CN208108973U - Fixed thick device is thinned in electronic component test sample - Google Patents
Fixed thick device is thinned in electronic component test sample Download PDFInfo
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- CN208108973U CN208108973U CN201820224582.5U CN201820224582U CN208108973U CN 208108973 U CN208108973 U CN 208108973U CN 201820224582 U CN201820224582 U CN 201820224582U CN 208108973 U CN208108973 U CN 208108973U
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- electronic component
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Abstract
The utility model discloses electronic component test samples, and fixed thick device is thinned, including fixed thick body frame is thinned, the thinned fixed thick body frame bottom inner portion is equipped with body frame fixed hole, and fixed thick body frame front end is thinned and is externally connected to electronic component positioning plate, support fixed ring column is installed inside the electronic component positioning plate, and support fixed ring column bottom end is connected with and fixed thick body frame is thinned, the thinned fixed thick body frame upper interior is equipped with activity orientation slot, and activity orientation slot is internally connected with sample and is thinned and determines slab, the sample, which is thinned, determines to be equipped with the fixed thick slot in sample top inside slab, and sample is thinned and determines slab bottom end and be connected with support fixed ring column, comparison scale is mounted at left and right sides of the activity orientation slot.The real-time thickness for prompt testing staff's electronic component that fixed thick device can be convenient is thinned in the electronic component test sample, and can prevent electronic component from shaking everywhere, avoids testing staff's grinding excessive.
Description
Technical field
The utility model relates to electronic component detection device technology field, specially electronic component test sample is thinned
Fixed thickness device.
Background technique
Electronic component is the component part of electronic component and electric small-sized machine, instrument, itself is often by several parts
Constitute, can be general in similar product, often refer to certain parts of the industry such as electric appliance, radio, instrument, as capacitor, transistor,
The general name of the sub- device such as balance spring, clockwork spring, common are diode etc., when detecting electronic component, need will test
Sample top is thinned to expose detection part.
It is mostly hand grinding that common electronic component test sample thining method, which exists, after needing real-time measurement to be thinned
Thickness, the case where more wasting time.
Utility model content
The purpose of this utility model is to provide electronic component test samples, and fixed thick device is thinned, to solve above-mentioned background
It is mostly hand grinding that the common electronic component test sample thining method proposed in technology, which exists, and real-time measurement is needed to subtract
Thickness after thin, the problem of more wasting time.
To achieve the above object, the utility model provides the following technical solutions：Fixed thickness is thinned in electronic component test sample
Device, including fixed thick body frame is thinned, the thinned fixed thick body frame bottom inner portion is equipped with body frame fixed hole, and it is main that fixed thickness is thinned
Frame front end is externally connected to electronic component positioning plate, is equipped with support fixed ring column inside the electronic component positioning plate,
And support fixed ring column bottom end is connected with and fixed thick body frame is thinned, the electronic component positioning plate is equipped with component inside upper end
Fixing groove, the support fixed ring column inner upper end, which is connected with, determines slab support column, and determines slab support top end and be equipped with sample
Product, which are thinned, determines slab, and the thinned fixed thick body frame upper interior is equipped with activity orientation slot, and activity orientation slot is internally connected with
Sample, which is thinned, determines slab, and the sample, which is thinned, determines to be equipped with the fixed thick slot in sample top inside slab, and sample is thinned and determines slab bottom
End is connected with support fixed ring column, is mounted on comparison scale at left and right sides of the activity orientation slot.
Preferably, described fixed thick body frame is thinned is L-shaped structure, and it is fixed with electronic component by welding that fixed thick body frame is thinned
Position plate is thinned fixed thick body frame axis and is overlapped with the vertical bisector of body frame fixed hole at fixed structure.
Preferably, the activity orientation slot and comparison scale bottom end are overlapped with component fixing groove bottom end, and determine slab
The height of support column and activity orientation slot is equal with support fixed ring column height, determines slab support column diameter and fixes equal to support
Annulated column internal diameter.
Preferably, the fixed thick slot of the electronic component positioning plate and sample top is with thinned fixed thick body frame bottom surface at parallel
Structure, and sample is thinned and determines slab and activity orientation slot composition slide construction.
Preferably, the fixed thick slot in the sample top is through-hole structure, and component fixing groove is blind hole structure, and sample top
Each size of fixed thickness slot and component fixing groove is equal, and the axis of the fixed thick slot in sample top and component fixing groove is overlapped.
Compared with prior art, the utility model has the beneficial effects that：Fixed thick dress is thinned in the electronic component test sample
The real-time thickness for the prompt testing staff's electronic component that can be convenient is set, and can prevent electronic component from shaking everywhere, is kept away
Test free personnel's grinding is excessive.The thinned fixed thick body frame that fixed thick device is thinned in this electronic component test sample is L-shaped structure, and
Fixed thick body frame is thinned by welding with electronic component positioning plate into fixed structure, it is fixed logical with body frame that fixed thick body frame axis is thinned
The vertical bisector in hole is overlapped, and enables thinned fixed thick body frame to be smoothly fixed on working face, and electronic component positions
Plate can hold together with thinned fixed thick body frame and be fixed, and the work of fixed thickness device is thinned in this electronic component test sample
Dynamic locating slot and comparison scale bottom end are overlapped with component fixing groove bottom end, and determine the height of slab support column and activity orientation slot
Degree is equal with support fixed ring column height, determine slab support column diameter and is equal to support fixed ring column internal diameter, enable tester
The actual height for enough observing directly electronic component test sample without being additionally carried out calculating elapsed time, and determines slab branch
Dagger can be thinned with sample to be determined the reduction of slab and is fully inserted among support fixed ring column.
Detailed description of the invention
Fig. 1 is the utility model left view structural representation；
Fig. 2 is the utility model schematic view of the front view；
Fig. 3 is the utility model overlooking structure diagram.
In figure：1, it is thinned and determines thick body frame, 2, activity orientation slot, 3, electronic component positioning plate, 4, the fixed thick slot in sample top,
5, sample, which is thinned, determine slab, and 6, determine slab support column, 7, component fixing groove, 8, support fixed ring column, 9, body frame fixed hole,
10, scale is compared.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution：Fixed thick dress is thinned in electronic component test sample
It sets, including fixed thick body frame 1 is thinned, fixed thick 1 bottom inner portion of body frame is thinned, body frame fixed hole 9 is installed, and fixed thick body frame 1 is thinned
Front end is externally connected to electronic component positioning plate 3, and it is L-shaped structure that fixed thick body frame 1, which is thinned, and fixed thick body frame 1 is thinned and passes through weldering
It connects with electronic component positioning plate 3 into fixed structure, fixed thick 1 axis of body frame and the vertical bisector weight of body frame fixed hole 9 is thinned
It closes, this structure enables thinned fixed thick body frame 1 to be smoothly fixed on working face, and electronic component positioning plate 3 can
Be fixed with fixed thick body frame 1 being thinned holding together, the fixed thick slot 4 of electronic component positioning plate 3 and sample top with subtract
Thin fixed thick 1 bottom surface of body frame is at parallel construction, and sample is thinned and determines slab 5 and the composition slide construction of activity orientation slot 2, this structure makes
Obtaining the electronic component test sample placed inside the fixed thick slot 4 of electronic component positioning plate 3 and sample top can determine with being thinned
Thick 1 bottom surface of body frame is parallel, will not generate and cause error when inclination enables tester be ground, install inside electronic component positioning plate 3
There is support fixed ring column 8, and supports 8 bottom end of fixed ring column to be connected with and fixed thick body frame 1,3 upper end of electronic component positioning plate is thinned
Inside is equipped with component fixing groove 7, and support 8 inner upper end of fixed ring column, which is connected with, determines slab support column 6, and determines slab support
6 top of column, which is equipped with sample and is thinned, determines slab 5, and fixed thick 1 upper interior of body frame is thinned and is equipped with activity orientation slot 2, and activity is fixed
Position slot 2, which is internally connected with sample and is thinned, determine slab 5, activity orientation slot 2 and compare 10 bottom end of scale with 7 bottom of component fixing groove
End is overlapped, and the height for determining slab support column 6 and activity orientation slot 2 is equal with 8 height of support fixed ring column, determines slab support
6 diameter of column is equal to support 8 internal diameter of fixed ring column, this structure enables tester to observe directly electronic component test sample
Actual height, without being additionally carried out calculating elapsed time, and determine slab support column 6 can with sample be thinned determine slab 5
It reduces and is fully inserted among support fixed ring column 8, sample, which is thinned, determines to be equipped with the fixed thick slot 4 in sample top inside slab 5, and sample
Product, which are thinned, determine 5 bottom end of slab and is connected with support fixed ring column 8, and the fixed thick slot 4 in sample top is through-hole structure, component fixing groove 7
For blind hole structure, and each size of the fixed thick slot 4 in sample top and component fixing groove 7 is equal, the fixed thick slot 4 in sample top and member
The axis of device fixing groove 7 is overlapped, this structure enables electronic component test sample bottom end to be stuck in component fixing groove 7
Portion, and electronic component test sample upper end can be stuck in inside the fixed thick slot 4 in sample top and be fixed, tester is merely able to
It is ground to sample and is thinned and determine 5 top of slab, prevent from being excessively ground, comparison scale 10 is mounted at left and right sides of activity orientation slot 2.
Working principle：When fixed thick device is thinned using the electronic component test sample, first check that whether there is or not mills for the present apparatus
Damage, cracking place, begin to use if all are intact, and it is fixed will be thinned that first fixing screws are inserted among body frame fixed hole 9
Thick body frame 1 is fixed on horizontal working face, and electronic component test sample to be ground is then placed on electronic component
In component fixing groove 7 in positioning plate 3, then the scale of observation comparison scale 10 is to find out electronic component to be ground
Test sample needs thickness after grinding, is thinned by 2 mobile example of activity orientation slot and determine slab 5 to enable sample be thinned fixed thick
5 top of plate needs thickness after grinding to flush with electronic component test sample to be ground, at this time the fixed thickness in sample top
Slot 4 can be stuck in outside electronic component test sample upper end to be ground, and slab can be determined as sample is thinned by determining slab support column 6
5 decline and be inserted into inside support fixed ring column 8 that sample is thinned and determine slab 5 and play a supporting role, then tester grinds away
The electronic component test sample to be ground for determining 5 top of slab is thinned in sample, to complete a series of activities.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art
Say, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (5)
1. fixed thick device is thinned in electronic component test sample, including fixed thick body frame (1) is thinned, it is characterised in that：It is described to be thinned
Fixed thickness body frame (1) bottom inner portion is equipped with body frame fixed hole (9), and fixed thick body frame (1) front end is thinned and is externally connected to electronics
Component positioning plate (3), the electronic component positioning plate (3) is internal to be equipped with support fixed ring column (8), and supports fixed ring
Column (8) bottom end, which is connected with, is thinned fixed thick body frame (1), and it is solid to be equipped with component inside electronic component positioning plate (3) upper end
Determine slot (7), support fixed ring column (8) inner upper end, which is connected with, determines slab support column (6), and determines slab support column (6) top
End, which is equipped with sample and is thinned, determines slab (5), and described thinned fixed thick body frame (1) upper interior is equipped with activity orientation slot (2), and living
Dynamic locating slot (2), which are internally connected with sample and are thinned, determines slab (5), and the sample, which is thinned, to be determined to be equipped with sample top inside slab (5)
The fixed thick slot (4) in end, and sample is thinned and determine slab (5) bottom end and is connected with support fixed ring column (8), activity orientation slot (2) left side
Right two sides are mounted on comparison scale (10).
2. fixed thick device is thinned in electronic component test sample according to claim 1, it is characterised in that：Described be thinned is determined
Thick body frame (1) is L-shaped structure, and fixed thick body frame (1) is thinned by welding and electronic component positioning plate (3) into fixed structure,
Fixed thick body frame (1) axis is thinned to be overlapped with the vertical bisector of body frame fixed hole (9).
3. fixed thick device is thinned in electronic component test sample according to claim 1, it is characterised in that：The activity is fixed
Position slot (2) and comparison scale (10) bottom end are overlapped with component fixing groove (7) bottom end, and determine slab support column (6) and activity
The height of locating slot (2) is equal with support fixed ring column (8) height, determines slab support column (6) diameter and is equal to support fixed ring
Column (8) internal diameter.
4. fixed thick device is thinned in electronic component test sample according to claim 1, it is characterised in that：The electronics member
The fixed thick slot (4) of device positioning plate (3) and sample top is with thinned fixed thick body frame (1) bottom surface at parallel construction, and sample is thinned
Determine slab (5) and activity orientation slot (2) and constitutes slide construction.
5. fixed thick device is thinned in electronic component test sample according to claim 1, it is characterised in that：The sample top
The fixed thick slot (4) in end is through-hole structure, and component fixing groove (7) is blind hole structure, and the fixed thick slot (4) in sample top and component are solid
Each size for determining slot (7) is equal, and the axis of the fixed thick slot (4) in sample top and component fixing groove (7) is overlapped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820224582.5U CN208108973U (en) | 2018-02-08 | 2018-02-08 | Fixed thick device is thinned in electronic component test sample |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820224582.5U CN208108973U (en) | 2018-02-08 | 2018-02-08 | Fixed thick device is thinned in electronic component test sample |
Publications (1)
| Publication Number | Publication Date |
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| CN208108973U true CN208108973U (en) | 2018-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820224582.5U Active CN208108973U (en) | 2018-02-08 | 2018-02-08 | Fixed thick device is thinned in electronic component test sample |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112207678A (en) * | 2020-09-25 | 2021-01-12 | 孙永 | Electronic information components and parts detects sample attenuate device of deciding thickness |
-
2018
- 2018-02-08 CN CN201820224582.5U patent/CN208108973U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112207678A (en) * | 2020-09-25 | 2021-01-12 | 孙永 | Electronic information components and parts detects sample attenuate device of deciding thickness |
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