CN207995499U - A kind of porous ceramics electronic circuit - Google Patents
A kind of porous ceramics electronic circuit Download PDFInfo
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- CN207995499U CN207995499U CN201820147023.9U CN201820147023U CN207995499U CN 207995499 U CN207995499 U CN 207995499U CN 201820147023 U CN201820147023 U CN 201820147023U CN 207995499 U CN207995499 U CN 207995499U
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Abstract
The utility model discloses a kind of porous ceramics electronic circuit, including electronic circuit, porous ceramics and resin；The electronic circuit is set on the porous ceramics, fills or be coated with the resin in the hole of the porous ceramics, forms resin/ceramic composite；The microscopic appearance of the hole of the porous ceramics includes one or more of spherical, spherical, sheet or vertical finger-like；The pore-size of the porous ceramics is 1um 1000um.Resin is filled or infiltrated in the tiny hole of porous ceramics, the weight of the carrier of entire electronic circuit can be effectively reduced using the lighter proportion of resin, simultaneously because the filling of resin can improve the toughness and impact resistance of ceramics；When electronic circuit as antenna in use, can both adjust the size of the careful degree and hole of ceramic hole using the resin with differing dielectric constant, to adjust the dielectric constant of entire porous ceramics, and then increase the application range of porous ceramics electronic circuit.
Description
Technical field
The utility model belongs to electronic circuit communication field, more particularly to a kind of porous ceramics electronic circuit.
Background technology
Mobile consumer electronics field at present, on ceramics adhesion metal layer manufacture electronic circuit oneself become more and more extensive and make
Electronic circuit form；In order to reach beautiful needs, electronic circuit needs are thinner to save space, while also requiring electronics
Circuit in a limited space in performance and more efficient；The electronic circuit of different frequency has different requirements to dielectric constant；Because of pottery
Porcelain is by being sintered, therefore its structure is more careful, proportion is larger, dielectric constant (Dk) is relatively simple, to limit ceramic electrical
The use scope on sub-line road.
Utility model content
The utility model provides a kind of porous ceramics electronic circuit, and tree is filled or infiltrated in the tiny hole of porous ceramics
Fat can effectively reduce the weight of the carrier of entire electronic circuit using the lighter proportion of resin, simultaneously because the filling of resin
The toughness and impact resistance of ceramics can be improved；The careful of ceramic hole can be both adjusted using the resin with differing dielectric constant
The size of density and hole to adjust the dielectric constant of entire porous ceramics, and then increases the application of porous ceramics electronic circuit
Range.
The technical solution of the utility model is as follows：
A kind of porous ceramics electronic circuit, including electronic circuit, porous ceramics and resin；The electronic circuit is set to institute
It states on porous ceramics, fills or be coated with the resin in the hole of the porous ceramics, form resin/ceramic composite；
The microscopic appearance of the hole of the porous ceramics includes one or more of spherical, spherical, sheet or vertical finger-like；It is described
The pore-size of porous ceramics is 1um-1000um.When pore-size is less than 1um, since surface tension is excessive, it is unfavorable for setting
The smooth filling of fat material；And when hole is more than 1000um, the decline of porous ceramics mechanical strength can be caused, be unfavorable for keeping
Integrally-built stability.
Preferably, the open-cell porosity of the porous ceramics ranging from 5%-50%.When porosity ranges are less than 5%,
It is not enough to form the three-dimensional communication pore network from porous ceramic surface up to internal all areas, therefore is unfavorable for resin material
Smooth filling；When porosity ranges are between 5% to 10%, it is sufficient to be formed from porous ceramic surface up to internal all areas
The three-dimensional communication pore network in domain will not hinder the smooth filling of resin material, will not significantly damage the machinery of porous ceramics
Intensity；When porosity ranges are more than 50%, the decline of porous ceramics mechanical strength can be caused, be unfavorable for keeping integrally-built
Stability.
Preferably, the open-cell porosity of the porous ceramics ranging from 5%-10%.Exist for open-cell porosity range
The case where porous ceramics of 5%-10%, ceramics/resin composite materials especially suitable for being partially filled with resin.Work as ceramics
For porosity ranges in 5%-10%, the fill rate among the ceramic hole of resin filling is moderate, by controlling the filling time just
It can easier realize the depth for accurately controlling resin filling, ensure that the consistency of product processing procedure.Except this range, work as hole
When gap rate is more than 10%, resin is very easy to be filled among hole, but the case where needing to accurately control resin depth of cracking closure
Under, technique controlling difficulty will slightly increase.
Preferably, microscopic appearance is that spherical, the spherical porous ceramics porosity ranges are set as 5%-30%；
Microscopic appearance is that the porosity ranges of the porous ceramics of sheet are set as 10%-30%；Microscopic appearance is vertical finger-like
The porosity ranges of the porous ceramics are set as 30%-50%.The ceramics of different gap microscopic appearances select different holes
Rate, to maintain the mechanical strength of the porous ceramics.
Preferably, the electronic circuit is attached to the porous pottery by way of printing, transfer, gold stamping, attaching or LDS
On porcelain.
Preferably, the resin is selected from polyethylene, polystyrene, polypropylene, makrolon, nylon, polyether-ether-ketone, polyethers
Inkstone, polyvinyl chloride, acrylonitrile butadiene and styrol copolymer (ABS), one kind in polyimides (PI) or its alloy.
Preferably, the resin is immersed in by way of dipping, injection molding or encapsulation in the hole of the porous ceramics.
Preferably, the resin fills the hole of the porous ceramics and/or the resin portion/whole is coated on institute
State porous ceramic surface.
Preferably, the resin contains metal component, and the metal component is attached to the tree by LDS and change depositing process
Fat.
Preferably, the porous ceramics be one pack system ceramics, the one-component ceramics be zirconium oxide, aluminium oxide, titanium oxide,
Magnesia, silicon carbide, silicon nitride, boron nitride, aluminium nitride, mullite, cordierite, rare earth manganese oxide, alkali silicate or
The microscopic appearance of one kind in metal phosphate, the one-component ceramic raw material is spheric granules or spherical particle, the list
The particle median size of component ceramic raw material is 100nm between 5um, and specific grain surface product is 5m2/ g to 50m2/ g it
Between.One-component ceramic raw material as characterized above has higher sintering activity, is conducive to avoid ceramic plain embryo machine-shaping
Difficulty, and the problems such as be susceptible in sintering process not fine and close sintering, abnormal grain growth, can ensure that porous ceramics is whole
The stability of body structure；When the particle median of ceramic raw material is less than 100nm or specific surface area more than 50m2It, will be notable when/g
The evenly dispersed difficulty for increasing ceramic slurry, when particle median is more than 5um or specific surface area less than 5m2When/g, it may be difficult to
Ensure the abundant sintering of ceramic raw material, it is difficult to obtain the porous ceramics of stable structure.
Preferably, the porous ceramics is multicomponent composite ceramics, and the multicomponent composite ceramics include the first matrix group
Divide and the second supplemental components, first matrix component one kind in the one-component ceramics, second supplementation group sort
It is selected from alkali metal oxide, alkaline-earth metal oxygen from one or more or described second supplemental components in the one-component ceramics
Compound, silica, diboron trioxide, bismuth oxide, manganese dioxide, iron oxide, nickel oxide, cobalt oxide, yttrium oxide, scandium oxide with
And it is one or more in rare earth oxide；The raw material microscopic appearance of first matrix component is spheric granules or spherical
The raw material median size of grain, first matrix component is 100nm-5um, and specific grain surface product is 5m2/g-50m2/g；
The component raw material microscopic appearance of second supplemental components is spherical, spherical, fibrous, sheet, one kind in tubulose or several
Kind, the raw material median size of second supplemental components is 10nm-10um, and the specific surface area of raw material is 5m2/g-
200m2/g.First matrix component as characterized above and the one-component ceramic raw material application effect having the same；Have
Second supplemental components of features described above also have enhancing more other than having application effect identical with one-component ceramic raw material
The effect of the mechanical strength and fracture toughness of hole ceramics.
The preparation method that the utility model also provides the resin/ceramic composite includes the following steps：
The first step：All material powders of the porous ceramics are proportionally mixed, according still further to ratio addition solvent,
It is one or more in dispersant, binder, plasticizer, foaming agent, pore creating material and levelling agent, and will own using hybrid technique
Material is uniformly mixed, and the slurry presoma of the porous ceramics is made；
Second step：The slurry presoma that the first step obtains is filtered removal of impurities, and utilizes casting molding processes, phase
Convert moulding process, extruding-out process, mould-forming process, isostatic pressing process, foaming forming technique, freeze-drying at
The plain embryo of the porous ceramics is made in one or more of type technique；
Third walks：Take non-pressure sintering technology, pressure sintering technique, plasma discharging hot-pressing sintering technique, microwave sintering
It is one or more in technique, high temperature sintering is carried out to the plain embryo, obtains the porous ceramics；
4th step：On the surface for the porous ceramics that third walks, spin coating proceeding, impregnation technology, spraying are utilized
Resin is filled into the trepanning hole of the porous ceramics by one or more of technique, printing technology, and is carried out pre- solid
Change, obtains the resin/ceramic composite.
Preferably, the electronic circuit passes through as antenna in use, because different resins has different dielectric constants
The dielectric constant of ceramic electronic circuit can be adjusted by adjusting the ratio of resin, to improve the performance of antenna and transmission.
Compared with prior art, the beneficial effects of the utility model are as follows：
Resin is arranged in the utility model in porous ceramics, reduces the quality of entire electronic circuit, and enhances more
The toughness and impact resistance of hole ceramics；The ceramics of different gap microscopic appearances select different porositys, to remain described porous
The mechanical strength of ceramics；Different resins has different dielectric constants, and the ratio by adjusting resin can adjust ceramic electrical
The dielectric constant on sub-line road, to increase scope of application when ceramic electronic circuit is used as antenna.
Certainly, any product for implementing the utility model does not necessarily require achieving all the advantages described above at the same time.
Description of the drawings
Fig. 1 is the structural schematic diagram of the porous ceramic matrices suitable 1 of the embodiments of the present invention 1；
Fig. 2 is the structural representation of PI resins/ceramic composite 1-a of the partial immersion of the embodiments of the present invention 1
Figure；
Fig. 3 is the structural representation of PI resins/ceramic composite 1-b of the thorough impregnation of the embodiments of the present invention 1
Figure；
Fig. 4 is the structural schematic diagram of the porous ceramic matrices suitable 2 of the embodiments of the present invention 2；
Fig. 5 is the structural representation of PI resins/ceramic composite 2-a of the partial immersion of the embodiments of the present invention 2
Figure；
Fig. 6 is the structural representation of PI resins/ceramic composite 2-b of the thorough impregnation of the embodiments of the present invention 2
Figure；
Fig. 7 is that the LDS resins/ceramic composite surface of the utility model embodiment 3 prepares the schematic diagram of electronic circuit；
Fig. 8 is the structure design of the porous ceramic matrices suitable of the hexagonal hole of the utility model other embodiment；
Fig. 9 is the structure design of the porous ceramic matrices suitable of the multistage hexagonal hole of the utility model other embodiment；
Figure 10 is the structure design of the porous ceramic matrices suitable of the sheetlike pores of the utility model other embodiment；
Figure 11 is the structure design of the porous ceramic matrices suitable of the vertical finger-like hole of the utility model other embodiment.
Specific implementation mode
With reference to specific embodiment, the utility model is expanded on further.It should be understood that these embodiments are merely to illustrate
The utility model, rather than limit the scope of protection of the utility model.Those skilled in the art are according to this in practical applications
The modifications and adaptations that utility model is made, still fall within the scope of protection of the utility model.
Reach the ratio of adjustment institute potting resin by selecting the density in ceramic fine crack/hole, so as to adjust ceramic electrical
The dielectric constant on sub-line road.In order to better illustrate the utility model, the utility model is carried out below with attached drawing detailed
Description.
A kind of porous ceramics electronic circuit, including electronic circuit, porous ceramics and resin；The electronic circuit is set to institute
It states on porous ceramics, fills or be coated with the resin in the hole of the porous ceramics, form resin/ceramic composite；
The microscopic appearance of the hole of the porous ceramics includes one or more of spherical, spherical, sheet or vertical finger-like；It is described
The pore-size of porous ceramics is 1um-1000um.When pore-size is less than 1um, since surface tension is excessive, it is unfavorable for setting
The smooth filling of fat material；And when hole is more than 1000um, the decline of porous ceramics mechanical strength can be caused, be unfavorable for keeping
Integrally-built stability.
Further, the open-cell porosity of the porous ceramics ranging from 5%-50%.When porosity ranges are less than 5%
When, it is not enough to form the three-dimensional communication pore network from porous ceramic surface up to internal all areas, therefore be unfavorable for resin
The smooth filling of material；When porosity ranges are between 5% to 10%, it is sufficient to be formed from porous ceramic surface up to internal institute
The three-dimensional communication pore network for having region will not hinder the smooth filling of resin material, will not significantly damage porous ceramics
Mechanical strength；When porosity ranges are more than 50%, the decline of porous ceramics mechanical strength can be caused, be unfavorable for keeping whole knot
The stability of structure.
Further, the open-cell porosity of the porous ceramics ranging from 5%-10%.Exist for open-cell porosity range
The porous ceramics of 5%-10%, especially suitable for being partially filled with ceramics/resin compounded material of resin as shown in Figure 2 and Figure 5
The case where material.When ceramic porosity ranges are in 5%-10%, the fill rate among the ceramic hole of resin filling is moderate, passes through
The control filling time can easier realize the depth for accurately controlling resin filling, ensure that the consistency of product processing procedure.
Except this range, when porosity is more than 10%, resin is very easy to be filled among hole, but is needing to accurately control resin
In the case of depth of cracking closure, technique controlling difficulty will slightly increase.
Fig. 1 and Fig. 4 is the porous ceramics containing spherical, spherical hole, and Figure 10 is the porous ceramics containing sheetlike pores, Figure 11
For the porous ceramics of vertical finger-like hole, the above structure is adapted to porous ceramics of the porosity in 5% to 50% range.More
Good, the porous ceramics of the structure of Fig. 1 and Fig. 4 more suitable for porosity in 5% to 30% range, Figure 10 is more suitable for hole
Porous ceramics of the rate in 10% to 30% range, porous potteries of the Figure 11 more suitable for porosity in 30% to 50% range
Porcelain.
Preferably, the porous ceramics be one pack system ceramics, the one-component ceramics be zirconium oxide, aluminium oxide, titanium oxide,
Magnesia, silicon carbide, silicon nitride, boron nitride, aluminium nitride, mullite, cordierite, rare earth manganese oxide, alkali silicate or
The microscopic appearance of one kind in metal phosphate, the one-component ceramic raw material is spheric granules or spherical particle, the list
The particle median size of component ceramic raw material is 100nm between 5um, and specific grain surface product is 5m2/ g to 50m2/ g it
Between.One-component ceramic raw material as characterized above has higher sintering activity, is conducive to avoid ceramic plain embryo machine-shaping
Difficulty, and the problems such as be susceptible in sintering process not fine and close sintering, abnormal grain growth, can ensure that porous ceramics is whole
The stability of body structure；When the particle median of ceramic raw material is less than 100nm or specific surface area more than 50m2It, will be notable when/g
The evenly dispersed difficulty for increasing ceramic slurry, when particle median is more than 5um or specific surface area less than 5m2When/g, it may be difficult to
Ensure the abundant sintering of ceramic raw material, it is difficult to obtain the porous ceramics of stable structure.
Preferably, the porous ceramics is multicomponent composite ceramics, and the multicomponent composite ceramics include the first matrix group
Divide and the second supplemental components, first matrix component one kind in the one-component ceramics, second supplementation group sort
It is selected from alkali metal oxide, alkaline-earth metal oxygen from one or more or described second supplemental components in the one-component ceramics
Compound, silica, diboron trioxide, bismuth oxide, manganese dioxide, iron oxide, nickel oxide, cobalt oxide, yttrium oxide, scandium oxide with
And it is one or more in rare earth oxide；The raw material microscopic appearance of first matrix component is spheric granules or spherical
The raw material median size of grain, first matrix component is 100nm-5um, and specific grain surface product is 5m2/g-50m2/g；
The component raw material microscopic appearance of second supplemental components is spherical, spherical, fibrous, sheet, one kind in tubulose or several
Kind, the raw material median size of second supplemental components is 10nm-10um, and the specific surface area of raw material is 5m2/g-
200m2/g.First matrix component as characterized above and the one-component ceramic raw material application effect having the same；Have
Second supplemental components of features described above also have enhancing more other than having application effect identical with one-component ceramic raw material
The effect of the mechanical strength and fracture toughness of hole ceramics.
The porous ceramics electronic circuit of the utility model is expanded on further with reference to specific embodiment
Embodiment 1
The first step：Selective oxidation zirconium (ZrO2) powder is as the first matrix component of porous ceramics (middle position of Zirconium powder
Grain size is 500nm, specific surface area 11m2/ g), nano yttrium oxide (Y2O3) second supplemental components of the powder as porous ceramics
(yttrium oxide powder is spherical, median 40nm, specific surface area 100m2/ g), spherical graphite powder is as porous
(median of spherical graphite powder is 2um to the pore creating material of ceramics, specific surface area 15m2/ g), select triethanolamine for dispersion
Agent, PVB are binder, dibutyl phthalate is plasticizer and select absolute ethyl alcohol for solvent, and according to ZrO2：
Y2O3：Spherical graphite：Triethanolamine：PVB：Lead dibatyl phithalate：Absolute ethyl alcohol=92:8:30:5:5:5:60 mass ratio
Example configuration ceramic slurry, and slurry is adequately disperseed using planetary ball mill, obtain presoma.
Second step：Removal of impurities is filtered to presoma, and slurry is cast and is dried using casting molding processes, passes through essence
Really control scraper height obtains the ceramic casting films that thickness is 200um, and multi-layer ceramics casting films progress lamination is obtained porous pottery
The required thickness of porcelain electronic circuit then carries out isostatic pressing under the conditions of 70 DEG C, 3000psi, and the dwell time is
10min obtains ceramic plain embryo.
Third walks：Using non-pressure sintering technology, it is slowly increased to from room temperature with the heating rate of 2 DEG C/min in high temperature furnace
1400 DEG C, and keep the temperature 2h, high temperature sintering is carried out to ceramic plain embryo and obtains porous ceramics, in the process, pore creating material in plain embryo,
Dispersant, binder are removed, and leave the trepanning of three-dimensional communication, and obtained 1 structural schematic diagram of porous ceramic matrices suitable is referring to figure
1。
4th step：Using impregnation technology, porous ceramic matrices suitable 1 is completely submerged in the precursor solution of PI resins, with
This starts simultaneously at timing, accurately controls dip time when reaching 30min, has the porous ceramics of PI resins to take partial immersion
Go out, and carry out baking and curing, obtains PI resins/ceramic composite 1-a, PI resin/ceramic composite 1-a of partial immersion
Structural schematic diagram is referring to Fig. 2.Similar, other a piece of identical porous ceramic matrices suitable 1 is completely submerged in the forerunner of PI resins
In liquid solution, and vacuum defoamation is carried out fully to remove the residual gas in porous ceramics, to reach the resin of thorough impregnation
Filling effect carries out precuring to precursor solution, obtains PI resins/ceramic composite 1-b, PI resin/Ceramic Composite material
Expect 1-b structural schematic diagrams referring to Fig. 3.
Embodiment 2
The first step：Selective oxidation zirconium (ZrO2) powder is as the first matrix component of porous ceramics (middle position of Zirconium powder
Grain size is 500nm, specific surface area 11m2/ g), nano yttrium oxide (Y2O3) second supplemental components of the powder as porous ceramics
(yttrium oxide powder is spherical, median 40nm, specific surface area 100m2/ g), spherical graphite powder is as porous
(median of spherical graphite powder is 2um to the pore creating material of ceramics, specific surface area 15m2/ g), select triethanolamine for dispersion
Agent, PVB are binder, dibutyl phthalate is plasticizer and select absolute ethyl alcohol for solvent, and according to ZrO2：
Y2O3：Spherical graphite：Triethanolamine：PVB：Lead dibatyl phithalate：Absolute ethyl alcohol=92:8:25:5:5:5:60 mass ratio
Example configuration ceramic slurry, and slurry is adequately disperseed using planetary ball mill, obtain presoma.
Second step：Removal of impurities is filtered to presoma, and slurry is cast and is dried using casting molding processes, passes through essence
Really control scraper height obtains the ceramic casting films that thickness is 200um, and multi-layer ceramics casting films progress lamination is obtained porous pottery
The required thickness of porcelain electronic circuit then carries out isostatic pressing under the conditions of 70 DEG C, 3000psi, and the dwell time is
10min obtains ceramic plain embryo.
Third walks：Using non-pressure sintering technology, it is slowly increased to from room temperature with the heating rate of 2 DEG C/min in high temperature furnace
1400 DEG C, and keep the temperature 2h, high temperature sintering is carried out to ceramic plain embryo and obtains porous ceramics in the process, pore creating material in plain embryo,
Dispersant, binder are removed, and leave the trepanning of three-dimensional communication, and obtained 2 structural schematic diagram of porous ceramic matrices suitable is referring to figure
4。
4th step：Using impregnation technology, porous ceramic matrices suitable 2 is completely submerged in the precursor solution of PI resins, with
This starts simultaneously at timing, accurately controls dip time when reaching 40min, has the porous ceramics of PI resins to take partial immersion
Go out, and carry out baking and curing, obtains PI resins/ceramic composite 2-a, PI resin/ceramic composite 2-a of partial immersion
Structural schematic diagram is referring to Fig. 5.Similar, other a piece of identical porous ceramic matrices suitable 2 is completely submerged in the forerunner of PI resins
In liquid solution, and vacuum defoamation is carried out fully to remove the residual gas in porous ceramics, to reach the resin of thorough impregnation
Filling effect carries out precuring to precursor solution, obtains PI resins/ceramic composite 2-b, PI resin/Ceramic Composite material
Expect 2-b structural schematic diagrams referring to Fig. 6.
To the following characterization of performance progress for resin/ceramic composite that above-described embodiment obtains：
Open-cell porosity is detected using Archimedes's drainage；
Apparent density is detected using weight method；
Relative dielectric constant is detected using empty resonance method；
Fracture toughness is measured using Single edge notch beam (SENB)；
Specimen size is 2mm*4mm*36mm, kerf width 0.25mm, and span is 20mm when measurement, and loading speed is
0.5mm/min.And compared with corresponding reference sample testing result, statistics see the table below 1.
It can also be seen that, relative to compact zirconia ceramics, PI resins/ceramic composite can have by data in table 1
Effect reduces the proportion of material, while fracture toughness also gets a promotion；And by resin fill porous ceramics, also make PI resins/
The dielectric constant of ceramic composite is different from compact zirconia ceramics.
It can be obtained in conjunction with the embodiments from table 1, by adjusting the time of impregnating resin, the number of dipping and dipping environment
Vacuum degree rationally to adjust the dipping total amount of resin, obtains resin/Ceramic Composite of partial immersion resin or thorough impregnation resin
Material, such as PI resins/ceramic composite 1-a and PI resins/ceramic composite 1-b, to reach adjusting resin/ceramics
The purpose of the dielectric constant of composite material；In addition, pore size and porosity by changing porous ceramics, and then fill not
Resin in proportion obtains PI resins/ceramic composite 1-b and PI resins/ceramic composite 2-b, is adjusted to reach
The purpose of the dielectric constant of resin/ceramic composite；It is of course also possible to fill different types of resin to adjust resin/pottery
The dielectric constant of porcelain composite material.
The performance characterization of 1 different materials of table
Embodiment 3
Electronic circuit is prepared on LDS resins/ceramic composite
LDS is the abbreviation of Laser Direct Structure, is that one kind of LPKF D. O. O.'s exploitation is directly done on plastic cement
The gold-plated technique of selectivity；LDS resins refer to the resin that disclosure satisfy that LDS techniques.Contain in the raw material of LDS resins appropriate
Metal component.
The first step：LDS resins are replaced into former PI resins used in embodiment 1, and according to preparation PI trees in embodiment 1
The Overall Steps of fat/ceramic composite 1-b prepare LDS resins/ceramic composite.
Second step：It is radium-shine to LDS resins/ceramic composite surface (region for having electronic circuit) progress using laser,
To which activation is exposed the LDS resin surfaces in region.
Third walks：Using being electroplated and/or changing depositing process required electronics is obtained in radium-shine region surface deposited metal layer
Circuit.LDS resins/ceramic composite surface prepares electronic line structure figure referring to Fig. 7.
In other embodiments, can also by change porous ceramic matrices suitable hole microscopic appearance come adjust resin/
The dielectric constant of ceramic composite, the microscopic appearance of the hole of porous ceramic matrices suitable include spherical, spherical, sheet or vertically
One or more of finger-like, specifically, the gap microscopic appearance structure of porous ceramic matrices suitable is referring to Fig. 8-11.
The preferred embodiment in the utility model disclosed above is only intended to help to illustrate the utility model.Preferred embodiment is simultaneously
There is no the details that detailed descriptionthe is all, does not limit the specific implementation mode that the utility model is only described yet.Obviously, according to this theory
The content of bright book can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to preferably
The principles of the present invention and practical application are explained, to enable skilled artisan to be best understood by and utilize this
Utility model.The utility model is limited only by the claims and their full scope and equivalents.
Claims (8)
1. a kind of porous ceramics electronic circuit, which is characterized in that including electronic circuit, porous ceramics and resin；The electric wire
Road is set on the porous ceramics, fills or be coated with the resin in the hole of the porous ceramics, forms resin/ceramics
Composite material；The microscopic appearance of the hole of the porous ceramics include spherical, spherical, sheet or one kind in vertical finger-like or
It is several；The pore-size of the porous ceramics is 1um-1000um.
2. porous ceramics electronic circuit according to claim 1, which is characterized in that the open-cell porosity of the porous ceramics
Ranging from 5%-50%.
3. porous ceramics electronic circuit according to claim 2, which is characterized in that the open-cell porosity of the porous ceramics
Ranging from 5%-10%.
4. porous ceramics electronic circuit according to claim 2, which is characterized in that microscopic appearance is spherical, spherical
The porosity ranges of the porous ceramics are set as 5%-30%；Microscopic appearance is the porosity model of the porous ceramics of sheet
It encloses and is set as 10%-30%；Microscopic appearance is that the porosity ranges of the porous ceramics of vertical finger-like are set as 30%-
50%.
5. porous ceramics electronic circuit according to claim 1, which is characterized in that the electronic circuit by printing, turn
The mode of print, gold stamping, attaching or LDS is attached on the porous ceramics.
6. porous ceramics electronic circuit according to claim 1, which is characterized in that the resin by dipping, injection molding or
The mode of encapsulation is immersed in the hole of the porous ceramics.
7. porous ceramics electronic circuit according to claim 1, which is characterized in that the resin fills the porous ceramics
Hole and/or the resin portion/whole be coated on the porous ceramic surface.
8. porous ceramics electronic circuit according to claim 1, which is characterized in that the resin contains metal component, institute
It states metal component and the resin is attached to by LDS and change depositing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820147023.9U CN207995499U (en) | 2018-01-29 | 2018-01-29 | A kind of porous ceramics electronic circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820147023.9U CN207995499U (en) | 2018-01-29 | 2018-01-29 | A kind of porous ceramics electronic circuit |
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| CN207995499U true CN207995499U (en) | 2018-10-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490352A (en) * | 2021-06-30 | 2021-10-08 | Oppo广东移动通信有限公司 | Shell, preparation method thereof and electronic equipment |
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2018
- 2018-01-29 CN CN201820147023.9U patent/CN207995499U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490352A (en) * | 2021-06-30 | 2021-10-08 | Oppo广东移动通信有限公司 | Shell, preparation method thereof and electronic equipment |
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