Background technology
Wireless charging technology be it is a kind of transmitted between two induction coils by near-field sensing principle electric power in the way of, and nothing
Transimission power, the transmission speed of micro USB electric coil are to influence the key factor of charge efficiency.The side of existing manufacture induction coil
Formula is generally using etching method and copper wire coil winding method, wherein etching method, using the production process of conventional FPC, to raw material
It is cut to obtain copper base, be drilled to copper base using drilling machine, dry film is attached in the tow sides of copper base, it will be copper-based
Plate is placed on egative film, is aligned up and down, then is exposed the effect for making circuit pass through dry film and is transferred on copper base, then is passed through
The processing for crossing developer solution, unexposed dry film is washed away and retain it is exposed occur polymerisation dry film, make circuit substantially at
Type makes etching liquid uniformly spray the surface to copper base by nozzle finally under conditions of temperature is 45 DEG C -50 DEG C, with
Do not have to etch the copper redox reaction of resist protection, and unwanted copper is reacted away, by demoulding after exposing base material
Processing makes circuit shape, which is referred to as sawing sheet → drilling → patch dry film → contraposition → exposure → development → etching, that is,
Say that the technology is that the shape of required induction coil is directly etched using image transfer method, since this method is grasped using etching
Make, directly using copper base as FPC substrates, therefore the plate thickness of the copper base as etching generally requires to be less than 70um, copper base
Spacing between the two neighboring loop line that if thickness is excessive, can not be etched, and etch is generally higher than 50um, because
Transimission power, the transmission speed of the Wireless charging coil of this its manufacture are smaller;And copper wire coil winding method is due to directly utilizing copper
Silk coiling, size is generally large, and the spacing between loop line is larger, and leads to annular since copper wire coil is yielding
Spacing between circuit is not fixed, therefore the transmission power of the copper wire coil is smaller, and efficiency of transmission is relatively low.To sum up, existing
There is the problem that transimission power, transmission speed are smaller, and the spacing between loop line is larger, coil is yielding in induction coil.
Utility model content
The utility model provides a kind of wireless charging FPC coils, between the loop line of wireless charging FPC coils
Spacing is smaller, and transimission power, transmission speed are higher.
The technical solution adopted in the utility model is a kind of wireless charging FPC coils, including FPC substrates, the FPC
The thickness of substrate is not more than 500um, and multi-ring annular circuit, two neighboring annular are equipped on the periphery of the FPC substrates
Interstice coverage between circuit is 30um-40um, and AD glue and resin ink are equipped in the gap.
After the above technical solution is adopted, the utility model has the following advantages compared with prior art:
The thickness of FPC substrates in the utility model is larger, and the gap between loop line is smaller, transmission speed, transmission
Efficiency is higher, and be equipped in gap AD glue and resin ink to support, the loop line on fixed interval (FI) both sides, prevent annular
Circuit deforms, and increases the stability and intensity of wireless charging FPC coils.
As an improvement, the thickness of the FPC substrates is 500um, the thickness of the AD glue is 30-50um, described
The thickness of resin ink is 450um-470um, and the thickness of FPC substrates is ensureing efficiency of transmission, transmission speed in 500um or so
On the basis of, lighter weight carries convenient for user.
As an improvement, the upper and lower surface of the FPC substrates is respectively equipped with protective film, wireless charging FPC coils are protected, are kept away
Exempt from loop line to be scraped off, scratch, and is readily transported wireless charging FPC coils.
As an improvement, the FPC substrates described in radium-shine cutting form the loop line, cutting accuracy is higher.
Specific implementation mode
As shown in Figures 2 and 3, the utility model provides a kind of wireless charging FPC coils, including FPC substrates 2, FPC bases
The thickness of plate 2 is not more than 500um, and multi-ring annular circuit 3, two neighboring loop line 3 are equipped on the periphery of FPC substrates 2
Between the ranging from 30um-40um of gap 4, AD glue 6 and resin ink 7 are filled in gap 4.The thickness of wherein FPC substrates 2 is
The filling thickness of 500um, AD glue 6 is 30-50um, and the filling thickness of resin ink 7 is 450um-470um, in FPC substrates 2
Upper and lower surface is respectively equipped with protective film 9, and loop line 3 therein is that radium-shine cutting obtains, and the gap 4 between loop line 3 is got over
Small, under 2 equal area of FPC substrates, the quantity of loop line 3 is then more, can improve the efficiency of transmission of signal.
The utility model is simple in structure, and the thickness of FPC substrates 2 is larger, and the gap 4 between loop line 3 is smaller, is connecting
In the case of power supply, electric energy efficiently can be converted to magnetic energy by the wireless charging FPC coils of transmitting terminal, to generate magnetic field,
The wireless charging FPC coils of receiving terminal can sense the magnetic field, and magnetic energy is converted to electric energy to realize, reaches and is filled to mobile phone
The purpose of electricity.Therefore, under same size, electric energy more efficient can be converted to magnetic energy by the utility model, improved and passed
Defeated power and transmission speed.
As shown in Figure 1, the manufacturing method of the wireless charging FPC coils in the utility model, includes the following steps:
S1, to the copper base 1 of the circular ring type after development carry out plating make its thickness increase to form FPC substrates 2, FPC substrates 2
Thickness be no more than 500um, (the circular ring type copper base after developing in above-mentioned steps refers to that carry out sawing sheet, drilling, patch to raw material dry
It is obtained after film, contraposition, exposed and developed process, wherein each step in sawing sheet, drilling, patch dry film, contraposition, exposure, development
Rapid sequence can require to be adjusted according to actual production);
S2, FPC substrates 2 are carried out radium-shine, loop line 3 is respectively cut out outward successively from the center of circle of FPC substrates 2,
When cutting, between the ranging from 30um-40um of gap 4 between adjacent two loop lines 3 and two adjacent loop lines 3
There are connecting line 5, connecting line 5 is radially extended along FPC substrates 2, and each circle loop line 3 includes multiple arcs line segment 31, arc
The head end and tail end of shape line segment 31 are respectively fixedly connected on connecting line 5;
S3, high viscosity carrier film 8 and high temperature are attached respectively dissociate film, high viscosity carrier film to the upper and lower surfaces of FPC substrates 2
One side where 8 is the upper surface of FPC substrates 2, and the one side where high temperature dissociation film is the bottom surface of FPC substrates 2, and high viscosity is held
The viscosity of film carrier 8 is 80g/25mm, and the viscosity that high temperature dissociates film is 1000g/25mm;
S4, the position on high viscosity carrier film 8 corresponding to connecting line 5 are opened a window using radium-shine or punching, exposure
Go out connecting line 5, then using the radium-shine connecting line 5 cut away between 3 gap 4 of two neighboring loop line, makes the rail of loop line 3
Mark becomes complete continuous round;
S5, a protective film 9 of taking, and in one layer of AD glue 6 of the glue surface cloth of protective film 9, then remove 2 upper table of FPC substrates
The high viscosity carrier film 8 in face, by one of AD glue on protective film down the whole upper table for being attached to FPC substrates 2 of protective film 9
Face since the viscosity of high viscosity carrier film 8 is relatively low, can remove manually in this step;
S6, the gap between making AD glue 6 be filled into loop line 3 in the upper surface of protective film 9 is pressed against with quick pressing machine
In 4, AD glue 6 has certain mobility, applies certain pressure to AD glue 6 using heat pressure roller, while heat pressure roller provides
Temperature can slow down the setting time of AD glue 6, so that it is sufficient filling with into gap 4;
S7, keep the bottom of FPC substrates 2 face-up, and first time baking is carried out to FPC substrates 2, baking for the first time makes high temperature
Dissociating the viscosity of film reduces, and then removes high temperature dissociation film, then printed in gap 4 of the vacuum printer between loop line 3
Brush resin ink 7, then second of baking is carried out, second of baking makes resin ink 7 cure, and is finally brushed away and is higher by using ceramics
7 residue of resin ink on 3 surface of loop line;The temperature range of baking and second of baking is respectively 110 DEG C -150 for the first time
DEG C, the time of baking is 3min-5min for the first time, and the time of second of baking is 30min-60min;In this step, due to
High temperature dissociate film viscosity it is larger, can not remove manually, it is therefore desirable to first to high temperature dissociation film toast, make its viscosity compared with
It is low;
S8, on the bottom surface of FPC substrates 2 attach protective film 9.
The material of high viscosity carrier film and high temperature dissociation film in the present invention is carrier film, and viscosity is different.
In S2 steps, radium-shine cutting is carried out to FPC substrates 2, the light-gathering of laser is preferable, and cutting track is convenient for control
System, radium-shine cutting accuracy is higher, and radium-shine cutting includes two ways, the first is two sides patterning method:First, according to FPC substrates 2
Integral thickness, determine the concrete numerical value of its half thickness and adjust radium-shine depth of cut, make radium-shine depth of cut
Secondly radium-shine cutting is carried out respectively from upper and lower surface at twice to FPC substrates 2, i.e., equal to the half thickness of FPC substrates 2
To cutting on one side, then another side is cut, to make the loop line 3 on two sides be interconnected, forms one, a circle
Complete loop line 3, second is the complete patterning method of one side, i.e., whole using the radium-shine FPC substrates 2 that directly disposably cut through,
Loop line 3 is often enclosed to be formed, it is larger to the power requirement of radium-shine used laser under this kind of method.
The thickness range of the copper base 1 of development is 10-50um, convenient for making the initial model of plating.
As shown in figure 3, in the present invention, it is 30-40um that protective film 9, which is CVL protective films its thickness range, AD glue 6 its
Thickness is 30-50um, and the thickness of resin ink 7 is 450um-470um, and the thickness of resin ink 7 becomes with the thickness of FPC substrates 2
Change.The quantitative range of connecting line 5 is 8-40, for example connecting line 5 takes 8,24,36 etc., and the numerical value of connecting line 5 depends on toroid
The width on road 3, width is smaller, and 5 quantity of connecting line needed is more, and connecting line 5 is for avoiding loop line 3 from being broken.
Above example is only to illustrate the technical solution of the utility model, rather than its limitations.Although with reference to aforementioned reality
Example is applied the utility model is described in detail, it will be understood by those of ordinary skill in the art that, it still can be to preceding
The technical solution recorded in embodiment stated is modified, or to wherein each section technical characteristic progress equivalent replacement, and this
A little modification or replacements, the range for the utility model embodiment technical solution that it does not separate the essence of the corresponding technical solution.