CN208005390U - A kind of silicon chip cutting grinding device - Google Patents

Abstract

The utility model discloses a kind of silicon chip cutting grinding devices, including shell, operation console and geometrical clamp, it is connected with support column below the shell, and the inside of support column is equipped with damper, the first motor is connected by machine governor with polishing plane, and it is provided with drainage trough on the outside of polishing plane, it is provided with supporting rack above the operation console, and supporting rack is internally connected with telescopic rod, the inside of the connecting plate opens up fluted, and groove is internally connected with fixed plate, the lower section of the fixed plate is connected with silicon chip, one end of the nozzle is connected with conduit, and the other end of conduit is connected with water pump, the water pump is connected by hose with NaOH solution tank NaOH, it is provided with console on the outside of the shell.The support construction that the silicon chip cutting is provided with support column with grinding device, damper and pedestal are constituted, damper can during the device work slowing device mechanical shock, to improve the machining accuracy that silicon chip is polished.

Description

A kind of silicon chip cutting grinding device

Technical field

The utility model is related to silicon wafer processing equipment technical field, specially a kind of silicon chip cutting grinding device.

Background technology

With the development of integrated circuit, IC chip is constantly sent out to highly integrated, densification and high-performance direction Exhibition, integrated circuit are the bases of modern information industry, and the material of used in integrated circuits is mainly silicon, germanium and GaAs etc., is integrated The circuit overwhelming majority all uses silicon chip, has very high requirement to the flatness of silicon chip surface, is needed to the silicon chip after cutting with this It polishes, damping effect is bad in the process of work for traditional silicon chip grinding device, is not easy to install in silicon chip bruting process With dismounting.

Utility model content

The purpose of this utility model is to provide a kind of silicon chip cutting grinding devices, are proposed with solving above-mentioned background technology Silicon chip grinding device currently on the market damping effect is bad in the process of work, be not easy to install in silicon chip bruting process The problem of with dismounting.

To achieve the above object, the utility model provides the following technical solutions：A kind of silicon chip cutting grinding device, including Shell, operation console and geometrical clamp are connected with support column below the shell, and the inside of support column is equipped with damper, institute The lower end for stating damper is connected with pedestal, and the operation console is arranged in the upper end of shell, and first is equipped with below operation console Motor, the first motor is connected by machine governor with polishing plane, and is provided with drainage trough on the outside of plane of polishing, The lower end of the drainage trough is connected with collecting box, and collecting box is connected by connecting tube with valve, the top of the operation console It is provided with supporting rack, and supporting rack is internally connected with telescopic rod, the lower end of the telescopic rod is equipped with the second motor, and second It is connected with connecting plate below motor, the inside of the connecting plate opens up fluted, and groove is internally connected with fixed plate, institute The fixture block that is internally provided with of fixed plate is stated, and fixture block is connected by spring with fixed plate, the lower section of the fixed plate and silicon chip Be connected, the geometrical clamp is arranged in the top of fixed plate, and geometrical clamp is internally connected with nozzle, one end of the nozzle with Conduit is connected, and the other end of conduit is connected with water pump, and the water pump is connected by hose with NaOH solution tank NaOH, the shell Outside be provided with console.

Preferably, the support column, damper and pedestal constitute support construction, and support construction is distributed in below shell Four corners.

Preferably, the drainage trough is set as annulus bathtub construction, and the lower end of drainage trough and collecting box connection Groove depth is more than the groove depth on its opposite.

Preferably, support frame as described above is set as rectangular configuration, and supporting rack is placed in shell transverse axis position.

Preferably, be between second motor and supporting rack it is longitudinal be flexibly connected, and longitudinal work of the second motor Dynamic range is less than the height of supporting rack.

Preferably, it is snap-in structure between the groove and fixed plate, and the side of inside grooves is provided with circular hole, and The diameter of circular hole is more than the diameter of fixture block.

Compared with prior art, the utility model has the beneficial effects that：The silicon chip cutting is provided with support with grinding device The support construction that column, damper and pedestal are constituted, and the four corners below shell are arranged in support construction, damper can be at this Reeded company is arranged to improve the machining accuracy of silicon chip polishing in the mechanical shock of slowing device during device works Fishplate bar, and inside grooves are provided with fixed plate, fixed plate is internally provided with spring, and spring side is connected with fixture block so that fixed It is snap-in structure between plate and groove, under the action of spring and fixture block, is convenient for fixing board card into groove, consequently facilitating fixed The installation of plate, while also allowing for fixing or removing silicon chip after dismantling fixed plate, and then improve the working efficiency of polishing.

Description of the drawings

FIG. 1 is a schematic structural view of the utility model；

Fig. 2 is the utility model overlooking structure diagram；

Fig. 3 is partial enlargement structural representation at A in the utility model Fig. 1.

In figure：1, shell, 2, support column, 3, damper, 4, pedestal, 5, operation console, 6, first motor, 7, electric machine speed regulation Device, 8, polishing plane, 9, drainage trough, 10, collecting box, 11, connecting tube, 12, valve, 13, supporting rack, 14, telescopic rod, 15, the Two motors, 16, connecting plate, 17, groove, 18, fixed plate, 19, fixture block, 20, spring, 21, silicon chip, 22, geometrical clamp, 23, nozzle, 24, conduit, 25, water pump, 26, hose, 27, NaOH solution tank NaOH, 28, console.

Specific implementation mode

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work The every other embodiment obtained, shall fall within the protection scope of the present invention.

- 3 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of silicon chip cutting grinding device, including it is outer Shell 1, damper 3, pedestal 4, operation console 5, first motor 6, machine governor 7, polishing plane 8, drainage trough 9, is received support column 2 Header 10, connecting tube 11, valve 12, supporting rack 13, telescopic rod 14, the second motor 15, connecting plate 16, groove 17, fixed plate 18, Fixture block 19, spring 20, silicon chip 21, geometrical clamp 22, nozzle 23, conduit 24, water pump 25, hose 26, NaOH solution tank NaOH 27 and console 28, The lower section of shell 1 is connected with support column 2, and the inside of support column 2 is equipped with damper 3, support column 2, damper 3 and pedestal 4 Support construction is constituted, and support construction is distributed in the four corners of the lower section of shell 1, during silicon chip is polished, damper 3 can be with The vibrations for effectively slowing down the device, to improve the precision of silicon chip polishing, the lower end of damper 3 is connected with pedestal 4, operates Platform 5 is arranged in the upper end of shell 1, and the lower section of operation console 5 is equipped with first motor 6, and first motor 6 passes through machine governor 7 It is connected with polishing plane 8, and the outside for plane 8 of polishing is provided with drainage trough 9, drainage trough 9 is set as annulus bathtub construction, and The lower end of drainage trough 9 is more than the groove depth on its opposite with the groove depth of 10 connection of collecting box, and during polishing, polishing liquid is just In the drainage trough 9 for entering annulus bathtub construction, due to the difference in height of 9 both sides of drainage trough so that polishing liquid is convenient for being flowed into collection In case 10, the lower end of drainage trough 9 is connected with collecting box 10, and collecting box 10 is connected by connecting tube 11 with valve 12, is passed through Valve 12 is convenient for handling the polishing liquid releasing in collecting box 10, and the top of operation console 5 is provided with supporting rack 13, and supporting rack 13 Be internally connected with telescopic rod 14, supporting rack 13 is set as rectangular configuration, and supporting rack 13 is placed in 1 transverse axis position of shell It sets, convenient for supporting rack 13 is fixed on shell 1, while the supporting rack 13 of position and 1 transverse axis position of shell, convenient for making lower section Silicon chip 21 be fixed on polishing plane 8 center, convenient for silicon chip polish, the lower end of telescopic rod 14 is equipped with the second motor 15, and the lower section of the second motor 15 is connected with connecting plate 16, be between the second motor 15 and supporting rack 13 it is longitudinal be flexibly connected, And second longitudinal scope of activities of motor 15 be less than the height of supporting rack 13, convenient for by the silicon chip 21 of the second motor 15 and lower section Lift, avoid silicon chip 21 from declining and excessively it is damaged, the inside of connecting plate 16 opens up fluted 17, and the inside of groove 17 It is connected with fixed plate 18, is snap-in structure between groove 17 and fixed plate 18, and the side inside groove 17 is provided with circular hole, and And the diameter of circular hole is more than the diameter of fixture block 19, fixture block 19 sticks into the circular hole of 17 inside of groove by the effect of spring 20 It is interior, to be convenient for the installation and dismounting of fixed plate 18, and then improve the working efficiency of polishing, the inside setting of fixed plate 18 There is fixture block 19, and fixture block 19 is connected by spring 20 with fixed plate 18, the lower section of fixed plate 18 is connected with silicon chip 21, fixed Folder 23 is arranged in the top of fixed plate 18, and geometrical clamp 22 is internally connected with nozzle 23, one end and 24 phase of conduit of nozzle 23 Connection, and the other end of conduit 24 is connected with water pump 25, water pump 25 is connected by hose 26 with NaOH solution tank NaOH 27, shell 1 Outside is provided with console 28.

Operation principle：When using the silicon chip cutting grinding device, it is necessary first to the silicon chip cutting grinding device Overall structure simply understood, device is first transported to fixed place by staff, and pedestal 4 is stably placed at On ground, polishing liquid is added into NaOH solution tank NaOH 27, which is powered on, the device is adjusted by console 28, Fixed plate 18 is removed, silicon chip 21 is placed on to the lower surface of fixed plate 18, is then sticked into fixed plate 18 recessed in connecting plate 16 In slot 17, starts first motor 6 later and drive polishing plane 8 to rotate by machine governor 7, water pump 25 is opened, by liquid of polishing It is imported into nozzle 23 by conduit 24, adjusting geometrical clamp 22 makes nozzle 23 be directed toward silicon chip 21, starts the second motor 15 and passes through connection Plate 16 drives fixed plate 18 to rotate, and then adjustable telescopic rod 14 declines so that the contact polishing plane 8 of silicon chip 21 is polished, and is beaten During mill, polishing liquid is entered by drainage trough 9 in collecting box 10, then polishing liquid is discharged by valve 12, this theory The content not being described in detail in bright belongs to the prior art well known to professional and technical personnel in the field.

Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art is come Say, still can with technical scheme described in the above embodiments is modified, or to which part technical characteristic into Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all It is included within the scope of protection of this utility model.

Claims (6)

1. a kind of silicon chip cutting grinding device, including shell（1）, operation console（5）And geometrical clamp（22）, it is characterised in that：Institute State shell（1）Lower section be connected with support column（2）, and support column（2）Inside damper is installed（3）, the damper（3） Lower end be connected with pedestal（4）, the operation console（5）It is arranged in shell（1）Upper end, and operation console（5）Lower section be equipped with First motor（6）, the first motor（6）Pass through machine governor（7）With polishing plane（8）It is connected, and plane of polishing（8） Outside be provided with drainage trough（9）, the drainage trough（9）Lower end be connected with collecting box（10）, and collecting box（10）Pass through company It takes over（11）With valve（12）It is connected, the operation console（5）Top be provided with supporting rack（13）, and supporting rack（13）It is interior Portion is connected with telescopic rod（14）, the telescopic rod（14）Lower end the second motor is installed（15）, and the second motor（15）Under Side is connected with connecting plate（16）, the connecting plate（16）Inside open up it is fluted（17）, and groove（17）Be internally connected with Fixed plate（18）, the fixed plate（18）Be internally provided with fixture block（19）, and fixture block（19）Pass through spring（20）With fixed plate （18）It is connected, the fixed plate（18）Lower section and silicon chip（21）It is connected, the geometrical clamp（22）It is arranged in fixed plate （18）Top, and geometrical clamp（22）Be internally connected with nozzle（23）, the nozzle（23）One end and conduit（24）It is connected It connects, and conduit（24）The other end and water pump（25）It is connected, the water pump（25）Pass through hose（26）With NaOH solution tank NaOH（27）Phase Connection, the shell（1）Outside be provided with console（28）.

2. a kind of silicon chip cutting grinding device according to claim 1, it is characterised in that：The support column（2）, damping Device（3）And pedestal（4）Support construction is constituted, and support construction is distributed in shell（1）The four corners of lower section.

3. a kind of silicon chip cutting grinding device according to claim 1, it is characterised in that：The drainage trough（9）Setting For annulus bathtub construction, and drainage trough（9）Lower end and collecting box（10）The groove depth of connection is more than the groove depth on its opposite.

4. a kind of silicon chip cutting grinding device according to claim 1, it is characterised in that：Support frame as described above（13）Setting For rectangular configuration, and supporting rack（13）It is placed in shell（1）Transverse axis position.

5. a kind of silicon chip cutting grinding device according to claim 1, it is characterised in that：Second motor（15）With Supporting rack（13）Between be longitudinal flexible connection, and the second motor（15）Longitudinal scope of activities be less than supporting rack（13）'s Highly.

6. a kind of silicon chip cutting grinding device according to claim 1, it is characterised in that：The groove（17）With fixation Plate（18）Between be snap-in structure, and groove（17）Internal side is provided with circular hole, and the diameter of circular hole is more than fixture block （19）Diameter.