CN207947261U - Clamping jaw device and wafer carrying device - Google Patents

Abstract

A kind of clamping jaw device and the wafer carrying device comprising clamping jaw device.Clamping jaw device includes two clip claw assemblies and an active module.Two clip claw assembly sides relative to each other are respectively formed with the first clamp structure, and the other side of each clip claw assembly is formed with the second clamp structure.Two clip claw assemblies can actively be set to active module, and active module is electrically connected control module, and it is close to each other or away from each other that control module can control two clip claw assemblies by active module.Two clip claw assemblies be controlled as each other close to when, the auxiliary part of the first wafer carrier can be clamped in two the first clamp structures.When two clip claw assemblies are controlled as away from each other to each other, the auxiliary part of the second wafer carrier can be clamped in two the second clamp structures.The structure of first wafer carrier and the structure of the second wafer carrier differ.

Description

Clamping jaw device and wafer carrying device

Technical field

It is especially a kind of gripping the clamping jaw of wafer carrier the utility model is related to a kind of clamping jaw device and carrying device Device, and the wafer carrying device to carrying wafer carrier.

Background technology

In general, wafer is disposed in process of production in wafer carrier (such as FOUP or cassette), And in different production procedures, wafer can be arranged in the wafer carrier of different shape.Therefore, in the logical of same carrying On road, may occur the wafer carrier of different shape simultaneously, for this purpose, associated production manufacturer must be directed to the wafer of different shape Tool is corresponding to design different clamping jaw devices, and must will be set to corresponding to the clamping jaw device of the wafer carrier of different shape specific Production stations, otherwise will be unable to the gripping and carrying that are smoothed out wafer carrier.Therefore, associated production manufacturer must purchase a variety of The clamping jaw device of different shape also results in the complicated of subsequent maintenance so as to cause the increase of production cost.

Utility model content

The main purpose of the utility model is to provide a kind of clamping jaw device and wafer carrying devices, to improve existing skill In art, associated production manufacturer must purchase the clamping jaw device of a variety of different shapes, can just correspond to the crystalline substance that a variety of different shapes are clamped Circle carrier.

To achieve the goals above, the utility model provides a kind of clamping jaw device, it includes：Two clip claw assemblies, two The clip claw assembly facing side each other, is defined as one first nip side, each clip claw assembly is in contrast to described The side of one nip side is defined as one second nip side, and each clip claw assembly is formed with one first in first nip side Clamp structure, each clip claw assembly are formed with one second clamp structure in second nip side；One active module, two The clip claw assembly can actively be set to the active module, and the active module is electrically connected a control module, the control It is close to each other or away from each other that molding block can control two clip claw assemblies；Wherein, two clip claw assemblies are controlled as Each other close to when, the auxiliary part of one first wafer carrier can be clamped in two first clamp structures；Two folders When claw assembly is controlled as away from each other to each other, the auxiliary structure of one second wafer carrier can be clamped in two second clamp structures Part；Wherein, the structure of first wafer carrier is different from the structure of second wafer carrier.

Preferably, each clip claw assembly is formed with one first guiding structure in first nip side, each described First guiding structure of clip claw assembly is interconnected with one another with first clamp structure, and each first guiding knot Structure can guide the auxiliary part on first wafer carrier and cooperate with first clamp structure.

Preferably, each clip claw assembly is formed with one second guiding structure in second nip side, each described Second guiding structure of clip claw assembly is interconnected with one another with second clamp structure, and each second guiding knot Structure can guide the auxiliary part on second wafer carrier and cooperate with second clamp structure.

Preferably, each clip claw assembly is formed with a third clamp structure, the third in first nip side Clamp structure is intervally installed with first clamp structure；Wherein, two clip claw assemblies are controlled as each other When close, a third wafer carrier can be clamped in two third clamp structures；Wherein, the structure of first wafer carrier, The structure of second wafer carrier and the structure of the third wafer carrier are differing from each other.

Preferably, each clip claw assembly is formed with a third guiding structure in first nip side, each described The third guiding structure of clip claw assembly is interconnected with one another with the third clamp structure, and each third guiding knot Structure can guide the auxiliary part on the third wafer carrier and cooperate with the third clamp structure.

Preferably, the one end side of each clip claw assembly is provided with a baffle.

Preferably, the one side wall for forming second clamp structure has an escape groove, and the escape groove is by the side wall It separates as one first limited block and one second limited block；When two second clamp structures correspond to described the of clamping change type When the auxiliary part of two wafer carriers, the part of the auxiliary part of second wafer carrier of change type, which can correspond to, is contained in institute It states in escape groove, and the part of second limited block can correspond to the auxiliary structure for second wafer carrier for being contained in change type In one perforation of part.

To achieve the goals above, the utility model also provides a kind of wafer carrying device, to the multiple wafers of carrying, The wafer carrying device includes：One clamping jaw device, it includes：Two clip claw assemblies, two clip claw assemblies are practised physiognomy each other To side, be defined as one first nip side, each clip claw assembly is defined as in contrast to the side of first nip side One second nip side, each clip claw assembly are formed with one first clamp structure, each folder in first nip side Claw assembly is formed with one second clamp structure in second nip side；One active module, two clip claw assemblies can activity Ground is set to the active module, and the active module is electrically connected a control module, and the control module can control two institutes It is close to each other or away from each other to state clip claw assembly；The inside of one first wafer carrier, first wafer carrier is formed with an appearance Slot is set, a top surface of first wafer carrier is provided with an auxiliary part；Wherein, the active module can be by the control mould Block controls and keeps two clip claw assemblies close each other, to utilize two the first clamp structure clampings described first The auxiliary part of wafer carrier；The active module can be controlled by the control module and make two clip claw assemblies phase each other It is mutually separate, the auxiliary part of one second wafer carrier to be clamped using two second clamp structures；Wherein, described second is brilliant The structure of circle carrier is different from the structure of first wafer carrier.

To achieve the goals above, the utility model more provides a kind of wafer carrying device, to the multiple wafers of carrying, The wafer carrying device includes：One clamping jaw device, it includes：Two clip claw assemblies, two clip claw assemblies are practised physiognomy each other To side, be defined as one first nip side, each clip claw assembly is defined as in contrast to the side of first nip side One second nip side, each clip claw assembly are formed with one first clamp structure, each folder in first nip side Claw assembly is formed with one second clamp structure in second nip side；One active module, two clip claw assemblies can activity Ground is set to the active module, and the active module is electrically connected a control module, and the control module can control two institutes It is close to each other or away from each other to state clip claw assembly；The inside of one second wafer carrier, second wafer carrier is formed with an appearance Set slot, the top surface setting of second wafer carrier there are two auxiliary part, second wafer carrier it is each described auxiliary Help component that there is a perforation；Wherein, the active module can by the control module control and make two clip claw assemblies that This is located remotely from each other, the side wall to form the perforation to be clamped using two second clamp structures；The active module can be by The control module controls and keeps two clip claw assemblies close each other, to be pressed from both sides using two first clamp structures Hold the auxiliary part of one first wafer carrier；Wherein, the structure of first wafer carrier is different from second wafer carrier Structure.

Preferably, the wafer carrier also includes two grip structures, and each grip structure is articulated in wafer The carrying ontology of tool, and two grip structures correspond to the top surface for being located at the carrying ontology；When two grip structures It is operated when being rotated to the carrying ontology direction and collapsing in the top surface of the carrying ontology, two grip structures are opposite Height in the top surface of the carrying ontology is less than height of each auxiliary part relative to the top surface of the carrying ontology.

To achieve the goals above, the utility model provides a kind of wafer carrying device, to the multiple wafers of carrying, institute Stating wafer carrying device includes：One clamping jaw device, it includes：Two clip claw assemblies, two clip claw assemblies are facing each other Side, be defined as one first nip side, each clip claw assembly is defined as one in contrast to the side of first nip side Second nip side, each clip claw assembly are formed with one first clamp structure, each clamping jaw in first nip side Component is formed with one second clamp structure in second nip side, and each clip claw assembly is in first nip side also shape Cheng Youyi third clamp structures；One active module, two clip claw assemblies can actively be set to the active module, described Active module is electrically connected a control module, and it is close to each other or remote each other that the control module can control two clip claw assemblies From；One third wafer carrier, the inside of the third wafer carrier are formed with a storage tank, third wafer carrier phase each other Anti- both sides are respectively formed with a holding tank, and the one side wall for forming the holding tank is defined as an auxiliary part；Wherein, the work Dynamic model block can be controlled by the control module and keep two clip claw assemblies close each other, to utilize two thirds The auxiliary part of the third wafer carrier is clamped in clamp structure；The active module can be controlled by the control module and make two A clip claw assembly is close each other, the auxiliary of one first wafer carrier to be clamped using two first clamp structures Component；The active module can be controlled by the control module and keep two clip claw assemblies away from each other to each other, to utilize The auxiliary part of one second wafer carrier is clamped in two second clamp structures；Wherein, the structure of first wafer carrier, The structure of second wafer carrier and the structure of the third wafer carrier are differing from each other.

The beneficial effects of the utility model can be：Through two the first clamp structures and two the second clamp structures The wafer carrier of at least two different shapes can be clamped in design, the clamping jaw device of the utility model.

Description of the drawings

Figure 1A, Fig. 2 are the schematic diagram of the clamping jaw device of the utility model.

Figure 1B is the enlarged diagram of IA in Figure 1A.

Fig. 3 is the front view of the clamping jaw device of the utility model.

Fig. 4 is the one of which wafer carrier that the clamping jaw device of the utility model can be clamped.

Fig. 5 is that the schematic diagram of wafer carrier shown in Fig. 4 is clamped in the clamping jaw device of the utility model；Fig. 5 is also this practicality Wherein the one of novel wafer carrying device implements schematic diagram.

Fig. 6 is the one of which wafer carrier that the clamping jaw device of the utility model can be clamped.

Fig. 7 is that the schematic diagram of wafer carrier shown in fig. 6 is clamped in the clamping jaw device of the utility model；Fig. 7 is also this practicality Wherein the one of novel wafer carrying device implements schematic diagram.

Fig. 8 is the one of which wafer carrier that the clamping jaw device of the utility model can be clamped.

Fig. 9 is that the schematic diagram of wafer carrier shown in Fig. 8 is clamped in the clamping jaw device of the utility model；Fig. 9 is also this practicality Wherein the one of novel wafer carrying device implements schematic diagram.

Figure 10 is the one of which wafer carrier that the clamping jaw device of the utility model can be clamped.

Figure 11 is that the schematic diagram of wafer carrier shown in Fig. 10 is clamped in the clamping jaw device of the utility model；Figure 11 is also this reality Implement schematic diagram with wherein the one of novel wafer carrying device.

Specific implementation mode

Also referring to Figure 1A, Figure 1B to Fig. 3, it is shown as the schematic diagram of the clamping jaw device of the utility model.As schemed Show, clamping jaw device 1 includes：Two clip claw assemblies 10 and an active module 20.Two clip claw assemblies 10 facing side each other It is defined as one first nip side 10a, each clip claw assembly 10 is defined as one second clamping in contrast to the side of the first nip side 10a Side 10b, each clip claw assembly 10 are formed with one first clamp structure 101 in the first nip side 10a, and each clip claw assembly 10 is in Two nip side 10b are formed with one second clamp structure 102.For example, the first clamp structure 101 and the second clamp structure 102 Can be the groove that the first nip side 10a in clip claw assembly 10 and the second nip side 10b are recessed respectively, but not as Limit.

Two clip claw assemblies 10 can actively be connect with active module 20, and active module 20 is electrically connected a control module (not shown, e.g. microprocessor, computer equipment etc.), control module can control two clip claw assemblies 10 it is close to each other or Away from each other.In practical applications, active module 20 can include a slide track component 21 (such as comprising sliding rail, shell Deng), two sliding parts 22 and multiple linkage parts (not shown, e.g. stepper motor, belt etc.), two sliding parts 22 are distinguished It can be actively set to slide track component 21, and control module can control two sliding parts 22 and be moved on slide track component 21. In concrete application, control module can control two sliding parts 22 on slide track component 21, while movement close to each other or same When be located remotely from each other movement, two sliding parts 22 are controlled alternatively, in different applications, when control module can also be different in cunning It is moved on rail assembly 21, and can only control single sliding part 22 according to demand and be moved on slide track component 21, and reach set of jaws Part 10 is close to each other or action away from each other.

It is noted that as shown in Fig. 2, the one end side of each clip claw assembly 10 can be provided with a baffle 11, gear Plate 11 is limiting by wafer carrier (such as can be wafer carrier shown in Fig. 4) that clip claw assembly 10 is clamped relative to clamping jaw The moving range of component 10.Specifically, in practical applications, when wafer carrier is clamped in clip claw assembly 10, clip claw assembly 10 can The wafer carrier clamped by it can be made to present by mechanical arm control skewed, at this point, skewed wafer carrier is presented will It can correspond to and be resisted against baffle 11, and can prevent wafer carrier from falling off.

When control module two sliding parts 22 of control are close each other or are located remotely from each other, two clip claw assemblies will be interlocked 10 each other closer or far from therefore, clamping jaw device 1 is clamped using two the first clamp structures 101 or two second First wafer carrier A1 (such as Fig. 4), second wafer carrier A2 (such as Fig. 6) or change type of the clamping of structure 102 with different structure The second wafer carrier A3 (such as Fig. 8), will then be directed to two the first clamp structures 101 and the first wafer carrier A1 and two are clamped The second wafer carrier A2 is clamped in a second clamp structure 102 or the second wafer carrier A3 of change type is described in detail.

A kind of wafer carrier of form is shown in also referring to Fig. 4 and Fig. 5, Fig. 4 (for the benefit of to illustrate, hereinafter referred to as First wafer carrier) A1 (FOUP), the first wafer carrier A1 can be able to be mainly to be applied to crystalline substance to carry 12 inch wafers In the operations such as pad pasting, grinding and polishing in circle manufacturing process.As shown in figure 4, the first wafer carrier A1 includes a carrying ontology The side of A10 and auxiliary part A11, carrying ontology A10 have been recessed a storage tank A101, and storage tank A101 is accommodating crystalline substance Disk.Auxiliary part A11 is fixedly installed on the top surface of carrying ontology A10, and auxiliary part A11 is pressed from both sides in order to associated mechanical arm It holds.First wafer carrier A1 can also include that two grip structures A12, two grip structure A12 can be correspondingly arranged in The reciprocal both sides ontology A10 are carried, two grip structure A12 move to take the first wafer carrier A1 to personnel easy to operation.

As shown in figure 5, two sliding parts 22 can be close relative to one another by control module control, two first press from both sides whereby Clamping auxiliary part A11 can be corresponded to by holding structure 101, then clamping jaw device 1 can be controlled and by the first wafer clamped by it Carrier A1 is moved to specific position.In practical application, clamping jaw device 1 can be connected with a mechanical arm R, and manipulator Arm R can control the whole movement (can certainly include the action of rotation) for carrying out upper and lower, left and right of clamping jaw device 1, and machinery Arm R is electrically connected control module, and control module energy control machinery arm R is acted, so that clamping jaw device 1 (and its clamping First wafer carrier A1) it is moved to specific position.

In preferable application, each clip claw assembly 10 could be formed with one first guiding structure 1011, and each first leads Guiding structure 1011 is to be adjacent to each first clamp structure 101 and be arranged, and the first guiding structure 1011 is for example formed at the first folder Hold the inclined surface structure of the one side wall of structure 101；In this present embodiment, it is that the first clamping is located at each first guiding structure 1011 For the top of structure 101, but not limited to this, position of each first guiding structure 1011 relative to the first clamp structure 101 Can be changed according to demand.

For control module when controlling the first wafer carrier A1 of gripping of clamping jaw device 1, control module can be first control machinery Arm R drives clamping jaw device 1 to act, and makes the first clamp structure 101 close to the auxiliary part A11 of the first wafer carrier A1, then It is close each other that control module controls two sliding parts 22 again, in this way, auxiliary part A11, which will enter, is rendered as groove-like Two the first clamp structures 101；Or auxiliary part A11 will by two the first guiding structures 1011 guiding and successfully into Two the first clamp structures 101 for entering to be rendered as groove-like can help to clamping jaw device 1 and grip the first wafer carrier A1's whereby Stability.

The wafer carrier that another form is shown as also referring to Fig. 6 and Fig. 7, Fig. 6 (for the benefit of illustrates, hereinafter referred to as Two wafer carriers) A2 (metal cassette), the second wafer carrier A2 can carry 8 inch wafers, can be mainly application In the operations such as the wafer cutting in wafer production process.As shown in fig. 6, the second wafer carrier A2 includes a carrying ontology The side of A20 and two auxiliary part A21, carrying ontology A20 have been recessed a storage tank A201, and storage tank A201 is holding Nano-crystal disk.Auxiliary part A21 is fixedly installed on the top surface of carrying ontology A20, and each auxiliary part A21 includes a perforation A211, each perforation A211 can be that each auxiliary part A21 and carrying ontology A20 are collectively formed, or can be each auxiliary structure Part A21 is independently formed, and is not limited in this.Second wafer carrier A2 can also include two grip structure A22, and two one or two Hand structure A22 can be disposed on the top surface of carrying ontology A20, and two grip structure A22 move to take the to personnel easy to operation Two wafer carrier A2；In practical applications, each grip structure A22 can be articulated in carrying ontology A20, and each grip structure A22 can be folded on the top surface of carrying ontology A20, when each grip structure A22 is folded on the top surface of carrying ontology A20, Grip structure A22 is less than height of each auxiliary part A21 relative to top surface relative to the height of the top surface of carrying ontology A20, because This, two grip structure A22 will not affect that clamping jaw device 1 grips two auxiliary part A21.As shown in fig. 7, two sliding parts 22 can be separate relative to one another by control module control, and two the second clamp structures 102 can correspond to clamping auxiliary part whereby A21, then clamping jaw device 1 can be controlled and the second wafer carrier A2 clamped by it is moved to specific position.

Clip claw assembly 10 can also include there are two the second guiding structure 1021, one of them second guiding structure 1021 with An interconnection in two the second clamp structures 102, another second guiding structure 1021 and two the second clamp structures Another interconnection in 102.Specifically, each second guiding structure 1021 can be formed at each second clamp structure One inclined surface structure of 102 side wall, and control module controls mould when controlling the second wafer carrier A2 of gripping of clamping jaw device 1 Block can first control machinery arm R drive clamping jaw device 1, make the second clamp structure 102 close to the auxiliary of the second wafer carrier A2 Component A21, then it is away from each other to each other to control two sliding parts 22 again for control module, in this way, auxiliary part A21 will enter is in It is now two the second clamp structures 102 of groove-like；Or auxiliary part A21 will be led by two the second guiding structures 1021 Draw and smoothly enter two the second clamp structures 102 for being rendered as groove-like, can help to the gripping of clamping jaw device 1 second whereby The stability of wafer carrier A2.

The wafer carrier that another form is shown as also referring to Fig. 8 and Fig. 9, Fig. 8 (for the benefit of illustrates, hereinafter referred to as becomes Second wafer carrier of change type) A3 (metal cassette), the second wafer carrier A3 of such change type can be carrying 12 inches Wafer mainly can be applied in the operations such as the wafer cutting in wafer production process.As shown in figure 8, the second of change type is brilliant Circle carrier A3 includes a carrying ontology A30 and two auxiliary part A31, and the side of carrying ontology A30 has been recessed an appearance Set slot A301, storage tank A301 is accommodating wafer.Auxiliary part A31 is fixedly installed on the top surface of carrying ontology A30, each Auxiliary part A31 includes that perforation an A311, each perforation A311 can be that each auxiliary part A31 and carrying ontology A30 are common It is formed, or can be that each auxiliary part A31 is independently formed, do not limited in this.In practical applications, relevant staff Can be the second wafer carrier A3 that change type is moved to take by auxiliary part A31 and its perforation A311.As shown in figure 9, two cunnings Moving part 22 can be separate relative to one another by control module control, and two the second clamp structures 102 can correspond to clamping auxiliary whereby Component A31, then clamping jaw device 1 can be controlled and be moved to the second wafer carrier A3 of the deformation type clamped by it specific Position.

When controlling the second wafer carrier A3 of the gripping change type of clamping jaw device 1, control module can be controlled first control module Mechanical arm R processed makes the second clamp structure 102 then be controlled close to the auxiliary part A31 of the second wafer carrier A3 of change type Module controls that two sliding parts 22 are away from each other to each other again, in this way, auxiliary part A31, which will enter, is rendered as two of groove-like Second clamp structure 102；Or auxiliary part A31 will be smoothly entered by the guiding of two the second guiding structures 1021 and is in It is now two the second clamp structures 102 of groove-like, can help to the second wafer carrier that clamping jaw device 1 grips change type whereby The stability of A3.

Referring again to Figure 1A and Figure 1B, in practical applications, each clip claw assembly 10 is according to the auxiliary of various wafer carriers The shape of component is different, and each clip claw assembly 10 can also include that an at least escape groove 104 avoids each clip claw assembly 10 whereby When the auxiliary part of wafer carrier is clamped, the problem of each clip claw assembly 10 and auxiliary part interfere.For example, as schemed Shown in 1B and Fig. 8, when each clip claw assembly 10 corresponds to clamping wafer carrier A3 shown in Fig. 8, the support cylinder of wafer carrier A3 A312 can be corresponded in escape groove 104；In addition, each clip claw assembly 10 can also include one first limited block 105 and one Two limited blocks 106, can correspond to positioned at the both sides of escape groove 104, and wafer shown in Fig. 8 is clamped when each clip claw assembly 10 corresponds to When carrier A3, the first limited block 105 can be corresponded to positioned at the side of support cylinder A312, and the second limited block 106 can then correspond to Positioned at perforation A311 in, in this way, by can be promoted clip claw assembly 10 be clamped wafer carrier when stability.Certainly, each clip claw assembly Position set by 10 escape groove 104 and its shape can be determined according to the shape of practical auxiliary part, be not limited to As shown in the figure.

The wafer carrier that another form is shown as also referring to Figure 10 and Figure 11, Figure 10 (for the benefit of illustrates, hereinafter referred to as Third wafer carrier) A4 (shipping box), third wafer carrier A4 can mainly answer to carry 8 inch wafers For in the operations such as wafer pad pasting, grinding and polishing in wafer production process.As shown in Figure 10, third wafer carrier A4 includes One carrying ontology A40 and grip structure A41, the side of carrying ontology A4 have been recessed a storage tank A401, storage tank A401 To house wafer.Third carries the reciprocal both sides ontology A4, can be recessed a holding tank A402, shape respectively It is defined as an auxiliary part A4021 at the one side wall of each holding tank A402, auxiliary part A4021 is pressed from both sides in order to clip claw assembly 10 It holds.

Also referring to Figure 1A, Figure 1B, Fig. 3 and Figure 11, each clip claw assembly 10 can also include third clamping knot Structure 103, each third clamp structure 103 can be formed in the first nip side 10a of each clip claw assembly 10, and each third clamp structure 103 with each first clamp structure 101 can be arranged at each interval without be interconnected.As shown in figure 11, two sliding parts 22 can be close relative to one another by control module control, and two third clamp structures 103 can correspond to clamping auxiliary part whereby A4021, then clamping jaw device 1 can be controlled and the third wafer carrier A4 clamped by it is moved to specific position.

Clip claw assembly 10 can also include there are two third guiding structure 1031, one of third guiding structure 1031 with An interconnection in two third clamp structures 103, another third guiding structure 1031 and two third clamp structures Another interconnection in 103.Specifically, each third guiding structure 1031 can be formed at each third clamp structure One inclined surface structure of 103 side wall, and control module controls mould when controlling the gripping third wafer carrier A4 of clamping jaw device 1 Block can first control machinery arm R drive clamping jaw device 1, make third clamp structure 103 close to the auxiliary of third wafer carrier A4 Component A4021, then it is close each other to control two sliding parts 22 again for control module, in this way, auxiliary part A4021 will be into Enter to be rendered as two third clamp structures 103 of groove-like；Or auxiliary part A4021 will be by two third guiding structures 1031 guiding and smoothly enter two third clamp structures 103 for being rendered as groove-like, can help to clamping jaw device 1 whereby Grip the stability of third wafer carrier A4.

Also referring to Fig. 5, Fig. 7, Fig. 9 and Figure 11, the utility model also provides a kind of wafer carrier device, wafer carrying Device include aforementioned clamping jaw device 1 and wafer carrier A1, A2 of Fig. 4, Fig. 6, Fig. 8 or different shape shown in Fig. 10, A3, A4.About the detailed description of clamping jaw device 1 and the wafer carrier of aforementioned various forms, previous embodiment is please referred to, no longer in this It repeats.

In conclusion the clamping jaw device and wafer carrier device of the utility model can be clamped first with different structure Wafer carrier, the second wafer carrier, the second wafer carrier of change type and third wafer carrier, and relevant manufactures are not necessarily to for not Isostructural wafer carrier buys more a variety of different clamping jaw devices, so as to which production finished product is greatly reduced.

Claims (11)

1. a kind of clamping jaw device, which is characterized in that the clamping jaw device includes：

Two clip claw assemblies, two clip claw assemblies facing side each other, are defined as one first nip side, each described Clip claw assembly is defined as one second nip side in contrast to the side of first nip side, and each clip claw assembly is described One nip side is formed with one first clamp structure, and each clip claw assembly is formed with one second clamping in second nip side Structure；

One active module, two clip claw assemblies can actively be set to the active module, and the active module electrically connects Connect a control module, it is close to each other or away from each other that the control module can control two clip claw assemblies；

Wherein, two clip claw assemblies be controlled as each other close to when, two first clamp structures can be clamped one The auxiliary part of first wafer carrier；When two clip claw assemblies are controlled as away from each other to each other, two second folders The auxiliary part of one second wafer carrier can be clamped by holding structure；Wherein, the structure of first wafer carrier is different from described the The structure of two wafer carriers.

2. clamping jaw device according to claim 1, which is characterized in that each clip claw assembly is in first nip side It is formed with one first guiding structure, first guiding structure and first clamp structure of each clip claw assembly are each other It is connected with each other, and each first guiding structure can guide the auxiliary part on first wafer carrier and be pressed from both sides with described first Hold structure mutual cooperation.

3. clamping jaw device according to claim 1, which is characterized in that each clip claw assembly is in second nip side It is formed with one second guiding structure, second guiding structure and second clamp structure of each clip claw assembly are each other It is connected with each other, and each second guiding structure can guide the auxiliary part on second wafer carrier and be pressed from both sides with described second Hold structure mutual cooperation.

4. clamping jaw device according to claim 1, which is characterized in that each clip claw assembly is in first nip side It is formed with a third clamp structure, the third clamp structure is intervally installed with first clamp structure；Wherein, two The clip claw assembly be controlled as each other close to when, a third wafer carrier can be clamped in two third clamp structures； Wherein, the structure of first wafer carrier, the structure of the structure of second wafer carrier and the third wafer carrier that This is differed.

5. clamping jaw device according to claim 4, which is characterized in that each clip claw assembly is in first nip side It is formed with a third guiding structure, the third guiding structure and the third clamp structure of each clip claw assembly are each other It is connected with each other, and each third guiding structure can guide the auxiliary part on the third wafer carrier and be pressed from both sides with the third Hold structure mutual cooperation.

6. clamping jaw device according to claim 1, which is characterized in that the one end side of each clip claw assembly is provided with One baffle.

7. clamping jaw device according to claim 1, which is characterized in that the one side wall for forming second clamp structure has The sidewall region is divided into one first limited block and one second limited block by one escape groove, the escape groove；When two described second When clamp structure corresponds to the auxiliary part of second wafer carrier of clamping change type, second wafer carrier of change type The part of auxiliary part can correspond to and be contained in the escape groove, and the part of second limited block can correspond to and be contained in change In one perforation of the auxiliary part of second wafer carrier of change type.

8. a kind of wafer carrying device, which is characterized in that the wafer carrying device is to the multiple wafers of carrying, the wafer Shipping unit includes：

One clamping jaw device, it includes：

Two clip claw assemblies, two clip claw assemblies facing side each other, are defined as one first nip side, each described Clip claw assembly is defined as one second nip side in contrast to the side of first nip side, and each clip claw assembly is described One nip side is formed with one first clamp structure, and each clip claw assembly is formed with one second clamping in second nip side Structure；And

One active module, two clip claw assemblies can actively be set to the active module, and the active module electrically connects Connect a control module, it is close to each other or away from each other that the control module can control two clip claw assemblies；And

One first wafer carrier, the inside of first wafer carrier are formed with a storage tank, and the one of first wafer carrier Top surface is provided with an auxiliary part；

Wherein, the active module can be controlled by the control module and keep two clip claw assemblies close each other, with The auxiliary part of first wafer carrier is clamped using two first clamp structures；The active module can be by the control Molding block controls and keeps two clip claw assemblies away from each other to each other, to utilize two second clamp structures clampings 1 the The auxiliary part of two wafer carriers；Wherein, the structure of second wafer carrier is different from the structure of first wafer carrier.

9. a kind of wafer carrying device, which is characterized in that the wafer carrying device is to the multiple wafers of carrying, the wafer Shipping unit includes：

One clamping jaw device, it includes：

Two clip claw assemblies, two clip claw assemblies facing side each other, are defined as one first nip side, each described Clip claw assembly is defined as one second nip side in contrast to the side of first nip side, and each clip claw assembly is described One nip side is formed with one first clamp structure, and each clip claw assembly is formed with one second clamping in second nip side Structure；And

One active module, two clip claw assemblies can actively be set to the active module, and the active module electrically connects Connect a control module, it is close to each other or away from each other that the control module can control two clip claw assemblies；And

One second wafer carrier, the inside of second wafer carrier are formed with a storage tank, and the one of second wafer carrier There are two auxiliary part, each auxiliary parts of second wafer carrier to have a perforation for top surface setting；

Wherein, the active module can be controlled by the control module and keep two clip claw assemblies away from each other to each other, with The side wall to form the perforation is clamped using two second clamp structures；The active module can be by the control module control It makes and keeps two clip claw assemblies close each other, one first wafer is clamped using two first clamp structures The auxiliary part of tool；Wherein, the structure of first wafer carrier is different from the structure of second wafer carrier.

10. wafer carrying device according to claim 9, which is characterized in that the wafer carrier also includes two one or two Hand structure, each grip structure is articulated in the carrying ontology of the wafer carrier, and two grip structures correspond to position In the top surface of the carrying ontology；When two grip structures are rotated by operation to the carrying ontology direction and collapse in institute When stating the top surface of carrying ontology, two grip structures are less than each described relative to the height of the top surface of the carrying ontology Height of the auxiliary part relative to the top surface of the carrying ontology.

11. a kind of wafer carrying device, which is characterized in that the wafer carrying device is to the multiple wafers of carrying, the wafer Carrying device includes：

One clamping jaw device, it includes：

Two clip claw assemblies, two clip claw assemblies facing side each other, are defined as one first nip side, each described Clip claw assembly is defined as one second nip side in contrast to the side of first nip side, and each clip claw assembly is described One nip side is formed with one first clamp structure, and each clip claw assembly is formed with one second clamping in second nip side Structure, each clip claw assembly are also formed with a third clamp structure in first nip side；And

One active module, two clip claw assemblies can actively be set to the active module, and the active module electrically connects Connect a control module, it is close to each other or away from each other that the control module can control two clip claw assemblies；And

The inside of one third wafer carrier, the third wafer carrier is formed with a storage tank, and the third wafer carrier is each other Opposite both sides are respectively formed with a holding tank, and the one side wall for forming the holding tank is defined as an auxiliary part；

Wherein, the active module can be controlled by the control module and keep two clip claw assemblies close each other, with The auxiliary part of the third wafer carrier is clamped using two third clamp structures；The active module can be by the control Molding block controls and keeps two clip claw assemblies close each other, to utilize two first clamp structures clampings 1 the The auxiliary part of one wafer carrier；The active module can be controlled by the control module and make two clip claw assemblies each other It is located remotely from each other, the auxiliary part of one second wafer carrier to be clamped using two second clamp structures；Wherein, described first The structure of wafer carrier, the structure of second wafer carrier and the structure of the third wafer carrier are differing from each other.