CN208093765U - A kind of 3D Section of Microstrip Antenna Array printing harden structure - Google Patents
A kind of 3D Section of Microstrip Antenna Array printing harden structure Download PDFInfo
- Publication number
- CN208093765U CN208093765U CN201820454372.5U CN201820454372U CN208093765U CN 208093765 U CN208093765 U CN 208093765U CN 201820454372 U CN201820454372 U CN 201820454372U CN 208093765 U CN208093765 U CN 208093765U
- Authority
- CN
- China
- Prior art keywords
- pcb
- section
- antenna array
- microstrip antenna
- top layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of 3D Section of Microstrip Antenna Array to print harden structure, including microwave base material, chip and feeder;Include the PCB top layers positioned at top and the sides PCB positioned at both sides on microwave base material, chip is fixed on PCB top layers upper surface, two parts feeder being located on PCB top layers and the sides PCB is connected on chip, a part, which is located on the feeder of PCB top layers upper surface, is equipped with positive Section of Microstrip Antenna Array, and lateral Section of Microstrip Antenna Array is equipped on the feeder that a part is located on the sides PCB.The utility model is both provided with micro-strip array antenna on the two sides PCB in 90 ° of angles, to realize that antenna is distributed on solid space.Therefore better signal transmitting and receiving function can be obtained using the 3D Section of Microstrip Antenna Array in the utility model, user experience is more preferable, also is adapted for large-scale promotion application.
Description
Technical field
The utility model is related to printed circuit board field, specifically a kind of 3D Section of Microstrip Antenna Array prints harden structure.
Background technology
Existing Section of Microstrip Antenna Array printed board is all that Section of Microstrip Antenna Array is placed in same layer, i.e. top layer
(Top Layer), to realize preceding visual angle and/or angle viewing function;But to realize more additional functions, such as obtain side view
Angle function then needs the top layer in printed board to arrange some sideward-looking antennas again;This just occupies forward sight, angle regards the PCB cloth of antenna
Space of lines, and may cause forward sight, angle visual function other key parameters performance decline.
Invention content
The purpose of this utility model is to provide a kind of 3D Section of Microstrip Antenna Array to print harden structure, to solve the above-mentioned back of the body
The problem of being proposed in scape technology.
To achieve the above object, the utility model provides the following technical solutions:
A kind of 3D Section of Microstrip Antenna Array printing harden structure, including microwave base material, chip and feeder;Microwave base material
On include the PCB top layers positioned at top and the sides PCB positioned at both sides, chip is fixed on PCB top layers upper surface, connects on chip
It is connected to two parts feeder being located on PCB top layers and the sides PCB, a part is located at the antenna of PCB top layers upper surface
Positive Section of Microstrip Antenna Array is installed on feeder line, is equipped on the feeder that a part is located on the sides PCB lateral micro-
Band patch array antenna.
Further:Intensive PTH side walls are worn on the corresponding side PCB top layers of lateral Section of Microstrip Antenna Array.
Further:It is 0.10-0.40mm that the PTH of intensive PTH side walls, which bores nozzle aperture,.
Further:Intensive PTH side walls spacing is 0.10-0.40mm.
Further:The downside of the forward direction Section of Microstrip Antenna Array is laid with paving copper stratum, paving copper stratum and intensive PTH
Side wall connects and spreads the vertically intensive PTH side walls setting of copper stratum.
Compared with prior art, the utility model has the beneficial effects that:The utility model is equal on the two sides PCB in 90 ° of angles
It is provided with micro-strip array antenna, to realize that antenna is distributed on solid space.Therefore using the 3D in the utility model
Section of Microstrip Antenna Array can obtain better signal transmitting and receiving function, and user experience is more preferable, also is adapted for large-scale promotion application.
Sideward-looking antenna wiring is not take up PCB top layers forward sight and/or angle regards any space of antenna wiring, in addition to realizing good preceding visual angle
And/or outside the viewing function of angle, good side view angle can also be obtained, and obtains good antenna directivity, separability and low
Side lobe levels.
Description of the drawings
Fig. 1 is the structural schematic diagram that a kind of 3D Section of Microstrip Antenna Array prints harden structure;
Fig. 2 is the perspective diagram that a kind of 3D Section of Microstrip Antenna Array prints harden structure;
In figure:1. microwave base material;2. chip;3.PCB top layers;The sides 4.PCB;5. spreading copper stratum;6. intensive PTH side walls;
7. positive Section of Microstrip Antenna Array;8. lateral Section of Microstrip Antenna Array;9. feeder.
Specific implementation mode
Please refer to figure, in the utility model embodiment, a kind of 3D Section of Microstrip Antenna Array prints harden structure, including microwave
Base material 1, chip 2 and feeder 9,10;It is Teflon material that the microwave base material 1, which uses microwave material, microwave material,
(PTFE), hydrocarbon material (hydrocarbon) or liquid crystal polymer (LCP) include to be located at top on microwave base material 1
The PCB top layers 3 in portion and sides PCB 4 positioned at both sides, chip 2 are fixed on 3 upper surface of PCB top layers, difference are connected on chip 2
Feeder 9,10 on PCB top layers 3 and the sides PCB 4, is equipped on the feeder 10 of 3 upper surface of PCB top layers
Positive Section of Microstrip Antenna Array 7 is equipped with lateral Section of Microstrip Antenna Array 8 on the feeder 9 on the sides PCB 4,
Two sides is both provided with micro-strip array antenna, to realize that antenna is distributed on solid space.
Intensive PTH side walls 6, the intensive sides PTH are worn on 8 corresponding side PCB top layers 3 of lateral Section of Microstrip Antenna Array
It is 0.10-0.40mm that the PTH of wall 6, which bores nozzle aperture, and intensive 6 spacing of PTH side walls is 0.10-0.40mm.
The downside of the forward direction Section of Microstrip Antenna Array 7 is laid with paving copper stratum 5, paving copper stratum 5 and intensive PTH side walls 6
It connects and spreads the vertical intensive PTH side walls 6 in copper stratum 5 and be arranged.
Positive Section of Microstrip Antenna Array and other line patterns of printed board pass through normal PCB technology flow system
It makes, lateral Section of Microstrip Antenna Array directly burns process for copper technology by laser and is achieved.
3D Section of Microstrip Antenna Array prints harden structure, and sideward-looking antenna wiring is not take up PCB top layers forward sight and/or angle regards day
Any space of line wiring can also obtain good side view other than realizing good preceding visual angle and/or angle viewing function
Angle, and it is horizontal to obtain good antenna directivity, separability and low sidelobe.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.
Claims (5)
1. a kind of 3D Section of Microstrip Antenna Array prints harden structure, including microwave base material(1), chip(2)And feeder(9,
10);Microwave base material(1)On include PCB top layers positioned at top(3)With the sides PCB positioned at both sides(4), chip(2)It is fixed
In PCB top layers(3)Upper surface, it is characterised in that:Chip(2)On be connected with and be located at PCB top layers(3)With the sides PCB(4)On
Feeder(9,10), it is located at PCB top layers(3)The feeder of upper surface(10)On positive array of microstrip patches day is installed
Line(7), it is located at the sides PCB(4)On feeder(9)On lateral Section of Microstrip Antenna Array is installed(8).
2. a kind of 3D Section of Microstrip Antenna Array according to claim 1 prints harden structure, it is characterised in that:Lateral micro-
Band patch array antenna(8)Corresponding side PCB top layers(3)On wear intensive PTH side walls(6).
3. a kind of 3D Section of Microstrip Antenna Array according to claim 1 prints harden structure, it is characterised in that:Intensive PTH
Side wall(6)PTH to bore nozzle aperture be 0.10-0.40mm.
4. a kind of 3D Section of Microstrip Antenna Array according to claim 1 prints harden structure, it is characterised in that:Intensive PTH
Side wall(6)Spacing is 0.10-0.40mm.
5. printing harden structure according to a kind of any 3D Section of Microstrip Antenna Array of claim 2-4, it is characterised in that:Institute
State positive Section of Microstrip Antenna Array(7)Downside be laid with paving copper stratum(5), paving copper stratum(5)With intensive PTH side walls(6)Even
It connects and spreads copper stratum(5)Vertical intensive PTH side walls(6)Setting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820454372.5U CN208093765U (en) | 2018-04-02 | 2018-04-02 | A kind of 3D Section of Microstrip Antenna Array printing harden structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820454372.5U CN208093765U (en) | 2018-04-02 | 2018-04-02 | A kind of 3D Section of Microstrip Antenna Array printing harden structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208093765U true CN208093765U (en) | 2018-11-13 |
Family
ID=64057530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820454372.5U Expired - Fee Related CN208093765U (en) | 2018-04-02 | 2018-04-02 | A kind of 3D Section of Microstrip Antenna Array printing harden structure |
Country Status (1)
Country | Link |
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CN (1) | CN208093765U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3748374A1 (en) * | 2019-06-06 | 2020-12-09 | Rohde & Schwarz GmbH & Co. KG | System and method for calibrating radio frequency test chambers |
-
2018
- 2018-04-02 CN CN201820454372.5U patent/CN208093765U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3748374A1 (en) * | 2019-06-06 | 2020-12-09 | Rohde & Schwarz GmbH & Co. KG | System and method for calibrating radio frequency test chambers |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181113 Termination date: 20210402 |
|
CF01 | Termination of patent right due to non-payment of annual fee |