CN208044258U - A kind of heat dissipation type backlight - Google Patents
A kind of heat dissipation type backlight Download PDFInfo
- Publication number
- CN208044258U CN208044258U CN201820466074.8U CN201820466074U CN208044258U CN 208044258 U CN208044258 U CN 208044258U CN 201820466074 U CN201820466074 U CN 201820466074U CN 208044258 U CN208044258 U CN 208044258U
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- China
- Prior art keywords
- aluminium alloy
- lamp bar
- alloy plate
- heat
- heat conduction
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- Expired - Fee Related
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- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model is related to a kind of heat dissipation type backlights, including glue frame, the light guide plate and radiating piece that are arranged in glue frame, glue frame opens up lamp bar slot close to the side of light guide plate incidence surface, be provided with lamp bar in lamp bar slot, radiating piece include heat conduction rubber cushion, aluminium alloy plate, be arranged the outer surface of aluminium alloy plate thermal-radiating material and the Heat Conduction Material in aluminium alloy plate inner surface is set；Aluminium alloy plate insertion is set in glue frame, and aluminium alloy plate is located at the bottom of lamp bar slot, and lamp bar is pasted onto by heat-conducting glue on the Heat Conduction Material of aluminium alloy plate side.The heat dissipation type backlight, the bottom heat radiation part of the lamp bar slot of the backlight, it is provided with Heat Conduction Material on the inner surface of the aluminium alloy plate of the radiating piece, lamp bar is arranged on Heat Conduction Material, the heat that lamp bar generates is conducted in the plane using Heat Conduction Material, make the even heat of backlight various places inside, recycles the thermal-radiating material on aluminium alloy plate outer surface to carry out heat loss through radiation to backlight, radiating efficiency can be effectively improved.
Description
Technical field
The utility model is related to backlight technology fields, more particularly to a kind of heat dissipation type backlight.
Background technology
Liquid crystal display die set because can not self-luminous, so need coordinate backlight use, as market is to high brightness backlight
Pursuit, more and more using LED quantity in backlight, power is also increasing, and heat dissipation performance is for high brightness backlight
It is most important.
Utility model content
In order to solve above-mentioned the deficiencies in the prior art, the utility model provides a kind of backlight.The lamp bar energy of the backlight
It is enough effectively increased heat dissipation area, improves radiating efficiency.
A kind of heat dissipation type backlight, including glue frame, the light guide plate and radiating piece that are arranged in the glue frame, the glue frame lean on
The side of the nearly light guide plate incidence surface opens up lamp bar slot, and lamp bar is provided in the lamp bar slot,
The radiating piece includes heat conduction rubber cushion, aluminium alloy plate, heat radiation material in the outer surface of the aluminium alloy plate is arranged
Expect and be arranged the Heat Conduction Material in the aluminium alloy plate inner surface；The aluminium alloy plate insertion is set in the glue frame, and institute
The bottom that aluminium alloy plate is located at the lamp bar slot is stated, the lamp bar is pasted onto the aluminium alloy plate side by the heat-conducting glue
On the Heat Conduction Material.
The thickness of the thermal-radiating material is 4 μm in one of the embodiments,.
Heat Conduction Material is the copper sheet that thickness is 10 μm in one of the embodiments,.
Above-mentioned heat dissipation type backlight, the bottom heat radiation part of the lamp bar slot of the backlight, the aluminium alloy plate of the radiating piece it is interior
It is provided with Heat Conduction Material on surface, lamp bar is arranged on Heat Conduction Material, the heat that lamp bar generates is being put down using Heat Conduction Material
It is conducted on face, makes the even heat of backlight various places inside, recycle the thermal-radiating material pair on aluminium alloy plate outer surface
Backlight carries out heat loss through radiation, can effectively improve radiating efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of the heat dissipation type backlight of one of embodiment.
Specific implementation mode
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, below in conjunction with the accompanying drawings to this
The specific implementation mode of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be much to implement different from other manner described here, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific embodiment opened.
In the description of the present invention, it should be understood that term "center", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside",
The orientation or positional relationship of the instructions such as " clockwise ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " is based on ... shown in the drawings
Orientation or positional relationship is merely for convenience of describing the present invention and simplifying the description, and does not indicate or imply the indicated dress
It sets or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as to the utility model
Limitation.
As shown in Figure 1, a kind of heat dissipation type backlight, including glue frame 1, the light guide plate 2 that is arranged in the glue frame 1 and heat dissipation
Part 3, the glue frame 1 open up lamp bar slot 11 close to the side of 2 incidence surface of the light guide plate, lamp bar are provided in the lamp bar slot 11
4,
The radiating piece 3 includes heat conduction rubber cushion 31, aluminium alloy plate 32, outer surface heat spoke in the aluminium alloy plate 32 is arranged
It penetrates material 33, the Heat Conduction Material 34 in 32 inner surface of the aluminium alloy plate is set.The insertion of the aluminium alloy plate 32 is set to described
In glue frame 1, and the aluminium alloy plate 32 is located at the bottom of 4 slot 11 of the lamp bar, and the lamp bar 4 is pasted onto by the heat-conducting glue
On the Heat Conduction Material 34 of 32 side of the aluminium alloy plate.
Above-mentioned heat dissipation type backlight, the bottom heat radiation part 3 of 4 slot 11 of lamp bar of the backlight, the aluminium alloy plate of the radiating piece 3
It is provided with Heat Conduction Material 34 on 32 inner surface, lamp bar 4 is arranged on Heat Conduction Material 34, using Heat Conduction Material 34 to lamp bar 4
The heat of generation is conducted in the plane, makes the even heat of backlight various places inside, recycles 32 outer surface of aluminium alloy plate
On thermal-radiating material 33 to backlight carry out heat loss through radiation, radiating efficiency can be effectively improved.
The thickness of the thermal-radiating material 33 is 4 μm in one of the embodiments,.Thermal-radiating material 33 is by carbon nanotube
Ink sprays.
Heat Conduction Material 34 is the copper sheet that thickness is 10 μm in one of the embodiments, and the copper sheet of the thickness has well
Plane and heat conductivility, convenient for manufacture.
Lamp bar 4 includes wiring board 41 and is arranged on the wiring board 41 several luminous in one of the embodiments,
Device 42, one side of the wiring board 41 far from several luminescent devices 42 are pasted onto by heat-conducting glue on Heat Conduction Material 34；The circuit
Plate 41 is preferably FPC, and the luminescent device 42 is preferably LED.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (3)
1. a kind of heat dissipation type backlight, which is characterized in that including glue frame, the light guide plate and radiating piece that are arranged in the glue frame,
The glue frame opens up lamp bar slot close to the side of the light guide plate incidence surface, and lamp bar is provided in the lamp bar slot,
The radiating piece include heat conduction rubber cushion, aluminium alloy plate, be arranged the outer surface of the aluminium alloy plate thermal-radiating material and
Heat Conduction Material in the aluminium alloy plate inner surface is set；The aluminium alloy plate insertion is set in the glue frame, and the aluminium
Alloy sheets are located at the bottom of the lamp bar slot, and the lamp bar is pasted onto by the heat-conducting glue described in the aluminium alloy plate side
On Heat Conduction Material.
2. heat dissipation type backlight according to claim 1, which is characterized in that the thickness of the thermal-radiating material is 4 μm.
3. heat dissipation type backlight according to claim 1, which is characterized in that the Heat Conduction Material is the copper that thickness is 10 μm
Piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820466074.8U CN208044258U (en) | 2018-04-03 | 2018-04-03 | A kind of heat dissipation type backlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820466074.8U CN208044258U (en) | 2018-04-03 | 2018-04-03 | A kind of heat dissipation type backlight |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208044258U true CN208044258U (en) | 2018-11-02 |
Family
ID=63946775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820466074.8U Expired - Fee Related CN208044258U (en) | 2018-04-03 | 2018-04-03 | A kind of heat dissipation type backlight |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208044258U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111565549A (en) * | 2020-06-15 | 2020-08-21 | 高创(苏州)电子有限公司 | Heat dissipation assembly, backlight source assembly and display device |
-
2018
- 2018-04-03 CN CN201820466074.8U patent/CN208044258U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111565549A (en) * | 2020-06-15 | 2020-08-21 | 高创(苏州)电子有限公司 | Heat dissipation assembly, backlight source assembly and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181102 Termination date: 20200403 |