CN207901653U - Vamp spike molding machine - Google Patents

Vamp spike molding machine Download PDF

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Publication number
CN207901653U
CN207901653U CN201820156418.5U CN201820156418U CN207901653U CN 207901653 U CN207901653 U CN 207901653U CN 201820156418 U CN201820156418 U CN 201820156418U CN 207901653 U CN207901653 U CN 207901653U
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CN
China
Prior art keywords
metal frame
vamp
molding machine
lower die
heater
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CN201820156418.5U
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Chinese (zh)
Inventor
萧瑞芬
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DALIPU Co Ltd
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DALIPU Co Ltd
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Priority to CN201820156418.5U priority Critical patent/CN207901653U/en
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Abstract

The utility model provides a kind of vamp spike molding machine, it is mainly made of board, a upper die unit and a lower die unit, by upper and lower heater and upper and lower silica gel piece at a distance of a distance, the mode of heating of hanging indirect is provided, the heat source for preventing semi-finished product vamp heated is influenced and is deformed, and achievees the purpose that reduce defective products generation rate.

Description

Vamp spike molding machine
Technical field
The utility model is especially a kind of to pass through pull of vacuum and heat effect system about a kind of vamp spike molding machine Make the vamp spike molding machine of vamp.
Background technology
General vamp is in order to increase the effect of beauty etc., it will usually mold lines of all kinds on the outer surface, and be The lines is molded, producer would generally be operated using heat pressing forming machines, and general heat pressing forming machines are mainly arranged Shoes form unit, the shoes form unit are combined by male model and the master mold that can be combined with the male model, the shoes for finished product of meeting half way Face is placed in the shoes form unit, heating with by way of pressurization, can form the lines in the vamp.
Prior art heat pressing forming machines structure is because of the heating that the heater of the male model and the master mold is contact, so when should When carrying out hot briquetting to the vamp, generated heat can be directly conducted on the vamp shoes form unit, and may make this The situation of lines softening transform occurs, and will so increase the generation of defective products, and reduces the operating efficiency pole of heat pressing forming machines Forming Quality.
Therefore, this creator in view of prior art heat pressing forming machines structure and uses upper missing, and spy is by continuous Research and improvement develop a kind of utility model for improving prior art defect finally.
Utility model content
The shortcomings that in view of the above-mentioned prior art, therefore, the utility model, provide a kind of vamp spike molding machine, provide outstanding The mode of heating of empty indirect prevents vamp from being heated by direct heat source and influencing to deform.
Another object of the present invention is to provide a kind of vamp spike molding machine, and main sides inhale vacuum around Mode improves the mode of suction and pumping vacuum under the prior art, can reduce the packet wind that cladding packet vamp caused by the prior art generates Phenomenon.In addition, the utility model can carry out positive pressure air blowing assistant formation by upper die unit and lower die unit.
To reach foregoing purpose, the utility model provides a kind of vamp spike molding machine, including:
One board;
One upper die unit can be telescopically arranged in the board, including a upper mold, die cavity on the upper mold recessed one, One is set on this upper metal frame in die cavity, metal frame slot on metal frame recessed one on this, and one is set on this in metal frame slot Upper heater and one can alternatively be set to metal frame on this and cover the upper silicon rubber piece of metal frame slot on this, silicon on this Film is with the upper heater at a distance of a distance;
Two lower die units, are slidedly arranged on the board and two lower die unit is able to combination opposite with the upper die unit or divides From, and there are twice molds, each recessed die cavity once of the lower mold, one is set to the lower metal frame in the lower die cavity, the lower gold Belong to the recessed metal frame slot once of frame, a lower heater being set in the lower metal frame slot and one can alternatively be set under this Metal frame and the lower silicon rubber piece for covering the lower metal frame slot, the lower silicon rubber piece is with the lower heater at a distance of a distance.
Preferably, wherein the upper heater includes at least one upper heating component for being installed in inside.
Preferably, heating component uses infrared lamp wherein on this.
Preferably, wherein respectively the lower heater includes at least one lower heating component for being installed in inside.
Preferably, wherein the lower heating component uses infrared lamp.
Preferably, wherein on this die cavity and on this between metal frame have a upper mold flow channel, the upper die unit have one It is connected to the upper mold flow channel and through the upper mold outlet of die cavity on this.
Preferably, wherein respectively having a lower die flow channel between the lower die cavity and the lower metal frame, respectively the lower die unit has There is the connection lower die flow channel and is exported through the lower die of the lower die cavity.
Preferably, wherein each both sides of the lower die unit, two first positioning locks are respectively set and two correspond to first positioning Second positioning lock of lock.
Accordingly, the utility model provides a kind of vamp spike molding machine, mainly by board, a upper die unit, And one lower die unit formed, by upper and lower heater and upper and lower silica gel piece at a distance of a distance, provide hanging indirect plus Hot mode, the heat source for preventing vamp heated are influenced and are deformed, and achieve the purpose that reduce defective products generation rate.
Description of the drawings
Fig. 1 is the stereogram of the utility model embodiment vamp spike molding machine;
Fig. 2 is the sectional view of the utility model embodiment;
Fig. 3 is the sectional view of the utility model embodiment upper mold unit;
Fig. 4 is the sectional view of die unit under the utility model embodiment;
Fig. 5 is the pressing schematic diagram of the utility model embodiment;And
Fig. 6 is the flow chart of the utility model embodiment vamp spike forming method.
Reference sign.
Semi-finished product vamp A
X-direction X
Y direction Y
Board 20
Cabinet seat 21
Distribution base 22
Distribution portion 221
Plummer 23
Cunning sets slot 231
First cooling zone 232
Second cooling zone 233
Heating zone 234
Track groups 24
Telescopic rod 25
Upper die unit 30
Upper mold 31
Upper die cavity 311
Upper mold seal groove 312
Upper metal frame 32
Upper metal frame slot 321
Upper heater 33
Upper heating component 331
Upper diffusion sheet 332
Upper silicon rubber piece 34
Upper mold flow channel 35
Upper mold outlet 36
Upper mold optical sensor 37
Upper mold is arranged ring 38
Upper mold sealing ring 39
Lower die unit 40
Lower mold 41
Lower die cavity 411
Lower die seal groove 412
Lower metal frame 42
Lower metal frame slot 421
Lower heater 43
Lower heating component 431
Lower diffusion sheet 432
Lower silicon rubber piece 44
Lower die flow channel 45
Lower die outlet 46
Lower die optical sensor 47
Lower die is arranged ring 48
Lower die sealing ring 49
First positioning lock 50
Second positioning lock 60
It is evacuated chamber 70
Setting steps S1
Place step S2
Closely sealed step S3
Pump step S4
Heating stepses S5
Blow step S6.
Specific implementation mode
About the aforementioned of the utility model and other technology contents, feature and effect, in following cooperation refer to the attached drawing In the detailed description of preferred embodiment, can clearly it present.
It please referring to Fig.1 to shown in Fig. 2, the utility model embodiment provides a kind of vamp spike molding machine, including:One Board 20, a upper die unit 30 and two lower die units 40.
The board 20 includes a cabinet seat 21, one setting 21 top of cabinet seat and is set in the distribution base 22, one of ㄇ fonts The plummer 23 of the distribution base 22 is set between the distribution base 22 and the cabinet seat 21 and connects, which has a distribution Portion 221, which is in rectangular parallelepiped structure, and the cunning with one in face of the distribution portion 221 sets slot 231 and one and is set to this The sliding track groups 24 set in slot 231.There is the plummer 23 one first cooling zone 232, one second cooling zone 233 and one to be located at Heating zone 234 between first cooling zone 232 and second cooling zone 233 and in face of the distribution portion 221.The board 20 has The Y direction Y of the vertical X-direction X of one X-direction X and one, which can be along the Y The telescopic rod 25 that axis direction Y reciprocally stretches above and below, can drive the upper die unit 30 to move up and down by the telescopic rod 25.
It please refers to shown in Fig. 2, which can telescopically be arranged the telescopic rod 25 in the board 20, including one Upper mold 31, die cavity 311 on the upper mold 31 recessed one, one is set on this upper metal frame 32 in die cavity 311, metal on this Metal frame slot 321 on frame 32 recessed one, one is set to upper heater 33 on this in metal frame slot 321 and one can alternatively set It is placed in metal frame 32 on this and covers the upper silicon rubber piece 34 of metal frame slot 321 on this, the upper silicon rubber piece 34 and the upper heater 33 At a distance of a distance;In the present embodiment, which includes at least one to be installed in internal upper heating component 331, on this plus For hot component 331 lifts four, but not limited to this, and respectively heating component 331 uses infrared lamp on this.Die cavity 311 on this There is a upper mold flow channel 35 between metal frame on this 32, please refer to shown in Fig. 3, which has one to be connected on this Mould flow channel 35 and the upper mold outlet 36 for running through die cavity 311 on this.Setting at least two is in V-shape and packet in the upper heater 33 Cover the upper diffusion sheet 332 of respectively heating component 331 on this, such upper diffusion sheet 332 is improving and concentrate such upper heating component The infrared energy of 331 releases.The upper silicon rubber piece 34 is to be locked in metal frame 32 on this, provides and is easy to change the upper silicon rubber piece 34 Function, meanwhile, ring 38 is arranged with a upper mold and is sheathed on the upper silicon rubber piece 34, to fix the metal on this of upper silicon rubber piece 34 On frame 32.The peripheral region recessed one of the upper mold 31 surrounds the upper mold seal groove 312 of die cavity 311 on this, and is sealed with a upper mold Ring 39 is set in the upper mold seal groove 312;The upper silicon rubber piece 34 provides outstanding with the upper heater 33 at a distance of a distance as a result, The mode of heating of empty indirect, the heat source for preventing vamp heated are influenced and are deformed, and reaching reduces defective products generation rate Purpose.
It please refers to shown in Fig. 2, two lower die unit 40, is slidedly arranged in the track groups 24 of the board 20 and two lower die unit 40 are able to combine or detach relatively with the upper die unit 30, and have twice molds 41, and respectively the lower mold 41 is recessed once Die cavity 411, one is set to the lower metal frame 42 in the lower die cavity 411, the recessed slot of metal frame once of the lower metal frame 42 421, and one Lower heater 43 and one in the lower metal frame slot 421 can alternatively be set to the lower metal frame 42 and cover under this The lower silicon rubber piece 44 of metal frame slot 421, the lower silicon rubber piece 44 is with the lower heater 43 at a distance of a distance;Under this in the present embodiment two Form unit 40 in first cooling zone 232, second cooling zone 233 and can be somebody's turn to do by the track groups 24 and along X-direction X It is moved back and forth between heating zone 234.Respectively the lower heater 43 includes at least one to be installed in internal lower heating component 431, under this For heating component 431 lifts four, but not limited to this, which uses infrared lamp.The respectively lower die cavity There is a lower die flow channel 45 between 411 and the lower metal frame 42, please refer to shown in Fig. 4, respectively the lower die unit 40 has one to connect Lead to the lower die flow channel 45 and through the lower die of the lower die cavity 411 outlet 46.Setting at least two is in V words in the lower heater 43 The lower diffusion sheet 432 of type and each lower heating component 431 of cladding, such lower diffusion sheet 432 is improving and concentrate the lower heating The infrared energy that component 431 discharges.The lower silicon rubber piece 44 is to be locked in metal frame 42 on this, provides and is easy to change the lower silica gel The function of piece 44, meanwhile, ring 48 is set with a lower die-sleeve and is sheathed on the lower silicon rubber piece 44, to fix the lower silicon rubber piece 44 on this On metal frame 42.The peripheral region recessed one of the lower mold 41 surrounds the lower die seal groove 412 of the lower die cavity 411, and with a lower die Sealing ring 49 is set in the upper mold seal groove 412;The lower silicon rubber piece 44 is carried with the lower heater 43 at a distance of a distance as a result, For the mode of heating of hanging indirect, the heat source for preventing vamp heated is influenced and is deformed, and reaching reduces defective products generation The purpose of rate.
It please refers to shown in Fig. 2, when being acted to the board 20, first, please refers to shown in Fig. 5, half product shoes are set Face A is arranged on the surface of such lower die unit 40, wherein the lower die unit 40 can be slidably installed in the heating zone 234(In figure not Show), another lower die unit 40 can rest on first cooling zone 232 or second cooling zone 233 and wait for, at this point, on this Form unit 30 moves down along X-direction X and carries out pressing action with the lower die unit 40 of position in the heating zone 234, Thus heat-activated processing can be carried out to semi-finished product vamp A, wherein heating component 331 and such lower heating component on this 431 be by infrared thermal radiation mode penetrates the upper silicon rubber piece 34 and lower silicon rubber piece 44 for the semi-finished product vamp A with Contactless state is heated, and avoidable to the semi-finished product vamp A, softening transform or the situation of damage are sent out caused by temperature is excessively high It is raw, allow the semi-finished product vamp A entirety temperature rise effect that can achieve the purpose that reduce defective products generation rate more rapidly with concentration.In addition, Cooperation vacuumizes operation while during above-mentioned hot-forming, and the air in center can be toward the side in left side and right side when pressing To pushing, which is laminated with the lower die sealing ring 49, to completely cut off the entrance of extraneous air so that on this Reach airtight protection effect between form unit 30 and the lower die unit 40, meanwhile, the upper die unit 30 and the lower die unit 40 Between air be pulled out by the upper mold flow channel 35 and the lower die flow channel 45.
It is noted that please referring to shown in Fig. 4, respectively the both sides of the lower die unit 40, are respectively set two at a distance of a distance The first positioning lock 50 and two correspond to first positioning lock 50 and at a distance of a distance the second positioning lock 60.
It is noted that please referring to shown in Fig. 5, which there is a pair to be installed on this in die cavity 311 There is a pair to be installed in the lower die optical sensor 47 in the lower die cavity 411 for upper mold optical sensor 37, the lower die unit 40, should Upper mold optical sensor 37 senses such upper heating component 331 and such lower heating component with the lower die optical sensor 47 The infrared energy of 431 releases, to prevent the semi-finished product vamp A because temperature causes to damage, and can pass through the upper mold optics Sensor 37 and the lower die optical sensor 47 allow the action that operator knows that the board 20 is being heated, to reach safety The protection effect of operation.
It is above a kind of vamp spike molding machine main member of the utility model and structure assembled state, in addition, as Details are as follows for vamp spike forming method, before proposing to be described in detail, it is noted that, it is in the following description, similar Component is indicated with being identically numbered.And please refer to shown in Fig. 5, Fig. 6, a vamp spike forming method, this method includes:
(A)Setting steps S1:A upper die unit 30 is enabled to be equipped with a upper silicon rubber piece 34 and a lower die unit 40 equipped with silicon once Film 44;
(B)Place step S2:Half finished product vamp A is placed on the lower silicon rubber piece 44;
(C)Closely sealed step S3:The mobile upper die unit 30 forms a pumping chamber 70 toward the lower die unit 40 is closely sealed;
(D)Pump step S4:Opening laterally to vacuumize makes to form negative pressure in the pumping chamber 70;
(E)Heating stepses S5:It opens in a upper heater 33 and lower die unit 40 in the upper die unit 30 once It is molten that heater 43 carries out glue to semi-finished product vamp A;
(F)Blow step S6:It opens positive pressure to blow, to upper silicon rubber piece 34 and the lower die unit 40 of the upper die unit 30 Lower silicon rubber piece 44 bestows the spike of pressure assistant formation semi-finished product vamp A.
The technology of the above-mentioned vamp spike forming method is to belong to side-suction type and is without the use of mold, compared to existing skill The mode inhaled under art will produce packet wind phenomenon, which is if inhaling mode instantly using air-locked material when ground Air or gas has little time effectively to flee from the pumping chamber 70 so that plastics can not effectively be injected into some corner in mold It is formed by scarce material problem, therefore, the utility model inhales mode using side and is without the use of mold, improves lacking for the prior art It falls into.
In conclusion the utility model mainly by the upper heater 33, the lower heater 44 and the upper silicon rubber piece 34, should Lower silicon rubber piece 44 provides the mode of heating of hanging indirect, the heat source for preventing semi-finished product vamp A heated at a distance of a distance It influences and deforms, and achieve the purpose that reduce defective products generation rate.
Only as described above, embodiment and attached drawing are only the preferred embodiment of the utility model, when cannot be limited with this Determine the range of the utility model implementation, it is all according to equivalent variations made by the utility model claims range and modification, should all it belong to The range that the utility model patent is protected.

Claims (8)

1. a kind of vamp spike molding machine, which is characterized in that include:
One board;
One upper die unit can be telescopically arranged in the board, including a upper mold, die cavity on the upper mold recessed one, one sets The upper metal frame being placed on this in die cavity, metal frame slot on metal frame recessed one on this, one is upper in metal frame slot on this Heater and one it can alternatively be set to metal frame on this and cover the upper silicon rubber piece of metal frame slot on this, the upper silicon rubber piece With the upper heater at a distance of a distance;And
Two lower die units, be slidedly arranged on the board and two lower die unit be able to it is opposite with the upper die unit combine or detach, And there are twice molds, each recessed die cavity once of the lower mold, one is set to the lower metal frame in the lower die cavity, the lower metal frame Recessed metal frame slot once, a lower heater being set in the lower metal frame slot and one can alternatively be set to the lower metal Frame and the lower silicon rubber piece for covering the lower metal frame slot, the lower silicon rubber piece is with the lower heater at a distance of a distance.
2. vamp spike molding machine as described in claim 1, which is characterized in that the upper heater is installed in comprising at least one Internal upper heating component.
3. vamp spike molding machine as claimed in claim 2, which is characterized in that heating component uses infrared lamp on this Pipe.
4. vamp spike molding machine as described in claim 1, which is characterized in that respectively the lower heater includes at least one installing In internal lower heating component.
5. vamp spike molding machine as claimed in claim 4, which is characterized in that the lower heating component uses infrared lamp Pipe.
6. vamp spike molding machine as described in claim 1, which is characterized in that die cavity and have between metal frame on this on this There are a upper mold flow channel, the upper die unit to have one to be connected to the upper mold flow channel and through the upper mold outlet of die cavity on this.
7. vamp spike molding machine as described in claim 1, which is characterized in that respectively between the lower die cavity and the lower metal frame With a lower die flow channel, respectively the lower die unit is with the connection lower die flow channel and through the outlet of the lower die of the lower die cavity.
8. vamp spike molding machine as described in claim 1, which is characterized in that the respectively both sides of the lower die unit are set respectively Set two first positioning locks and two correspond to first positioning lock the second positioning lock.
CN201820156418.5U 2018-01-30 2018-01-30 Vamp spike molding machine Active CN207901653U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820156418.5U CN207901653U (en) 2018-01-30 2018-01-30 Vamp spike molding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820156418.5U CN207901653U (en) 2018-01-30 2018-01-30 Vamp spike molding machine

Publications (1)

Publication Number Publication Date
CN207901653U true CN207901653U (en) 2018-09-25

Family

ID=63561666

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820156418.5U Active CN207901653U (en) 2018-01-30 2018-01-30 Vamp spike molding machine

Country Status (1)

Country Link
CN (1) CN207901653U (en)

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