CN208111399U - A kind of chip impregnation mold - Google Patents
A kind of chip impregnation mold Download PDFInfo
- Publication number
- CN208111399U CN208111399U CN201820537423.0U CN201820537423U CN208111399U CN 208111399 U CN208111399 U CN 208111399U CN 201820537423 U CN201820537423 U CN 201820537423U CN 208111399 U CN208111399 U CN 208111399U
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- side plate
- rectangular slab
- bar
- chip
- plate
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Abstract
The utility model provides a kind of chip impregnation mold, more particularly to chip impregnation technical field, including bottom plate, first side plate, second side plate and bar, the bottom plate includes rectangular slab and is fixed on the U-shaped board of two adjacent edge upper openings of the rectangular slab outwardly, first side plate and second side plate are separately fixed on other two adjacent edge of the rectangular slab, first side plate and second side plate are mutually perpendicular to the rectangular slab, the U-shaped board and the rectangular slab are located in same level, the bar is located at the opening of the U-shaped board, the bar is fixedly connected with the U-shaped board, first side plate is equipped with the first waist through hole, second side plate is equipped with the second waist through hole.The utility model is picked and placed when having high-temperature heating and is easy, and is squeezed when chip sticks together and is not easy the advantages of scattering.
Description
Technical field
The utility model belongs to chip impregnation technical field, and in particular to a kind of chip impregnation mold.
Background technique
After abrasive sheet cleaning and before wire cutting long side, needing to stick together to chip carries out sinking heating impregnation operation,
Traditional sinking impregnation mode is to pick and place chip using metal tweezers to stick together in container, and such mode operation difficulty is big, low efficiency,
Squeeze chip stick together interior bubble when, chip stick together easily skew damage.
Therefore, it is badly in need of picking and placing when a kind of high-temperature heating and is easy, squeezes when chip sticks together and be not easy the chip impregnation mold to scatter.
Utility model content
In order to solve the problems, such as existing chip stick together sink impregnation when operation difficulty is big, low efficiency, easily skew damage etc., this reality
It is to provide a kind of chip impregnation mold with novel purpose, picks and places and be easy when there is high-temperature heating, squeezes not fugitive when chip sticks together
The advantages of opening.
The utility model provides the following technical solution：
A kind of chip impregnation mold, including bottom plate, the first side plate, the second side plate and bar, the bottom plate include rectangular slab
Be fixed on the U-shaped board of two adjacent edge upper openings of the rectangular slab outwardly, first side plate and second side plate difference
It is fixed on other two adjacent edge of the rectangular slab, first side plate and second side plate are mutual with the rectangular slab
Vertically, the U-shaped board and the rectangular slab are located in same level, and the bar is located at the opening of the U-shaped board, described
Bar is fixedly connected with the U-shaped board, and first side plate is equipped with the first waist through hole, and second side plate is equipped with second
Waist through hole.
Chip, which sticks together, can be placed on the bottom plate, and first side plate, second side plate and the bar can be according to crystalline substances
Chip size is designed, and is left and taken suitable gap and is placed chip, is fixed on chip in mold, brilliant when guaranteeing impregnation and squeezing bubble
Piece, which sticks together, not to scatter, and the setting of first waist through hole and second waist through hole can be taken using hitcher at high temperature
It puts.
Preferably, the rectangular slab is equipped with circular through hole.The setting of the circular through hole can save material, convenient for squeezing
Piezocrystal piece sticks together interior bubble.
Preferably, the rectangular slab and two U-shaped boards are integrally formed.
Preferably, the height of first side plate, second side plate and the bar is equal.
Preferably, the thickness of the bottom plate, first side plate, second side plate and the bar is equal.
Preferably, the connection type of first side plate and second side plate and the rectangular slab is to be bolted, institute
The connection type for stating bar and the U-shaped board is also to be bolted.
The utility model has the beneficial effects that：Chip, which sticks together, can be placed on bottom plate, and the first side plate, the second side plate and bar can
It to be designed according to wafer size, leaves and takes suitable gap and places chip, be fixed on chip in mold, guarantee impregnation and squeeze gas
Chip sticks together and does not scatter when bubble, and the setting of the first waist through hole and the second waist through hole can be taken using hitcher at high temperature
It puts.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings：
Fig. 1 is the utility model structure diagram；
Fig. 2 is the utility model structural diagram of base plate；
Fig. 3 is the utility model the first lateral plate structure schematic diagram；
Fig. 4 is the utility model the second lateral plate structure schematic diagram；
Fig. 5 is the utility model bar structural schematic diagram；
In figure label for：1, bottom plate；11, rectangular slab；111, circular through hole；12, U-shaped board；2, the first side plate；21, first
Waist through hole；3, the second side plate；31, the second waist through hole；4, bar.
Specific embodiment
Specific embodiment of the present utility model is described with reference to the accompanying drawing.
As shown in Figs. 1-5, a kind of chip impregnation mold, including bottom plate 1, the first side plate 2, the second side plate 3 and bar 4, bottom
Plate 1 includes rectangular slab 11 and is fixed on the U-shaped board 12 of 11 two adjacent edge upper openings of rectangular slab outwardly, rectangular slab 11 and two U
Template 12 is integrally formed, and the first side plate 2 and the second side plate 3 are separately fixed on other two adjacent edge of rectangular slab 11, and first
Side plate 2 and the second side plate 3 are mutually perpendicular to rectangular slab 11, and U-shaped board 12 and rectangular slab 11 are located in same level, bar 4
Positioned at the opening of U-shaped board 12, bar 4 is fixedly connected with U-shaped board 12, and the height of the first side plate 2, the second side plate 3 and bar 4 is equal
It is equal, bottom plate 1, the first side plate 2, the second side plate 3 and bar 4 thickness be equal, the first side plate 2 is equipped with the first waist through hole
21, the second side plate 3 is equipped with the second waist through hole 31, and rectangular slab 11 is equipped with circular through hole 111.
Specifically, the connection type of the first side plate 2 and the second side plate 3 and rectangular slab 11 is to be bolted, bar 4 with it is U-shaped
The connection type of plate 12 is also to be bolted.
Utility model works mode：The chip put in order is placed in mold, i.e., chip sticks together and is placed on bottom plate 1,
So that the first side plate 2, the second side plate 3 and bar 4 is located at the surrounding that chip sticks together, then mold be put into high temperature oven and is dried,
It is hooked up in mold to bonded adhesives container with metal hook, when hooking up, metal hook can be hooked in the first waist through hole 21 or the second kidney-shaped
In through-hole 31, impregnation after a certain period of time, sticks together to chip in vertical direction with metal block and carries out extrusion operation, and discharge chip sticks together interior
Bubble, then mold is taken out with metal hook, it sticks together to chip and carries out shaping, extruding, the cold operation to stick together.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, although ginseng
The utility model is described in detail according to previous embodiment, it for those skilled in the art, still can be with
It modifies the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.It is all
Within the spirit and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in practical
Within novel protection scope.
Claims (6)
1. a kind of chip impregnation mold, which is characterized in that including bottom plate, the first side plate, the second side plate and bar, the bottom plate packet
It includes rectangular slab and is fixed on the U-shaped board of two adjacent edge upper openings of the rectangular slab outwardly, first side plate and described second
Side plate is separately fixed on other two adjacent edge of the rectangular slab, first side plate and second side plate with the square
Shape plate is mutually perpendicular to, and the U-shaped board and the rectangular slab are located in same level, and the bar is located at opening for the U-shaped board
At mouthful, the bar is fixedly connected with the U-shaped board, and first side plate is equipped with the first waist through hole, second side plate
It is equipped with the second waist through hole.
2. a kind of chip impregnation mold according to claim 1, which is characterized in that the rectangular slab is equipped with round logical
Hole.
3. a kind of chip impregnation mold according to claim 1, which is characterized in that the rectangular slab and two it is described U-shaped
Plate is integrally formed.
4. a kind of chip impregnation mold according to claim 1, which is characterized in that first side plate, described second side
The height of plate and the bar is equal.
5. a kind of chip impregnation mold according to claim 1, which is characterized in that the bottom plate, first side plate, institute
The thickness for stating the second side plate and the bar is equal.
6. a kind of chip impregnation mold according to claim 1, which is characterized in that first side plate and described second side
The connection type of plate and the rectangular slab is to be bolted, and the connection type of the bar and the U-shaped board is also to be bolted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820537423.0U CN208111399U (en) | 2018-04-16 | 2018-04-16 | A kind of chip impregnation mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820537423.0U CN208111399U (en) | 2018-04-16 | 2018-04-16 | A kind of chip impregnation mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208111399U true CN208111399U (en) | 2018-11-16 |
Family
ID=64118336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820537423.0U Active CN208111399U (en) | 2018-04-16 | 2018-04-16 | A kind of chip impregnation mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208111399U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109854595A (en) * | 2019-01-17 | 2019-06-07 | 珠海东锦石英科技有限公司 | A kind of quartz wafer adhering method |
-
2018
- 2018-04-16 CN CN201820537423.0U patent/CN208111399U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109854595A (en) * | 2019-01-17 | 2019-06-07 | 珠海东锦石英科技有限公司 | A kind of quartz wafer adhering method |
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