CN208109998U - A kind of circuit board testing device - Google Patents
A kind of circuit board testing device Download PDFInfo
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- CN208109998U CN208109998U CN201820482510.0U CN201820482510U CN208109998U CN 208109998 U CN208109998 U CN 208109998U CN 201820482510 U CN201820482510 U CN 201820482510U CN 208109998 U CN208109998 U CN 208109998U
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- circuit board
- test
- supporting element
- testing device
- probe
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Abstract
This application discloses a kind of circuit board testing device, which includes：First supporting element, for fixing circuit board under test；Probe is tested, test probe can be mobile relative to the first supporting element, to contact when testing circuit board under test with circuit board under test；Linkage unit, can be with test probe synchronizing moving；Sensor is arranged on the first supporting element, for obtaining reference pressure value when linkage unit and sensor contacts in linkage unit synchronizing moving；Controller, connection sensor and test probe, reference pressure value when for according to linkage unit and sensor contacts adjust the movement of test probe.By the above-mentioned means, the application can prevent test probe poor contact bring index from accidentally surveying, the testing efficiency of production line is improved.
Description
Technical field
This application involves circuit board testing technical fields, more particularly to a kind of circuit board testing device.
Background technique
Circuit board needs to test the performance of circuit board when producing line produces.Generally by the various tests of stretching
Probe pushes up in test point on circuit boards, completes the test of circuit board indices.
General test device is all using Mechanical Design, and driving probe contacts the test point on circuit board, but visits
Whether needle contacts well, has no way of judging, thus will cause accidentally to test because of the poor contact of probe and circuit board test point, increases
Add testing time and human cost.
Utility model content
In order to solve the above technical problems, the technical solution that the application uses is：A kind of circuit board testing device is provided,
The circuit board testing device includes：First supporting element, for fixing circuit board under test；Probe is tested, test probe can be relative to
First supporting element is mobile, to contact when testing circuit board under test with circuit board under test；Linkage unit can be visited with test
Needle synchronizing moving；Sensor is arranged on the first supporting element, for obtaining linkage unit in linkage unit synchronizing moving and passing
Reference pressure value when sensor contacts；Controller, connection sensor and test probe, for being connect according to linkage unit and sensor
Reference pressure value when touching adjusts the movement of test probe.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.Wherein：
Fig. 1 is the structural schematic diagram of one embodiment of circuit board testing device provided by the present application；
Fig. 2 is the structural schematic diagram of the first supporting element in one embodiment of circuit board testing device provided by the present application；
Fig. 3 is the structural schematic diagram of another embodiment of circuit board testing device provided by the present application；
Fig. 4 is the structural schematic diagram of the second supporting element in another embodiment of circuit board testing device provided by the present application；
Fig. 5 is the structural schematic diagram of linkage unit in another embodiment of circuit board testing device provided by the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description.It is understood that specific embodiment described herein is only used for explaining the application, rather than to the limit of the application
It is fixed.It also should be noted that illustrating only part relevant to the application for ease of description, in attached drawing and not all knot
Structure.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Term " first ", " second " in the application etc. be for distinguishing different objects, rather than it is specific suitable for describing
Sequence.In addition, term " includes " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The process, method, system, product or equipment of a series of steps or units are not limited to listed step or unit, and
It is optionally further comprising the step of not listing or unit, or optionally further comprising for these process, methods, product or equipment
Intrinsic other step or units.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Refering to fig. 1, Fig. 1 is the structural schematic diagram of one embodiment of circuit board testing device provided by the present application, the circuit board
Test device includes the first supporting element 10, test probe 20, linkage unit 30, sensor 40 and controller 50.Wherein：
First supporting element 10 is for fixing circuit board under test A.Specifically, it can be set on the first supporting element 10 to be measured
Retaining mechanism that circuit board A is fixed, such as pressure lock, buckle etc..
Testing probe 20 can be mobile relative to the first supporting element 10, with when testing circuit board under test A with it is to be measured
Circuit board A contact.Specifically, the test probe 20 mainly contacted with the test point on circuit board under test A, so as to via
The test probe 20 is passed through test signal to circuit board under test A.
Linkage unit 30 can be with test 20 synchronizing moving of probe.Specifically, linkage unit 30 and test probe 20 are opposite
It is fixed, the distance between cannot change.For example, can be by the way of welding to linkage unit 30 and test probe
20 are fixed.
Sensor 40 is arranged 10 on the first supporting element, for obtaining linkage unit 30 in 30 synchronizing moving of linkage unit
Reference pressure value when being contacted with sensor 40.Specifically, which can be voltage sensitive sensor, in setting pressure-responsive
It is when device, the pressure contact of voltage sensitive sensor is face-up, so that linkage unit 30 contacts.
Optionally, test probe 20 includes the first contact jaw 20a that can be contacted with circuit board under test A, and linkage unit 30 wraps
Include the second contact jaw 30a that can be contacted with sensor 40.In the present embodiment, the first contact jaw 20a and the second contact jaw 30a exist
It is flushed in plane relative to the first supporting element 10.It should be understood that using such design primarily to guaranteeing that test is visited
Needle 20 and linkage unit 30 can contact measured circuit board A and sensor 40 contact simultaneously respectively, and test probe 20 and treat
The pressure and linkage unit 30 of slowdown monitoring circuit plate A is equal to the pressure of sensor 40 or is positively correlated.
It should be understood that since the height of circuit board under test A and sensor 40 are possible to inconsistent, accordingly it is also possible to not
It has to flush the first contact jaw 20a and the second contact jaw 30a in the plane relative to the first supporting element 10, as long as guaranteeing
The distance between first contact jaw 20a and circuit board under test A, the distance between the second contact jaw 30a and sensor 40 are equal
?.
In addition, since the height of slowdown monitoring circuit plate A and sensor 40 are possible to inconsistent, in order to guarantee its top surface in same water
In plane, groove can be set on the first supporting element 10.
As shown in Fig. 2, the structure that Fig. 2 is the first supporting element in one embodiment of circuit board testing device provided by the present application is shown
It is intended to, the first groove 11 and the second groove 12 is provided on the first supporting element 10, the first groove 11 is for accommodating circuit board under test
A, the second groove 12 is for accommodating sensor 40；Wherein, the depth of the first groove 11 and the second groove 12 can be according to corresponding
The height of circuit board under test A and sensor 40 is arranged, so that the upper surface of the upper surface of circuit board under test A and sensor 40,
It is flushed with the upper surface of the first supporting element 10.The first contact jaw 20a and the linkage of test probe 20 can be thus always maintained at
Second contact jaw 30a of probe 30 is flushed in the plane relative to the first supporting element 10.
In addition, since the height of sensor 40 is usually fixed, but the height of circuit board under test A can be surveyed according to each
The difference of the circuit board of examination and change, therefore, can in the first groove 11 setting height adjustment assembly (not shown), for
When circuit board under test A is placed on 11 in the first groove, the height of circuit board under test A is adjusted, so that the upper surface of circuit board under test A
It is flushed with the upper surface of the first supporting element 10.
Optionally, sensor 40 can be voltage sensitive sensor.
With continued reference to Fig. 1, controller 50 connects sensor 40 and test probe 20, for according to linkage unit 30 and sensing
Reference pressure value when device 40 contacts adjusts the movement of test probe 20.
It should be understood that since the pressure of the test point on test 20 contact measured circuit board A of probe is difficult to measure,
So the present embodiment is substituted by measuring the pressure of 30 contact sensor 40 of a linkage unit.Wherein it is possible to think linkage groups
Reference pressure value when 30 compression sensor 40 of part and the pressure value of test 20 contact measured circuit board A of probe be it is equal,
It is considered that be between the two it is positively related, i.e., sensor 40 obtain reference pressure value it is bigger, test 20 contact measured of probe
Pressure value when circuit board A is bigger.
Therefore, controller 50 further judges to test according to sensor 50 according to the reference pressure value that sensor 40 obtains
Whether the contact between probe 20 and circuit board under test A is good, is a kind of indirect measurement method.
It is different from the prior art, the circuit board testing device of the present embodiment includes：First supporting element, for fixing electricity to be measured
Road plate；Test probe, test probe can be mobile relative to the first supporting element, with when testing circuit board under test with it is to be measured
Circuit board contacts；Linkage unit, can be with test probe synchronizing moving；Sensor is arranged on the first supporting element, for linking
Reference pressure value when linkage unit and sensor contacts is obtained when component synchronization is mobile；Controller connects sensor and test
Probe, reference pressure value when for according to linkage unit and sensor contacts adjust the movement of test probe.Pass through above-mentioned side
Formula can indirectly obtain the contact situation between test probe and circuit board under test, and then judge test probe and electricity to be measured
Whether the contact between the plate of road is good, so as to prevent test probe poor contact bring index from accidentally surveying, improves production
The testing efficiency of line.
It is the structural schematic diagram of another embodiment of circuit board testing device provided by the present application, the circuit refering to Fig. 3, Fig. 3
Board test device includes the first supporting element 10, test probe 20, linkage unit 30, sensor 40, controller 50, the second supporting element
60 and driving assembly 70.Wherein：
First supporting element 10 is for fixing circuit board under test A.Testing probe 20 can be mobile relative to the first supporting element 10, with
It is contacted when testing circuit board under test A with circuit board under test A.Linkage unit 30 can be with test 20 synchronizing moving of probe.
Sensor 40 is arranged 10 on the first supporting element, for obtaining linkage unit 30 and sensor in 30 synchronizing moving of linkage unit
Reference pressure value when 40 contact.Controller 50 connects sensor 40 and test probe 20, is used for according to linkage unit 30 and passes
Reference pressure value when sensor 40 contacts adjusts the movement of test probe 20.
In addition, being different from above-described embodiment, the second supporting element 60 in the present embodiment is fixed relative to the first supporting element 10
The side of circuit board under test A is arranged, i.e. circuit board under test A is between the first supporting element 10 and the second supporting element 60；Test is visited
Needle 20 and linkage unit 30 are fixed on the second supporting element 60 close to the side of the first supporting element 10, i.e. lower surface.Driving assembly 70
It is connected to controller 50 and the second supporting element 60, for driving the movement of the second supporting element 60 under control of controller 50.
It should be understood that above-mentioned the first supporting element 10 and the second supporting element 60 can form a fixture, by circuit under test
Plate A is clipped between the first supporting element 10 and the second supporting element 60 and is tested.
Wherein, driving assembly 70 is specifically as follows spring driving assembly or air pressure driving assembly.
By taking air pressure driving assembly as an example, which includes an air seal chamber, and test probe 20 is set to this
In seal chamber, and internal gas is sealed jointly with the seal chamber.In driving, increase the air pressure of inner space, leads to
It crosses air pressure and is popped up probe 20 is tested, circuit board under test A is contacted, after being completed, reduces the air pressure of inner space,
Test probe 20 is withdrawn.
Wherein, the second supporting element 60 can be plate, other tests except test probe 20 can also be provided thereon
Probe.
It should be understood that needing simultaneously when testing circuit board under test A to multiple surveys on circuit board under test A
Pilot is passed through test signal to be tested, and carries out that then the testing time can be shortened simultaneously using multiple probes.
By taking cell phone mainboard as an example, on cell phone mainboard include multiple test points, radiofrequency signal test point therein be easy to because
Poor contact and generate accidentally survey, therefore, can based on the radiofrequency signal test probe be arranged a linkage unit, carry out to the radio frequency
The contact situation of signal test probe measures.
It optionally, is the second supporting element in another embodiment of circuit board testing device provided by the present application in conjunction with Fig. 4, Fig. 4
Structural schematic diagram, in one embodiment, testing probe 20 and linkage unit 30 can be in the plane where the second supporting element 60
Interior movement, to adjust the horizontal distance between test probe 20 and linkage unit 30.
Specifically, sliding rail can be set on the lower surface of the second supporting element 60, test probe 20 and linkage unit 30
Top is arranged inside sliding rail, and can move along sliding, specifically can be by the way of manual or Mechanical course, this
In with no restriction.
Optionally, it is provided with length adjustment mechanism on linkage unit, for adjusting linkage unit and test probe in movement
Relative distance on direction.It is linkage unit in another embodiment of circuit board testing device provided by the present application in conjunction with Fig. 5, Fig. 5
Structural schematic diagram, in another embodiment, linkage unit 30 further comprises fixing piece 31, regulating part 32 and contact
33.Wherein, fixing piece 31 is fixed on the second supporting element 60, and regulating part 32 is fixed on fixing piece 31, contact 33 and adjusting
Part 32 movably connects.
Specifically, regulating part 32 and contact 33 can be fixed by the way of screw thread, for example, being provided on regulating part 32
Through-hole, the inside of through-hole are arranged internal screw thread, external screw thread are arranged on contact 33, and be spirally connected with the internal screw thread of regulating part 32.Pass through
Contact 33 is twisted, its adjustable height, i.e., adjusting linkage unit 30 and tests in the direction of movement opposite of probe 20
Distance.
The structure is mainly to be applied to the inconsistent situation of height of circuit board under test A and sensor 40, in order to guarantee to survey
It sounds out the distance between needle 20 and circuit board under test A and linkage unit 30 is equal with the distance between sensor 40.
Specifically, before test, test probe 20 and linkage unit 30 can be preconditioned, to guarantee that test is visited
Needle 20 is consistent with the height of linkage unit 30.
Different from above-described embodiment, test probe and linkage unit in this implementation can carry out horizontal direction and vertical
The adjusting in direction further increases the scope of application of the test device, and can also further mention to being highly adjusted
High measuring accuracy.
In conjunction with the embodiment of above-mentioned Fig. 1-Fig. 5, in order to keep above-mentioned measurement more accurate, we can pre-establish test
The corresponding relationship between reference pressure value that probe 20 is obtained with the contact situation of circuit board under test A and sensor 40.
Wherein, reference pressure value be less than first threshold when, it is believed that test probe 20 not yet with circuit board under test A
Contact.Particularly, first threshold here can be 0 or a very small numerical value, i.e., the pressure value that sensor 40 measures is 0
Or pressure value it is minimum when, it is believed that test probe 20 not yet contacted with circuit board under test A.
Further, when reference pressure value is greater than first threshold and is less than second threshold, it is believed that test probe 20 is
Through contacting with circuit board under test A, but contact is not sufficiently good, may result in and accidentally surveys.
Further, when reference pressure value is greater than second threshold, it is believed that test probe 20 and circuit board under test A connects
Touching, and contact well, the test job of next step can be carried out.
In addition, (third threshold value is greater than second threshold) or reference pressure value when reference pressure value is greater than third threshold value
When much larger than second threshold, it is believed that the contact force of test probe 20 and circuit board under test A are spent greatly, it is likely that can be damaged
The performance of circuit board under test A.
Based on above scheme, a controller 50 with corresponding regulatory function can be provided.Specifically, controller 50 is specific
For when reference pressure value is less than setting first threshold, the direction of control test probe 20 towards the first supporting element 10 mobile the
One distance.
Optionally, controller 50 is specifically used for being greater than setting first threshold in reference pressure value and is less than the second threshold of setting
When value, control tests probe 20 towards the mobile second distance in the direction of the first supporting element 10.
Wherein, first distance is greater than second distance.It is surveyed it should be understood that the different distance moved here specifically refers to control
Needle 20 is soundd out to the pressure of circuit board under test A.
Specifically, in conjunction with the above-mentioned example using air pressure driving assembly, if when mobile first distance, it will be using bigger
Air pressure has bigger pressure to circuit board under test A with control test probe 20, on the contrary, if will use when moving second distance
Lesser air pressure is reduced with controlling test probe 20 to the pressure of circuit board under test A.
Optionally, controller 50 is also used to be passed through when reference pressure value is greater than setting second threshold to test probe 20
Signal is tested, to test circuit board under test A.
Optionally, controller 50 is also used to when reference pressure value is greater than setting third threshold value, control test 20 court of probe
It is mobile to the direction far from the first supporting element 10.
By above-mentioned mode, the different pressure values that can be obtained based on sensor 40 are different to test probe 20
Strength of adjustment so that test probe 20 is more in line with the requirement of setting with the contact of circuit board under test A.
Embodiments herein is illustrated below with reference to the above embodiments and a specific application scenarios：
1, circuit board testing device is preconditioned.
In a first aspect, being adjusted according to the size of circuit board under test A and the distance between circuit board under test and sensor 40
Horizontal distance between section test probe 20 and linkage unit 30；On the other hand, according to the height of circuit board under test A and sensor 40
Degree, adjust test probe 20 and linkage unit 30 vertical height, with guarantee test probe 20 and circuit board under test A between away from
From and the distance between linkage unit 30 and sensor 40 it is equal.
2, controller is pre-seted.
Here the corresponding relationship that the pressure value and test probe 20 that mainly setting sensor 40 obtains are adjusted.
Specifically, the controller 50 pre-seted is with the following functions：Controller 50 is specifically used in reference pressure value
When less than setting first threshold, control tests probe 20 towards the mobile first distance in the direction of the first supporting element 10.Controller 50
Specifically for controlling test 20 direction of probe when reference pressure value is greater than setting first threshold and is less than setting second threshold
The mobile second distance in the direction of first supporting element 10；Wherein, setting first threshold is less than setting second threshold, and first distance is greater than
Second distance.Controller 50 is also used to be passed through test letter to test probe 20 when reference pressure value is greater than setting second threshold
Number, to test circuit board under test A.Controller 50 is also used to the control when reference pressure value is greater than setting third threshold value
The direction that test probe 20 is directed away from the first supporting element 10 is mobile；Wherein, third threshold value is greater than second threshold.
3, the contraposition of probe is tested.
Controller 50 is specifically used for when reference pressure value is less than setting first threshold, control test probe 20 towards first
The mobile first distance in the direction of supporting element.Controller 50 is specifically used for being greater than setting first threshold in reference pressure value and be less than
When setting second threshold, control tests probe 20 towards the mobile second distance in the direction of the first supporting element 10；Wherein, first is set
Threshold value is less than setting second threshold, and first distance is greater than second distance.
4, the input of signal is tested.
Controller 50 is also used to be passed through test letter to test probe 20 when reference pressure value is greater than setting second threshold
Number, to test circuit board under test A.
Furthermore it is possible to understand, in the above-described embodiment, sensor 40, controller 50 and driver 70 are only function
Energy property divides into three components, and in practical applications, which can be respectively three specific devices, for example, passing
Sensor 40 is voltage sensitive sensor, controller 50 is single-chip microcontroller, and driver 70 is mechanical arm or pressure driver etc..In addition, three
Also it can be combined composition one while there is the component of multiple functions.For example, driver 70 is the drive of an included control function
Dynamic device, is internally provided with control chip, is able to carry out above-described control method.
In conjunction with the above embodiments, the application is by indirectly obtaining the contact feelings between test probe and circuit board under test
Condition, and then judge whether the contact tested between probe and circuit board under test is good, so as to prevent the contact of test probe not
Good bring index is accidentally surveyed, and the testing efficiency of production line is improved.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (16)
1. a kind of circuit board testing device, which is characterized in that the circuit board testing device includes：
First supporting element, for fixing circuit board under test；
Probe is tested, the test probe can be mobile relative to first supporting element, to carry out to the circuit board under test
It is contacted when test with the circuit board under test；
Linkage unit, can be with the test probe synchronizing moving；
Sensor is arranged on first supporting element, for obtaining the linkage groups in the linkage unit synchronizing moving
Reference pressure value when part and the sensor contacts；
Controller connects the sensor and the test probe, for according to the linkage unit and the sensor contacts
When reference pressure value adjust it is described test probe movement.
2. circuit board testing device according to claim 1, which is characterized in that
The test probe includes the first contact jaw that can be contacted with the circuit board under test, and the linkage unit includes can be with institute
State the second contact jaw of sensor contacts；
Wherein, the distance between first contact jaw and the circuit board under test, with second contact jaw and the sensing
The distance between device is equal.
3. circuit board testing device according to claim 2, which is characterized in that
First contact jaw and second contact jaw flush in the plane relative to first supporting element.
4. circuit board testing device according to claim 1, which is characterized in that
The circuit board testing device further includes the second supporting element, and second supporting element is fixed relative to first supporting element
The side of the circuit board under test is arranged；
The test probe and the linkage unit are fixed on second supporting element close to the side of first supporting element.
5. circuit board testing device according to claim 4, which is characterized in that
The test probe and the linkage unit can move in the plane where second supporting element, to adjust the survey
Sound out the horizontal distance between needle and the linkage unit.
6. circuit board testing device according to claim 4, which is characterized in that
The circuit board testing device further includes driving assembly, is connected to the controller and second supporting element, is used for
The movement of second supporting element is driven under the control of the controller.
7. circuit board testing device according to claim 6, which is characterized in that
The driving component is specially spring driving assembly or air pressure driving assembly.
8. circuit board testing device according to claim 1, which is characterized in that
The controller is specifically used for controlling the test probe direction when the reference pressure value is less than setting first threshold
The mobile first distance in the direction of first supporting element.
9. circuit board testing device according to claim 8, which is characterized in that
The controller is specifically used for being greater than the setting first threshold in the reference pressure value and is less than setting second threshold
When, the test probe is controlled towards the mobile second distance in the direction of first supporting element；Wherein, the setting first threshold
Less than the setting second threshold, the first distance is greater than the second distance.
10. circuit board testing device according to claim 9, which is characterized in that
The controller is also used to be passed through when the reference pressure value is greater than the setting second threshold to the test probe
Signal is tested, to test the circuit board under test.
11. circuit board testing device according to claim 10, which is characterized in that
The controller is also used to control the test probe towards far when the reference pressure value is greater than setting third threshold value
Direction from first supporting element is mobile；Wherein, the third threshold value is greater than the second threshold.
12. circuit board testing device according to claim 1, which is characterized in that
The sensor is voltage sensitive sensor.
13. circuit board testing device according to claim 1, which is characterized in that
The first groove and the second groove are provided on first supporting element, first groove is for accommodating the circuit under test
Plate, second groove is for accommodating the sensor；
Wherein, the upper surface of the upper surface of the circuit board under test and the sensor, the upper surface with first supporting element
It flushes.
14. circuit board testing device according to claim 13, which is characterized in that
Height adjustment assembly is set in first groove, for being placed in first groove in the circuit board under test
When, the height of the circuit board under test is adjusted, so that the upper table of the upper surface of the circuit board under test and first supporting element
Face flushes.
15. circuit board testing device according to claim 1, which is characterized in that
It is provided with length adjustment mechanism on the linkage unit, for adjusting the linkage unit and the test probe in movement
Relative distance on direction.
16. circuit board testing device according to claim 1, which is characterized in that
The circuit board under test is cell phone mainboard, and radiofrequency signal test point is included at least on the cell phone mainboard, and the test is visited
Needle is that radiofrequency signal tests probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820482510.0U CN208109998U (en) | 2018-04-04 | 2018-04-04 | A kind of circuit board testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820482510.0U CN208109998U (en) | 2018-04-04 | 2018-04-04 | A kind of circuit board testing device |
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| CN208109998U true CN208109998U (en) | 2018-11-16 |
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| CN201820482510.0U Expired - Fee Related CN208109998U (en) | 2018-04-04 | 2018-04-04 | A kind of circuit board testing device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109459647A (en) * | 2018-12-26 | 2019-03-12 | 无锡格菲电子薄膜科技有限公司 | It is a kind of for quickly detecting the method and device of electrothermal membrane infrared performance |
| CN110879349A (en) * | 2019-12-03 | 2020-03-13 | 孝感华工高理电子有限公司 | Linear testing arrangement of executor circuit board carbon film |
| CN111308301A (en) * | 2019-12-05 | 2020-06-19 | 王东 | Semiconductor performance testing method based on Internet of things |
-
2018
- 2018-04-04 CN CN201820482510.0U patent/CN208109998U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109459647A (en) * | 2018-12-26 | 2019-03-12 | 无锡格菲电子薄膜科技有限公司 | It is a kind of for quickly detecting the method and device of electrothermal membrane infrared performance |
| CN110879349A (en) * | 2019-12-03 | 2020-03-13 | 孝感华工高理电子有限公司 | Linear testing arrangement of executor circuit board carbon film |
| CN111308301A (en) * | 2019-12-05 | 2020-06-19 | 王东 | Semiconductor performance testing method based on Internet of things |
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Granted publication date: 20181116 |