined distance, using the accommodating space to deflect as 20 part of sealing element.
Referring to figs. 5 and 6, specifically, in an embodiment, calutron 40 is magnetic coil.When needing sealing element 20
When point deflecting to open through-hole 12, magnetic coil leads to the electric current in a direction, to generate attraction to sealing element 20, in turn
So that sealing element 20 generates partially deflected opening through-hole 12.On the contrary, when needing sealing element 20 to seal through-hole 12 after moisture discharge,
Magnetic coil no power, so that sealing element 20 is restored to original position.12 inside of through-hole can be located in one embodiment on the housing 10
Edge be arranged magnetic powder last layer (not shown), for sealing element 20 generate attraction, as long as magnetic coil be powered produced by
Attraction to be greater than the attraction that generates to sealing element 20 of magnetic powder last layer big.Or magnetic coil is passed through opposite direction
Electric current, to generate repulsive force to sealing element 20, by 20 pushed home of sealing element.
Referring to figs. 7 and 8, in another embodiment, calutron 40 is electromagnet.It is inclined when needing 20 part of sealing element to occur
When turning to open through-hole 12, electromagnet is powered to generate attraction to sealing element 20, so that the generation of sealing element 20 part is inclined
Turn to open through-hole 12.On the contrary, when needing sealing element 20 to seal through-hole after moisture discharge, electromagnet no power, so that sealing element
20 are restored to original position.In one embodiment, magnetic powder last layer is arranged in the edge that can be located at 12 inside of through-hole on the housing 10, is used for
Attraction is generated to sealing element 20, generated attraction is greater than magnetic powder last layer and generates to sealing element 20 as long as electromagnet is powered
Attraction it is big.
It should be understood that under normal circumstances, in addition to electronic device 100 falls into the water, or obviously touched with liquid
In the case of, otherwise user can not generally judge the moisture situation inside electronic device 100, and then can not determine the need for excluding
Moisture.
It in order to solve this problem, further include being installed on electronic device 100 in the electronic device 100 of one embodiment of the application
Internal wetness sensor 50, as shown in Figure 9.The wetness sensor 50 is used for the inner moisture content of detection electronic installation 100,
And user is reminded by intended manner, such as formation notice is shown on the display screen of electronic device 100 or voice
Remind etc., this is not especially limited.Specifically, a moisture threshold value can be set, when wetness sensor 50 detects electronic device
Moisture inside 100 is more than or equal to moisture threshold value, and i.e. passing through intended manner reminds user.Then user can pass through above each implementation
The mode that example is introduced carries out dehumidification operation to electronic device 100.
Further, in an embodiment, electronic device 100 further includes printed circuit board 60, and wetness sensor 50 is located at printing
On circuit board 60, it is electrically connected with printed circuit board 60.It should be understood that being dispersed with numerous metal member devices on printed circuit board 60
Part, therefore wetness sensor 50 is installed on apart from the closer position of metal component, metal component week can be timely feedbacked
The moisture content enclosed.And then when being distributed moisture around metal component, user is reminded to dehumidify in time.Further, it prints
Printed circuit board 60 includes main circuit board 62 and secondary circuit board 64, can be in main circuit board 62 or secondary electricity in different embodiments
Wetness sensor 50 is set on road plate 64.Moisture sensing can also be set simultaneously on main circuit board 62 and secondary circuit board 64 simultaneously
Device 50.
It should be understood that wetness sensor 50 also can be set other than printed circuit board 60 in other embodiments
Other positions.Optionally, the embodiment relative moisture sensor 50 that wetness sensor 50 is arranged on printed circuit board 60 is set
The embodiment in the other positions in addition to printed circuit board 60 is set, moisture threshold value can with respect to Latter embodiment in the former embodiment
To be arranged smaller, metal component can be preferably avoided to be in the high environment of moisture content in this way.
In the present embodiment, through-hole 12 and sealing element 20 are respectively positioned on the top of electronic device 100, that is, electronic device 100
The top.In other embodiments, through-hole 12 and sealing element 20 can also be arranged in the bottom of electronic device 100.Also or
It is the top and bottom of electronic device 100 while is equipped with through-hole 12 and sealing element 20, such as the through-hole 12 of bottom is mainly used for arranging
Moisture near secondary circuit board 64 out；The through-hole 12 at top is mainly used for that the moisture near main circuit board 62 is discharged.And then it is more preferable
Ground avoids the metal component inside electronic device 10 from being in the higher environment of moisture content, extends metal component, even
The service life of complete machine.
Further, in an embodiment, Air Filter (not shown) is provided in through-hole, specific Air Filter can be with shell 10
Flush with outer surface, can also be slightly toward sinking to a bit inside through-hole 12, this is not specifically limited.Air Filter primarily serves dust-proof
Effect, avoid sealing element 20 from depositing dust on 100 outer surface side of electronic device, so avoid sealing element 20 deflect
When fall into inside electronic device 100.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (10)
1. a kind of electronic device, which is characterized in that including：
Shell, the shell rim open up through-hole；
Sealing element, it is unilateral to be fixed on the shell, and the sealing element seals the through-hole；
Wherein, the force-applied unilateral opening of the sealing element, and gap is formed with the shell, the gap is connected with the through-hole
It is logical, to exclude the moisture inside the electronic device.
2. electronic device according to claim 1, which is characterized in that including calutron, the calutron closes on institute
Sealing element setting is stated, the sealing element is diskette, generates attraction to the diskette when calutron is powered with list
Open the through-hole in side.
3. electronic device according to claim 2, which is characterized in that the calutron is magnetic coil or electromagnetism
Iron.
4. electronic device according to claim 1, which is characterized in that further include card needle, the card needle can be used for across institute
It states through-hole and supports the sealing element, with the unilateral opening sealing element.
5. electronic device according to claim 4, which is characterized in that the sealing element is silica gel piece or soft polyurethane foam
Foam plastic sheet.
6. electronic device according to claim 1, which is characterized in that further include be installed on it is wet inside the electronic device
Gas sensor, the wetness sensor are used for the inner moisture content of detection electronic installation and are reminded by intended manner.
7. electronic device according to claim 6, which is characterized in that the electronic device further includes printed circuit board, institute
Wetness sensor is stated to be located on the printed circuit board.
8. electronic device according to claim 1, which is characterized in that be provided with Air Filter in the through-hole.
9. electronic device according to claim 1, which is characterized in that the through-hole and the sealing element are located at electronic device
Top.
10. electronic device according to claim 1, which is characterized in that the bottom of the electronic device is equipped with the through-hole
It is equipped with the through-hole and the sealing element simultaneously with the top and bottom of the sealing element or the electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820415116.5U CN208113143U (en) | 2018-03-26 | 2018-03-26 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820415116.5U CN208113143U (en) | 2018-03-26 | 2018-03-26 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208113143U true CN208113143U (en) | 2018-11-16 |
Family
ID=64123034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820415116.5U Expired - Fee Related CN208113143U (en) | 2018-03-26 | 2018-03-26 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208113143U (en) |
-
2018
- 2018-03-26 CN CN201820415116.5U patent/CN208113143U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181116 |