CN207919965U - A kind of floor base plate and the floor panel structure using the substrate - Google Patents
A kind of floor base plate and the floor panel structure using the substrate Download PDFInfo
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- CN207919965U CN207919965U CN201621329416.9U CN201621329416U CN207919965U CN 207919965 U CN207919965 U CN 207919965U CN 201621329416 U CN201621329416 U CN 201621329416U CN 207919965 U CN207919965 U CN 207919965U
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- substrate
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- plate
- floor base
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Abstract
The utility model discloses a kind of floor base plate, including substrate plate body, the groove for placing heating pipeline is provided on the substrate plate body, the left side and/or right side of the substrate plate body are vertically arranged with buckle and/or card slot along it, the buckle and card slot can mutually matched grafting by adjacent two substrate connections in left and right.
Description
Technical field
The utility model is related to the technical field of floor installation, a kind of particularly floor base plate and using the substrate
Floor panel structure.
Background technology
With the development of society, people are higher and higher to environment especially living environment requirement, do not require nothing more than and has family and can occupy,
What is also required is comfortable.But the north especially cold in winter, using traditional fireplace style heating equipment, due to fever
Source is gathered on a point, indoor non-uniform temperature, is not particularly suitable for the use of multicell household.By air conditioning and heating, by
It is lighter in warm wind, warm air is needed into prodigious power full of entire room, to need to expend a large amount of thermal energy, resource consumption
Take larger.
For these reasons, present majority begin to use the mode of floor heating to heat.
In the prior art, floor and heating equipment（Electric heating or hot-water heating）It is two products respectively, flooring mode is complicated.First will
Heating equipment is mated formation to be embedded in fever spool in cement layer on the surface layer of floor, waits cement layers to solidify completely, water is finished on ground
Floor Covering is used on the ground again after flat processing, room can be radiated heat source by first having to preheating floor cement layer
In, thermal conversion rate is very low, and heating rate is very slow.Here it is in place of the deficiencies in the prior art.
Utility model content
Technical problem to be solved in the utility model aiming at deficiency of the prior art, and provides a kind of
Floor base plate can facilitate installation using the substrate, and can be rapidly heated.
This programme is achieved by the following technical measures：A kind of floor base plate, including substrate plate body, the substrate plate
The groove for placing heating pipeline is provided on body, the left side and/or right side of the substrate plate body are vertically arranged with card along it
Button and/or card slot, the buckle and card slot can mutually matched grafting by adjacent two substrate connections in left and right.Using this skill
Art scheme is provided with the groove due to placing heating pipeline on substrate plate body, and heating pipeline is placed in groove, pipeline is heated
The heat of generation can be directly transferred on the floor above substrate, and realization is rapidly heated, in addition, being provided with matching on substrate plate body
Card slot and buckle, adjacent substrate are easy for installation by card slot and buckle grafting.
Preferably, the buckle includes that cross spacing protrusion and the vertical spacing being connect with cross spacing protrusion are raised,
The card slot is the card slot of through substrate plate body, and the card slot includes cross spacing groove and is connected to cross spacing groove
Vertical spacing groove, the cross spacing protrusion are mutually matched with cross spacing groove, the vertical spacing protrusion and vertical limit
Position groove is mutually matched.Using the technical program, when buckle is with card slot cooperation, the card slot and buckle can be from laterally and vertically
Limit left and right adjacent substrate position, can realize the accurate positionin of adjacent substrate, avoid due to operating personnel slip up or not
The phenomenon of gap size unevenness between left and right adjacent substrate caused by conscientious, improves construction quality；In addition, need to only fix start bit
The substrate set can be achieved with that the substrate of interconnection is fixed, and facilitate installation.
Preferably, the cross spacing protrusion is arc convex, cross spacing groove position arc groove；It is described vertical
Limit protrusion is L-type lap segment, and the vertical spacing groove is formed by inverted L shape lap segment, and the buckle is inserted in mutually matched
After in card slot, the arc convex is located in arc groove, and the L-type lap segment is docked with inverted L shape lap segment.Using this technology
Scheme, with after the card slot grafting being mutually matched, the arc convex is located in arc groove the buckle, the inverted L shape overlap joint
Section rides in L-type lap segment, realizes the docking of left and right adjacent substrate.
Preferably, the substrate plate body is the substrate plate body made of heat preservation antistatic material.Using the technical program, institute
It states substrate plate body to be made of thermal insulation material, the groove is arranged in the top of substrate plate body, effectively avoids adding in groove
The heat that hot pipeline generates is spread downwards, effectively raises heat utilization efficiency.
Preferably, the substrate plate body includes upper plate, lower plate and middle plate, and ribs are provided between the upper plate and middle plate
I, it is provided with ribs II between the middle plate and lower plate.Using the technical program, substrate plate body is using the above structure in not shadow
In the case of ringing substrate strength, basic weight can be effectively reduced, the cost of substrate is reduced.
Preferably, the ribs I and ribs II are staggered in the horizontal.Using the technical program, ribs I
It is mutually cooperateed with ribs II, ensures the intensity of substrate.
Preferably, for the groove along the longitudinally disposed of substrate plate body, the groove is the groove of through substrate plate body, institute
Groove is stated to be arranged in the top of middle plate.Using the technical program, groove is arranged in the top of middle plate, is further effectively avoided
Heat is spread downwards.
Preferably, ribs II are provided with below the middle part of the groove.Using the technical program, can effectively increase
The intensity of strong basis plate, avoids substrate from being broken from groove.
Preferably, as another embodiment, the substrate plate body includes upper plate and lower plate, between the upper plate and lower plate
It is provided with ribs III.
Preferably, for the groove along the longitudinally disposed of substrate plate body, the groove is the groove of through substrate plate body.
A kind of floor panel structure using aforesaid substrate, including multiple aforesaid substrates are laid with the substrate layer to be formed, the substrate
Layer, which is arranged above the top of concrete layer, the substrate layer, is equipped with floor layer, is provided with and adds in the groove of the substrate
Hot pipeline.Using the technical program, in the top of concrete layer, paving substrate layer（The direct grafting of adjacent substrate is not necessarily to glue
It is viscous）, heating pipeline is laid in substrate layer（Such as heating pipe or heating cable）, then laying floor on the substrate layer, passes through
Pipeline heating is heated, heat is directly transferred on floor layer, and then is diffused into interior.Using this floor panel structure, heat utilization is high, heating
Efficiency is fast, easy for installation.
Preferably, Self-leveling screed-coat is provided between the concrete layer and substrate layer.Using the technical program, utilize
Self-leveling screed-coat is arranged in Self-leveling technique, and the thickness of Self-leveling screed-coat is 5mm-20mm.
Preferably, the Self-leveling screed-coat is equipped with thermal insulation board with substrate layer, it is preferred that the thermal insulation board is extrusion molding
Plate.Using the technical program, being provided with thermal insulation board can prevent heat from spreading downwards.
It can be seen that the utility model compared with prior art, has substantive features and progress, the beneficial effect implemented
Fruit is also obvious.
Description of the drawings
In order to illustrate more clearly of the technical solution of the utility model, attached drawing needed in description will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the utility model, for this field
For those of ordinary skill, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is the main structure diagram of substrate；
Fig. 2 is the overlooking structure diagram of substrate；
Fig. 3 is the connection diagram of adjacent substrate；
Fig. 4 is the structural schematic diagram of floor panel structure；
Fig. 5 is the main structure diagram of another embodiment of substrate；
Fig. 6 is the enlarged structure schematic diagram in the portions A in Fig. 1；
Fig. 7 is the enlarged structure schematic diagram in the portions B in Fig. 1；
Fig. 8 is another structural schematic diagram of floor panel structure.
In figure：1- substrate bodies, 1.1- grooves, 1.2- card slots, 1.2.1- cross spacing grooves, 1.2.2- vertical spacings are recessed
Slot, 1.2.3- inverted L shape lap segments, 1.3- buckles, 1.3.1- cross spacing protrusions, 1.3.2- vertical spacing protrusions, 1.4- upper plates,
Plate in 1.5-, 1.6- lower plates, 1.7- ribs I, 1.8- ribs II, 1.9- ribs III, 2- concrete layers, 3- Self-levelings are looked for
Flat bed, 4- substrate layers, 5- heat pipeline, 6- floor layers, 7- thermal insulation boards.
Specific implementation mode
It, below will fortune to enable the purpose of utility model, feature, advantage of the utility model more apparent and understandable
With specific embodiment and attached drawing, the technical solution of the utility model protection is clearly and completely described, it is clear that below
The described embodiments are only a part of the embodiments of the utility model, and not all embodiment.Based on the reality in this patent
Example is applied, all other embodiment obtained by those of ordinary skill in the art without making creative efforts all belongs to
In the range of this patent protection.
As shown in Fig. 1,2,3,6 and 7, a kind of floor base plate, including substrate plate body 1 is arranged on the substrate plate body 1 useful
In the groove 1.1 for placing heating pipeline 5, the left side and/or right side of the substrate plate body 1 along its be vertically arranged with buckle 1.3 and/
Or card slot 1.2, the buckle 1.3 and card slot 1.2 can mutually matched grafting by adjacent two substrate connections in left and right.Substrate
It is provided with the groove 1.1 due to placing heating pipeline 5 on plate body 1, heating pipeline 5 is placed in groove 1.1, pipeline 5 is heated
The heat of generation can be directly transferred on the floor above substrate, and realization is rapidly heated, in addition, being provided with matching on substrate plate body 1
Card slot 1.2 and buckle 1.3, adjacent substrate by card slot 1.2 and buckle 1.3 grafting, it is easy for installation.
In the technical scheme, it is described buckle 1.3 include cross spacing protrusion 1.3.1 and with cross spacing protrusion
1.3.1 the vertical spacing protrusion 1.3.2 connected, the card slot 1.2 are the card slot of through substrate plate body 1, and the card slot 1.2 includes
The cross spacing groove 1.2.1 and vertical spacing groove 1.2.2 being connected to cross spacing groove 1.2.1, the cross spacing
Raised 1.3.1 is mutually matched with cross spacing groove 1.2.1, the vertical spacing protrusion 1.3.2 and vertical spacing groove 1.2.2
It is mutually matched.When buckle 1.3 coordinates with card slot 1.2, the card slot 1.2 and buckle 1.3 can be from laterally and vertical limiting left and right
The position of adjacent substrate can realize the accurate positionin of adjacent substrate, avoid due to operating personnel's error or half-hearted cause
Left and right adjacent substrate between gap size unevenness phenomenon, improve construction quality；In addition, need to only fix the substrate of initial position
It can be achieved with that the substrate of interconnection is fixed, facilitate installation.
In the technical scheme, the cross spacing protrusion 1.3.1 is arc convex, the cross spacing groove 1.2.1
Position arc groove；The vertical spacing protrusion 1.3.2 is L-type lap segment, and the vertical spacing groove 1.2.2 is overlapped by inverted L shape
Section is formed, and after the buckle 1.3 is inserted in mutually matched card slot 1.2, the arc convex is located in arc groove, the L
Type lap segment is docked with inverted L shape lap segment.After the buckle 1.3 and 1.2 grafting of card slot being mutually matched, the arc convex position
In in arc groove, the inverted L shape lap segment rides in L-type lap segment, realizes the docking of left and right adjacent substrate.
In the technical scheme, the substrate plate body 1 is the substrate plate body made of heat preservation antistatic material.The substrate
Plate body 1 uses thermal insulation material（Such as PVC material）It is made, the groove 1.1 is arranged in the top of substrate plate body 1, effectively avoids
The heat that heating pipeline 5 in groove 1.1 generates is spread downwards, effectively raises heat utilization efficiency.
In the technical scheme, the substrate plate body 1 includes upper plate 1.4, lower plate 1.6 and middle plate 1.5, the upper plate 1.4
Ribs I 1.7 are provided between middle plate 1.5, ribs II 1.8 are provided between the middle plate 1.5 and lower plate 1.6.Substrate
Plate body 1 in the case where not influencing substrate strength, can effectively reduce the quality of substrate using the above structure, reduce substrate at
This.
In the technical scheme, the ribs I 1.7 and ribs II 1.8 are staggered in the horizontal.Ribs I
1.7 and ribs II 1.8 mutually cooperate with, ensure the intensity of substrate.
In the technical scheme, for the groove 1.1 along the longitudinally disposed of substrate plate body 1, the groove 1.1 is perforation base
The groove of plate plate body 1, the groove 1.1 are arranged in the top of middle plate 1.5.Groove 1.1 is arranged in the top of middle plate 1.5, into
One step effectively avoids heat from spreading downwards.
In the technical scheme, ribs II 1.8 are provided with below the middle part of the groove 1.1.Can effectively it increase
The intensity of strong basis plate avoids substrate from being broken from groove 1.1.
Preferably, as shown in figure 5, as another embodiment, the substrate plate body 1 includes upper plate 1.4 and lower plate 1.6,
Ribs III 1.9 are provided between the upper plate 1.4 and lower plate 1.6.
Preferably, for the groove 1.1 along the longitudinally disposed of substrate plate body 1, the groove 1.1 is through substrate plate body 1
Groove.
As shown in figure 4, a kind of floor panel structure using aforesaid substrate, including multiple aforesaid substrates are laid with the substrate layer to be formed
4, the substrate layer 4 is arranged in the top of concrete layer 2, and the top of the substrate layer 4 is equipped with floor layer 6, the substrate
Heating pipeline 5 is provided in groove 1.1.In the top of concrete layer 2, paving substrate layer 4（The direct grafting of adjacent substrate,
Without gluing）, heating pipeline 5 is laid in substrate layer 4（Such as heating pipe or heating cable）, then it is laid on substrate layer 4
Floor layer 6 is heated by heating pipeline 5, and heat is directly transferred on floor layer 6, and then is diffused into interior.Using local hardened
Structure, heat utilization is high, and the efficiency of heating surface is fast, easy for installation.
In the technical scheme, Self-leveling screed-coat 3 is provided between the concrete layer 2 and substrate layer 4.Utilize gravity flow
Flat technique setting Self-leveling screed-coat 3, the thickness of Self-leveling screed-coat 3 is 5mm-20mm.
The Self-leveling screed-coat 3 is equipped with thermal insulation board 7 with substrate layer 4, and the thermal insulation board 7 is extruded sheet, is provided with guarantor
Warm plate 7 can prevent heat from spreading downwards.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other
The difference of embodiment, identical similar portion refers to mutually between each embodiment.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use this practicality new
Type.Various modifications to these embodiments will be apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest range consistent with features of novelty, creative feature.
Claims (22)
1. a kind of floor base plate, it is characterized in that：Including substrate plate body, it is provided on the substrate plate body for placing heating pipeline
Groove, the left side and/or right side of the substrate plate body are vertically arranged with buckle and/or card slot, the buckle and card slot along it
Can mutually matched grafting by two adjacent substrate connections of left and right；
The buckle includes cross spacing protrusion and the vertical spacing protrusion being connect with cross spacing protrusion, and the card slot is to pass through
The card slot of logical substrate plate body, the card slot includes that cross spacing groove and the vertical spacing being connected to cross spacing groove are recessed
Slot, the cross spacing protrusion are mutually matched with cross spacing groove, and the vertical spacing protrusion and vertical spacing groove are mutual
Matching.
2. floor base plate according to claim 1, it is characterized in that：The cross spacing protrusion is arc convex, the cross
To limiting groove position arc groove；The vertical spacing protrusion is L-type lap segment, and the vertical spacing groove is overlapped by inverted L shape
Section is formed, and after the buckle is inserted in mutually matched card slot, the arc convex is located in arc groove, the L-type overlap joint
Section is docked with inverted L shape lap segment.
3. floor base plate according to claim 1 or 2, it is characterized in that：The substrate plate body is by heat preservation antistatic material
Manufactured substrate plate body.
4. floor base plate according to claim 1 or 2, it is characterized in that：The substrate plate body include upper plate, lower plate and in
Plate is provided with ribs I, ribs II is provided between the middle plate and lower plate between the upper plate and middle plate.
5. floor base plate according to claim 4, it is characterized in that：The ribs I and ribs II are to hand in the horizontal
Mistake arrangement.
6. floor base plate according to claim 4, it is characterized in that：The groove is longitudinally disposed along substrate plate body, institute
The groove that groove is through substrate plate body is stated, the groove is arranged in the top of middle plate.
7. floor base plate according to claim 6, it is characterized in that：It is provided with ribs below the middle part of the groove
Ⅱ。
8. floor base plate according to claim 1 or 2, it is characterized in that：The substrate plate body includes upper plate and lower plate, described
Ribs III are provided between upper plate and lower plate.
9. floor base plate according to claim 8, it is characterized in that：The groove is longitudinally disposed along substrate plate body, institute
State the groove that groove is through substrate plate body.
10. a kind of floor base plate, it is characterized in that：Including substrate plate body, it is provided on the substrate plate body for placing heating tube
The groove of line, the left side and/or right side of the substrate plate body are vertically arranged with buckle and/or card slot, the buckle and card along it
Slot can mutually matched grafting by two adjacent substrate connections of left and right；
The substrate plate body includes upper plate, lower plate and middle plate, and ribs I, the middle plate are provided between the upper plate and middle plate
Ribs II are provided between lower plate.
11. floor base plate according to claim 10, it is characterized in that：The substrate plate body is by heat preservation antistatic material system
At substrate plate body.
12. floor base plate according to claim 10, it is characterized in that：The ribs I and ribs II are in the horizontal
It is staggered.
13. floor base plate according to claim 10, it is characterized in that：The groove is longitudinally disposed along substrate plate body,
The groove is the groove of through substrate plate body, and the groove is arranged in the top of middle plate.
14. floor base plate according to claim 10, it is characterized in that：It is provided with ribs below the middle part of the groove
Ⅱ。
15. a kind of floor base plate, it is characterized in that：Including substrate plate body, it is provided on the substrate plate body for placing heating tube
The groove of line, the left side and/or right side of the substrate plate body are vertically arranged with buckle and/or card slot, the buckle and card along it
Slot can mutually matched grafting by two adjacent substrate connections of left and right；
The substrate plate body includes upper plate and lower plate, and ribs III are provided between the upper plate and lower plate.
16. floor base plate according to claim 15, it is characterized in that：The substrate plate body is by heat preservation antistatic material system
At substrate plate body.
17. floor base plate according to claim 15, it is characterized in that：The groove is longitudinally disposed along substrate plate body,
The groove is the groove of through substrate plate body.
18. a kind of floor panel structure using substrate described in the claims 1-17 any claims, it is characterized in that：Including more
A aforesaid substrate is laid with the substrate layer to be formed, and the substrate layer is arranged in the top of concrete layer, and the top of the substrate layer is spread
Equipped with floor layer, heating pipeline is provided in the groove of the substrate.
19. floor panel structure according to claim 18, it is characterized in that：It is provided between the concrete layer and substrate layer certainly
Levelling screed-coat.
20. floor panel structure according to claim 19, it is characterized in that：The thickness of the Self-leveling screed-coat is 5mm-
20mm。
21. floor panel structure according to claim 19, it is characterized in that：The Self-leveling screed-coat is equipped with guarantor with substrate layer
Warm plate.
22. floor panel structure according to claim 21, it is characterized in that：The thermal insulation board is extruded sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621329416.9U CN207919965U (en) | 2016-12-02 | 2016-12-02 | A kind of floor base plate and the floor panel structure using the substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621329416.9U CN207919965U (en) | 2016-12-02 | 2016-12-02 | A kind of floor base plate and the floor panel structure using the substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207919965U true CN207919965U (en) | 2018-09-28 |
Family
ID=63611442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621329416.9U Active CN207919965U (en) | 2016-12-02 | 2016-12-02 | A kind of floor base plate and the floor panel structure using the substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207919965U (en) |
-
2016
- 2016-12-02 CN CN201621329416.9U patent/CN207919965U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221103 Address after: 250000 First Floor of Industrial Development Zone of Beiwaihuan Road, Tianqiao District, Jinan City, Shandong Province Patentee after: Jiegou (Shandong) prefabricated construction technology Co.,Ltd. Address before: No. 2, Fenghuang Road, Sanhe Village, Taiqian Office, Taishan District, Tai'an City, Shandong Province 250003 Patentee before: Zhou Meiliang |
|
| TR01 | Transfer of patent right |