CN208077142U

CN208077142U - Touch panel

Info

Publication number: CN208077142U
Application number: CN201820294129.1U
Authority: CN
Inventors: 李昭松; 纪贺勋; 方芳; 黄振潘; 余建贤; 陈志民; 吴珊瑀
Original assignee: TPK Touch Solutions Inc
Current assignee: TPK Touch Solutions Inc
Priority date: 2018-03-02
Filing date: 2018-03-02
Publication date: 2018-11-09
Anticipated expiration: 2028-03-02

Abstract

A kind of touch panel a, including substrate, the negative photosensitive layer being stacked on the substrate, a film layer are set to the perimeter circuit on the peripheral region with a metal nanometer line layer and one；The substrate has a viewing area and a peripheral region；The perimeter circuit has a joint sheet, a removal area and a reserved area are defined after the negative photosensitive floor is exposed, it is removed positioned at the negative photosensitive floor in the removal area, the film layer and the metal nanometer line floor and defines a touch-control sensing electrode and expose the joint sheet, which is electrically connected at the perimeter circuit.

Description

Touch panel

Technical field

The utility model is about a kind of touch panel.

Background technology

Since transparent conductor can have light peneration and electric conductivity appropriate simultaneously, thus it is commonly applied to many displays or touches It controls in relevant device.In general, transparent conductor can be various metal oxides, such as tin indium oxide (Indium Tin Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO), cadmium tin (Cadmium Tin Oxide, CTO) or Al-Doped ZnO (Aluminum-doped Zinc Oxide, AZO).Metal-oxide film can pass through physical vapor deposition method Or chemical meteorology deposition method and formed, and appropriate pattern is formed by laser technique.However, these metal-oxide films Production method may face the problem of high cost, complicated technique and low yield.It is patterned in part The problem of metal-oxide film may also be easily observed.Therefore, a variety of transparent conductors, such as profit have been developed now With the transparent conductor made by the materials such as nano wire.

However utilize nano wire to make touch control electrode, the metal lead wire of nano wire and peripheral region in technique and in structure all There are many problems to be solved, such as traditional handicraft, and nano wire is coated on viewing area and peripheral region, and covers the gold of peripheral region Belong to lead, nano wire is patterned using etching solution later, to produce touch-control sensing electrode in viewing area, and is etched Nano wire on metal lead wire to expose welded gasket, to be attached with the external circuit board.Etching used by above-mentioned technique Liquid is mostly highly acid, therefore metal lead wire can be caused to be acted on by etching solution, and production reliability is made to decline；In addition, etching solution Residue problem be also required to additional cleaning process and can overcome.

In another aspect, being made using nano wire in the technique of touch-control sensing electrode, it will usually which needs shape online in nanometer External coating (overcoat), to protect nano wire and nano wire be bonded on substrate, and etching solution used by above-mentioned technique It is only capable of removing nano wire, therefore after being etched technique, external coating can left behind, and the thickness of remaining external coating can be hindered in contact It is anti-that belt-type tools (trade off) are formed between electrode protection.Specifically, if the protectiveness of consideration electrode, remaining The thickness of external coating can thicken as far as possible, but after overetch, and the thickness for remaining external coating on welded gasket is blocked up (such as big In 20nm), the contact impedance between welded gasket and the external circuit board will be caused excessive, and then circuit is caused to be produced when transmitting signal Raw consume or distortion, that is to say, that blocked up residual external coating is folded between welded gasket and the external circuit board, can cause product The electrical performance the problem of.If conversely, considering contact impedance, the thickness of remaining external coating can be thinned as far as possible, but pass through After overetch, the thickness for forming online the remained external coating of nanometer of touch-control sensing electrode is too thin, and will be unable to offer nano wire has The protection of effect, that is to say, that excessively thin residual external coating can cause the problem of the durability deficiency of product.

Therefore using nano wire make touch-control sensing electrode technique on, must be according to material property weight on electrode structure New design, makes product reach preferable performance.

Utility model content

The some embodiments of the utility model, can be improved the durability of the touch-control sensing electrode of viewing area, and by connecing It closes and is in direct contact structure between pad and the electronic pads of the external circuit board, be formed simultaneously a low-impedance conducting wire.In addition, this In some embodiments of utility model, it is proposed that the direct patterning method of touch control electrode, thus generate different from the past It is touch panel structure provided.

The some embodiments of the utility model propose a kind of direct patterning method of touch panel, including：There is provided one Substrate, the substrate have a viewing area and a peripheral region, wherein a perimeter circuit is arranged in the peripheral region, which has One joint sheet；The metal nanometer line layer being made of metal nanometer line is set in the viewing area and the peripheral region；Half is set Cured film layer is on the metal nanometer line layer；One negative photosensitive layer is set in the film layer of the semi-solid preparation；It is micro- to carry out a yellow light Shadow step, including：The negative photosensitive floor is exposed to define a removal area and a reserved area；And use developer solution will It is removed positioned at the negative photosensitive floor in the removal area, the film layer and the metal nanometer line floor, the viewing area is set to produce On a touch-control sensing electrode and expose the joint sheet for being set to the peripheral region, which is electrically connected at this Perimeter circuit, wherein the touch-control sensing electrode are made of the film layer and the metal nanometer line layer；Wherein in the reserved area, The negative photosensitive layer is covered on the film layer and the metal nanometer line layer；And the film layer is subjected to a curing schedule.

In some embodiments of the utility model, a post-processing step is further included, is located at the removal to remove completely The metal nanometer line floor in area.

In some embodiments of the utility model, which includes being taken using organic solution or alkaline solution The metal nanometer line floor positioned at the removal area is removed completely with mechanical system.

In some embodiments of the utility model, which includes removing to be located at the removal using viscose process The metal nanometer line floor in area.

In some embodiments of the utility model, which removes position including the use of microwave or the irradiation of UV light The metal nanometer line floor in the removal area.

In some embodiments of the utility model, the photonasty of negative photosensitive layer is higher than the film layer.

In some embodiments of the utility model, the negative photosensitive layer is to the film layer of the semi-solid preparation and the metal nano Line layer consitutional adhesive strength be more than the semi-solid preparation film layer and the structure that is formed of the metal nanometer line layer to this The adhesive strength of substrate.

The some embodiments of the utility model propose a kind of touch panel, including：Substrate, the wherein substrate have one to show Show area and a peripheral region；It is stacked a negative photosensitive layer, a film layer and a metal nanometer line layer on the substrate；And one The perimeter circuit being set on the peripheral region, the wherein perimeter circuit have a joint sheet, fixed after the negative photosensitive layer is exposed Justice goes out a removal area and a reserved area, is moved positioned at the negative photosensitive floor in the removal area, the film layer and the metal nanometer line floor It removes and defines a touch-control sensing electrode and expose the joint sheet, which is electrically connected at the perimeter circuit.

In some embodiments of the utility model, which includes metal nanometer line, the metal nano Line, which is embedded in the film layer of the reserved area, forms conductive network, and the film layer positioned at the viewing area and the metal nano The touch-control sensing electrode is collectively formed in line, the remaining negative photosensitive layer of institute is covered on the touch-control sensing electrode.

In some embodiments of the utility model, the photonasty of the negative photosensitive layer is higher than the film layer.

In some embodiments of the utility model, the thickness of film layer is about 200nm-400nm.

Some embodiments according to the present utility model, metal nanometer line layer can be in the viewing areas and this with the perimeter circuit The intersection of peripheral region forms bridging arrangement.

In some embodiments of the utility model, touch-control sensing electrode extends to the peripheral region and is covered in the periphery On circuit, but it is not covered on the joint sheet.

In some embodiments of the utility model, metal nanometer line layer includes metal nanometer line, and removal area remains Metal nanometer line, concentration is less than an infiltration threshold value.

There is the straight shape electricity of multiple length extended in the same direction in some embodiments of the utility model, in viewing area Pole.

In some embodiments of the utility model, this for all having the corresponding viewing area in the opposing sides of substrate touches Control induction electrode.

In some embodiments of the utility model, the negative photosensitive layer and the thickness summation of the film layer are about 5 μm -10 μm。

Description of the drawings

Fig. 1 is the flow chart according to the production method of the touch panel of some embodiments of the utility model.

Fig. 2 is the upper schematic diagram according to the substrate of some embodiments of the utility model.

Fig. 2A is the diagrammatic cross-section of the line 2A-2A along Fig. 2.

Fig. 3 is the upper schematic diagram of the step S1 in the production method of Fig. 1.

Fig. 3 A are the diagrammatic cross-section of the line 3A-3A along Fig. 3.

Fig. 4 is the upper schematic diagram of the step S2 in the production method of Fig. 1.

Fig. 4 A are the diagrammatic cross-section of the line 4A-4A along Fig. 4.

Fig. 5 is the touch panel of some embodiments of the utility model.

Fig. 5 A are the diagrammatic cross-section of the line 5A-5A along Fig. 5 in step S3.

Fig. 5 B are the diagrammatic cross-section of the line 5B-5B along Fig. 5 in step S3.

Fig. 6 A are the diagrammatic cross-section of the line 5A-5A along Fig. 5 in step S4.

Fig. 6 B are the diagrammatic cross-section of the line 5B-5B along Fig. 5 in step S4.

Fig. 7 is the schematic diagram of the change aspect of the utility model.

Fig. 8 is the upper schematic diagram according to the touch panel of some embodiments of the utility model.

Fig. 9 shows the schematic diagram of the touch panel and the assembling of other electronic devices of some embodiments of the utility model.

Wherein, reference numeral is：

100：Display element TE, TE1, TE2：Touch-control sensing electrode

110：Substrate CE：Connection electrode

120：Perimeter circuit D1：First direction

130：Film layer D2：Second direction

136：Non-conducting areas 150：Negative photosensitive layer

140：Metal nanometer line 140A：Metal nanometer line layer

162：Bridging conductor AD：Optical cement

164：Collets CG：Outer cover glass

170：Joint sheet 180：The external circuit board

S1~S4：Step 130A：Reserved area

VA：Viewing area 130B：Remove area

PA：Peripheral region CS：Composite construction

Specific implementation mode

Multiple embodiments that the utility model will be disclosed with schema below, as clearly stated, in many practices Details will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit this practicality newly Type.That is, in the utility model some embodiments, the details in these practices is non-essential.In addition, to simplify For the sake of schema, some known usual structures and element in the drawings by a manner of simply illustrating for it.

About " about " used herein, " about " or " substantially ", generally refer to numerical value error or range in percentage 20 within, be preferably within 10, be more preferably within 5 percent.Wen Zhongruo is without clearly stating, institute The numerical value referred to is all considered as approximation, that is, has error or range as represented by " about ", " about " or " substantially ".In addition, this Signified equal of " external coating (overcoat), also known as OC layers ", " polymer ", " film layer of semi-solid preparation " used in text, " film layer " For same or analogous element, difference essentially consists in the difference of solid state, and for convenience of explanation, it may hereinafter hand over It mutually uses, illustrates hereby.

Fig. 1 is to pattern (or direct figure according to the direct of the touch panels of some embodiments of the utility model Change) flow chart of method.The concrete technology of the direct patterning method of present embodiment is：First, it with reference to figure 2 and Fig. 2A, carries For a substrate 110, in some embodiments of the utility model, substrate 110 is ideally that transparent substrate specifically can Think that a rigid transparent substrate or a flexible transparent substrate, material can be selected from glass, acryl (polymethylmethacrylate；PMMA), polyvinyl chloride (polyvinyl Chloride；PVC), polypropylene (polypropylene；PP), polyethylene terephthalate (polyethylene terephthalate；PET), poly- naphthalene Naphthalate (polyethylene naphthalate；PEN), makrolon (polycarbonate；PC), polyphenyl Ethylene (polystyrene；The transparent materials such as PS).

Then, a metal nanometer line layer 140A and perimeter line are made on substrate 110 such as step S1 with reference to figure 3 and Fig. 3 A Road 120, metal nanometer line layer 140A can be at least made of metal nanometer line 140；It is in the specific practice of the present embodiment：First profit Institute's thing on substrate 110 is taken shape in metal with good conductivity (such as the silver of single layer, copper or multilayer material, such as molybdenum/aluminium/molybdenum) The peripheral region PA first defined, to make one or more perimeter circuits 120, one end of perimeter circuit 120 has joint sheet (bonding pad) 170, above-mentioned technique can be preferably collocated with each other with Patternized technique；It again will be with metal nanometer line 140 Dispersion liquid or slurry (ink) are taken shape in coating method on substrate 110, and being dried makes metal nanometer line 140 cover in base The surface of plate 110；In other words, metal nanometer line 140 can be shaped to one because of above-mentioned dry solidification step and be set to substrate 110 On metal nanometer line layer 140A.And can define on substrate 110 has viewing area VA and peripheral region PA, peripheral region PA to be set to display The side of area VA, such as shown in Fig. 3, peripheral region PA is set to the left side of viewing area VA and the region on right side, but in other implementations In example, peripheral region PA can be then the frame-type area for the surrounding (covering right side, left side, upside and downside) for being set to viewing area VA Domain, or for be set to viewing area VA adjacent both sides L-type region；And the metal nanometer line layer 140A may include being molded First part in viewing area VA and the second part for taking shape in peripheral region PA, in more detail, in the VA of viewing area, metal is received The first part of rice noodles layer 140A can direct forming on the surface of substrate 110, and in the PA of peripheral region, metal nanometer line layer The second part of 140A can shape on the surface of substrate 110 and being covered in the (including joint sheet (bonding of perimeter circuit 120 Pad) 170) on.

In the embodiments of the present invention, above-mentioned dispersion liquid can be water, alcohol, ketone, ether, hydrocarbon or arsol (benzene, first Benzene, dimethylbenzene etc.)；Above-mentioned dispersion liquid also may include additive, surfactants or adhesive, such as carboxymethyl cellulose (carboxymethyl cellulose；CMC), 2- hydroxyethyl celluloses (hydroxyethyl Cellulose；HEC), hydroxyl Propyl methocel (hydroxypropyl methylcellulose；HPMC), sulphonic acid ester, sulfuric ester, disulfonate, sulphur Base succinate, phosphate or fluorine-containing interfacial agent etc..And described metal nanometer line (metal nano-wires) layer, It may be, for example, nano-silver thread (silver nano-wires) layer, gold nanowire (gold nano-wires) layer or NANO CRYSTAL COPPER WIRE (copper nano-wires) layer is constituted；In more detail, " metal nanometer line (metal nano- used herein Wires) " system is a collective noun, is referred to comprising multiple metal elements, (including the metal oxidation of metal alloy or metallic compound Object) metal wire set, the quantity of metal nanometer line contained therein has no effect on the protection model that the utility model is advocated It encloses；And at least one sectional dimension (i.e. the diameter in section) of single metal nanometer line is less than 500nm, preferably less than 100nm, and More preferably less than 50nm；And the utility model is so-called is " line (wire) " metal Nano structure, mainly there is high aspect ratio, Such as between 10 to 100,000, in more detail, the aspect ratio (length of metal nanometer line：The diameter in section) it can be more than 10, preferably it is more than 50, and be more preferably more than 100；Metal nanometer line can be any metal, including but not limited to silver, gold, copper, Nickel and gold-plated silver.And other terms, silk (silk), fiber (fiber), pipe (tube) if etc. equally have above-mentioned ruler Very little and high aspect ratio, the scope also covered by the utility model.

And the dispersion liquid containing metal nanometer line 140 or slurry can take shape in substrate 110 in any way Surface, such as, but not limited to：The techniques such as screen painting, nozzle coating, idler wheel coating；In one embodiment, volume pair can be used Dispersion liquid containing metal nanometer line 140 or slurry are coated on substrate 110 without interruption by volume (roll to roll) technique Surface.

In some embodiments of the utility model, metal nanometer line 140 can be nano-silver thread (Silver nano- Wires) or nano silver fibre (Silver nano-fibers), there can be average about 20 to 100 nanometers of diameter, it is average About 20 to 100 microns of length, preferably average about 20 to 70 nanometers of diameter, average about 20 to 70 microns of length are (i.e. vertical 1000) horizontal ratio is.In some embodiments, the diameter of metal nanometer line 140 can be between 70 nanometers to 80 nanometers, and length is about 8 microns.

Then, with reference to figure 4 and Fig. 4 A, such as step S2, the cured film layer of setting half 130 is in metal nanometer line layer 140A On, specific practice can be but be not limited to：Suitable polymer or its mixture are taken shape in coating method on substrate 110, and Preceding curing schedule (or precuring) is imposed to form the film layer 130 of semi-solid preparation on metal nanometer line layer 140A, in more detail It says, film layer 130 is included in the first part in the VA of viewing area and second part in the PA of peripheral region, first of film layer 130 Dividing can correspond to and form in the first part of metal nanometer line layer 140A, and the second part of film layer 130 can be corresponded to and be shaped In on the second part of metal nanometer line layer 140A.It in another embodiment, can be by suitable polymer or its mixture to apply Cloth method takes shape on substrate 110, and the polymer can penetrate between metal nanometer line 140 and form filler, and impose Preceding curing schedule (or precuring) is to form the film layer 130 of semi-solid preparation, and in other words, metal nanometer line 140 can be considered embedded half Among cured film layer 130.In one embodiment, preceding curing schedule can be：(temperature is about in the way of heated baking 60 DEG C to about 150 DEG C) above-mentioned polymer or its mixture formed into the film layer 130 of semi-solid preparation on metal nanometer line layer 140A. The utility model does not limit the entity structure between the film layer 130 of semi-solid preparation and metal nanometer line layer 140A, such as semi-solid preparation Film layer 130 and metal nanometer line layer 140A can be the storehouse of double-layer structure or the film layer 130 and metal nanometer line of semi-solid preparation Layer 140A can be combined with each other and form a composite layer.Preferably, metal nanometer line 140 is to be embedded among the film layer 130 of semi-solid preparation And the electrode layer (i.e. composite construction CS described hereinafter) of compound kenel is formed in subsequent technique.

The example of above-mentioned polymer may include, but be not limited to：Polyacrylic based resin, such as polymethacrylates (example Such as, poly- (methyl methacrylate)), polyacrylate and polyacrylonitrile；Polyvinyl alcohol；Polyester is (for example, poly terephthalic acid second Diester (PET), polyester naphthalate and makrolon)；Polymer with high aromaticity, such as phenolic resin or cresols- Formaldehyde, polystyrene, polyvinyl-toluene, polyvinyl dimethylbenzene, polyimides, polyamide, polyamidoimide, polyethers acyl Imines, polysulfones, gathers and stretches phenyl and polyphenyl ether polysulfide；Polyurethane (polyurethane；PU)；Epoxy resin； Polyolefin (such as polypropylene, polymethylpentene and cycloolefin)；Cellulose；Poly- silica and other silicon-containing polymers (such as poly- times Half oxosilane and polysilane)；Polyvinyl chloride (PVC)；Poly- acetic acid esters；Polynorbornene；Synthetic rubber is (for example, EP rubbers (ethylene-propylene rubber；EPR), butadiene-styrene rubber (styrene-Butadiene Rubber；SBR), ternary second Third rubber (ethylene-Propylene-Diene Monomer；EPDM)；And fluoropolymer is (for example, Kynoar, poly- Tetrafluoroethene (TFE) or polyhexafluoropropylene)；The non-conductive polymers such as fluoro-olefin and the copolymer of hydrocarbon alkene, above-mentioned polymer Photosensitive material can be separately added, to meet the needs of with exposure imaging artwork pattern film 130.In other embodiments, also It can be used with silica, mullite, aluminium oxide, SiC, carbon fiber, MgO-Al₂O₃-SiO₂、Al₂O₃-SiO₂Or MgO- Al₂O₃-SiO₂-Li₂The inorganic material such as O are mixed in photosensitive material to as film layer 130.

It is answered with what metal nanometer line 140 was formed in addition, above-mentioned polymer can assign film layer 130 after fully cured The certain specific chemistry of structure C S, machinery and optical characteristics are closed, such as the adherence of composite construction CS and substrate 110 are provided, or It is preferable entity mechanical strength, therefore film layer 130 can be referred to matrix (matrix) again.Another aspect, using certain specific Polymer makes film layer 130, and composite construction CS is made to have the surface protection of additional anti-scratch scrape along abrasion, in this case, film Layer 130 again can be referred to external coating (overcoat, OC), using such as polyacrylate, epoxy resin, polyurethane, Polysilane, poly- silica, poly- (silicon-acrylic acid) etc. can make composite construction CS have higher surface strength to improve resistance to scraping ability. Furthermore crosslinking agent, polymerization inhibitor, stabilizer (such as, but not limited to antioxidant, purple can be added in film layer 130 or polymer Outer light stabilizer (UV stabilizers)), interfacial agent or above-mentioned analog or mixture to be to improve composite construction CS Anti-uv-ray or reach compared with long shelf life.In other embodiments, film layer 130 can further include corrosion and inhibit Agent.However, above-mentioned is only the additive composition for illustrating film layer 130, the possibility of additional function/title, it is not intended to limit this Utility model.It is worth noting that since UV light stabilizing agent may be added in the photosensitive polymer of above-mentioned tool, this addition Object is possible to influence film layer 130 in the precision for the techniques such as being exposed, developing, and the utility model is then adjusted by the ginseng of exposure Number, such as exposure intensity, to reduce influence of the UV light stabilizing agent to exposure accuracy.

Then, carry out a yellow light following a lithography step, the utility model be using the photonasty of film layer 130, by film layer 130 into Row exposure, development etc. techniques (or being referred to generically as yellow light lithography process), to carry out the patterning of film layer 130, specifically may include with Lower step：The film layer 130 of semi-solid preparation is exposed and defines reserved area 130A and removal area 130B by step S3；Then, as walked Rapid S4 will be removed positioned at the film layer 130 of removal area 130B with metal nanometer line floor 140A, to form metal nanometer line layer 140A's Patterning mainly uses developer solution (or remover) will be positioned at the film layer 130 and metal nanometer line floor of removal area 130B 140A is removed, and to produce the touch-control sensing electrode TE being set on the VA of viewing area, and is exposed and is set to peripheral region PA's Joint sheet 170；More specifically, developer solution can will be removed positioned at the film layer 130 of removal area 130B, and therefore exposed gold Belong to nano wire layer 140A also can related developed liquid removed, to produce the touch-control sensing electrode TE on the VA of viewing area, And expose joint sheet 170 positioned at peripheral region PA.In other embodiments, it is possible to use developer solution arrange in pairs or groups other solvents progress By the step of being removed with metal nanometer line floor 140A positioned at the film layer 130 of removal area 130B.The step of herein referred development, be for Technology known in the art, in short, the photoactive substance in film layer 130, the part for receiving light source generates chemical reaction, makes Chemical bonded refractory is obtained to indurate, and non-irradiation can be removed (above-mentioned by taking negative-type photosensitive as an example) by above-mentioned developer solution.

The touch panel please completed referring initially to Fig. 5, display the embodiments of the present invention, below by Fig. 5 A-A, B-B section are described in detail step S3 and S4：5A, 5B figure are respectively that A-A, B-B section in Fig. 5 are defining removal The aspect of (i.e. film layer 130 is by after step of exposure), A-A sections can be seen that positioned at viewing area VA and peripheral region PA after area 130B Removal area 130B aspect, and B-B sections then can be seen that positioned at viewing area VA removal area 130B aspect.Such as 5A, 5B Shown in figure, the film layer 130 positioned at viewing area VA and peripheral region PA all can have removal area 130B and protect after overexposure, development Area 130A is stayed, the film layer 130 and metal nanometer line floor 140A positioned at removal area 130B can be removed, and positioned at viewing area VA In, electrically conducting transparent can be collectively formed in subsequent technique in the film layer 130 and metal nanometer line layer 140A positioned at reserved area 130A Layer, and then form touch-control sensing electrode TE.

In one embodiment, the exposure energy for being covered in film layer 130 using light shield in step S3, and being utilized is about 200mj/cm²To about 5000mj/cm²Exposure source (such as UV light) pattern of light shield is transferred in film layer 130, to define The removal area 130B stated and reserved area 130A, in this embodiment, film layer 130 is light-sensitive layer, can have negative photonasty, but not As limit, therefore it is unexposed area to remove area 130B；Reserved area 130A is exposure area.Then, using developer solution appropriate The above-mentioned film layer 130 for being located at removal area 130B is removed, dimethylbenzene (xylene, C specifically can be used₆H₄(CH₃)₂), butyl acetate or The above-mentioned film layer 130 for being located at removal area 130B of aromatic hydrocarbon solvent etc. removal.

And after removing the film layer 130 for being located at and removing area 130B, it more may include following post-processing step to remove completely Positioned at removal area 130B metal nanometer line floor 140A：Due to the film layer 130 for the protective effect for providing metal nanometer line layer 140A It is removed after above-mentioned exposure, development and (forms removal area 130B), therefore can utilize method appropriate that will be located at removal The metal nanometer line floor 140A of area 130B is removed completely.6A, 6B figure are respectively that A-A, B-B section in Fig. 5 are exposed in removal Metal nanometer line layer 140A after aspect, that is, the structure of touch panel that the embodiments of the present invention are completed.Such as Shown in 6A, 6B figure, in one embodiment, post-processing step can use solvent, such as organic solution (such as IPA, DAA, NMP Equal solution) or alkaline solution (tetramethyl ammonium hydroxide (TMAH), Na₂CO₃Equal solution) mode impregnated, removal area will be located at The metal nanometer line layer 140A of 130B is removed；Or post-processing step can use solvent, such as organic solution (such as IPA, DAA, NMP Equal solution) or alkaline solution (tetramethyl ammonium hydroxide (TMAH), Na₂CO₃Equal solution) collocation mechanical system, such as with pressure Sprinkler head in the immersion etc. of object, cooperation ultrasonic vibrating, will receive above-mentioned spray solution positioned at the metal of removal area 130B Rice noodles layer 140A is removed；In another specific embodiment, post-processing step can be used viscose process, such as utilize adhesive tape or similar Tool will be removed positioned at the metal nanometer line floor 140A of removal area 130B.In another specific embodiment, post-processing step also may be used It is located at the metal nanometer line floor 140A of removal area 130B including the use of microwave or irradiation (such as 172UV) removal of UV light, further Remove the exposed metal nanometer line in side 140 of the etching line boundary line of area 130B and reserved area 130A (remove).

It is worth noting that the metal nanometer line floor 140A positioned at removal area 130B also can be in the developing process of previous step In developed liquid impregnate and fallen off by 110 surface of substrate, in other words, the step of the present embodiment can be integrated into a development step and It will simultaneously be removed positioned at the film layer 130 and metal nanometer line floor 140A of removal area 130B using developer solution, be set to producing A touch-control sensing electrode TE on the VA of viewing area, then above-mentioned post-processing step is coordinated to carry out complementary or secondary removal step Suddenly, to remove completely possible remaining metal nanometer line 140, that is to say, that the utility model does not limit removal area 130B's Opportunity removed metal nanometer line layer 140A, as long as be without the use of etching solution, and only to divest the patterning of film layer 130 Journey just can reach the technique of pattern metal nano wire layer 140A, just belong to the range that the utility model is covered.

In one embodiment, as shown in Fig. 5 A and Fig. 6 A, week can be corresponded to positioned at the position of the removal area 130B of peripheral region PA The joint sheet (bonding pad) 170 on sideline road 120, in other words, after the completion of step S3, S4, joint sheet (bonding Pad it) 170 can expose, top is subsequently equipped with outside there is no having metal nanometer line 140 and a film layer 130 by one The external circuit board 180 of controller, the step of being connected to the touch panel of the utility model such as flexible circuit board (FPC), is (i.e. Bonding steps) when, joint sheet 170 can be welded directly with the electronic pads (not shown) of flexible circuit board and form conduction Access.In other embodiment, can also be formed on joint sheet 170 other welding auxiliary layer (not shown), then with it is soft Property circuit board carries out engagement (bonding) step such as welding；Or by conducting resinl (not shown, such as anisotropic conductive adhesive paste) into Row conducting.Therefore, generally, due on joint sheet (bonding pad) 170 metal nanometer line 140 and film layer 130 it is complete Full removal, making the electronic pads (not shown) of itself and circuit board 180 that can be formed, one kind is in direct contact and low-impedance signal transmits road Diameter (can be referring initially to Fig. 9), control signal and the touch-control being used for transmission between touch-control sensing electrode TE and said external controller Inductive signal, and due to its low-impedance characteristic, contribute to the consume for reducing signal transmission in fact, to solve tradition using etching Liquid carries out patterning step, and film layer 130 can still remain in the excessively high problem of contact impedance caused on joint sheet 170.At this In embodiment, metal nanometer line 140 and film layer 130 on perimeter circuit 120 and between adjacent peripheral circuit 120 are also gone completely It removes, in other words, the metal nanometer line 140 and film layer 130 for being coated on peripheral region PA in step sl are completely removed, therefore phase Insulation layer (non-conducting areas 136 i.e. described below) can be formed between adjacent perimeter circuit 120, non-conducting areas 136 is not deposited There are metal nanometer line 140 and film layer 130, therefore forming electrically isolation between adjacent peripheral circuit 120, and then is reaching touch panel Circuit configuration.

In addition, as shown in Fig. 5 B and Fig. 6 B, and coordinate Fig. 5, it can be corresponded to positioned at the position of the removal area 130B of viewing area VA Insulation layer (non-conducting areas 136 i.e. described below) between adjacent touch induction electrode TE is used to sense not to define With the touch-control sensing electrode TE of position of touch, in other words, the non-conducting areas 136 between adjacent touch induction electrode TE is not deposited There are metal nanometer line 140 and film layer 130.

In one embodiment, above-mentioned technique can't remove completely the metal nanometer line 140 of non-conducting areas 136, change speech It, removes in area 130B and remains metal nanometer line 140, but the concentration of institute's remaining metal nanometer line 140 is permeated less than one and faced Limit value (percolation threshold).The electrical conductivity of the composite construction of film layer 130 and metal nanometer line 140 mainly by with Lower factor controlling：A) electrical conductivity of single metal nanometer line 140, b) number of metal nanometer line 140 and c) such metal nano Connectivity (also known as contact) between line 140；If the concentration of metal nanometer line 140 is less than infiltration threshold value (percolation Threshold), since the interval between metal nanometer line 140 is too far, removal area 130B monolithic conductive degree is very low, or It is zero, implies that metal nanometer line 140 does not provide continuous current path in removing area 130B, and a conductive network can not be formed (conductive network), that is to say, that metal nanometer line 140 formed in non-conducting areas 136 is non-conductive mesh Network (non-conductive network).In one embodiment, the sheet resistance of a region or a structure is in following range In can be identified as it is non-conductive：Sheet resistance is higher than 10⁸Ohm-sq (ohm/square), or it is higher than 10⁴Ohm-sq (ohm/square), or it is higher than 3000 ohm-sqs (ohm/square), or is higher than 1000 ohm-sqs (ohm/square), Or it is higher than 350 ohm-sqs (ohm/square), or it is higher than 100 ohm-sqs (ohm/square).

Preferably, after step s4, it may include a curing schedule, with the film layer 130 of the semi-solid preparation after will be patterned into It forms crosslinking and is fully cured；In one embodiment, (intensity about 100mj/cm is irradiated with UV light²To about 1500mj/cm²) Or heating (about 130 DEG C to about 150 DEG C, about 10 to about 15 minutes time).In other words, the meeting of remaining film layer 130 curing molding, and A kind of composite construction CS is formed with metal nanometer line 140, metal nanometer line 140 can form conductive network in film layer 130 (conductive network), also just forms so-called transparency conducting layer, and this transparency conducting layer is after above-mentioned patterning It can be in the VA of viewing area as touch-control sensing electrode TE, to reach preferable display effect, metal nanometer line 140 and 130 institute of film layer The light transmittance (Transmission) of the composite construction CS of formation can be greater than about 80%, and surface resistivity (surface Resistance) between about 10 to 1000 ohm-sqs (ohm/square)；Preferably, metal nanometer line 140 and film layer 130 light transmittances (Transmission) for being formed by composite construction CS are greater than about 85%, and surface resistivity (surface Resistance) between about 50 to 500 ohm-sqs (ohm/square).

So far, you can produce the touch panel that can be used for incuding touch-control, may include the viewing area VA institutes in substrate 110 The touch-control sensing electrode TE (i.e. film layer 130 with metal nanometer line 140 be formed by composite construction CS) of formation and in substrate 110 Peripheral region PA is formed by perimeter circuit 120, and touch-control sensing electrode TE can be electrically connected to each other with perimeter circuit 120 to transmit letter Number, in the present embodiment, metal nanometer line layer 140A and the perimeter circuit 120 of touch-control sensing electrode TE can be in viewing area VA and week The intersection of border area PA forms bridging arrangement, specifically, as shown in Figure 6A, the metal nanometer line layer of touch-control sensing electrode TE 140A can slightly protrude from viewing area VA and extend to peripheral region PA, so that the lapping ends of metal nanometer line layer 140A are in periphery On circuit 120, that is to say, that peripheral region PA can slightly be distinguished into two regions, and first area is reserved area 130A, for touch-control Induction electrode TE (i.e. film layer 130 is formed by composite construction CS with metal nanometer line 140) extends and is formed with perimeter circuit 120 Bridging arrangement；And second area is then removal area 130B, perimeter circuit 120 is predominantly located at removal area 130B, therefore in addition to above-mentioned Outside overlap, film layer 130 and metal nanometer line 140, adjacent peripheral line are had no on perimeter circuit 120 (including joint sheet 170) Non-conducting areas 136 between road 120 is also without film layer 130 and metal nanometer line 140.And in another embodiment, touch-control sensing The metal nanometer line layer 140A of electrode TE is overlapped with perimeter circuit 120 in addition to being formed in the intersection of viewing area VA and peripheral region PA Outside structure, metal nanometer line layer 140A and film layer 130 can extend to peripheral region PA, so that metal nanometer line layer 140A and film layer 130 are covered on perimeter circuit 120, but are not covered on joint sheet 170, that is to say, that peripheral region PA can slightly be distinguished into two A region, first area be reserved area 130A, correspond to perimeter circuit 120 size and position (but and do not include joint sheet 170), so that touch-control sensing electrode TE (i.e. film layer 130 is formed by composite construction CS with metal nanometer line 140) extends to periphery Area PA and be covered on perimeter circuit 120, but be not covered on joint sheet 170；And second area is then removal area 130B, is gone Except area 130B can expose the non-conducting areas 136 between joint sheet 170 and adjacent peripheral circuit 120, therefore perimeter line can be made There is no film layer 130 and metal nanometer line 140 on the joint sheet 170 on road 120.Generally speaking, film layer 130 and metal nanometer line 140 In peripheral region, PA can there are many structure aspects, as long as can reach the protection category that exposed joint sheet 170 belongs to the utility model.

In a particular embodiment, due to having no film layer 130 on joint sheet 170, therefore the film layer 130 of the utility model is not required to examine The problem of considering contact impedance, therefore be molded in the technique of film layer 130 (such as sedimentation time) and can be controlled, to increase film layer 130 thickness and so that metal nanometer line 140 is had the protections such as enough anti-oxidant, resistant to moisture, antiacid alkali, specifically implementing In example, the thickness of the film layer 130 of the utility model can be about 40nm to about 400nm, preferably about 200nm to about 400nm, this reality It is wide with the more traditional thicknesses of layers of the adjusting range of novel 130 thickness of film layer, above-mentioned maximum thickness limit is (such as above-mentioned 400nm) can also greatly improve protective capability of the film layer 130 to metal nanometer line 140.

Preferably, being formed by metal nanometer line 140 can further be post-processed to improve its electrical conductivity, this post-processing It includes process steps such as heating, plasma-based, corona discharge, UV ozone or pressure that can be.For example, being formed by curing metal nanometer line After the step of layer 140A, brought pressure to bear on thereon using idler wheel, it in one embodiment, can be by one or more idler wheels to metal Nano wire layer 140A applies 50 to 3400psi pressure, can preferably apply 100 to 1000psi, 200 to 800psi or 300 to The pressure of 500psi.In some embodiments, the post-processing of heating and pressure can be carried out at the same time；In detail, it is formed by gold Pressure can be applied via one or more idler wheels as described above by belonging to nano wire 140, and be heated simultaneously, such as applied by idler wheel Pressure is 10 to 500psi, preferably 40 to 100psi；Idler wheel is heated to about between 70 DEG C and 200 DEG C simultaneously, preferably to about Between 100 DEG C and 175 DEG C, the electrical conductivity of metal nanometer line layer 140A can be improved.In some embodiments, metal nanometer line 140 can preferably be exposed in reducing agent and be post-processed, such as the metal nanometer line 140 being made of nano-silver thread can preferably expose It is post-processed in silver reductor, silver reductor includes boron hydride, such as sodium borohydride；Boron-nitrogen compound, such as dimethyl amine Base borine (DMAB)；Or gaseous reducing agent, such as hydrogen (H₂).And about 10 seconds to the about 30 minutes exposure duration, preferably About 1 minute to about 10 minutes.And the step of above-mentioned application pressure, can implement the step of being coated with film layer 130 it according to actual demand It is preceding or later.

As shown in figure 5, the touch panel of the present embodiment is a kind of touch panel of single side non-bridging formula (non-cross), The quantity of touch-control sensing electrode TE can be one or more.In more detail, prolong in the same direction with multiple in the VA of viewing area The touch-control sensing electrode TE stretched is respectively the straight shape electrode of length being made of film layer 130 and metal nanometer line 140, and adjacent tactile The non-conducting areas 136 defined by the removal area 130B in above-mentioned technique between control induction electrode TE；Likewise, peripheral region Also there is the non-conducting areas 136 that removal area 130B is defined, electrically to block adjacent perimeter circuit 120 in PA.This reality The touch panel for applying example can be not via etching solution with regard to the directly patterning of progress metal nanometer line layer 140A, wherein is located at display The touch-control sensing electrode TE of area VA can be used for sensing the touch position or gesture of user, be located at the perimeter circuit 120 of peripheral region PA It is then electrically connected at touch-control sensing electrode TE, the touch-control sensing electrode TE sensing signals measured are sent to a peripheral control unit (not shown), and film layer 130 and metal nanometer line 140 are had no on the joint sheet (bonding pad) 170 of perimeter circuit 120, therefore Joint sheet (bonding pad) 170 can directly with the electronic pads (not shown) contact of the external circuit board 180/connect, to reduce this The circuit impedance of the touch panel of embodiment, to reach preferable electric signal characteristic.On the other hand, the touch-control sensing of viewing area VA It is thick film layer 130 that electrode TE, which has compared with conventional electrode configurations, thus can be improved the present embodiment touch panel it is anti-oxidant, water-fast The properties such as gas, antiacid alkali, therefore there is preferable durability and production reliability.

In an alternate embodiment, in order to improve the photonasty of film layer 130, with further promoted patterned precision (or Claim resolution ratio), a negative photosensitive layer 150 can be set in semi-solid preparation film layer 130, and Fig. 7 shows Fig. 5 after above-mentioned steps S2 In A-A sections in step S3 after overexposure, negative photosensitive floor 150 be defined out reserved area 130A with removal area 130B；This The specific practice of embodiment can be but be not limited to：By negative photosensitive material in a manner of screen painting, nozzle coating, idler wheel coating etc. It is coated in film layer 130, being again heated to about 80 DEG C to about 120 DEG C makes it be solidified into negative photosensitive layer 150.And subsequently using exposure Light energy is about 50mj/cm²To about 1000mj/cm²The patterning of 150/ film layer 130 of negative photosensitive layer is carried out, and equally according to aforementioned Mode is removed the metal nanometer line 140 for removing area 130B.It is high sense since the present embodiment addition has compared with film layer 130 The negative photosensitive layer 150 of photosensitiveness, therefore used exposure energy can be less than previous embodiment, and utilize negative photosensitive layer 150 Produce more filament it is wide/pattern of line-spacing, such as the resolution ratio of film layer 130 is about 20 μm or higher, point of negative photosensitive layer 150 Resolution is about 10 μm or 5 μm, while can be by the mistake for removing the negative photosensitive floor 150 for being located at removal area 130B using developer solution The film layer 130 for being similarly positioned in removal area 130B and/or metal nanometer line floor 140A are removed and are patterned by journey.It is real one It applies in example, film layer 130 can not have photonasty, and utilize developer solution, such as organic solvent, such as dimethylbenzene, n-butyl acetate (n- Butyl Acetate, nBA) etc. removal exposure area negative photosensitive layer 150 while, by film layer 130 and/or metal nano Line layer 140A is removed and is reached patterned effect.In addition, by negative photosensitive layer 150 is added in process, film can be solved Be added with influence of the UV light stabilizing agent for the resolution ratio of exposure imaging technique in layer 130, and from the viewpoint of product characteristic and It says, visible product application addition UV light stabilizing agent, makes product have more anti-ultraviolet characteristic in film layer 130.Implement one In example, the consitutional adhesive strength of 150 pair of half cured film layer 130 of negative photosensitive layer and metal nanometer line layer 140A institutes can Preferably more than the film layer 130 of semi-solid preparation and the structures that are formed of metal nanometer line layer 140A to the adhesive strength of substrate 110, with While 150 developed liquid of sharp negative photosensitive layer removes, together by the film layer 130 of the semi-solid preparation under it and metal nanometer line layer 140A is removed.

In addition, due to the characteristic of negative photosensitive layer 150, the negative photosensitive layer 150 in irradiation region has stronger chemical bond Knot, therefore be not easy to be dissolved by the developing, therefore after patterning, the negative photosensitive layer 150 of reserved area 130A can remain On film layer 130 and metal nanometer line layer 140A, for example, be just laminated on the touch-control sensing electrode TE of viewing area VA There is above-mentioned remaining negative photosensitive layer 150, and more improves metal nanometer line layer 140A's due to the presence of negative photosensitive layer 150 Protecting effect, such as after solidification, negative photosensitive layer 150 and film layer 130 be formed by protective layer thickness (i.e. the two thickness it Summation) can be in about 1 μm -10 μm, preferably about 5 μm -10 μm, therefore the durability of product is substantially improved.Negative photosensitive layer 150 and film Layer 130 is formed by protective layer thickness also can be below above range.In another embodiment, it may include one by remaining minus The step of photosensitive layer 150 removes.

And in another embodiment, the metal nanometer line layer 140A of touch-control sensing electrode TE and perimeter circuit 120 in addition to The intersection of viewing area VA and peripheral region PA is formed outside bridging arrangement, and metal nanometer line layer 140A and film layer 130 can extend to week Border area PA so that metal nanometer line layer 140A and film layer 130 are covered on perimeter circuit 120, but is not covered in joint sheet 170 On, and negative photosensitive layer 150 can also be laminated and be covered in metal nanometer line layer 140A and composite construction CS that film layer 130 is constituted On.That is peripheral region PA can slightly be distinguished into two regions, and first area is reserved area 130A, corresponds to perimeter circuit 120 size and position (but and not including joint sheet 170), for touch-control sensing electrode TE (i.e. film layer 130 and metal nanometer line 140 are formed by composite construction CS) it extends to peripheral region PA and is covered on perimeter circuit 120, but it is not covered in joint sheet On 170, and negative photosensitive layer 150 can also be laminated and be covered in metal nanometer line layer 140A and composite construction that film layer 130 is constituted On CS；And second area is then removal area 130B, removal area 130B can expose joint sheet 170 and adjacent peripheral circuit 120 Between non-conducting areas 136, therefore can make there is no film layer 130 and metal nanometer line 140 on the joint sheet 170 of perimeter circuit 120.

The explanation of previous embodiment, such as post-processing step can be applied in the present embodiment, and it will not be described here.

Fig. 8 then shows another embodiment of the touch panel of the utility model, is a kind of single side bridge type (bridge) Touch panel.This embodiment and the difference of above-described embodiment is, transparency conducting layer (the i.e. film that will be formed on substrate 110 Layer 130 is formed by composite construction CS with metal nanometer line 140) the touch-control sensing electrode that is formed after above-mentioned patterned step TE includes:Along the first touch-control sensing electrode TE1 of first direction D1 arrangements, the second touch-control sensing of D2 arrangements is electric in a second direction The pole TE2 and connection electrode CE for being electrically connected two the first adjacent touch-control sensing electrode TE1, and due to the film layer of connection electrode CE 130 had adequate thickness (such as>40nm), therefore insulating materials is can be used as, and bridging conductor 162 can be made to be directly arranged at connection In the film layer 130 of electrode CE, to be connected to two the second touch-control sensing electrode TE2 adjacent on second direction D2.Alternatively, another In one embodiment, a collets 164 can be set on connection electrode CE, such as collets 164 are formed with silica；Most Bridging conductor 162 is more set on collets 164 afterwards, such as forms bridging conductor 162 with copper, and bridging conductor 162 is made to connect In two the second touch-control sensing electrode TE2 adjacent on second direction D2, collets 164 are located at connection electrode CE and bridging conductor Between 162, connection electrode CE and bridging conductor 162 are electrically completely cut off, so that on first direction D1 and second direction D2 Touch control electrode is electrically insulated from each other.It is worth noting that if considering, the film layer 130 of the second touch-control sensing electrode TE2 may cause Insulating properties, via hole (via hole, not shown) can be preferably made in the film layer 130 of the second touch-control sensing electrode TE2, The both ends of bridging conductor 162 connect via hole, and adjacent two the in a second direction d 2 are electrically connected with sharp bridging conductor 162 Two touch-control sensing electrode TE2.

In addition, in the embodiment shown in fig. 8, film layer 130 is formed by composite construction CS with metal nanometer line 140 and can set It is covered on perimeter circuit 120 in peripheral region PA and exposed joint sheet 170, specific practice can refer to above, no longer go to live in the household of one's in-laws on getting married in this It states.

In another embodiment, on the first touch-control sensing electrode TE1, the second touch-control sensing electrode TE2 and connection electrode CE Equal lamination is covered with negative photosensitive layer 150, and the film layer 130 of connection electrode CE and thereon remaining negative photosensitive layer 150 are With adequate thickness (such as>5 μm), therefore insulating materials is can be used as, and bridging conductor 162 can be made to be directly arranged at connection electrode CE Film layer 130 on the remaining negative photosensitive layer of institute 150 thereon, it is tactile to be connected to adjacent second direction D2 on two second Control induction electrode TE2.If considering the film layer 130 of the second touch-control sensing electrode TE2 and a remaining negative photosensitive layer 150 can thereon Insulating properties caused by energy, can be preferably in the film layer 130 of the second touch-control sensing electrode TE2 and remaining negative photosensitive layer thereon Via hole (via hole, not shown) is made in 150, the both ends of bridging conductor 162 connect via hole, with sharp bridging conductor 162 It is electrically connected two adjacent in a second direction d 2 the second touch-control sensing electrode TE2.

In addition to the touch panel of above-mentioned one plane type, the technique of the utility model is also applicable to the touch panel of two plane type, In other words, perimeter circuit 120 is first made in the opposing sides of substrate 110 (such as upper and lower two surface) respectively, further in accordance with above-mentioned Way forms metal nanometer line layer 140A and film layer 130 in the opposing sides of substrate 110；Then coordinate double-sided exposure, development Etc. techniques, have patterned touch-control sensing electrode TE to be formed in the opposing sides of substrate 110.It is same as previous embodiment, position In having no film layer 130 and metal nanometer line 140 on the joint sheet (bonding pad) 170 of the perimeter circuit 120 of peripheral region PA, Therefore joint sheet (bonding pad) 170 can directly with the electronic pads contact of circuit board 180/connect, to reduce touching for the present embodiment Control the circuit impedance of panel；And the thickness of the film layer 130 positioned at the touch-control sensing electrode TE of viewing area VA can be compared with traditional structure Thickness has the protections such as more preferably anti-oxidant, resistant to moisture, antiacid alkali, anti-organic solvent to provide metal nanometer line 140.

In one embodiment, the film layer 130 in the opposing sides to avoid substrate 110 is mutual dry when being exposed It disturbs, the light source that different sequential can be used is exposed technique.In another embodiment, the light source of different wave length can be used to be exposed Light technology, in other words, the film layer 130 in the opposing sides of substrate 110 are to have photosensitive material to light sources with different wavelengths.? It, can be first on the opposing sides elder generation shaped beam barrier layer (not shown) of substrate 110, the above-mentioned periphery of reshaping in another embodiment Circuit 120 and metal nanometer line layer 140A.Specifically, beam blocking layer is the barrier layers UV, in the opposing sides of substrate 110 Identical polymer can be used to be made for film layer 130, then is patterned by technique is exposed using same UV light sources, The barrier layers UV can absorb a part of UV light (such as at least 10%, 20%, 25% or 20%- of gross energy under specific wavelength 50%) it, can substantially allow the light of visible wavelength (such as 400-700nm) to transmit, be greater than the 85% of gross energy Visible transmission.In one embodiment, it is " HB3-50 " that the barrier layers UV, which are the name of product selected from Teijin DuPont Films, 50 μ m-thicks polyethylene terephthalate (PET) film；Another illustrative barrier layers UV are selected from Teijin DuPont's Polyethylene terephthalate (PET) film of 125 μ m-thicks of entitled " XST6758 ".

In one embodiment, perimeter circuit 120 is first made in the opposing sides of substrate 110, further in accordance with above-mentioned way Metal nanometer line layer 140A, film layer 130 and negative photosensitive layer 150 are formed in the opposing sides of substrate 110；Then coordinate two-sided The techniques such as exposure, development have patterned touch-control sensing electrode TE to be formed in the opposing sides of substrate 110.It is aforementioned two-sided The process conditions of exposure can be applied to the negative photosensitive layer 150 of the present embodiment, and it will not be described here.

Fig. 9 shows that the utility model embodiment touch panel is assembled with other electronic devices, such as a kind of tool touch function Display, wherein substrate 110, perimeter circuit 120 (include joint sheet 170), metal nanometer line layer 140A and the composition of film layer 130 Touch-control sensing electrode TE and negative photosensitive layer 150 can refer to above, do not repeating herein.On the other hand, under substrate 110 Surface can fit in a display element 100, such as liquid crystal display element, and optics can be used between substrate 110 and display element 100 Glue (OCA) AD is bonded；And it equally (or is protected using optical cement (OCA) AD and outer cover glass CG on negative photosensitive layer 150 Shield glass) it is bonded.Preferably, optical cement (OCA) AD can insert the non-conducting areas between adjacent touch induction electrode TE 136, to reach preferable structural strength.It is same as previous embodiment, positioned at the joint sheet of the perimeter circuit 120 of peripheral region PA Have no film layer 130, metal nanometer line 140 and negative photosensitive layer 150 on (bonding pad) 170, therefore joint sheet (bonding Pad) 170 can directly with the electronic pads contact of the external circuit board 180/connect, to reduce the circuit of the touch panel of the present embodiment Impedance.

In some embodiments of the utility model, it is not necessary to be patterned and (exposed using film layer 130 using etching solution Photodevelopment) technique while, together by pattern for transparent conductive layer that metal nanometer line layer 140A is formed with film layer 130 to be formed Touch-control sensing electrode TE positioned at viewing area can save the etching step that tradition needs etching solution to carry out metal nanometer line layer 140A Suddenly, therefore caused by can solving the problems, such as the residual of etching solution, and achieve the effect that improve production yield.

In some embodiments of the utility model, it is not necessary to carry out pattern using negative photosensitive layer 150 using etching solution While changing (i.e. exposure imaging) technique, the pattern for transparent conductive layer that together forms metal nanometer line layer 140A and film layer 130 Change to form the touch-control sensing electrode TE for being located at viewing area, tradition can be saved, etching solution is needed to carry out metal nanometer line layer 140A's Etching step, therefore caused by can solving the problems, such as the residual of etching solution, and achieve the effect that improve production yield.

In some embodiments of the utility model, it is not necessary to etch metal nano wire layer 140A using etching solution, therefore can Etching solution is excluded on influence caused by element (such as perimeter circuit 120 made by metal material).

In some embodiments of the utility model, the step of traditional etching metal nano wire layer 140A can be omitted, therefore Integrated artistic can be simplified, to achieve the effect that reduce cost.

In some embodiments of the utility model, by by film layer 130 and the metal nanometer line 140 on joint sheet 170 It removes completely, joint sheet 170 is made directly to be contacted with the external circuit board 180, therefore a low-impedance conducting wire can be formed, and then subtract The loss and distortion of touching signals are transmitted less.

In some embodiments of the utility model, by by joint sheet 170 film layer 130, metal nanometer line 140 with Negative photosensitive layer 150 removes completely, and joint sheet 170 is made directly to be contacted with the external circuit board 180, therefore can form one and low-impedance lead Electric line, and then reduce the loss and distortion for transmitting touching signals.

In some embodiments of the utility model, due to being not required to consider that joint sheet 170 is indirectly with the external circuit board 180 The influence for touching impedance, can increase the thickness of the film layer 130 on the touch-control sensing electrode of viewing area, by increasing film layer 130 The effect of protective layer that is provided of thickness, so that product is passed through stringenter resistance to ring test.

The some embodiments of the utility model can by the effect for the protective layer that the thickness for increasing film layer 130 is provided Improve the durability of the touch-control sensing electrode of viewing area.

The some embodiments of the utility model are provided by the integral thickness of film layer 130 and negative photosensitive layer 150 The durability of the touch-control sensing electrode of viewing area can be improved in the effect of protective layer.

In some embodiments of the utility model, the technique a large amount of batches can carry out touching for single or double simultaneously Control the making of panel.

Although the utility model is disclosed above with numerous embodiments, so it is not limited to the utility model, appoints What is familiar with this those skilled in the art, without departing from the spirit and scope of the utility model, when can be used for a variety of modifications and variations, therefore this The protection domain of utility model is when subject to the protection domain institute defender of appended claims.

Claims

1. a kind of touch panel, which is characterized in that include：

One substrate, the wherein substrate have a viewing area and a peripheral region；

It is stacked a negative photosensitive layer, a film layer and a metal nanometer line layer on the substrate；And

One is set to the perimeter circuit on the peripheral region, and wherein the perimeter circuit has a joint sheet, and the negative photosensitive layer is through exposing A removal area and a reserved area are defined after light, are located at the negative photosensitive floor, the film layer and the metal nanometer line in the removal area Layer is removed and defines a touch-control sensing electrode and expose the joint sheet, which is electrically connected at the periphery Circuit.

2. touch panel as described in claim 1, which is characterized in that the metal nanometer line layer includes metal nanometer line, the gold Belong to nano wire and is embedded in the film layer of the reserved area film layer and the gold for forming conductive network, and being located at the viewing area The touch-control sensing electrode is collectively formed in category nano wire, the remaining negative photosensitive layer of institute is covered on the touch-control sensing electrode.

3. touch panel as described in claim 1, which is characterized in that the photonasty of the negative photosensitive layer is higher than the film layer.

4. touch panel as described in claim 1, which is characterized in that the thickness of the film layer is about 200nm-400nm.

5. touch panel as described in claim 1, which is characterized in that the metal nanometer line layer can be aobvious at this with the perimeter circuit Show that area and the intersection of the peripheral region form bridging arrangement.

6. touch panel as described in claim 1, which is characterized in that the touch-control sensing electrode extends to the peripheral region and covers In on the perimeter circuit, but it is not covered on the joint sheet.

7. touch panel as described in claim 1, which is characterized in that the metal nanometer line layer includes metal nanometer line, this goes Except area remains the metal nanometer line, concentration is less than an infiltration threshold value.

8. touch panel as described in claim 1, which is characterized in that have in the viewing area and multiple extend in the same direction Long straight shape electrode.

9. touch panel as described in claim 1, which is characterized in that all have the corresponding display in the opposing sides of the substrate The touch-control sensing electrode in area.

10. touch panel as described in claim 1, which is characterized in that the negative photosensitive layer and the thickness summation of the film layer are About 5 μm -10 μm.