CN207931213U - A kind of copper-clad plate - Google Patents
A kind of copper-clad plate Download PDFInfo
- Publication number
- CN207931213U CN207931213U CN201820251073.1U CN201820251073U CN207931213U CN 207931213 U CN207931213 U CN 207931213U CN 201820251073 U CN201820251073 U CN 201820251073U CN 207931213 U CN207931213 U CN 207931213U
- Authority
- CN
- China
- Prior art keywords
- thermal insulation
- layer
- copper
- insulation layer
- clad plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 claims abstract description 73
- 238000009413 insulation Methods 0.000 claims abstract description 40
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 229910000077 silane Inorganic materials 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000012792 core layer Substances 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 238000002360 preparation method Methods 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims abstract description 9
- 230000007704 transition Effects 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 9
- 229920000728 polyester Polymers 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model is related to copper-clad plate technical fields, and in particular to the upper and lower surface of a kind of copper-clad plate, including half consolidated structures layer, semi-solid preparation structure sheaf is respectively laid with a copper foil layer.The semi-solid preparation structure sheaf includes the first thermal insulation layer, core layer and the second thermal insulation layer, the core layer is between first thermal insulation layer and the second thermal insulation layer, the upper surface of first thermal insulation layer and the lower surface of second thermal insulation layer are all covered with silane coupled agent film, and the copper foil layer is covered on the silane coupled agent film.Compared with prior art, advantageous effect is the utility model：The peel strength of copper-clad plate can be improved by covering silane coupled agent film in the lower surface of the upper surface of the first thermal insulation layer and the second insulating layer.
Description
Technical field
The utility model is related to copper-clad plate technical fields, and in particular to a kind of copper-clad plate.
Background technology
Copper-clad plate is also known as base material, and one or both sides become through a kind of board-like material made of hot pressing coated with copper foil and cover copper foil
Laminate.
Its peel strength of current copper-clad plate is relatively low, and making copper-clad plate, there are the risks that copper foil peels off in PCB processing.Its
It is secondary, traditional copper-clad plate thermosetting epoxy resin and glass fabric composition, although at low cost, good electrical property, intensity it is high,
The advantages that heat-resist, but its thermosetting epoxy resin and glass fibre are compound after heat cure is molded, and brittleness is bigger, in life
Produce process in, easy to produce cracking phenomena, and there are resin-lints to fall, dust pollution and cause copper-clad plate fail ask
Topic.
Therefore, it is necessary to a kind of copper-clad plate be developed, with the big characteristic of cracking resistance, anti-strip intensity, to adapt to be punched
Processing technology, so as to shorten PCB production cycle and reduce its production cost, and improve its quality.
Invention content
Purpose of the utility model is to solve the above problems, provide a kind of copper-clad plate.
In order to reach above-mentioned purpose of utility model, the utility model uses following technical scheme：
The upper and lower surface of a kind of copper-clad plate, including half consolidated structures layer, semi-solid preparation structure sheaf is respectively laid with a copper foil layer.
The semi-solid preparation structure sheaf includes the first thermal insulation layer, core layer and the second thermal insulation layer, the core layer
Between first thermal insulation layer and the second thermal insulation layer, the upper surface of first thermal insulation layer and described
The lower surface of two thermal insulation layers is all covered with silane coupled agent film, and the copper foil layer is covered in the silane coupled agent film
On.
The core layer includes high tenacity resin matrix, and glass fibrous layer, the glass are equipped in high tenacity resin matrix
Dimension layer forms the transition part of multiple arcs in the high tenacity resin matrix, and band, the beam are wound on the transition part
The surface that band is located on the outside of the transition part is Nian Jie with first thermal insulation layer or the second thermal insulation layer.
Preferably, the band is wrapped on the transition part by polyester fiber and is formed.
Preferably, the density range of the polyester fiber is 400/cm ~ 600 piece/cm.
Preferably, the thickness of first thermal insulation layer is 5 ~ 25 μm.
Preferably, the thickness of second thermal insulation layer is 20 ~ 30 μm.
Preferably, the thickness range of the silane coupled agent film is 5 ~ 30 μm.
Compared with prior art, advantageous effect is the utility model：
1, silane coupled agent film is covered in the upper surface of the first thermal insulation layer and the lower surface of the second insulating layer
The peel strength of copper-clad plate can be improved.
2, the curved transition sections that glass layer is formed in high tenacity resin matrix are to cope with the variation of size.
3, band is wound on transition part, can improve anti-cracking ability of the plank when being cut, and polyester fiber twines
Band around formation has favorable elasticity and dimensional stability, further improves anti-cracking performance.
4, band is Nian Jie with the first thermal insulation layer and the second insulating layer, keeps the whole engagement of copper-clad plate more firm
Gu.
5, the utility model can effectively prevent cracking using high tenacity resin matrix.
6, first thermal insulation layer and the second insulating layer can be arranged to different thickness, in a certain range
The problems such as restrictive condition of processing technology can be reduced, improve or solve copper-clad plate base material white point, bow warping.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram of the glass fibrous layer of the utility model；
Fig. 3 is the belt structure schematic diagram of the utility model.
In figure：1 semi-solid preparation structure sheaf, 2 copper foil layers, 3 first thermal insulation layers, 4 core layers, 41 high tenacity resin matrixes,
42 glass fibrous layers, 420 transition parts, 43 bands, 5 second thermal insulation layers, 6 silane coupled agent films.
Specific implementation mode
Explanation is further described to the technical solution of the utility model below by specific embodiment.
The present embodiment is as shown in Figure 1 to Figure 3, a kind of copper-clad plate, including half consolidated structures layer 1, semi-solid preparation structure sheaf 1
Upper and lower surface is respectively laid with a copper foil layer 2.
The semi-solid preparation structure sheaf 1 include thickness be 15 μm the first thermal insulation layer 3, core layer 4, thickness be 20 μm the
Two thermal insulation layers 5, the core layer 4 are and described between first thermal insulation layer, 3 and second thermal insulation layer 5
The upper surface of first insulating layer 3 and the lower surface of the second insulating layer 4 are all covered with silane coupled agent film 6, silane coupled
The thickness of agent film 6 is 10 μm, and the copper foil layer 2 is covered on the silane coupled agent film 6.
The core layer 4 includes high tenacity resin matrix 41, and glass fibrous layer 42, institute are equipped in high tenacity resin matrix 41
The transition part 420 that glass fibrous layer 42 forms multiple arcs in the high tenacity resin matrix 41 is stated, is twined on the transition part 420
It is wound with band 43, the one of the band 43 is located at the surface in 420 outside of the transition part and first thermal insulation layer 3 or the
Two thermal insulation layers 5 are bonded.
The band 43 is wrapped on the transition part 420 by polyester fiber and is formed.Polyester fiber twines on transition part 420
Around the number of turns be 600 circles/cm.The anti-crack ability of band 43 increases with the winding number of turns of polyester fiber and is enhanced.
The utility model is compared with traditional copper-clad plate, and the utility model is in the upper surface of the first thermal insulation layer 3 and institute
The lower surface for stating second insulating layer 5 covers silane coupled agent film 6 and can improve the peel strength of copper-clad plate.The utility model
The curved transition sections 420 that are formed in the high tenacity resin matrix 41 of glass layer 42 can cope with the variation of size.In mistake
Winding band 43 in portion 420 is crossed, anti-cracking ability of the plank when being cut, and the beam that polyester fiber is wound can be improved
Band 43 has favorable elasticity and dimensional stability, further improves anti-cracking performance.Band 43 and the first thermal insulation layer 3
It is bonded with the second insulating layer 5, keeps the whole engagement of copper-clad plate more secured.The utility model uses high tenacity resin matrix
41 can effectively prevent cracking.First thermal insulation layer 3 and the second insulating layer 5 can be arranged to different thickness,
The restrictive condition of processing technology can be reduced in a certain range, and improvement or solution copper-clad plate base material white point, bow warping etc. are asked
Topic.
Above description is merely a prefered embodiment of the utility model, does not constitute the limit to scope of protection of the utility model
It is fixed.Any all any modification, equivalent and improvement made within spirit of the present utility model and principle etc., should be included in
Within the protective scope of the claims of the utility model.
Claims (6)
1. a kind of copper-clad plate, which is characterized in that including half consolidated structures layer（1）, semi-solid preparation structure sheaf（1）Upper and lower surface it is each
It is laid with a copper foil layer（2）；
The semi-solid preparation structure sheaf（1）Including the first thermal insulation layer（3）, core layer（4）With the second thermal insulation layer（5）, institute
State core layer（4）Positioned at first thermal insulation layer（3）With the second thermal insulation layer（5）Between, first insulating heat-conductive
Layer（3）Upper surface and second thermal insulation layer（5）Lower surface be all covered with silane coupled agent film（6）, the copper
Layers of foil（2）It is covered in the silane coupled agent film（6）On；
The core layer（4）Including high tenacity resin matrix（41）, high tenacity resin matrix（41）Inside it is equipped with glass fibrous layer
（42）, the glass fibrous layer（42）In the high tenacity resin matrix（41）The interior transition part for forming multiple arcs（420）, described
Transition part（420）On be wound with band（43）, the band（43）Positioned at the transition part（420）The surface in outside and described the
One thermal insulation layer（3）Or second thermal insulation layer（5）Bonding.
2. a kind of copper-clad plate according to claim 1, which is characterized in that the band（43）Institute is wrapped in by polyester fiber
State transition part（420）Upper formation.
3. a kind of copper-clad plate according to claim 2, which is characterized in that polyester fiber is in transition part（420）Upper winding
The number of turns ranging from 400 circles/cm ~ 600 circles/cm.
4. a kind of copper-clad plate according to claim 1, which is characterized in that first thermal insulation layer（3）Thickness be 5
~25μm。
5. a kind of copper-clad plate according to claim 1, which is characterized in that second thermal insulation layer（5）Thickness be
20~30μm。
6. according to a kind of copper-clad plate of claim 1-5 any one of them, which is characterized in that the silane coupled agent film（6）
Thickness range be 5 ~ 30 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820251073.1U CN207931213U (en) | 2018-02-12 | 2018-02-12 | A kind of copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820251073.1U CN207931213U (en) | 2018-02-12 | 2018-02-12 | A kind of copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207931213U true CN207931213U (en) | 2018-10-02 |
Family
ID=63652551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820251073.1U Active CN207931213U (en) | 2018-02-12 | 2018-02-12 | A kind of copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207931213U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110126387A (en) * | 2019-06-14 | 2019-08-16 | 铜陵华科电子材料有限公司 | It is a kind of using polytetrafluoroethylene (PTFE) as the flexible aluminium base board manufacturing method of matrix |
| CN110406203A (en) * | 2019-08-16 | 2019-11-05 | 南亚电子材料(惠州)有限公司 | A kind of heat-resisting composite-based copper clad plate |
| CN110421930A (en) * | 2019-08-16 | 2019-11-08 | 南亚电子材料(惠州)有限公司 | A kind of insulating sticky sheeting |
-
2018
- 2018-02-12 CN CN201820251073.1U patent/CN207931213U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110126387A (en) * | 2019-06-14 | 2019-08-16 | 铜陵华科电子材料有限公司 | It is a kind of using polytetrafluoroethylene (PTFE) as the flexible aluminium base board manufacturing method of matrix |
| CN110406203A (en) * | 2019-08-16 | 2019-11-05 | 南亚电子材料(惠州)有限公司 | A kind of heat-resisting composite-based copper clad plate |
| CN110421930A (en) * | 2019-08-16 | 2019-11-08 | 南亚电子材料(惠州)有限公司 | A kind of insulating sticky sheeting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A type of copper-clad board Effective date of registration: 20231128 Granted publication date: 20181002 Pledgee: Agricultural Bank of China Limited Hangzhou Yuhang Branch Pledgor: ZHEJIANG HUAZHENG NEW MATERIAL GROUP Co.,Ltd. Registration number: Y2023980067733 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |