CN208110655U - A kind of smart card - Google Patents
A kind of smart card Download PDFInfo
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- CN208110655U CN208110655U CN201820706622.XU CN201820706622U CN208110655U CN 208110655 U CN208110655 U CN 208110655U CN 201820706622 U CN201820706622 U CN 201820706622U CN 208110655 U CN208110655 U CN 208110655U
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Abstract
The utility model discloses a kind of smart card including substrate, coating, communication module and light emitting module, coating is covered on substrate, and light emitting module is located in substrate, and communication module is located in substrate, and communication module is used for and external progress data interaction；Light emitting module is connected with communication module；Light emitting module is used to receive the power supply of communication module and shines；Or the control signal for receiving communication module shines.The utility model enhances the aesthetic feeling and interest of smart card, preferably meets people for the individual demand of smart card, has expanded the application and development of smart card.
Description
Technical field
The utility model relates to field of intelligent cards, in particular to a kind of smart card.
Background technique
Today's society starts to become diversification to the pursuit of smart card product, with smart card production technology increasingly at
Ripe, people are also more and more for the individual demand of smart card.The prior art only passes through the print of the printing layer on smart card surface
Map brushing case meets people for the individual demand of smart card, has limited to the application and development of smart card.
Utility model content
Utility model aims to solve the prior arts to be unable to satisfy people for the individual demand of smart card, office
The technical issues of having limited the application and development of smart card.
The utility model provides a kind of smart card, including：Substrate, coating, light emitting module and communication module；It is described to cover
Cap rock pastes on the substrate, and the light emitting module is located in the substrate, and the communication module is partially or entirely located in
In the substrate, the communication module is used for and external progress data interaction；The light emitting module is connected with the communication module；
The light emitting module is used to receive the power supply of the communication module and shines；Or the control letter for receiving the communication module
Number shine.
Optionally, the communication module specifically includes：Communication unit and IC module；The communication unit and the IC module
Connection；The IC module is located in the substrate；The IC module is used to receive external power supply by the communication unit, and leads to
Cross the communication unit and external progress data interaction；The light emitting module and the IC module or the communication unit connect
It connects；When the light emitting module is connect with the communication unit, the light emitting module is used to receive the power supply of the communication unit
And it shines；When the light emitting module is connect with the IC module, the light emitting module is used to receive the control of the IC module
Signal processed shines.
Optionally, the communication module further includes：Magnetic stripe；The magnetic stripe is embedded in a surface of the coating,
For carrying out data interaction with outside.
Optionally, the communication unit includes：Contact and/or aerial coil；When the light emitting module and the communication are single
When member connection：If the communication unit includes contact,：The contact is recessed positioned at being made of the substrate and the coating
In slot；The IC module is connect with the lower surface of the contact；The upper surface of the contact is exposed in the groove；The hair
Optical module is connect with the lower surface of the contact；The light emitting module is used to receive external power supply by the contact and shine；If
The communication unit includes aerial coil, then：It further include voltage regulator circuit in the smart card；The aerial coil is embedded in described
In substrate, the both ends of the aerial coil are connect with voltage regulator circuit；The both ends of the aerial coil are connected with the IC module；Institute
It states light emitting module and is connect especially by the voltage regulator circuit with the aerial coil；The voltage regulator circuit is located in the substrate,
It is separately connected with the both ends of the aerial coil and the light emitting module, for being converted to the supply voltage from aerial coil
Stable supply voltage provides stable supply voltage for the light emitting module.
Optionally, the communication unit includes：Contact and/or aerial coil；When the light emitting module and the IC module
When connection：If the communication unit includes contact,：The contact is located at the groove being made of the substrate and the coating
In；The IC module is connect with the lower surface of the contact；The upper surface of the contact is exposed in the groove；If described logical
Interrogating unit includes aerial coil, then：The aerial coil is embedded in the substrate, the both ends of the aerial coil and the IC
Module connection.
Optionally, the IC module is located at the bottom that the groove is placed on the lower surface of the contact.
It optionally, further include circuit board, the circuit board is located in the substrate, and the IC module is located in the substrate
Circuit board the second preset areas in；The light emitting module is located in the 4th preset areas of the circuit board in the substrate；If institute
Stating communication unit includes contact, then：The IC module passes through conducting medium and institute in the first preset areas on the circuit board
State the lower surface connection of contact；The following table that the light emitting module passes through conducting medium and the contact in first preset areas
Face connection；If the communication unit includes aerial coil,：The aerial coil is embedded in the substrate, the antenna line
The both ends of circle are located at the third preset areas of the circuit board；The voltage regulator circuit is located in the 5th preset areas of the circuit board.
It optionally, further include circuit board, the circuit board is located in the substrate, and the IC module is located in the substrate
Circuit board the second preset areas in；The light emitting module is located in the 4th preset areas of the circuit board；If the communication is single
Member includes contact, then：The IC module passes through the conducting medium and the contact in the first preset areas on the circuit board
Lower surface connection；If the communication unit includes aerial coil,：The aerial coil is embedded in the substrate, the day
The both ends of line coil are located at the third preset areas of the circuit board.
It optionally, further include the first control module and power module；First control module is located at the circuit board
In default control area；The power module is located in the power supply preset areas of the circuit board；The power module and described first
Control module connection；The IC module is specially with connection with the light emitting module：The IC module is controlled by described first
Module is connect with the light emitting module；First control module, for receiving the power supply of the power module and receiving
From the control signal of the IC module, and the light emitting module is controlled according to the difference of the control signal of the IC module and is issued not
With the light of color.
It optionally, further include first switch module；The first switch module is located at the 6th preset areas of the circuit board
In and the exposed surface in smart card；The power module is connect with first control module：The power module
It is connect by the first switch module with first control module；The first switch module is used for by receiving user's touching
Send the open and close state for controlling the circuit between the power module and first control module；First control
Module is specifically used for when the circuit between the power module and first control module is closed state, described in receiving
The control signal of power supply and reception from the IC module of power module, and not according to the control signal of the IC module
With the light for controlling the light emitting module sending different colours.
It optionally, further include interactive circuit module on the circuit board；The interactive circuit module is located at the circuit board
Default interactive areas in, the interactive circuit module is connect with the IC module.
Optionally, the interactive circuit module includes：Interaction key and/or display screen.
The utility model additionally provides a kind of smart card, including：Substrate, coating, light emitting module, power supply module, second
Switch module and communication module；
The coating pastes on the substrate, and the light emitting module is located in the substrate, the power supply module position
In the substrate, the second switch module is located in the substrate and the exposed surface in smart card；The second switch
Module is connect with the light emitting module and the power supply module respectively, for controlling the luminous mould by receiving user's triggering
The open and close state of circuit between block and the power supply module；The light emitting module is used to work as the light emitting module and institute
When to state circuit between power supply module be closed state, receive the power supply light emitting of the power supply module；The communication module part
It is either entirely located in the substrate or is embedded in the coating, for carrying out data interaction with external.
Optionally, the communication module includes：Communication unit and IC module；The communication unit and the IC module connect
It connects；The IC module is located in the substrate；The IC module is used to receive external power supply by the communication unit, and passes through
The communication unit and external progress data interaction.
Optionally, the communication unit includes：Contact and/or aerial coil；If the communication unit includes contact,：
The contact is located in the groove being made of the substrate and the coating；The lower surface of the IC module and the contact connects
It connects；The upper surface of the contact is exposed in the groove；If the communication unit includes aerial coil,：The antenna line
Circle is embedded in the substrate, and the both ends of the aerial coil are connect with the IC module.
Optionally, the IC module is located at the bottom that the groove is placed on the lower surface of the contact.
It optionally, further include circuit board, the circuit board is located in the substrate, and the IC module is located in the substrate
Circuit board the second preset areas in；The light emitting module is located in the 4th preset areas of the circuit board in the substrate；It is described
Second switch module is located in the 6th preset areas of the circuit board in the substrate；The power supply module is located in the substrate
In 7th preset areas of circuit board；If the communication unit includes contact,：The IC module passes through the on the circuit board
Conducting medium in one preset areas is connect with the lower surface of the contact；If the communication unit includes aerial coil,：It is described
Aerial coil is embedded in the substrate, and the both ends of the aerial coil are located at the third preset areas of the circuit board.
It optionally, further include interactive circuit module on the circuit board；The interactive circuit module is located at the circuit board
Default interactive areas in, the interactive circuit module is connect with the IC module
Optionally, the interactive circuit module includes：Interaction key and/or display screen.
Optionally, the communication module includes magnetic stripe；The magnetic stripe is embedded in a surface of the coating, is used for
Data interaction is carried out with outside.
The beneficial effects of the utility model：It includes substrate, coating, communication module and hair that the utility model, which provides a kind of,
The smart card of optical module, the light emitting module in smart card can shine, and enhance the aesthetic feeling and interest of smart card, preferably full
Foot individual demands of the people for smart card, have expanded the application and development of smart card.
Detailed description of the invention
Fig. 1 is a kind of plan view for smart card that the utility model embodiment 1 provides；
Fig. 2 and Fig. 6 is a kind of sectional structure chart for smart card that the utility model embodiment 1 provides；
Fig. 3 is the pin of the contact in a kind of smart card that the utility model embodiment 1, embodiment 2 and embodiment 3 provide
Structure chart；
Fig. 4 is the structure chart of the IC module in a kind of smart card provided in the utility model embodiment 1 and embodiment 3；
Fig. 5 is the circuit diagram of the light emitting module in a kind of smart card that the utility model embodiment 1 provides；
Fig. 7 and Fig. 8 is a kind of sectional structure chart for smart card that the utility model embodiment 1 provides；
Fig. 9 is aerial coil and IC module in a kind of smart card that the utility model embodiment 1 and embodiment 3 provide
Circuit diagram；
Figure 10 is a kind of sectional structure chart for smart card that the utility model embodiment 1 provides；
Figure 11 and Figure 12 is recessed on a kind of smart card that the utility model embodiment 1, embodiment 2 and embodiment 3 provide
The structure chart of slot；
Figure 13 is a kind of sectional structure chart for smart card that the utility model embodiment 1 provides；
Figure 14 is a kind of circuit diagram including aerial coil and voltage regulator circuit that the utility model embodiment 1 provides；
Figure 15 is a kind of plan view for smart card that the utility model embodiment 1 provides；
Figure 16 and Figure 17 is a kind of sectional structure chart for smart card that the utility model embodiment 1 provides；
Figure 18 is a kind of plan view for smart card that the utility model embodiment 1 provides；
Figure 19 is a kind of sectional structure chart for smart card that the utility model embodiment 1 provides；
Figure 20 is a kind of plan view for smart card that the utility model embodiment 1 provides；
Figure 21 is a kind of sectional structure chart for smart card that the utility model embodiment 1 provides；
Figure 22 is a kind of plan view for smart card that the utility model embodiment 2 provides；
Figure 23 and Figure 26 is a kind of sectional structure chart for smart card that the utility model embodiment 2 provides；
Figure 24 is the structure chart of the IC module in a kind of smart card that the utility model embodiment 2 provides；
Figure 25 is the circuit diagram of the light emitting module in a kind of smart card that the utility model embodiment 2 provides；
Figure 27 and Figure 28 is a kind of sectional structure chart for smart card that the utility model embodiment 2 provides；
Figure 29 is the circuit diagram of the aerial coil and IC module in a kind of smart card that the utility model embodiment 2 provides；
Figure 30 is a kind of sectional structure chart for smart card that the utility model embodiment 2 provides；
Figure 31 is a kind of sectional structure chart for smart card that the utility model embodiment 2 provides；
Figure 32, Figure 33, Figure 34 and Figure 35 are a kind of sectional structure chart for smart card that the utility model embodiment 2 provides；
Figure 36 is a kind of plan view for smart card that the utility model embodiment 2 provides；
Figure 37 and Figure 38 is a kind of sectional structure chart for smart card that the utility model embodiment 2 provides；
Figure 39 is a kind of plan view for smart card that the utility model embodiment 2 provides；
Figure 40 is a kind of sectional structure chart for smart card that the utility model embodiment 2 provides；
Figure 41 is a kind of plan view for smart card that the utility model embodiment 2 provides；
Figure 42 is a kind of sectional structure chart for smart card that the utility model embodiment 2 provides；
Figure 43 is that light emitting module, the power supply module and second in a kind of smart card that the utility model embodiment 3 provides are opened
Close the circuit diagram of module；
Figure 44 and Figure 45 is a kind of plan view for smart card that the utility model embodiment 3 provides；
Figure 46 is a kind of sectional structure chart for smart card that the utility model embodiment 3 provides；
Figure 47 is a kind of plan view for smart card that the utility model embodiment 3 provides；
Figure 48-Figure 53 is a kind of sectional structure chart for smart card that the utility model embodiment 3 provides；
Figure 54 is a kind of plan view for smart card that the utility model embodiment 3 provides；
Figure 55 and Figure 56 is a kind of sectional structure chart for smart card that the utility model embodiment 3 provides；
Figure 57 is a kind of plan view for smart card that the utility model embodiment 3 provides；
Figure 58 is a kind of sectional structure chart for smart card that the utility model embodiment 3 provides.
Specific embodiment
Below in conjunction with the attached drawing of the utility model, the technical scheme in the embodiment of the utility model is carried out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than whole implementation
Example.Based on the embodiments of the present invention, those skilled in the art are obtained without making creative work
Every other embodiment, fall within the protection scope of the utility model.
Embodiment 1
A kind of smart card is present embodiments provided, plan view is as shown in Figure 1, include：Substrate 100, coating 200, hair
Optical module 300 and communication module 400；Coating 200 pastes on the substrate 100, and light emitting module 300 is located in substrate 100, communication
Module 400 can be partially or entirely located in substrate 100, and communication module 400 is used for and external progress data interaction；Shine mould
Block 300 and communication module 400 connect, and light emitting module 300 is used to receive external power supply by communication module 400 to shine.
Further, communication module 400 specifically includes communication unit and IC module 4002；Wherein, communication unit can have
Body includes：Contact 01；Accordingly, the sectional view of smart card can as illustrated in figs. 2 or 6, and contact 01 is located at by substrate 100 and covers
In the groove 801 that cap rock 200 is constituted；IC module 4002 is located at the bottom that groove 801 is placed on the lower surface of contact 01；Touching
The upper surface of piece 01 is exposed in a groove；IC module 4002 is used to receive external power supply by contact 01, and by contact 01 with
Outside carries out data interaction；Light emitting module 300 is connect with the lower surface of contact 01；Light emitting module 300 is used to connect by contact 01
It is shone by external power supply.
More specifically, smart card can be as shown in Fig. 2, the pin of IC module 4002 can be by wire bond in contact
Be placed in the bottom of groove 801 in the respective pins of 01 lower surface, the upper surface of contact 01 it is exposed in groove 801 for and
External contact, to provide external power supply for IC module 4002 and realize IC module 4002 and external communication.For example, contact 01
Pin arrangements figure on lower surface can be, but not limited to (such as the pin of contact 01 can also be 6PIN's) as shown in Figure 3, touching
01 pin C1 of piece is the end VCC, and for being grounded, IC module 4002 can be as shown in figure 4, IC module 4002 by the pin C5 of contact 01
VCC pin is connect with the pin C1 of contact 01, and the GND pin of IC module 4002 is connect with the pin C5 of contact 01；IC module
4002 receive the external power supply from contact 01 by the pin C1 of itself.
In the present embodiment, light emitting module 300 can be specially the electronic building brick that LED light etc. has light-emitting function, it is preferable that
Light emitting module 300 is Surface-mount LED lamp.It may include one or more (two or more) Surface-mount LED lamp in light emitting module 300,
For example, the circuit diagram of light emitting module 300 can be as shown in figure 5, the end VCC of the Surface-mount LED lamp in light emitting module 300 passes through conduction
Medium is connected on the C1 pin on the lower surface of contact 01, and light emitting module 300 receives external power supply by contact 01 and shines.
The sectional view of smart card can be as shown in fig. 6, contact 01 and IC module 4002 be located at by substrate 100 and coating
In 200 grooves 801 constituted, the pin of IC module 4002 is drawn by the corresponding of lower surface that conducting medium is fixed on contact 01
The bottom of groove 801 is placed on foot, the exposed upper surface in groove 801 in the upper surface of contact 01 is used for and external contact, from
It and is that IC module 4002 provides external power supply and realizes IC module 4002 and external communication.
In the present embodiment, the shape of groove 801 and the shape of communication module 400 are adapted, and the depth capacity of groove 801 is not
Less than the maximum gauge of communication module 400.Groove 801 can specifically include inside groove and outer groove；The shape and depth and IC of inside groove
Module 4002 is adapted, and the shape and depth and contact 01 of outer groove are adapted.
In the present embodiment, conducting medium be can be, but not limited to as tin ball or tin cream or conducting resinl.
Further, can also include in communication unit：Aerial coil 02, accordingly, the sectional view of smart card can be with Fig. 7
Or shown in Fig. 8, aerial coil 02 is embedded in substrate 100, the both ends of aerial coil 02 respectively with voltage regulator circuit 500 and IC module
4002 connections；IC module 4002 is also used to receive the power supply of aerial coil 02, and passes through aerial coil 02 and external progress data
Interaction；Voltage regulator circuit 500 is located in substrate 100, connect respectively with aerial coil 02 and light emitting module 300, for working as antenna line
When 02 power supply of circle, stable supply voltage is provided for light emitting module 300；Light emitting module 300 is also used to receive from voltage regulator circuit
500 supply voltage shines.
Specifically, the both ends of aerial coil 02 can be directly welded on the pin of IC module 4002, can also be by leading
Dielectric is bonded or is welded on the pin of IC module 4002.For example, the circuit that aerial coil 02 and IC module 4002 connect
Figure can be as shown in figure 9, between the endpoint 1 and endpoint 2 of aerial coil 02 and be connected with capacitor C10 and C11；The end of aerial coil 02
Point 1 can be directly welded on the pin LB of IC module 4002, can also be bonded or be welded on IC module by conducting medium
On 4002 pin LB；The endpoint 2 of aerial coil 02 can be directly welded on the pin LA of IC module 4002, can also be passed through
Conducting medium be bonded or be welded on the pin LA of IC module 4002, aerial coil 02 be used for when sense it is non-connect field after, be
IC module 4002 is powered.The circuit diagram that voltage regulator circuit 500 is connect with aerial coil 02 and light emitting module 300 respectively can be such as Figure 14
Shown, voltage regulator circuit 500 includes chip U1；The both ends of aerial coil 02 are connect with chip U1 pin 3 and pin 4, chip U1's
Pin 1 is for exporting stable supply voltage to light emitting module 300.
In the present embodiment, the sectional view of smart card can be as shown in Figure 10, and contact 01 is located at by substrate 100 and coating
In 200 grooves 802 constituted, IC module 4002 is located on the second preset areas of the circuit board 03 in substrate 100, light emitting module
300 are located in the 4th preset areas of the circuit board 03 in substrate 100, have electrical connection between light emitting module 300 and contact 01, shine
Module 300 is used to receive external power supply by contact 01 to shine.In further detail, contact 01 is connected to circuit by conducting medium
On pad in first preset areas of plate 03；In the second preset areas of the IC module 4002 by the circuit board 03 in substrate 100
Pad is integrated on the second preset areas of circuit board 03；Light emitting module 300 is preset by the 4th of the circuit board 03 in substrate 100
Pad in area is integrated on the 4th preset areas of circuit board 03；The pad of first preset areas of circuit board 03 and the second preset areas
Pad between have electrical connection；Have between the pad of first preset areas of circuit board 03 and the pad of the 4th preset areas and is electrically connected
It connects.
In the present embodiment, the structure of groove 802 can as seen in figures 11 or 12, in the first preset areas of circuit board 03
Conducting medium on pad is visible in 802 bottom of groove；Can be as shown in figure 11,802 bottom of groove is smooth；It can also be such as
Shown in Figure 12,802 bottom of groove has concave point corresponding with the conducting medium on the pad in the first preset areas of circuit board 03
8021.Wherein, the floor space of above-mentioned groove 802 is not less than the floor space of contact 01, and the depth capacity of above-mentioned groove 802 is not less than
The maximum gauge of contact 01.
Further, the sectional view of smart card is as shown in figure 13, can also include aerial coil 02, antenna in communication unit
There is electrical connection between coil 02 and IC module 4002, aerial coil is embedded in substrate 100, and the both ends of aerial coil 02 are welded on
On the pad of third preset areas on circuit board 03；The pad of the third preset areas of circuit board 03 and the pad of the second preset areas it
Between have electrical connection.Voltage regulator circuit 500 is provided in 5th preset areas of circuit board 03；Voltage regulator circuit 500 passes through in substrate 100
Circuit board 03 the 5th preset areas in pad be integrated on the 5th preset areas of circuit board 03；Third preset areas is pre- with the 5th
If having electrical connection between area, the 4th preset areas；IC module 4002 is also used to receive the power supply from aerial coil 02, and passes through
Aerial coil 02 and external progress data interaction；Voltage regulator circuit 500 is used for when antenna coil power supply 02, is light emitting module 300
Stable supply voltage is provided；Light emitting module 300 is also used to receive the power supply light emitting from voltage regulator circuit 500.
In the present embodiment, the plan view of smart card can also be as shown in figure 15, and sectional view is as shown in Figure 16 or 17, circuit
It further include interactive circuit module 700 on plate 03；Interaction circuit module 700 is located in the default interactive areas of circuit board 03, presets and hands over
Have between the second preset areas that mutual area is located at IC module 4002 and be electrically connected, interaction circuit module 700 is for realizing intelligence
Interaction between card and user, for example, interaction circuit module 700 may include：Interaction key and/or display screen, user can be with
Information is inputted on smart cards by interaction key, and the information of smart card output can be obtained by display screen.
In the present embodiment, the plan view of smart card can also be as shown in figure 18, and sectional view is as shown in figure 19, communication unit
It specifically includes：Aerial coil 02, aerial coil 02 are embedded in substrate 100, the both ends of aerial coil 02 and voltage regulator circuit 500,
IC module 4002 connects；IC module 4002 is also used to receive the power supply from aerial coil 02, and by aerial coil 02 and outside
Portion carries out data interaction；Voltage regulator circuit 500 is located in substrate to be connect with light emitting module 300, is used for when aerial coil 02 is powered,
Stable supply voltage is provided for light emitting module 300；Light emitting module 300 is also used to receive the hair of the power supply from voltage regulator circuit 500
Light.
In the present embodiment, the plan view of smart card can also be as shown in figure 20, and sectional view is as shown in figure 21, communication module
In further include：Magnetic stripe 04；Magnetic stripe 04 is embedded in the lower surface of coating 200, for carrying out data interaction with external.
In the present embodiment, the raw material of substrate 100 can be PVC (Polyvinyl chloride, polyvinyl chloride), PC
(Polycarbonate, polycarbonate), PETG (Poly (ethylene terephthalateco-1,4-
Cylclohexylenedimethylene terephthalate), non-crystalline type copolyesters), PET (poly (ethylene
At least one of terephthalate), pet resin) or ABS polyvinyl chloride resin.
In the present embodiment, the raw material of coating 200 can in PVC, PC, PETG, PET or ABS polyvinyl chloride resin extremely
Few one kind.Coating can specifically include：Printing pattern layer and the printing bed of material, in the present embodiment, printing pattern layer is with print
The figure layer of map brushing case, the printing bed of material are the bed of material for printing printed patterns.In the present embodiment, printing pattern layer be located at substrate and
It prints between the bed of material or the printing bed of material is between substrate and printing pattern layer.When printing pattern layer is located at substrate and printed material
When between layer, the printing bed of material is transparent；When printing the bed of material between substrate and printing pattern layer, coating can also be wrapped
Printing protective layer is included, printing protective layer is located on printing pattern layer, for protecting printing pattern layer.
Embodiment 2
A kind of smart card is present embodiments provided, plan view is as shown in figure 22, including：Substrate 100, coating 200, hair
Optical module 300 and communication module 401；Coating 200 pastes on the substrate 100, and light emitting module 300 is located in substrate 100, communication
Module 401 can be partially or entirely located in substrate 100, and communication module 401 is used for and external progress data interaction；Shine mould
Block 300 and communication module 401 connect, and the control that light emitting module 300 is used to receive the control signal of communication module 401 shines.
Further, communication module 401 specifically includes communication unit and IC module 4012；Wherein, communication unit can have
Body includes：Contact 01；Accordingly, the sectional view of smart card can be as shown in Figure 23 or Figure 26, and contact 01 is located at by 100 He of substrate
In the groove 801 that coating 200 is constituted；IC module 4012 is located at the bottom that groove 801 is placed on the lower surface of contact 01；
The upper surface of contact 01 is exposed in a groove；IC module 4012 is used to receive external power supply by contact, and by contact 01 and
Outside carries out data interaction；Light emitting module 300 is connect with IC module 4012；Light emitting module 300 is for receiving IC module 4012
The control for controlling signal shines.
More specifically, smart card can be as shown in figure 23, and the pin of IC module 4012 can touched by wire bond
The bottom of groove 801 is placed in the respective pins of the lower surface of piece 01, the upper surface of contact 01 is exposed to be used in groove 801
And external contact, to provide external power supply for IC module 4012 and realize IC module 4012 and external communication.For example, contact
Pin arrangements figure on 01 lower surface can be with as shown in figure 3, the structure chart of IC module 4012 can be as shown in figure 24, contact 01 draws
Foot C1 is the end VCC, and the pin C5 of contact 01 is grounded, and the VCC pin of IC module 4012 is connect with the pin C1 of contact 01, IC module
4012 GND pin is connect with the pin C5 of contact 01；IC module 4012 is received by the VCC pin of itself from contact 01
External power supply.
In the present embodiment, light emitting module 300 can be specially the electronic building brick that LED light etc. has light-emitting function, it is preferable that
Light emitting module 300 is Surface-mount LED lamp.It may include one or more (two or more) Surface-mount LED lamp in light emitting module 300,
For example, the circuit diagram of light emitting module 300 can be as shown in figure 25, the Surface-mount LED lamp in light emitting module 300 and IC module 4012
Pin IO2 connection, light emitting module 300 receive the control signal from IC module 4012 by the pin IO2 of IC module 4012.Example
Such as：After IC module is completed to trade, high-level control signal is sent to light emitting module 300 by IO2 pin；When light emitting module connects
After receiving the high-level control signal from IC module 4012, light emitting module 300 issues green light；When IC module judges Fail Transaction
Afterwards, low level control signal is sent to light emitting module 300；When light emitting module 300 receives the low level from IC module 4012
After controlling signal, light emitting module 300 issues feux rouges.
The sectional view of smart card can also be as shown in figure 26, and contact 01 and IC module 4012 are located at by substrate 100 and covering
In 200 groove 801 that is constituted of layer, the pin of IC module 4012 by conducting medium be fixed on contact 01 lower surface it is corresponding
The bottom of groove 801 is placed on pin, the exposed upper surface in groove 801 in the upper surface of contact 01 is used for and external contact,
To provide external power supply for IC module 4012 and realize IC module 4012 and external communication.
In the present embodiment, the shape of groove 801 and the shape of communication module 401 are adapted, and the depth capacity of groove 801 is not
Less than the maximum gauge of communication module 401.Groove 801 can specifically include inside groove and outer groove；The shape and depth and IC of inside groove
Module 4012 is adapted, and the shape and depth and contact 01 of outer groove are adapted.
In the present embodiment, conducting medium be can be, but not limited to as tin ball or tin cream or conducting resinl.
Further, can also include in communication unit：Aerial coil 02, accordingly, the sectional view of smart card can be as
Shown in Figure 27 or Figure 28, aerial coil 02 is embedded in substrate 100, and the both ends of aerial coil 02 are connect with IC module 4012；IC
Module 4012 is also used to receive the power supply from aerial coil 02, and passes through aerial coil 02 and external progress data interaction.
Specifically, the both ends of aerial coil 02 can be directly welded on the pin of IC module 4012, can also be by leading
Dielectric is bonded or is welded on the pin of IC module 4012.For example, the circuit that aerial coil 02 and IC module 4012 connect
Figure can be as shown in figure 29, between the endpoint 1 and endpoint 2 of aerial coil 02 and is connected with capacitor C10 and C11；Aerial coil 02
Endpoint 1 can be directly welded on the pin LB of IC module 4012, can also be bonded or be welded on IC mould by conducting medium
On the pin LB of block 4012；The endpoint 2 of aerial coil 02 can be directly welded on the pin LA of IC module 4012, can also be led to
Cross conducting medium bonding or be welded on the pin LA of IC module 4012, aerial coil 02 be used for when sense it is non-connect field after,
For the power supply of IC module 4012.
In the present embodiment, the sectional view of smart card can be as shown in figure 30, and contact 01 is located at by substrate 100 and coating
In 200 grooves 802 constituted, IC module 4012 is located on the second preset areas of the circuit board 03 in substrate 100, light emitting module
300 are located in the 4th preset areas of the circuit board 03 in substrate 100, have electrical connection between light emitting module 300 and IC module 4012,
The control that light emitting module 300 is used to receive the control signal of IC module 4012 shines.In further detail, contact 01 is situated between by conductive
Matter is connected on the pad in the first preset areas of circuit board 03；IC module 4012 pass through the circuit board 03 in substrate 100 the
Pad in two preset areas is integrated on the second preset areas of circuit board 03；Light emitting module 300 passes through the circuit board in substrate 100
Pad in 03 the 4th preset areas is integrated on the 4th preset areas of circuit board 03；The pad of first preset areas of circuit board 03
And second preset areas pad between have electrical connection；The pad of second preset areas of circuit board 03 and the pad of the 4th preset areas
Between have electrical connection.
In the present embodiment, the structure of groove 802 can as seen in figures 11 or 12, and specific structure may refer to embodiment 1
In associated description, repeat no more in the present embodiment.
It further, can also include aerial coil 02 in communication unit, the sectional view of smart card is as shown in figure 31, antenna
Coil is embedded in substrate 100, and the both ends of aerial coil 02 are welded on the pad of the third preset areas on circuit board 03；Antenna
Have electrical connection between coil 02 and IC module 4012, the pad of the pad of the third preset areas of circuit board 03 and the second preset areas it
Between have electrical connection.IC module 4012 is also used to receive the power supply from aerial coil 02, and passes through aerial coil 02 and outside
Carry out data interaction.
It can also include the first control module 600 and power module 900 in smart card in the present embodiment；Smart card cuts open
Face figure can also be as shown in Figure 32 and Figure 33, and the first control module 600 is located in the default control area of circuit board 03；Power module
900 are located in the power supply preset areas of circuit board；Contact 01 is located in the groove 802 being made of substrate 100 and coating 200,
IC module 4012 is located on the second preset areas of the circuit board 03 in substrate 100, and light emitting module 300 is located at the electricity in substrate 100
On 4th preset areas of road plate 03, IC module 4012 passes through the conducting medium and contact 01 in the first preset areas on circuit board 03
Lower surface connection；Wherein, have between the first preset areas on circuit board 03 and the second preset areas and be electrically connected；On circuit board 03
Default control area be electrically connected with the second preset areas and the 4th preset areas；Power supply preset areas has with default control area
Electrical connection；First control module 600, for receiving the power supply of power module 900 and receiving the control from IC module 4012
Signal, and the light of the different control light emitting modules 300 sending different colours according to the control signal of IC module 4012.
Further, in this embodiment can also include first switch module 601 in smart card；The sectional view of smart card
It can also be as shown in figs. 34 and 35：First switch module 601 is located in the 6th preset areas of the circuit board 03 in substrate 100 simultaneously
The exposed surface in smart card；Default control area is connected especially by between the 6th preset areas and power supply preset areas；First switch
Module 601 is used to control the closure of the circuit between power module 900 and the first control module 600 by receiving user's triggering
And off-state；First control module 600 is specifically used for when the circuit between power module 900 and the first control module 600
When for closed state, receives the power supply of power module 600 and receive the control signal from IC module 4012, and according to IC mould
The different control light emitting modules 300 of the control signal of block 4012 issue the light of different colours.
In the present embodiment, the plan view of smart card can also be as shown in figure 36, and sectional view is as shown in Figure 37 or 38, circuit
It further include interactive circuit module 700 on plate 03；Interaction circuit module 700 is located in the default interactive areas of circuit board 03, presets and hands over
Have between the second preset areas that mutual area is located at IC module 4012 and be electrically connected, interaction circuit module 700 is for realizing intelligence
Interaction between card and user, for example, interaction circuit module 700 may include：Interaction key and/or display screen, user can be with
Information is inputted on smart cards by interaction key, and the information of smart card output can be obtained by display screen.
In the present embodiment, the plan view of smart card can also be as shown in figure 39, and sectional view is as shown in figure 40, communication unit
It specifically includes：Aerial coil 02, aerial coil 02 are embedded in substrate 100, and the both ends of aerial coil 02 and IC module 4012 connect
It connects；IC module 4012 passes through aerial coil 02 and external progress data interaction for receiving the power supply from aerial coil 02；
Light emitting module 300 is connect with IC module 4012；Light emitting module 300 is used to receive the control hair of the control signal of IC module 4012
Light.
It can also include magnetic stripe in the communication module of smart card in the present embodiment, magnetic stripe is embedded in the following table of coating 200
In face, for carrying out data interaction with external.Example：As shown in Figure 41 and Figure 42, communication unit further includes：Magnetic stripe 04；Magnetic stripe 04
It is embedded in the lower surface of coating 200, for carrying out data interaction with external.
Embodiment 3
A kind of smart card is present embodiments provided, including：Substrate 100, coating 200, light emitting module 300, power supply module
501, second switch module 602 and communication module 400；
Coating 200 pastes on the substrate 100, and light emitting module 300 is located in substrate 100, and power supply module 501 is located at substrate
In 100, second switch module 602 is located in substrate 100 and the exposed surface in smart card；Second switch module 602 respectively with
Light emitting module 300 and power supply module 501 connect, for controlling light emitting module 300 and power supply module by receiving user's triggering
The open and close state of circuit between 501；
Light emitting module 300 is used to receive when the circuit between light emitting module 300 and power supply module 501 is closed state
The power supply light emitting of power supply module；
Communication module 400 can be partially or entirely located in substrate 100, can also be embedded on coating 200, be used for
Data interaction is carried out with outside.
In the present embodiment, light emitting module 300 can be specially the electronic building brick that LED light etc. has light-emitting function, it is preferable that
Light emitting module 300 is Surface-mount LED lamp.It may include one or more (two or more) Surface-mount LED lamp in light emitting module 300.
In the present embodiment, the circuit diagram of light emitting module 300, power supply module 501 and second switch module 602 can be as shown in figure 43, hair
The end VCC of Surface-mount LED lamp in optical module 300 is connect by second switch module 602 with the anode of power supply module 501；It shines
Surface-mount LED lamp in unit 302 is used to receive when the circuit between light emitting module 300 and power supply module 501 is closed state
The power supply light emitting of power supply module 501.
It include magnetic stripe 04 in communication module 400, the plan view of smart card can be as shown in figures 44 and 45 in the present embodiment.
The sectional view of smart card is as shown in figure 46, and magnetic stripe 04 is embedded in a surface of coating 200, for carrying out data with external
Interaction.
In the present embodiment, communication module 400 can also specifically include communication unit and IC module 4002；Wherein, communication is single
Member can specifically include：Contact 01；Accordingly, smart card plan view is as shown in figure 47, and the sectional view of smart card can be such as Figure 48
Or shown in Figure 49, contact 01 is located in the groove 801 being made of substrate 100 and coating 200；IC module 4002 is located at contact
The bottom of groove 801 is placed on 01 lower surface；The upper surface of contact 01 is exposed in groove 801；IC module 4002 is used for
Receive external power supply by contact, and passes through contact 01 and external progress data interaction.
More specifically, smart card can be as shown in figure 48, and the pin of IC module 4002 can touched by wire bond
The bottom of groove 801 is placed in the respective pins of the lower surface of piece 01, the upper surface of contact 01 is exposed to be used in groove 801
And external contact, to provide external power supply for IC module 4002 and realize IC module 4002 and external communication.For example, contact
Pin arrangements figure on 01 lower surface can be with as shown in figure 3,01 pin C1 of contact is the end VCC, the pin C5 of contact 01 be for connecing
Ground, IC module 4002 can be with as shown in figure 4, the VCC pin of IC module 4012 be connect with the pin C1 of contact 01, IC module 4012
GND pin connect with the pin C5 of contact 01；IC module 4012 receives the outside from contact 01 by the VCC pin of itself
Power supply.
The sectional view of smart card can also be as shown in figure 49, and contact 01 and IC module 4002 are located at by substrate 100 and covering
In 200 groove 801 that is constituted of layer, the pin of IC module 4002 by conducting medium be fixed on contact 01 upper surface it is corresponding
The bottom of groove 801 is placed on pin, the exposed upper surface in groove 801 in the upper surface of contact 01 is used for and external contact,
To provide external power supply for IC module 4002 and realize IC module 4002 and external communication.
In the present embodiment, the shape of groove 801 and the shape of communication module 400 are adapted, and the depth capacity of groove 801 is not
Less than the maximum gauge of communication module 400.Groove 801 can specifically include inside groove and outer groove；The shape and depth and IC of inside groove
Module 4002 is adapted, and the shape and depth and contact 01 of outer groove are adapted.
In the present embodiment, conducting medium be can be, but not limited to as tin ball or tin cream or conducting resinl.
Further, can also include in communication unit：Aerial coil 02, accordingly, the sectional view of smart card can scheme
Shown in 50 or Figure 51, aerial coil 02 is embedded in substrate 100, and the both ends of aerial coil 02 are connect with IC module 4002；IC mould
Block 4002 is also used to receive the power supply from aerial coil 02, and passes through aerial coil 02 and external progress data interaction.
Specifically, the both ends of aerial coil 02 can be directly welded on the pin of IC module 4002, can also be by leading
Dielectric is bonded or is welded on the pin of IC module 4002.For example, the circuit that aerial coil 02 and IC module 4002 connect
Figure can be as shown in figure 9, between the endpoint 1 and endpoint 2 of aerial coil 02 and be connected with capacitor C10 and C11；The end of aerial coil 02
Point 1 can be directly welded on the pin LB of IC module 4002, can also be bonded or be welded on IC module by conducting medium
On 4002 pin LB；The endpoint 2 of aerial coil 02 can be directly welded on the pin LA of IC module 4002, can also be passed through
Conducting medium be bonded or be welded on the pin LA of IC module 4002, aerial coil 02 be used for when sense it is non-connect field after, be
IC module 4002 is powered.
In the present embodiment, the sectional view of smart card can be as shown in figure 50, and contact 01 is located at by substrate 100 and coating
In 200 grooves 802 constituted, IC module 4002 is located on the second preset areas of the circuit board 03 in substrate 100, light emitting module
300 are located in the 4th preset areas of the circuit board 03 in substrate 100, and second switch module 602 is located at the circuit board in substrate 100
In 03 the 6th preset areas；Power supply module 501 is located in the 7th preset areas of the circuit board 03 in substrate 100；4th preset areas
Have between the 6th preset areas and is electrically connected；Have between 6th preset areas and the 7th preset areas and is electrically connected.
In further detail, contact 01 is connected on the pad in the first preset areas of circuit board 03 by conducting medium；IC
The pad in the second preset areas that module 4002 passes through the circuit board 03 in substrate 100 is integrated in the second preset areas of circuit board 03
On；The pad in the 4th preset areas that light emitting module 300 passes through the circuit board 03 in substrate 100 is integrated in the 4th of circuit board 03
On preset areas；The pad in the 6th preset areas that second switch module 602 passes through the circuit board 03 in substrate 100 is integrated in circuit
On 6th preset areas of plate 03；The pad in the 7th preset areas that power supply module 501 passes through the circuit board 03 in substrate 100 is integrated
On the 7th preset areas of circuit board 03；Have between the pad of first preset areas of circuit board 03 and the pad of the second preset areas
Electrical connection；Have between the pad and the pad of the 6th preset areas of 4th preset areas of circuit board 03 and is electrically connected；Circuit board 03
Have between the pad of 6th preset areas and the pad of the 7th preset areas and is electrically connected.
In the present embodiment, the structure of groove 802 can as seen in figures 11 or 12, and specific structure may refer to embodiment 1
In associated description, repeat no more in the present embodiment.
Further, the sectional view of smart card is as shown in figure 50, can also include aerial coil 02, antenna in communication unit
There is electrical connection between coil 02 and IC module 4002, aerial coil is embedded in substrate 100, and the both ends of aerial coil 02 are welded on
On the pad of third preset areas on circuit board 03；The pad of the third preset areas of circuit board 03 and the pad of the second preset areas it
Between have electrical connection；IC module 4002 is also used to receive the power supply from aerial coil 02, and passes through aerial coil 02 and outside
Carry out data interaction.
In the present embodiment, the plan view of smart card can also be as shown in figure 50, and sectional view is as shown in Figure 55 or 56, circuit
It further include interactive circuit module 700 on plate 03；Interaction circuit module 700 is located in the default interactive areas of circuit board 03, presets and hands over
Have between the second preset areas that mutual area is located at IC module 4002 and be electrically connected, interaction circuit module 700 is for realizing intelligence
Interaction between card and user, for example, interaction circuit module 700 may include：Interaction key and/or display screen, user can be with
Information is inputted on smart cards by interaction key, and the information of smart card output can be obtained by display screen.
In the present embodiment, the plan view of smart card can also be as shown in figure 50, and sectional view is as shown in figure 50, communication unit
It specifically includes：Aerial coil 02, aerial coil 02 are embedded in substrate 100, and the both ends of aerial coil 02 and IC module 4002 connect
It connects；IC module 4002 is also used to receive the power supply from aerial coil 02, and passes through aerial coil 02 and external progress data friendship
Mutually.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art can readily occur in technical scope disclosed by the utility model
Change or replacement, should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should
It is subject to the protection scope in claims.
Claims (20)
1. a kind of smart card, which is characterized in that including：Substrate, coating, light emitting module and communication module；
The coating pastes on the substrate, and the light emitting module is located in the substrate, the communication module part or
Person is entirely located in the substrate, and the communication module is used for and external progress data interaction；The light emitting module and described logical
Interrogate module connection；
The light emitting module is used to receive the power supply of the communication module and shines；Or the control for receiving the communication module
Signal processed shines.
2. smart card according to claim 1, which is characterized in that the communication module specifically includes：Communication unit and IC
Module；The communication unit is connected with the IC module；The IC module is located in the substrate；
The IC module is used to receive external power supply by the communication unit, and is counted by the communication unit with outside
According to interaction；
The light emitting module is connect with the IC module or the communication unit；
When the light emitting module is connect with the communication unit, the light emitting module is used to receive the power supply of the communication unit
And it shines；
When the light emitting module is connect with the IC module, the light emitting module is used to receive the control letter of the IC module
Number shine.
3. smart card according to claim 2, which is characterized in that the communication module further includes：Magnetic stripe；
The magnetic stripe is embedded in a surface of the coating, for carrying out data interaction with external.
4. smart card according to claim 2, which is characterized in that the communication unit includes：Contact and/or antenna line
Circle；When the light emitting module is connect with the communication unit：
If the communication unit includes contact,：The contact is located in the groove being made of the substrate and the coating；
The IC module is connect with the lower surface of the contact；The upper surface of the contact is exposed in the groove；The luminous mould
Block is connect with the lower surface of the contact；The light emitting module is used to receive external power supply by the contact and shine；
If the communication unit includes aerial coil,：It further include voltage regulator circuit in the smart card；The aerial coil is pre-buried
In the substrate, the both ends of the aerial coil are connect with voltage regulator circuit；The both ends of the aerial coil and the IC module
Connection；The light emitting module is connect especially by the voltage regulator circuit with the aerial coil；
The voltage regulator circuit is located in the substrate, is separately connected with the both ends of the aerial coil and the light emitting module, uses
In the supply voltage from aerial coil to be converted to stable supply voltage, stable power supply electricity is provided for the light emitting module
Pressure.
5. smart card according to claim 2, which is characterized in that the communication unit includes：Contact and/or antenna line
Circle；When the light emitting module is connect with the IC module：
If the communication unit includes contact,：The contact is located in the groove being made of the substrate and the coating；
The IC module is connect with the lower surface of the contact；The upper surface of the contact is exposed in the groove；
If the communication unit includes aerial coil,：The aerial coil is embedded in the substrate, the aerial coil
Both ends are connect with the IC module.
6. smart card according to claim 4 or 5, which is characterized in that the IC module is located at the lower surface of the contact
On be placed in the bottom of the groove.
7. smart card according to claim 4, which is characterized in that further include circuit board, the circuit board is located at the base
In plate, the IC module is located in the second preset areas of the circuit board in the substrate；The light emitting module is located at the substrate
In circuit board the 4th preset areas in；
If the communication unit includes contact,：The IC module passes through the conduction in the first preset areas on the circuit board
Medium is connect with the lower surface of the contact；The light emitting module passes through conducting medium in first preset areas and the touching
The lower surface of piece connects；
If the communication unit includes aerial coil,：The aerial coil is embedded in the substrate, the aerial coil
Both ends are located at the third preset areas of the circuit board；The voltage regulator circuit is located in the 5th preset areas of the circuit board.
8. smart card according to claim 5, which is characterized in that further include circuit board, the circuit board is located at the base
In plate, the IC module is located in the second preset areas of the circuit board in the substrate；The light emitting module is located at the circuit
In 4th preset areas of plate；
If the communication unit includes contact,：The IC module passes through the conduction in the first preset areas on the circuit board
Medium is connect with the lower surface of the contact；
If the communication unit includes aerial coil,：The aerial coil is embedded in the substrate, the aerial coil
Both ends are located at the third preset areas of the circuit board.
9. smart card according to claim 8, which is characterized in that further include the first control module and power module；It is described
First control module is located in the default control area of the circuit board；The power supply that the power module is located at the circuit board is default
Qu Zhong；The power module is connect with first control module；
The IC module is connect with the light emitting module is specially：The IC module passes through first control module and the hair
Optical module connection；
First control module, for receiving the power supply of the power module and receiving the control letter from the IC module
Number, and the light that the light emitting module issues different colours is controlled according to the difference of the control signal of the IC module.
10. smart card according to claim 9, which is characterized in that further include first switch module；
The first switch module is located in the 6th preset areas of the circuit board and the exposed surface in smart card；
The power module is connect with first control module：The power module passes through the first switch module
It is connect with first control module；
The first switch module is used to control the power module and first control module by receiving user's triggering
Between circuit open and close state；
First control module is specifically used for when the circuit between the power module and first control module being to close
When conjunction state, receives the power supply of the power module and receive the control signal from the IC module, and according to the IC
The difference of the control signal of module controls the light that the light emitting module issues different colours.
11. smart card according to any one of claims of claim 7-10, which is characterized in that further include handing on the circuit board
Mutual circuit module；The interactive circuit module is located in the default interactive areas of the circuit board, the interactive circuit module and institute
State the connection of IC module.
12. smart card according to claim 11, which is characterized in that the interactive circuit module includes：Interaction key and/
Or display screen.
13. a kind of smart card, which is characterized in that including：Substrate, coating, light emitting module, power supply module, second switch module
And communication module；
The coating pastes on the substrate, and the light emitting module is located in the substrate, and the power supply module is located at institute
It states in substrate, the second switch module is located in the substrate and the exposed surface in smart card；The second switch module
Connect respectively with the light emitting module and the power supply module, for by receive user triggering come control the light emitting module and
The open and close state of circuit between the power supply module；
The light emitting module is used to receive institute when the circuit between the light emitting module and the power supply module is closed state
State the power supply light emitting of power supply module；
The communication module is partially or entirely located in the substrate or is embedded in the coating, for and it is external into
Row data interaction.
14. smart card according to claim 13, which is characterized in that the communication module includes：Communication unit and IC mould
Block；The communication unit is connected with the IC module；The IC module is located in the substrate；
The IC module is used to receive external power supply by the communication unit, and is counted by the communication unit with outside
According to interaction.
15. smart card according to claim 14, which is characterized in that the communication unit includes：Contact and/or antenna line
Circle；
If the communication unit includes contact,：The contact is located in the groove being made of the substrate and the coating；
The IC module is connect with the lower surface of the contact；The upper surface of the contact is exposed in the groove；
If the communication unit includes aerial coil,：The aerial coil is embedded in the substrate, the aerial coil
Both ends are connect with the IC module.
16. smart card according to claim 15, which is characterized in that the IC module is located on the lower surface of the contact
It is placed in the bottom of the groove.
17. smart card according to claim 15, which is characterized in that further include circuit board, the circuit board is located at described
In substrate, the IC module is located in the second preset areas of the circuit board in the substrate；The light emitting module is located at the base
In 4th preset areas of the circuit board in plate；The second switch module is located at the 6th preset areas of the circuit board in the substrate
In；The power supply module is located in the 7th preset areas of the circuit board in the substrate；
If the communication unit includes contact,：The IC module passes through the conduction in the first preset areas on the circuit board
Medium is connect with the lower surface of the contact；
If the communication unit includes aerial coil,：The aerial coil is embedded in the substrate, the aerial coil
Both ends are located at the third preset areas of the circuit board.
18. smart card according to claim 17, which is characterized in that further include interactive circuit module on the circuit board；
The interactive circuit module is located in the default interactive areas of the circuit board, the interactive circuit module and the IC module
Connection.
19. smart card according to claim 18, which is characterized in that the interactive circuit module includes：Interaction key and/
Or display screen.
20. smart card described in 3 or 14 according to claim 1, which is characterized in that the communication module includes magnetic stripe；The magnetic
Item is embedded in a surface of the coating, for carrying out data interaction with external.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820706622.XU CN208110655U (en) | 2018-05-11 | 2018-05-11 | A kind of smart card |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820706622.XU CN208110655U (en) | 2018-05-11 | 2018-05-11 | A kind of smart card |
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| CN208110655U true CN208110655U (en) | 2018-11-16 |
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ID=64115345
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110298432A (en) * | 2019-06-29 | 2019-10-01 | 飞天诚信科技股份有限公司 | A kind of smart card and its manufacturing method |
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2018
- 2018-05-11 CN CN201820706622.XU patent/CN208110655U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110298432A (en) * | 2019-06-29 | 2019-10-01 | 飞天诚信科技股份有限公司 | A kind of smart card and its manufacturing method |
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