CN208051150U - Dust concentrating structure for semiconductor product laser marking cleaner head - Google Patents

Abstract

The utility model provides a kind of dust concentrating structure for semiconductor product laser marking cleaner head comprising：It is enclosed with periphery wall and sets the closeouts to form hollow structure, the closeouts are configured to masking end and inserted terminal in the opposite end of the periphery wall；The masking end is formed with roof and is connect with the periphery wall, and through-hole is offered on the roof and is connected to the inner space of the periphery wall；The inserted terminal is configured to step structure and with the convex jointing part to be formed is inside contracted, and the convex jointing part, which exceeds the edge of the periphery wall and encloses, to be set to form suction inlet, the suction inlet to formation negative pressure room for promotion between the roof；It enables the top end opening grafting of the convex jointing part of the closeouts and the dust laser hole of cleaner head fasten, is connected to by the suction inlet between the dust laser hole and the negative pressure room for promotion.Whereby, using roof and through-hole, make to form negative pressure room for promotion inside closeouts, promote pick-up performance and improve production efficiency.

Description

Dust concentrating structure for semiconductor product laser marking cleaner head

Technical field

The utility model is related to semiconductor laser Mark technology field, relate in particular to beat for semiconductor product laser Mark the dust concentrating structure of cleaner head.

Background technology

As shown in Figure 1, showing a kind of facing for dust concentrating structure 10 for semiconductor product laser marking cleaner head Perspective structure；The cleaner head 10 includes the vaccum suction pipe 11 connected to vaccum-pumping equipment and forms in the vaccum suction pipe The suction nozzle 12 of 11 ends, dust laser hole 13 has been provided inside the suction nozzle 12, and the dust laser hole 13 is inhaled with the vacuum The internal pipeline of pipe 11 is connected to, so as to form three-port structure.

It is worth noting that, the semiconductor product size produced at present reduces increasingly, to be wanted to product mark precision Ask very high, any factor may all cause equipment production mark during cause mark unqualified, it is therefore desirable to product into Row single product carries out independent positioning mark, and the dust for resulting in mark needs special collection.

However, existing mark cleaner head design as shown in Figure 1 is too simple, the dust of existing product mark cannot be satisfied Demand since dust laser hole 13 is configured to that aperture is identical and the structure of both ends perforation, causes dust can not in process of production It is concentrated by good suction, needs often to clean mark type pallet, hence it is evident that there are problems that reducing production efficiency, need further to be changed Into.

Utility model content

In view of the foregoing, the utility model provides a kind of dust concentration for semiconductor product laser marking cleaner head Structure, to solve the problems, such as that the negative pressure of vacuum suction deficiency of existing cleaner head leads to low production efficiency.

To achieve the above object, it is beaten for semiconductor product laser the technical scheme adopted by the utility model is that providing one kind The dust concentrating structure of cleaner head is marked, the cleaner head includes vaccum suction pipe and the suction nozzle that is connect with the vaccum suction pipe, institute It states suction nozzle and has provided dust laser hole, the dust laser hole forming top end opening, bottom suction inlet and sidewall opening, the side Wall opening is connected to the vaccum suction pipe；Wherein, the dust concentrating structure includes：There is periphery wall to enclose and set to be formed for closeouts Hollow structure, the closeouts are configured to masking end and inserted terminal in the opposite end of the periphery wall；The masking end forming There is roof to be connect with the periphery wall, through-hole is offered on the roof and is connected to the inner space of the periphery wall；It is described to insert It connects end to be configured to step structure and have inside contract the convex jointing part to be formed, the convex jointing part exceeds the edge of the periphery wall and encloses If forming suction inlet, the suction inlet to formation negative pressure room for promotion between the roof；Enable the convex jointing parts of the closeouts with The top end opening grafting of the dust laser hole fastens, by described between the dust laser hole and the negative pressure room for promotion Suction inlet is connected to.

In the embodiments of the present invention, the closeouts are configured to double-layer circular tubular structure；The closeouts are described in Internal ring wall is equipped on the inside of periphery wall, the masking end of the internal ring wall is connect with the roof, and the inserted terminal of the internal ring wall exceeds The edge of the periphery wall forms the convex jointing part, and the negative pressure room for promotion defines shape by the internal ring wall and the roof At.

In the embodiments of the present invention, the through-hole includes full open aperture and half trepanning, and the full open aperture is opened in described The intermediate region of roof, and the area of the full open aperture and the negative pressure room for promotion are completely overlapped；The half trepanning correspondence is opened The position of the internal ring wall is opened in the neighboring area of the roof, and the area of half trepanning and the negative pressure room for promotion It partly overlaps.

In the embodiments of the present invention, the through-hole is set to the intermediate region of the roof, and the area of the through-hole It is completely overlapped with the negative pressure room for promotion.

In the embodiments of the present invention, the opposite sides that the roof is external to the through-hole is configured to two recess portions.

In the embodiments of the present invention, the dust concentrating structure further includes sealing ring, and the sealing ring is sheathed on institute It states outside the convex jointing part of closeouts；The top end opening grafting of the convex jointing part and the dust laser hole of the closeouts is enabled, it is described Pass through the sealing ring fit sealing between convex jointing part and the top end opening.

The utility model makes it have following advantageous effect as a result of above technical scheme：

By the way that the closeouts of the utility model are inserted on the dust laser hole top end opening of the mark cleaner head, profit With roof and through-hole, make to form negative pressure room for promotion inside closeouts, can play good compared to existing cleaner head and ensure Enough negative pressure of vacuum effectively promote pick-up performance of the semiconductor product in laser marking, to reduce mark type pallet Cleaning frequency, and improve whole production efficiency.

The these and other objects, feature and advantage of the utility model, are obtained by following detailed descriptions and claim To fully demonstrate, and can be achieved by means, device and the combination thereof specially pointed out in appended claims.

Description of the drawings

Fig. 1 is the structural schematic diagram for being currently used for semiconductor product laser marking cleaner head.

Fig. 2 is the structural schematic diagram that the utility model dust concentrating structure is set to cleaner head.

Fig. 3 is the constructional appearance schematic diagram that the utility model dust concentrating structure is equipped with two through-holes.

Fig. 4 is the schematic structural cross-sectional view of A-A hatching lines in the utility model Fig. 3.

Fig. 5 is the schematic structural cross-sectional view that the utility model dust concentrating structure is equipped with single through-hole.

The correspondence of reference numeral and component is as follows：

Cleaner head 10；Vaccum suction pipe 11；Suction nozzle 12；Dust laser hole 13.

Cleaner head 20；Vaccum suction pipe 21；Suction nozzle 22；Dust laser hole 23.Top end opening 231；Bottom suction inlet 232；Side wall Opening 233；Closeouts 30；Cover end 301；Inserted terminal 302；Periphery wall 31；Roof 32；Through-hole 33；Full open aperture 331；Half trepanning 332；Internal ring wall 34；Convex jointing part 341；Suction inlet 342；Recess portion 35；Sealing ring 40.

Specific implementation mode

For the benefit of to the understanding of the utility model, illustrate with reference to the accompanying drawings and embodiments.

Fig. 2 to Fig. 5 is please referred to, the utility model provides a kind of dust collection for semiconductor product laser marking cleaner head Middle structure.As shown in Fig. 2, the cleaner head 20 includes vaccum suction pipe 21 and the suction nozzle 22 being connect with the vaccum suction pipe 21, The suction nozzle 22 has provided dust laser hole 23, the dust laser hole 23 shape top end opening 231, bottom suction inlet 232 and Sidewall opening 233, the sidewall opening 233 are connected to the vaccum suction pipe 21, in order to ensure that vacuum pressure, the utility model are logical It crosses the group on the top end opening 231 of 20 dust laser hole 23 of the cleaner head and sets the dust concentration knot being mainly made of closeouts 30 Structure is realized to form negative pressure room for promotion R at the top of dust laser hole 23 using closeouts 30 and effectively promotes cleaner head 20 Pick-up performance.

The utility model provides first embodiment as shown in Figure 3, Figure 4 and second embodiment as shown in Figure 5.Its In, first embodiment is preferred embodiment, illustrates the structural configuration that two through-holes 33 are formed in closeouts 30；Second implements Example illustrates to form the structural configuration of single through-hole 33 in closeouts 30.

As shown in Figures 3 to 5, the closeouts 30 are configured to double-layer circular tubular structure；The closeouts 30 have periphery Wall 31, the closeouts 30 are equipped with internal ring wall 34 along the inside of the periphery wall 31, the periphery wall 31 and the internal ring wall 34 it Between separated with space.The closeouts 30 are configured to masking end 301 and inserted terminal in the opposite end of the periphery wall 31 302；The masking end 301 is formed with roof 32 and is connect with the periphery wall 31 and the internal ring wall 34；It is opened on the roof 32 It is connected to the inner space of the internal ring wall 34 equipped with through-hole 33；The inserted terminal 302 of the internal ring wall 34 exceeds the periphery wall 31 edge forms convex jointing part 341, enable the inserted terminal 302 by the class difference of the periphery wall 31 and the internal ring wall 34 at Shape is step structure.The convex jointing part 341, which encloses, to be set to form suction inlet 342, the internal ring wall 34 to shape between the roof 32 At negative pressure room for promotion R；Whereby, the top end opening 231 of the convex jointing part 341 and the dust laser hole 23 of the closeouts 30 is enabled Grafting fastens, and is connected to by the suction inlet 342 between the dust laser hole 23 and the negative pressure room for promotion R.

In first embodiment, as shown in Figure 3, Figure 4, the through-hole 33 includes full open aperture 331 and half trepanning 332, described Full open aperture 331 is opened in the intermediate region of the roof 32, and the area of the full open aperture 331 and the negative pressure room for promotion R It is completely overlapped；The position that the correspondence of half trepanning 332 opens the internal ring wall 34 is opened in the neighboring area of the roof 32, and institute The area for stating half trepanning 332 is Chong Die with the negative pressure room for promotion R-portion.

In second embodiment, as shown in figure 5, the through-hole 33 is set to the intermediate region of the roof 32, and it is described logical The area in hole 33 and the negative pressure room for promotion R are completely overlapped.

In the utility model embodiment, two recess portions 35 are additionally provided with outside the roof 32 of the closeouts 30；Described two is recessed Portion 35 is located at the opposite sides of the through-hole 33.Closeouts 30 are screwed into the cleaner head 20 by the recess portion 35 to facilitate to exert a force Dust laser hole 23 in.Specifically, the recess portion 35 is configured to ladder-like, and there is the facade to connect and a plane to define shape Be configured to rectangular surfaces at, wherein the facade, there is the plane straight flange to connect with the straight flange of the facade, the plane by The arc-shaped edges of the straight flange and periphery wall 31 define to be formed.

In the utility model embodiment, as shown in Figure 4, Figure 5, the dust concentrating structure further includes sealing ring 40, institute Sealing ring 40 is stated to be sheathed on outside the convex jointing part 341 of the closeouts 30；Enable the convex jointing part 341 of the closeouts 30 and the powder 231 grafting of top end opening of dirt laser hole 23, passes through the sealing ring between the convex jointing part 341 and the top end opening 231 40 fit sealings.

In the utility model embodiment, the closeouts 30 and the fastening means of the cleaner head 20 can also include spiral shell Lock means.

The utility model is described in detail above in association with accompanying drawings and embodiments, those skilled in the art can Many variations example is made to the utility model according to the above description.Thus, certain details in embodiment should not be constituted to this reality With novel restriction, the utility model will be using the range that the appended claims define as the scope of protection of the utility model.

Claims (6)

1. a kind of dust concentrating structure for semiconductor product laser marking cleaner head, the cleaner head include vaccum suction pipe with And the suction nozzle being connect with the vaccum suction pipe, the suction nozzle have provided dust laser hole, dust laser hole forming top is opened Mouth, bottom suction inlet and sidewall opening, the sidewall opening are connected to the vaccum suction pipe；It is characterized in that, the dust collection Middle structure includes：

There is periphery wall to enclose and set to form hollow structure for closeouts, and the closeouts are configured in the opposite end of the periphery wall Cover end and inserted terminal；The masking end is formed with roof and is connect with the periphery wall, and through-hole and institute are offered on the roof State the inner space connection of periphery wall；The inserted terminal is configured to step structure and has inside contract the convex jointing part to be formed, described Convex jointing part, which exceeds the edge of the periphery wall and encloses, to be set to form suction inlet, and the suction inlet to formation negative pressure between the roof carries Between lift-off；

The top end opening grafting of the convex jointing part for enabling the closeouts and the dust laser hole fastens, the dust laser hole and institute It states and is connected to by the suction inlet between negative pressure room for promotion.

2. the dust concentrating structure according to claim 1 for semiconductor product laser marking cleaner head, feature exists In：

The closeouts are configured to double-layer circular tubular structure；The closeouts are equipped with internal ring wall on the inside of the periphery wall, described The masking end of internal ring wall is connect with the roof, and the edge of the inserted terminal of the internal ring wall beyond the periphery wall forms described convex Socket part, the negative pressure room for promotion, which is defined by the internal ring wall with the roof, to be formed.

3. the dust concentrating structure according to claim 2 for semiconductor product laser marking cleaner head, feature exists In：

The through-hole includes full open aperture and half trepanning, and the full open aperture is opened in the intermediate region of the roof, and the standard-sized sheet The area in hole and the negative pressure room for promotion are completely overlapped；The position that the half trepanning correspondence opens the internal ring wall is opened in described The neighboring area of roof, and the area of half trepanning partly overlaps with the negative pressure room for promotion.

4. the dust concentrating structure according to claim 1 for semiconductor product laser marking cleaner head, feature exists In：

The through-hole is set to the intermediate region of the roof, and the area of the through-hole and the negative pressure room for promotion are completely heavy It is folded.

5. the dust concentrating structure according to claim 2 for semiconductor product laser marking cleaner head, feature exists In：

The opposite sides that the roof is external to the through-hole is configured to two recess portions.

6. the dust for semiconductor product laser marking cleaner head according to any claim in claim 1 to 5 Concentrating structure, it is characterised in that：

The dust concentrating structure further includes sealing ring, and the sealing ring is sheathed on outside the convex jointing part of the closeouts；Enable institute The top end opening grafting for stating the convex jointing part and the dust laser hole of closeouts is led between the convex jointing part and the top end opening Cross the sealing ring fit sealing.