CN207966981U - Back side illumination image sensor - Google Patents
Back side illumination image sensor Download PDFInfo
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- CN207966981U CN207966981U CN201820160839.5U CN201820160839U CN207966981U CN 207966981 U CN207966981 U CN 207966981U CN 201820160839 U CN201820160839 U CN 201820160839U CN 207966981 U CN207966981 U CN 207966981U
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- back side
- illumination image
- image sensor
- side illumination
- metal
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Abstract
The utility model proposes a kind of back side illumination image sensors, metal routing are arranged in the back side of the back side illumination image sensor, the metal routing is used for transmission power supply signal, earth signal or data-signal；The metal routing at the back side is connected to the positive power signal line metal of back side illumination image sensor, earth signal line metal or data signal line metal by through-hole or groove, improves the driving capability of signal, reduces the voltage drop in transmission.
Description
Technical field
The utility model is related to image sensor technologies field more particularly to a kind of back side illumination image sensors.
Background technology
Back side illumination image sensor（BSI CMOS image sensor）It is in traditional preceding illuminated image sensor（FSI
CMOS image sensor）The original circuit part between lenticule and light receiving semiconductor is shifted on the basis of technology
To around or below light receiving semiconductor, light sensitive diode region, metal interconnection are made in semiconductor substrate front first, it is then right
The semiconductor substrate back side is thinned, and light sensitive diode is interconnected extraction, and at the semiconductor substrate back side, respective production is micro-
Lens so that light can directly enter light receiving semiconductor from the back side, reduce reflection, greatly improve the efficiency of daylighting, and front is complete
Portion leaves photodiode for, realizes fill factor as big as possible.Light sensitive diode region is connected to half by metal
The metal pad of conductor substrate back realizes the transmission of the power line signal, earth signal or data-signal in light sensitive diode region.
Utility model content
The purpose of this utility model is to provide a kind of back side illumination image sensors, improve the driving capability of signal, reduce
Voltage drop in transmission.
Based on considerations above, the utility model proposes a kind of back side illumination image sensors, are sensed in the back side illumination image
Metal routing is arranged in the back side of device, and the metal routing is used for transmission power supply signal, earth signal or data-signal；The back side
Metal routing is connected to the positive power signal line metal of back side illumination image sensor, earth signal line metal by through-hole or groove
Or data signal line metal, the driving capability of signal is improved, the voltage drop in transmission is reduced.
Preferably, the through-hole of part or groove are set to non-welding disking area.
Preferably, the metal routing at some or all of described back side illumination image sensor back side is connected to back side illumination image
The metal pad at the sensor back side.
Preferably, the metal routing at the back side be connected to the positive power signal line of back side illumination image sensor, believe
Number line or data signal line, and it is connected to the positive metal pad of back side illumination image sensor.
Preferably, there is pixel array region, the metal routing at the back side to be set to picture at the back side illumination image sensor back side
Pixel array area periphery, there are spacing, the spacing to be more than 5 μm between effective photosensitive pixel area.
Preferably, the thickness of the metal routing at the back side is more than 0.1 μm.
Compared with prior art, the utility model has the advantages that with back side illumination image sensor：
In the utility model, metal routing is set in the back side of the back side illumination image sensor, the metal routing is used
Back-illuminated type is connected to by through-hole or groove in transmission power supply signal, earth signal or data-signal, the metal routing at the back side
The positive power signal line metal of imaging sensor, earth signal line metal, earth signal line metal or data signal line metal improve
The driving capability of signal reduces the voltage drop in transmission.
Description of the drawings
By the Figure of description and then tool together with Figure of description for illustrating the certain principles of the utility model
Body embodiment, other feature and advantage will be apparent or more specifically illustrated possessed by the utility model.
Fig. 1 is the schematic diagram that metal routing is arranged according to the imaging sensor back side of the utility model one embodiment；
Fig. 2 is the schematic diagram that metal pad is arranged according to the imaging sensor back side of the utility model one embodiment.
Specific implementation mode
It, will be with reference to constituting the appended attached of the utility model part in the specific descriptions of following preferred embodiment
Figure.The specific embodiment that can realize the utility model has been illustrated by way of example in appended attached drawing.Exemplary implementation
Example is not intended to limit all embodiments according to the present utility model.It is appreciated that without departing from the scope of the utility model
Under the premise of, other embodiment can be utilized, structural or logicality modification can also be carried out.Therefore, below specifically to retouch
It states and unrestricted, and the scope of the utility model is defined by the claims appended hereto.
The utility model proposes a kind of back side illumination image sensors, and gold is arranged in the back side of the back side illumination image sensor
Belong to cabling, the metal routing is used for transmission power supply signal, earth signal or data-signal；The metal routing at the back side passes through logical
Hole or groove are connected to the positive power signal line metal of back side illumination image sensor, earth signal line metal or data signal line gold
Belong to, improve the driving capability of signal, reduces the voltage drop in transmission.
With reference to shown in figure 1, Fig. 2, back side illumination image sensor includes semiconductor substrate（Substrate）10, semiconductor lining
Bottom 10 has opposite front（Frontside）Or the back side（Backside）, sense is made in the front of the semiconductor substrate 10
Optical diode forms pixel array region 11 in substrate 10.Peripheral circuit is formed around pixel array region 11, realizes pixel battle array
Arrange the signal transmission in area 11, such as power supply signal（AVDD）, earth signal（GND）, data-signal etc..
Shown in continuing to refer to figure 1, metal routing 20, the metal routing 20 are set in the back side of back side illumination image sensor
It is used for transmission power supply signal, earth signal or data-signal.The metal routing 20 at the back side passes through through-hole（Via）Or groove
（Trench）40 are connected to the positive power signal line metal of back side illumination image sensor, earth signal line metal or data signal line
The region of metal pad is not arranged wherein having the through-hole of part or groove 40 to be set to non-welding disking area for metal.Described image
The thickness of the metal routing 20 at the sensor back side is more than 0.1 μm.
The metal routing 20 at some or all of the back side illumination image sensor back side is connected to back side illumination image sensing
The metal pad 50 at the device back side.The metal routing 20 at the back side is connected to the positive power supply signal of back side illumination image sensor
Line, earth signal line or data signal line 30, and it is connected to the positive metal pad of back side illumination image sensor（It is not shown in figure）,
Realize power supply signal（AVDD）, earth signal（GND）, data-signal is in positive power signal line, earth signal line or data-signal
It is transmitted between line and the metal routing at the back side, improves the driving capability of signal, reduce the voltage drop in transmission process.
The metal routing 20 at the back side is set to 11 periphery of pixel array region, and pixel array region 11 includes effective photosensitive
Pixel region and pseudo- photosensitive pixel（dummy pixel）, deposited between the metal routing 20 at the back side and effective photosensitive pixel area
In spacing, such as spacing is more than 5 μm, prevents the optical filter on pixel array region, micro-lens surface from being formed rugged
Structure.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, from the point of view of anyway, the present embodiments are to be considered as illustrative and not restrictive.In addition, it will be evident that
One word of " comprising " is not excluded for other elements and step, and wording "one" be not excluded for plural number.It is stated in device claim
Multiple element can also be realized by an element.The first, the second equal words are used to indicate names, and are not offered as any specific
Sequence.
Claims (6)
1. a kind of back side illumination image sensor, which is characterized in that in the back side of the back side illumination image sensor, setting metal is walked
Line, the metal routing are used for transmission power supply signal, earth signal or data-signal；The metal routing at the back side by through-hole or
Groove is connected to the positive power signal line metal of back side illumination image sensor, earth signal line metal or data signal line metal,
The driving capability of signal is improved, the voltage drop in transmission is reduced.
2. back side illumination image sensor according to claim 1, which is characterized in that there is the through-hole of part or groove to be set to
Non- welding disking area.
3. back side illumination image sensor according to claim 1, which is characterized in that the back side illumination image sensor back side
Some or all of metal routing be connected to the metal pad at the back side illumination image sensor back side.
4. back side illumination image sensor according to claim 3, which is characterized in that the metal routing at the back side is connected to
The positive power signal line of back side illumination image sensor, earth signal line or data signal line, and it is connected to back side illumination image sensing
The positive metal pad of device.
5. back side illumination image sensor according to claim 1, which is characterized in that the back side illumination image sensor back side has
The metal routing of pixel array region, the back side is set to pixel array region periphery, exists between effective photosensitive pixel area
Spacing, the spacing are more than 5 μm.
6. back side illumination image sensor according to claim 1, which is characterized in that the thickness of the metal routing at the back side
More than 0.1 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820160839.5U CN207966981U (en) | 2018-01-31 | 2018-01-31 | Back side illumination image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820160839.5U CN207966981U (en) | 2018-01-31 | 2018-01-31 | Back side illumination image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207966981U true CN207966981U (en) | 2018-10-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820160839.5U Active CN207966981U (en) | 2018-01-31 | 2018-01-31 | Back side illumination image sensor |
Country Status (1)
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| CN (1) | CN207966981U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111583844A (en) * | 2019-02-18 | 2020-08-25 | 上海和辉光电有限公司 | Display panel, driving method thereof and display device |
-
2018
- 2018-01-31 CN CN201820160839.5U patent/CN207966981U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111583844A (en) * | 2019-02-18 | 2020-08-25 | 上海和辉光电有限公司 | Display panel, driving method thereof and display device |
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