CN208109998U - A kind of circuit board testing device - Google Patents

Abstract

This application discloses a kind of circuit board testing device, which includes：First supporting element, for fixing circuit board under test；Probe is tested, test probe can be mobile relative to the first supporting element, to contact when testing circuit board under test with circuit board under test；Linkage unit, can be with test probe synchronizing moving；Sensor is arranged on the first supporting element, for obtaining reference pressure value when linkage unit and sensor contacts in linkage unit synchronizing moving；Controller, connection sensor and test probe, reference pressure value when for according to linkage unit and sensor contacts adjust the movement of test probe.By the above-mentioned means, the application can prevent test probe poor contact bring index from accidentally surveying, the testing efficiency of production line is improved.

Description

A circuit board testing device

technical field

The present application relates to the technical field of circuit board testing, in particular to a circuit board testing device.

Background technique

When the circuit board is produced on the production line, it is necessary to test the performance of the circuit board. Generally, various test probes are stretched out and placed on the test points on the circuit board to complete the test of various indicators of the circuit board.

General testing devices are mechanically designed to drive the probes to touch the test points on the circuit board, but it is impossible to judge whether the probes are in good contact, which will cause errors due to poor contact between the probes and the test points on the circuit board. testing, increasing testing time and manpower costs.

Utility model content

In order to solve the above technical problems, a technical solution adopted by the present application is: provide a circuit board testing device, the circuit board testing device includes: a first support for fixing the circuit board to be tested; test probes, test probes It can move relative to the first support so as to be in contact with the circuit board to be tested when the circuit board to be tested is tested; the linkage assembly can move synchronously with the test probe; the sensor is arranged on the first support for use in linkage The reference pressure value when the linkage component is in contact with the sensor is obtained when the components move synchronously; the controller is connected to the sensor and the test probe, and is used to adjust the movement of the test probe according to the reference pressure value when the linkage component is in contact with the sensor.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort. in:

Fig. 1 is a schematic structural view of an embodiment of a circuit board testing device provided by the application;

2 is a schematic structural view of a first support member in an embodiment of a circuit board testing device provided by the present application;

FIG. 3 is a schematic structural view of another embodiment of the circuit board testing device provided by the present application;

4 is a schematic structural view of a second support member in another embodiment of the circuit board testing device provided by the present application;

Fig. 5 is a schematic structural diagram of the linkage assembly in another embodiment of the circuit board testing device provided by the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

The terms "first", "second", etc. in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or apparatuses.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to FIG. 1 , FIG. 1 is a schematic structural diagram of an embodiment of a circuit board testing device provided by the present application. The circuit board testing device includes a first support 10 , a test probe 20 , a linkage assembly 30 , a sensor 40 and a controller 50 . in:

The first supporting member 10 is used for fixing the circuit board A to be tested. Specifically, a locking mechanism for fixing the circuit board A to be tested may be provided on the first support member 10 , such as a press lock, a buckle, and the like.

The test probes 20 can move relative to the first supporting member 10 to contact the circuit board A to be tested when the circuit board A is tested. Specifically, the test probes 20 are mainly in contact with test points on the circuit board A to be tested, so as to pass a test signal to the circuit board A to be tested via the test probes 20 .

The linkage assembly 30 can move synchronously with the test probe 20 . Specifically, the linkage assembly 30 and the test probe 20 are relatively fixed, and the distance between them cannot be changed. For example, the linkage assembly 30 and the test probe 20 may be fixed by welding.

The sensor 40 is disposed on the first support member 10 and is used to obtain a reference pressure value when the linkage assembly 30 contacts the sensor 40 when the linkage assembly 30 moves synchronously. Specifically, the sensor 40 may be a pressure-sensitive sensor. When setting up the pressure-sensitive sensor, the pressure-contact surface of the pressure-sensitive sensor faces upward so that the linkage assembly 30 can contact it.

Optionally, the test probe 20 includes a first contact end 20a capable of contacting the circuit board A to be tested, and the linkage assembly 30 includes a second contact end 30a capable of contacting the sensor 40 . In this embodiment, the first contact end 20 a and the second contact end 30 a are flush in a plane relative to the first support member 10 . It can be understood that such a design is adopted mainly to ensure that the test probe 20 and the linkage assembly 30 can contact the circuit board A to be tested and the sensor 40 at the same time, respectively, and the pressure of the test probe 20 on the circuit board A to be tested, and the linkage assembly 30 is equal or positively correlated to the pressure on sensor 40.

It can be understood that since the heights of the circuit board A to be tested and the sensor 40 may be inconsistent, it is not necessary to make the first contact end 20a and the second contact end 30a aligned in the plane relative to the first support member 10. As long as the distance between the first contact end 20a and the circuit board A to be tested is equal to the distance between the second contact end 30a and the sensor 40 .

In addition, since the heights of the test circuit board A and the sensor 40 may not be the same, in order to ensure that the top surfaces thereof are on the same level, grooves may be provided on the first support member 10 .

As shown in Figure 2, Figure 2 is a schematic structural view of the first support in an embodiment of the circuit board testing device provided by the present application, the first support 10 is provided with a first groove 11 and a second groove 12, and the first support 10 is provided with a first groove 11 and a second groove 12. A groove 11 is used to accommodate the circuit board A to be tested, and a second groove 12 is used to accommodate the sensor 40; wherein, the depth of the first groove 11 and the second groove 12 can be determined according to the corresponding circuit board A to be tested. and the height of the sensor 40 so that the upper surface of the circuit board A to be tested and the upper surface of the sensor 40 are flush with the upper surface of the first support member 10 . In this way, the first contact end 20 a of the test probe 20 and the second contact end 30 a of the linkage probe 30 can always be kept flush in a plane relative to the first support member 10 .

In addition, since the height of the sensor 40 is generally fixed, but the height of the circuit board A to be tested can vary according to the circuit board tested each time, therefore, a height adjustment assembly (not shown in the figure) can be arranged in the first groove 11. shown), for adjusting the height of the circuit board A to be tested when the circuit board A to be tested is placed in the first groove 11, so that the upper surface of the circuit board A to be tested is flush with the upper surface of the first supporting member 10 flat.

Optionally, the sensor 40 may be a pressure sensitive sensor.

Continuing to refer to FIG. 1 , the controller 50 is connected to the sensor 40 and the test probe 20 for adjusting the movement of the test probe 20 according to the reference pressure value when the linkage assembly 30 is in contact with the sensor 40 .

It can be understood that since it is difficult to measure the pressure of the test probe 20 contacting the test point on the circuit board A to be tested, this embodiment measures the pressure of a linkage assembly 30 contacting the sensor 40 instead. Wherein, it can be considered that the reference pressure value when the linkage assembly 30 presses the sensor 40 is equal to the pressure value when the test probe 20 contacts the circuit board A to be tested, and it can also be considered that there is a positive correlation between the two, that is, the reference pressure value obtained by the sensor 40 The greater the pressure value, the greater the pressure value when the test probe 20 touches the circuit board A to be tested.

Therefore, the controller 50 further judges whether the contact between the test probe 20 and the circuit board A to be tested is good according to the reference pressure value obtained by the sensor 50 and the sensor 40 , which is an indirect measurement method.

Different from the prior art, the circuit board testing device of this embodiment includes: a first support for fixing the circuit board to be tested; a test probe, the test probe can move relative to the first support for testing the circuit to be tested. When the board is tested, it is in contact with the circuit board to be tested; the linkage component can move synchronously with the test probe; the sensor is arranged on the first support member, and is used to obtain the reference pressure when the linkage component is in contact with the sensor when the linkage component moves synchronously value; a controller, connected to the sensor and the test probe, for regulating the movement of the test probe according to the reference pressure value when the linkage assembly is in contact with the sensor. Through the above method, the contact situation between the test probe and the circuit board to be tested can be obtained indirectly, and then it can be judged whether the contact between the test probe and the circuit board to be tested is good, so as to prevent the damage caused by the poor contact of the test probe. Mistesting of indicators improves the testing efficiency of the production line.

Referring to FIG. 3, FIG. 3 is a schematic structural diagram of another embodiment of a circuit board testing device provided by the present application, which includes a first support 10, a test probe 20, a linkage assembly 30, a sensor 40, and a controller 50 , the second support member 60 and the driving assembly 70 . in:

The first supporting member 10 is used for fixing the circuit board A to be tested. The test probes 20 can move relative to the first supporting member 10 to contact the circuit board A to be tested when the circuit board A is tested. The linkage assembly 30 can move synchronously with the test probe 20 . The sensor 40 is disposed on the first support member 10 and is used to obtain a reference pressure value when the linkage assembly 30 contacts the sensor 40 when the linkage assembly 30 moves synchronously. The controller 50 is connected to the sensor 40 and the test probe 20 for adjusting the movement of the test probe 20 according to the reference pressure value when the linkage assembly 30 is in contact with the sensor 40 .

In addition, different from the above-mentioned embodiments, the second support member 60 in this embodiment is arranged on the side where the circuit board A to be tested is fixed relative to the first support member 10, that is, the circuit board A to be tested is located between the first support member 10 and the first support member 10. Between the two supports 60 ; the test probe 20 and the linkage assembly 30 are fixed on the side of the second support 60 close to the first support 10 , ie the lower surface. The driving assembly 70 is connected to the controller 50 and the second support 60 for driving the second support 60 to move under the control of the controller 50 .

It can be understood that the above-mentioned first support member 10 and second support member 60 can form a jig, and the circuit board A to be tested is sandwiched between the first support member 10 and the second support member 60 for testing.

Wherein, the driving assembly 70 may specifically be a spring driving assembly or a pneumatic driving assembly.

Taking the pneumatic driving assembly as an example, the pneumatic driving assembly includes a gas-sealed cavity, and the test probe 20 is arranged in the sealed cavity, and together with the sealed cavity, the internal gas is sealed. When driving, the air pressure in the inner space is increased, and the test probe 20 is ejected by the air pressure to contact the circuit board A to be tested. After the test is completed, the air pressure in the inner space is reduced, and the test probe 20 is retracted.

Wherein, the second supporting member 60 may be in the shape of a plate, and other test probes other than the test probe 20 may also be arranged thereon.

It can be understood that when testing the circuit board A to be tested, it is necessary to pass test signals to multiple test points on the circuit board A to be tested at the same time, and using multiple probes simultaneously can shorten the test time.

Take the main board of a mobile phone as an example. The main board of a mobile phone includes multiple test points. The RF signal test point is easily mistested due to poor contact. Therefore, a linkage component can be set based on the RF signal test probe to test the RF signal. The contact condition of the signal test probe is measured.

Optionally, with reference to FIG. 4, FIG. 4 is a schematic structural diagram of the second support member in another embodiment of the circuit board testing device provided by the present application. In one embodiment, the test probe 20 and the linkage assembly 30 can be The two support members 60 move in the plane to adjust the horizontal distance between the test probe 20 and the linkage assembly 30 .

Specifically, a slide rail can be provided on the lower surface of the second support member 60, and the tops of the test probe 20 and the linkage assembly 30 are arranged inside the slide rail and can move along the slide, which can be manually or mechanically controlled. way, there is no limitation here.

Optionally, the linkage assembly is provided with a length adjustment mechanism for adjusting the relative distance between the linkage assembly and the test probe in the moving direction. With reference to FIG. 5 , FIG. 5 is a schematic structural view of the linkage assembly in another embodiment of the circuit board testing device provided by the present application. In another embodiment, the linkage assembly 30 further includes a fixing member 31 , an adjusting member 32 and a contact member 33 . Wherein, the fixing member 31 is fixed on the second supporting member 60 , the adjusting member 32 is fixed on the fixing member 31 , and the contact member 33 is connected to the adjusting member 32 movably.

Specifically, the adjustment piece 32 and the contact piece 33 can be fixed in a threaded manner, for example, the adjustment piece 32 is provided with a through hole, the inside of the through hole is provided with an internal thread, the contact piece 33 is provided with an external thread, and is connected with the adjustment piece 32 Internal thread screw connection. By twisting the contact member 33, its height can be adjusted, that is, the relative distance between the linkage assembly 30 and the test probe 20 in the moving direction can be adjusted.

This structure is mainly used when the heights of the circuit board A under test and the sensor 40 are inconsistent, in order to ensure that the distance between the test probe 20 and the circuit board A under test is equal to the distance between the linkage assembly 30 and the sensor 40 .

Specifically, before the test, the test probe 20 and the linkage assembly 30 can be pre-adjusted to ensure that the height of the test probe 20 and the linkage assembly 30 are consistent.

Different from the above-mentioned embodiments, the test probe and the linkage assembly in this embodiment can be adjusted horizontally and vertically, which further increases the scope of application of the test device, and adjusting the height can further improve the test accuracy.

1-5, in order to make the above measurement more accurate, we can pre-establish the correspondence between the contact between the test probe 20 and the circuit board A to be tested and the reference pressure value obtained by the sensor 40.

Wherein, when the reference pressure value is less than the first threshold, it can be considered that the test probe 20 has not been in contact with the circuit board A to be tested. In particular, the first threshold here can be 0 or an extremely small value, that is, the pressure value measured by the sensor 40 is 0 or the pressure value is extremely small, and it is considered that the test probe 20 has not been in contact with the circuit board A to be tested.

Further, when the reference pressure value is greater than the first threshold and less than the second threshold, it can be considered that the test probe 20 has been in contact with the circuit board A to be tested, but the contact is not good enough, which may lead to mistesting.

Further, when the reference pressure value is greater than the second threshold, it can be considered that the test probe 20 is in contact with the circuit board A to be tested, and the contact is good, and the next step of testing can be performed.

In addition, when the reference pressure value is greater than the third threshold (the third threshold is greater than the second threshold), or when the reference pressure value is much greater than the second threshold, it can be considered that the contact force between the test probe 20 and the circuit board A to be tested is too large, It is likely to damage the performance of the circuit board A under test.

Based on the above solution, a controller 50 with a corresponding adjustment function can be provided. Specifically, the controller 50 is specifically configured to control the test probe 20 to move toward the first support member 10 by a first distance when the reference pressure value is less than the set first threshold.

Optionally, the controller 50 is specifically configured to control the test probe 20 to move toward the first support 10 by a second distance when the reference pressure value is greater than the set first threshold and less than the set second threshold.

Wherein, the first distance is greater than the second distance. It can be understood that the different moving distances here specifically refer to controlling the pressure of the test probe 20 on the circuit board A to be tested.

Specifically, in conjunction with the above-mentioned example of using the air pressure drive assembly, if the first distance is moved, a greater air pressure will be used to control the test probe 20 to exert greater pressure on the circuit board A to be tested; on the contrary, if the second distance is moved , a smaller air pressure will be used to control the pressure of the test probe 20 on the circuit board A to be tested to decrease.

Optionally, the controller 50 is further configured to send a test signal to the test probe 20 to test the circuit board A to be tested when the reference pressure value is greater than the set second threshold.

Optionally, the controller 50 is further configured to control the test probe 20 to move away from the first support member 10 when the reference pressure value is greater than the set third threshold.

Through the above method, the test probe 20 can be adjusted differently based on the different pressure values obtained by the sensor 40 , so that the contact between the test probe 20 and the circuit board A to be tested is more in line with the set requirements.

The following describes the embodiments of the present application in combination with the above-mentioned embodiments and a specific application scenario:

1. Precondition the board test setup.

In the first aspect, according to the size of the circuit board to be tested A, and the distance between the circuit board to be tested and the sensor 40, adjust the horizontal distance between the test probe 20 and the linkage assembly 30; on the other hand, according to the circuit board to be tested A and the height of the sensor 40, adjust the vertical height of the test probe 20 and the linkage assembly 30, to ensure that the distance between the test probe 20 and the circuit board A to be tested is equal to the distance between the linkage assembly 30 and the sensor 40 .

2. Preset the controller.

Here, the corresponding relationship between the pressure value acquired by the sensor 40 and the adjustment of the test probe 20 is mainly set.

Specifically, the preset controller 50 has the following functions: the controller 50 is specifically configured to control the test probe 20 to move toward the first support member 10 by a first distance when the reference pressure value is less than the set first threshold. The controller 50 is specifically configured to control the test probe 20 to move toward the first support member 10 for a second distance when the reference pressure value is greater than the set first threshold and less than the set second threshold; wherein, the set first The threshold is smaller than the set second threshold, and the first distance is larger than the second distance. The controller 50 is also configured to send a test signal to the test probe 20 to test the circuit board A to be tested when the reference pressure value is greater than the set second threshold. The controller 50 is further configured to control the test probe 20 to move away from the first support member 10 when the reference pressure value is greater than a set third threshold; wherein the third threshold is greater than the second threshold.

3. Test the alignment of the probes.

The controller 50 is specifically configured to control the test probe 20 to move toward the first support for a first distance when the reference pressure value is less than the set first threshold. The controller 50 is specifically configured to control the test probe 20 to move toward the first support member 10 for a second distance when the reference pressure value is greater than the set first threshold and less than the set second threshold; wherein, the set first The threshold is smaller than the set second threshold, and the first distance is larger than the second distance.

4. Input of test signal.

The controller 50 is also configured to send a test signal to the test probe 20 to test the circuit board A to be tested when the reference pressure value is greater than the set second threshold.

In addition, it can be understood that in the above-mentioned embodiment, the sensor 40, the controller 50 and the driver 70 are only functionally divided into three components. In practical applications, the three components can be respectively three specific devices For example, the sensor 40 is a pressure-sensitive sensor, the controller 50 is a single-chip microcomputer, and the driver 70 is a mechanical arm or a pressure driver. In addition, the three can also be combined to form a component with multiple functions at the same time. For example, the driver 70 is a driver with a control function, and a control chip is arranged inside it, capable of performing the above-mentioned control method.

In combination with the above-mentioned embodiments, the present application indirectly obtains the contact condition between the test probe and the circuit board to be tested, and then judges whether the contact between the test probe and the circuit board to be tested is good, thereby preventing the test probe from contacting Mismeasurement of indicators caused by defects improves the test efficiency of the production line.

The above is only the implementation of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process conversion made by using the specification and drawings of the application, or directly or indirectly used in other related technologies fields, are all included in the scope of patent protection of this application in the same way.

Claims (16)

1. a kind of circuit board testing device, which is characterized in that the circuit board testing device includes：

First supporting element, for fixing circuit board under test；

Probe is tested, the test probe can be mobile relative to first supporting element, to carry out to the circuit board under test It is contacted when test with the circuit board under test；

Linkage unit, can be with the test probe synchronizing moving；

Sensor is arranged on first supporting element, for obtaining the linkage groups in the linkage unit synchronizing moving Reference pressure value when part and the sensor contacts；

Controller connects the sensor and the test probe, for according to the linkage unit and the sensor contacts When reference pressure value adjust it is described test probe movement.

2. circuit board testing device according to claim 1, which is characterized in that

The test probe includes the first contact jaw that can be contacted with the circuit board under test, and the linkage unit includes can be with institute State the second contact jaw of sensor contacts；

Wherein, the distance between first contact jaw and the circuit board under test, with second contact jaw and the sensing The distance between device is equal.

3. circuit board testing device according to claim 2, which is characterized in that

First contact jaw and second contact jaw flush in the plane relative to first supporting element.

4. circuit board testing device according to claim 1, which is characterized in that

The circuit board testing device further includes the second supporting element, and second supporting element is fixed relative to first supporting element The side of the circuit board under test is arranged；

The test probe and the linkage unit are fixed on second supporting element close to the side of first supporting element.

5. circuit board testing device according to claim 4, which is characterized in that

The test probe and the linkage unit can move in the plane where second supporting element, to adjust the survey Sound out the horizontal distance between needle and the linkage unit.

6. circuit board testing device according to claim 4, which is characterized in that

The circuit board testing device further includes driving assembly, is connected to the controller and second supporting element, is used for The movement of second supporting element is driven under the control of the controller.

7. circuit board testing device according to claim 6, which is characterized in that

The driving component is specially spring driving assembly or air pressure driving assembly.

8. circuit board testing device according to claim 1, which is characterized in that

The controller is specifically used for controlling the test probe direction when the reference pressure value is less than setting first threshold The mobile first distance in the direction of first supporting element.

9. circuit board testing device according to claim 8, which is characterized in that

The controller is specifically used for being greater than the setting first threshold in the reference pressure value and is less than setting second threshold When, the test probe is controlled towards the mobile second distance in the direction of first supporting element；Wherein, the setting first threshold Less than the setting second threshold, the first distance is greater than the second distance.

10. circuit board testing device according to claim 9, which is characterized in that

The controller is also used to be passed through when the reference pressure value is greater than the setting second threshold to the test probe Signal is tested, to test the circuit board under test.

11. circuit board testing device according to claim 10, which is characterized in that

The controller is also used to control the test probe towards far when the reference pressure value is greater than setting third threshold value Direction from first supporting element is mobile；Wherein, the third threshold value is greater than the second threshold.

12. circuit board testing device according to claim 1, which is characterized in that

The sensor is voltage sensitive sensor.

13. circuit board testing device according to claim 1, which is characterized in that

The first groove and the second groove are provided on first supporting element, first groove is for accommodating the circuit under test Plate, second groove is for accommodating the sensor；

Wherein, the upper surface of the upper surface of the circuit board under test and the sensor, the upper surface with first supporting element It flushes.

14. circuit board testing device according to claim 13, which is characterized in that

Height adjustment assembly is set in first groove, for being placed in first groove in the circuit board under test When, the height of the circuit board under test is adjusted, so that the upper table of the upper surface of the circuit board under test and first supporting element Face flushes.

15. circuit board testing device according to claim 1, which is characterized in that

It is provided with length adjustment mechanism on the linkage unit, for adjusting the linkage unit and the test probe in movement Relative distance on direction.

16. circuit board testing device according to claim 1, which is characterized in that

The circuit board under test is cell phone mainboard, and radiofrequency signal test point is included at least on the cell phone mainboard, and the test is visited Needle is that radiofrequency signal tests probe.