CN208113074U - A kind of power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure - Google Patents

A kind of power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure Download PDF

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Publication number
CN208113074U
CN208113074U CN201820460781.6U CN201820460781U CN208113074U CN 208113074 U CN208113074 U CN 208113074U CN 201820460781 U CN201820460781 U CN 201820460781U CN 208113074 U CN208113074 U CN 208113074U
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CN
China
Prior art keywords
power amplifier
radiator
integrated circuit
elastic circlip
power discharging
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Active
Application number
CN201820460781.6U
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Chinese (zh)
Inventor
罗小林
黄爱梅
董才胜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yanfeng Visteon Electronic Technology Shanghai Co Ltd
Original Assignee
Yanfeng Visteon Electronic Technology Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Yanfeng Visteon Electronic Technology Shanghai Co Ltd filed Critical Yanfeng Visteon Electronic Technology Shanghai Co Ltd
Priority to CN201820460781.6U priority Critical patent/CN208113074U/en
Application granted granted Critical
Publication of CN208113074U publication Critical patent/CN208113074U/en
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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

A kind of power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure, by making the elastic circlip of setting, deformation occurs to make its height increase, make pcb board surface that upward flexible deformation occur, making becomes interference fit from clearance fit between radiator at the top of power discharging IC fits closely to make to remain between power discharging IC and spreader surface, under conditions of not increasing cost, effectively improve the assembling structure of power discharging IC and radiator, card slot and guide rail structure are designed on a heat sink, and simplify installation procedure ensure that heat dissipation effect simultaneously.

Description

A kind of power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure
Technical field:
The utility model relates to electricity fields, in particular to the mounting technique of power amplifier in vehicle audio, especially a kind of Exempt from screw mounting structure for the power amplifier chips in vehicle audio power amplifier.
Background technique
In the prior art, the power amplification IC circuit in vehicle audio power amplifier uses vertical mounting means, in addition increases One bracket is auxiliarily fixed by screw.When installation, need to reserve rack mounting apertures on pcb board, bracket passes through installation Hole is first installed on pcb board, and bracket, power discharging IC and radiator three are then adjacent to fastening with screw.This fixed form is deposited In following deficiency:The mounting hole that reserved bracket is needed on pcb board, occupies pcb board space, reduces the utilization rate of pcb board;Bracket Twist leg and may scratch pcb board insulating layer and cause short circuit, pcb board electronic circuit needs to avoid twisting leg for bracket when wiring, increases Electronics fabric swatch difficulty is added;Each IC bracket needs to be fastened with IC, radiator using screw, increases the material of product Expect cost and production cost.
Summary of the invention
Exempt from screw peace the purpose of this utility model is to provide a kind of power amplifier chips in vehicle audio power amplifier Assembling structure, the described this power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure and to solve the prior art Power amplification IC circuit in middle power amplifier installs the undesirable technical problem of fixed form.
This power amplifier chips in vehicle audio power amplifier of the utility model exempt from screw mounting structure, including dissipate Hot device, PCB printed circuit board, power discharging IC integrated circuit, which is characterized in that be provided with printed circuit card in the middle part of the radiator Slot, the PCB printed circuit board are mounted in radiator by the printed circuit board card slot, the power discharging IC integrated circuit peace On PCB printed circuit board, it is provided with guide rail structure below the bottom radiator, power discharging IC integrated circuit, it is described to lead It is provided with elastic circlip in rail structure, the elastic circlip is intermediate to have arch protrusion and both ends are with being folded up flange W-shape, is set as sliding pair between elastic circlip and radiator, the glide direction of the sliding pair is parallel to PCB printing electricity Road plate, the arch protrusion among elastic circlip are located at the lower section of power discharging IC integrated circuit and by PCB printed circuit board by power amplifier IC integrated circuit is pressed on the radiator above power discharging IC integrated circuit, and elastic circlip both ends bottom both ends are respectively downward Equipped with a positioning protrusion, there are two location hole, elastic cards for the bottom setting of the guide rail structure immediately below power discharging IC integrated circuit The positioning protrusion of spring be respectively inserted into one described in location hole, the spacing of two location holes is less than elastic circlip in a free state Spacing between two positioning protrusion, when installation, push the elastic circlip mobile until two convex card liftings in guide rail Enter location hole, due to the positioning pitch of holes be less than the positioning protrusion spacing thus the elastic circlip can deformation occurs and to It is upper to jack up the PCB printed circuit board, fit closely the power discharging IC integrated circuit with the spreader surface.
Further, the location hole is longitudinally arranged in a staggered manner and the positioning protrusion is also accordingly longitudinally arranged in a staggered manner.
Further, the first side plate and the second side plate, and first side plate and second side is arranged in the radiator both ends Ventilation hole is set on plate.
The working principle of the utility model is:Deformation occurs for elastic circlip to make its height increase, and sends out pcb board surface Raw upward flexible deformation makes to become interference fit from clearance fit between radiator at the top of power discharging IC to make power discharging IC and dissipate It remains and fits closely between hot device surface, reach good heat dissipation effect.
The utility model compares with prior art, effect be actively and it will be evident that the utility model to IC bracket Structure optimizes, and using the elastic circlip fastening means for exempting from screw, which need not reserve rack mounting apertures on pcb board, Directly elastic circlip is fixed in the guide rail of radiator, this structure design had both improved the utilization rate of pcb board, reduced The difficulty of electronics wiring under conditions of not increasing cost effectively improves the assembling structure of power discharging IC and radiator, Card slot and guide rail structure are designed on radiator, simplify installation procedure ensure that heat dissipation effect simultaneously.
Detailed description of the invention:
Fig. 1 is the structural front view of the utility model.
Fig. 2 is the bottom view of the utility model.
Fig. 3 is the elastic circlip structure chart of the utility model.
Fig. 4 is the sectional view of the utility model.
Fig. 5 is the improved elastic circlip structure chart of the utility model.
Fig. 6 is the bottom view that the location hole of the utility model is arranged in a staggered manner.
Fig. 7 is the lateral plate structure figure of the utility model.
Specific embodiment:
Embodiment:
As shown in Figure 1, Figure 2, shown in Fig. 3 and Fig. 4, a kind of power amplifier chips in vehicle audio power amplifier exempt from screw installation Structure, including radiator 1, PCB printed circuit board 2, power discharging IC integrated circuit 3, which is characterized in that setting in the middle part of the radiator There is printed circuit board card slot 6, the PCB printed circuit board is mounted in radiator by the printed circuit board card slot, described Power discharging IC integrated circuit is mounted on PCB printed circuit board, at this time at the top of power discharging IC integrated circuit between spreader surface presence Gap facilitates installation with reducing friction resistance, is provided with guide rail structure 4 below the bottom radiator, power discharging IC integrated circuit, Elastic circlip 5 is provided in the guide rail structure, the elastic circlip is centre with arch protrusion and both ends have folding upwards The W-shape for playing flange 9, is set as sliding pair 8, the glide direction of the sliding pair is parallel between elastic circlip and radiator PCB printed circuit board, the arch protrusion among elastic circlip are located at the lower section of power discharging IC integrated circuit and print electricity by PCB Power discharging IC integrated circuit is pressed on the radiator above power discharging IC integrated circuit by road plate, elastic circlip both ends bottom two End is respectively to a positioning protrusion 10 is had, and there are two fixed for the bottom setting of the guide rail structure immediately below power discharging IC integrated circuit Position hole 7, the positioning protrusion of elastic circlip be respectively inserted into one described in location hole, the spacing of two location holes is less than elastic circlip Spacing between two positioning protrusion in a free state, tool fixture will act on two of elastic circlip simultaneously when assembly It is moved in guide rail on flange 9, until two positioning protrusion are installed in place after being caught in location hole, the elastic circlip two sides Inwardly tighten that deformation occurs and jacks up the PCB printed circuit board upwards due to being limited by location hole, make power discharging IC with Become being interference fitted from clearance fit between radiator, to make to remain close patch between power discharging IC and spreader surface It closes, reaches good heat dissipation effect.
Further, as shown in Figures 5 and 6, the location hole 12 is longitudinal is arranged in a staggered manner and the also phase of the positioning protrusion 11 It should longitudinally be arranged in a staggered manner, positioning protrusion sticks into tool fixture when mobile elastic circlip in guide rail when can effectively avoid assembly in this way Location of mistake hole influences installation effectiveness.
Further, as shown in fig. 7, the radiator both ends are arranged the first side plate 13 and the second side plate 14, and described the Ventilation hole is set on side plate and the second side plate, fixed pcb board be displaced it will not in printed circuit board card slot from side Power amplifier appearance tidiness is improved simultaneously.

Claims (3)

1. a kind of power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure, including radiator, PCB printing electricity Road plate, power discharging IC integrated circuit, which is characterized in that printed circuit board card slot, the PCB printing are provided in the middle part of the radiator Circuit board is mounted in radiator by the printed circuit board card slot, and the power discharging IC integrated circuit is mounted on PCB printing electricity On the plate of road, it is provided with guide rail structure below the lower part of radiator, power discharging IC integrated circuit, is provided in the guide rail structure Elastic circlip, the elastic circlip be it is intermediate there is arch protrusion and both ends have a W-shape on upper folded over side, elastic circlip with it is scattered It is set as sliding pair between hot device, the glide direction of the sliding pair is parallel to PCB printed circuit board, among elastic circlip Arch protrusion is located at the lower section of power discharging IC integrated circuit and power discharging IC integrated circuit is pressed on function by PCB printed circuit board It puts on the radiator above IC integrated circuit, the both ends bottom both ends of elastic circlip are respectively to having a positioning protrusion, function The bottom setting of the guide rail structure immediately below IC integrated circuit is put there are two location hole, the positioning protrusion of elastic circlip is respectively inserted into Location hole described in one, the spacing of two location holes is less than between elastic circlip in a free state two positioning protrusion Spacing.
2. exempting from screw mounting structure for the power amplifier chips in vehicle audio power amplifier as described in claim 1, feature exists In two location holes are longitudinally arranged in a staggered manner, and also corresponding longitudinal direction is arranged in a staggered manner two positioning protrusion.
3. exempting from screw mounting structure for the power amplifier chips in vehicle audio power amplifier as described in claim 1, feature exists In the first side plate and the second side plate is arranged in radiator both ends, and ventilation hole is arranged on first side plate and the second side plate.
CN201820460781.6U 2018-04-03 2018-04-03 A kind of power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure Active CN208113074U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820460781.6U CN208113074U (en) 2018-04-03 2018-04-03 A kind of power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820460781.6U CN208113074U (en) 2018-04-03 2018-04-03 A kind of power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure

Publications (1)

Publication Number Publication Date
CN208113074U true CN208113074U (en) 2018-11-16

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Application Number Title Priority Date Filing Date
CN201820460781.6U Active CN208113074U (en) 2018-04-03 2018-04-03 A kind of power amplifier chips in vehicle audio power amplifier exempt from screw mounting structure

Country Status (1)

Country Link
CN (1) CN208113074U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113660818A (en) * 2021-07-15 2021-11-16 杭州富特科技股份有限公司 PCBA assembly structure and assembly method based on lever principle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113660818A (en) * 2021-07-15 2021-11-16 杭州富特科技股份有限公司 PCBA assembly structure and assembly method based on lever principle

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