CN207895835U - Array substrate, electronic equipment - Google Patents
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- CN207895835U CN207895835U CN201721926093.6U CN201721926093U CN207895835U CN 207895835 U CN207895835 U CN 207895835U CN 201721926093 U CN201721926093 U CN 201721926093U CN 207895835 U CN207895835 U CN 207895835U
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Abstract
The disclosure is directed to a kind of array substrate, electronic equipments.The array substrate includes the TFT layer of substrate and setting on the substrate；The TFT layer includes multiple row pixel subelement, multiple data lines and data driving chip；The multiple data lines are electrically connected data driving chip；It is electrically connected by connecting line between every data line and respective column pixel subelement in the multiple data lines；The connecting line is used to adjust the voltage drop between the data driving chip and respective column pixel subelement.It can be seen that, the embodiment of the present disclosure is by adjusting the still identical effect of voltage after the same voltage arrival same row pixel subelement of voltage drop realization, to solve the problems, such as or alleviate pixel subelement caused by the resistance of data line and connecting line show it is non-uniform, picture is set to show the usage experience for uniformly improving user.In addition, the manufacture craft realization of TFT layer may be used in connecting line in the embodiment of the present disclosure, process costs and technology difficulty will not be increased.
Description
Technical field
This disclosure relates to display technology field more particularly to a kind of array substrate, electronic equipment.
Background technology
Universal with smart mobile phone or intelligent computer, requirement of the user to its display screen is also higher and higher, for example, high
Resolution ratio (Pixels Per Inch, PPI), high contrast etc., so as to watch truer finer and smoother picture.For this purpose,
In display screen use silicon substrate display technology, such as organic light emitting diode (Organic Light Emitting Diode,
OLED), it is hopeful to realize the demand for making user watch truer finer and smoother picture.
Display screen use OLED array when, due to line average algorithm (Edge-based Line Average, ELA),
The problems such as pixel compensation scarce capacity or uneven vapor deposition, can have brightness irregularities, use in the related technology for example
The methods of Demura backoff algorithms solve or improve the above problem.
However, the above method can not but solve resistance drop (the i.e. IR that the resistance band of OLED array upward wiring comes
Drop the non-uniform problem of picture is shown caused by), to reduce the usage experience of user.
Utility model content
A kind of array substrate of disclosure offer, electronic equipment, to solve deficiency in the related technology.
According to the first aspect of the embodiments of the present disclosure, a kind of array substrate is provided, the array substrate includes substrate and sets
Set TFT layer on the substrate and data driving chip；The TFT layer includes multiple row pixel subelement, multiple data lines；Institute
State multiple data lines electrical connection data driving chip；Every data line in the multiple data lines and respective column pixel subelement
Between be electrically connected by connecting line；The connecting line is for adjusting between the data driving chip and respective column pixel subelement
Voltage drop.
Optionally, the electricity that the voltage drop per between data line and respective column pixel subelement passes through the connecting line
Resistance value adjusts.
Optionally, for each row pixel subelement for connecting same data line, each pixel subelement and the number
It is steady state value according to the resistance value of connecting line between driving chip and data line segment, or is no more than difference threshold with the difference of steady state value
Value；
The data line segment is the tie point of respective data lines and connecting line and the tie point with the data driving chip
Between part.
Optionally, on the basis of the data driving chip, connect the length of the connecting line per data line according to
First predetermined manner reduces.
Optionally, the length of the connection connecting line per data line includes according to the reduction of the first predetermined manner：
The length of adjacent two connecting lines is sequentially reduced；
Alternatively,
The length of two adjacent groups connecting line is sequentially reduced, and every group of connecting line includes the identical company of the first preset quantity length
Wiring.
Optionally, on the basis of the data driving chip, connect the width of the connecting line per data line according to
Second predetermined manner increases.
Optionally, the width of the connection connecting line per data line includes according to the second predetermined manner increase：
The width of adjacent two connecting lines successively increases；
Alternatively,
The width of two adjacent groups connecting line successively increases, and every group of connecting line includes the second preset quantity item company of same size
Wiring.
Optionally, the connecting line is arranged using S types.
Optionally, on the basis of the data driving chip, the incorporation alms giver of the connecting line per data line is connected
The concentration of impurity or acceptor impurity increases according to third predetermined manner.
Optionally, the incorporation donor impurity of the connecting line per data line or the concentration of acceptor impurity are connected according to the
Three predetermined manners increase：
The incorporation donor impurity of adjacent two connecting lines or the concentration of acceptor impurity are sequentially increased；
Alternatively,
The width of two adjacent groups connecting line is sequentially increased, and every group of connecting line includes that third preset quantity item mixes donor impurity
Or the identical connecting line of concentration of acceptor impurity.
Optionally, the connecting line per between data line and respective column pixel subelement is via via and the data
Line and pixel unit electrical connection.
According to the second aspect of the embodiment of the present disclosure, a kind of electronic equipment, including the array base described in first aspect are provided
Plate.
The technical scheme provided by this disclosed embodiment can include the following benefits：
By above-described embodiment it is found that the embodiment of the present disclosure is adjusted by adjusting connecting line between data line and pixel subelement
Voltage drop between entire data driving chip and respective column pixel subelement.As it can be seen that the embodiment of the present disclosure is by adjusting voltage drop
Realize that same voltage reaches the still identical effect of voltage after each pixel subelement of same row, to solve or alleviate data line
Pixel subelement caused by resistance with connecting line shows non-uniform problem, and picture is made to show the use for uniformly improving user
Experience.In addition, in the embodiment of the present disclosure connecting line may be used TFT layer manufacture craft realize, will not increase process costs and
Technology difficulty.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not
The disclosure can be limited.
Description of the drawings
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.
Fig. 1 is a kind of structural schematic diagram of array substrate shown according to an exemplary embodiment；
Fig. 2 is a kind of structural schematic diagram of the array substrate shown according to another exemplary embodiment；
Fig. 3 is according to the connecting line set-up mode schematic diagram shown in an exemplary embodiment；
Fig. 4 is a kind of structural schematic diagram of the array substrate shown according to a further exemplary embodiment；
Fig. 5 is a kind of structural schematic diagram of array substrate shown according to another exemplary embodiment；
Fig. 6 is the block diagram according to a kind of electronic equipment shown in an exemplary embodiment.
Specific implementation mode
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended
The consistent device example of some aspects be described in detail in claims, the disclosure.
The size of the display screen of the electronic equipments such as smart mobile phone or intelligent computer is increasing, and data driving chip passes through
When data line is to pixel subelement writing pixel voltage, due to data line and company between each pixel subelement and data driving chip
There are resistance, the resistance can cause voltage drop for wiring, becomes different after causing same pixel data to reach each pixel subelement
Pixel voltage, the brightness shown by pixel subelement each in this way is different, causes the picture of display screen uneven.
To solve the technical problem, the embodiment of the present disclosure provides a kind of array substrate, which includes substrate, sets
Set TFT layer and data driving chip in substrate.Wherein TFT layer includes multiple row pixel subelement, multiple data lines.This is a plurality of
Data line is electrically connected data driving chip, each pixel in addition passing through connecting line and respective column per data line in multiple data lines
Subelement is electrically connected.Pixel voltage can be written to each pixel list by data driving chip by data line, connecting line in this way
In member.It should be noted that connecting line is for adjusting data driving chip and respective column pixel subelement in the embodiment of the present disclosure
Between voltage drop.
In one embodiment, data-driven can be passed through per the voltage drop between data line and respective column pixel subelement
Chip is suitably adjusted according to row where pixel subelement, i.e., with distance between pixel subelement and data driving chip
Increase, the relationship reduced according to pixel voltage and voltage suitably increases pixel voltage, single to ensure to reach same row pixel
The voltage of member is same or similar.
In one embodiment, every data line and respective column pixel subelement are adjusted by adjusting the resistance value of connecting line
Between voltage drop, for example, for each row pixel subelement for connecting same data line, each pixel subelement and data
The resistance value of connecting line and data line segment is steady state value between driving chip, or is no more than difference threshold with the difference of steady state value
Value.Wherein, data line segment is the tie point of respective data lines and connecting line and between the tie point of the data driving chip
Part.
Above-mentioned steady state value can be the electricity of the nearest connecting line and both corresponding data line segments of range data driving chip
The sum of resistance value.That is, needing to consider the resistance change of data line segment when the resistance value adjustment of follow-up connecting line, reach two
The identical purpose of resistance change amount of person.
Above-mentioned difference threshold can be the resistance of the nearest connecting line and corresponding data line segment of range data driving chip
The maximum value of both value and the steady state value absolute value of difference, and brightness user caused by the corresponding voltage drop of the difference threshold
Naked eyes can not be told, in this way the resistance value and the error brought of connecting line made by permission manufacture craft, will not improve making
The complexity of technique.That is, during the resistance value adjustment of follow-up connecting line, even if there are certain errors to reach
The effect same or similar to the brightness of display picture.
As it can be seen that resistance value of the embodiment of the present disclosure by adjusting connecting line, reaches adjustment data driving chip and respective column
The purpose of voltage drop between pixel subelement realizes that same pixel voltage reaches each pixel of same row by adjusting voltage drop
The still identical effect of the pixel voltage after subelement, to solve or alleviate picture caused by the resistance of data line and connecting line
Sub-prime unit shows non-uniform problem, and picture is made to show the usage experience for uniformly improving user.In addition, the embodiment of the present disclosure
The manufacture craft that TFT layer may be used in middle connecting line is realized, process costs and technology difficulty will not be increased.
Fig. 1 is a kind of structural schematic diagram of array substrate shown according to an exemplary embodiment.Referring to Fig. 1, the array
The TFT layer 100 and data driving chip 200 that substrate includes substrate (not shown), is arranged in substrate.Wherein TFT layer 100
Including multiple row pixel subelement 101, (pixel subelement includes red pixel subelement Rx, green pixel subelement Gx, blue picture
Sub-prime unit B x, wherein x indicate that line number, value can be 1,2,3 ...), multiple data lines 102.The multiple data lines 101
It is electrically connected data driving chip 200.In addition, passing through each of connecting line 103 and respective column in multiple data lines per data line 102
Pixel subelement 101 is electrically connected.Since data line segment is longer, resistance value is bigger, to ensure each pixel subelement and data
The resistance value of connecting line and data line segment is steady state value between driving chip, or is no more than difference threshold with the difference of steady state value
Value, in one embodiment of the disclosure, on the basis of data driving chip, connect the length of the connecting line 103 per data line according to
First predetermined manner reduces.
Above-mentioned first predetermined manner may include linear mode or step-wise manner.
When the first predetermined manner is linear mode, on the basis of data driving chip, the length of adjacent two connecting lines
It is sequentially reduced, (be subject to direction shown in Fig. 1) is arithmetic progression to the length of connecting line from top to bottom at this time.It will be every in the present embodiment
Connecting line as regulating object, can ensure in this way between each pixel subelement and the data driving chip connecting line and
The resistance value of data line segment is steady state value, and each pixel unit is reached to reach the same pixel voltage from data driving chip
It is the effect of identical voltage value afterwards so that all pixels subelement shows that the brightness of picture is identical, and raising picture shows equal
Evenness.
When the first predetermined manner is step-wise manner, on the basis of data driving chip, the length of two adjacent groups connecting line
It is sequentially reduced, every group of connecting line includes the identical connecting line of the first preset quantity length.It should be noted that this is first default
Quantity can be configured according to concrete scene, for example, the first preset quantity can be 2,3,4,5 or other numerical value, herein
It is not construed as limiting.
Referring to Fig. 2, by taking every group comprising 2 connecting lines as an example, the length of first group of connecting line be L1 (the 1st article of connecting line and
2nd article of connecting line), the length of second group of connecting line is L2 (the 3rd article of connecting line and the 4th article of connecting line), third group connecting line
Length is L3 (the 5th article of connecting line and the 6th article of connecting line), then L1, L2 and L3 are at arithmetic progression.Every group is connected in the present embodiment
Line, in this way can be with connecting line between the corresponding pixel subelement of every group of connecting line and the data driving chip as regulating object
It is no more than difference threshold with the resistance value of data line segment and the difference of steady state value, is i.e. has one in the corresponding resistance value of every group of connecting line
A is steady state value, other resistance values relatively, can make every group of connecting line electrical connection picture of array substrate in this way with the steady state value
The corresponding display area of sub-prime unit has the similar display uniformity, and the bright of picture is shown to reach all pixels subelement
The similar effect of degree, improves the uniformity that picture is shown.Due to each display area luminance uniformity relatively, user's meat
Eye can not be discovered, so as to improve usage experience.
Since the size of display screen is increasing, the size of corresponding array substrate is also increasing, and range data drives core
The length difference of the nearest connecting line of piece and farthest connecting line is larger, if connecting line is arranged using straight line, leads to data line
The distance between pixel subelement is excessive.For this purpose, as depicted in figs. 1 and 2, in one embodiment of the disclosure, connecting line uses S types
Setting.Wherein, the number of connecting line bending can need to be adjusted according to realizing, to reduce data line and picture as far as possible
The distance between sub-prime unit.
In one embodiment, the height of connecting line bending can also be adjusted according to concrete scene, as shown in figure 3, leaning on
When nearly data driving chip, since the length of connecting line is longer, the height of connecting line can be relatively high at this time, can reduce in this way
The number of bending achievees the effect that further reduce distance between data line and pixel subelement.
In another embodiment, connecting line can be arranged from data line and pixel subelement in different layers, connect in this way
Line carries out S type settings in place layer, and then connecting line is electrically connected with per data line with corresponding pixel subelement by via.
Since connecting line can be configured in the corresponding region of pixel subelement or the corresponding region of data line, can increase in this way
The length of connecting line is conducive to reduce adjacent pixel subelement corresponding voltage drop to reduce the amplitude that connecting line adjusts every time
Gap, the brightness that picture is shown can be refined, due to user naked eyes can not discover, can reach pixel subelement show picture
Similar brightness or identical effect.
As it can be seen that the embodiment of the present disclosure by adjusting connection line length to adjust between data driving chip and pixel subelement
Resistance value achievees the purpose that adjust the voltage drop between data driving chip and respective column pixel subelement, i.e., by adjusting electricity
Pressure drop realizes that same pixel voltage reaches the still identical effect of the pixel voltage after each pixel subelement of same row, to solve
Or pixel subelement caused by alleviating the resistance of data line and connecting line shows non-uniform problem, and picture is made to show uniformly,
Improve the usage experience of user.Fig. 4 is a kind of structural schematic diagram of the array substrate shown according to a further exemplary embodiment.Ginseng
See Fig. 4, which includes substrate (not shown), the TFT layer 100 that is arranged in substrate and data driving chip 200.
Wherein TFT layer 100 includes that (pixel subelement includes red pixel subelement Rx, green pixel-subcomponent list to multiple row pixel subelement 101
First Gx, blue pixel subelement Bx, wherein x indicate that line number, value can be 1,2,3 ...), multiple data lines 102.This is more
Data line 101 is electrically connected data driving chip 200.In addition, passing through connecting line 103 per data line 102 in multiple data lines
It is electrically connected with each pixel subelement 101 of respective column.Since data line segment is longer, resistance value is bigger, to ensure each pixel
The resistance value of connecting line and data line segment is steady state value between subelement and data driving chip, or not with the difference of steady state value
More than difference threshold, in one embodiment of the disclosure, on the basis of data driving chip, the connecting line 103 per data line is connected
Width increase according to the second predetermined manner.
Above-mentioned second predetermined manner may include linear mode or step-wise manner.
When the second predetermined manner is linear mode, on the basis of data driving chip, the width of adjacent two connecting lines
It successively increases, (be subject to direction shown in Fig. 4) is arithmetic progression to the width of connecting line from top to bottom at this time.It will be every in the present embodiment
Connecting line as regulating object, can ensure in this way between each pixel subelement and the data driving chip connecting line and
The resistance value of data line segment is steady state value, and each pixel unit is reached to reach the same pixel voltage from data driving chip
It is the effect of identical voltage value afterwards so that all pixels subelement shows that the brightness of picture is identical, and raising picture shows equal
Evenness.
When the second predetermined manner is step-wise manner, on the basis of data driving chip, the width of two adjacent groups connecting line
It successively increases, every group of connecting line includes the identical connecting line of the second preset quantity length.It should be noted that this is second default
Quantity can be configured according to concrete scene, for example, the second preset quantity can be 23,4,5 or other numerical value, herein not
It is construed as limiting.
Referring to Fig. 5, by taking every group comprising 2 connecting lines as an example, the length of first group of connecting line be W1 (the 1st article of connecting line and
2nd article of connecting line), the length of second group of connecting line is W2 (the 3rd article of connecting line and the 4th article of connecting line), third group connecting line
Length is W3 (the 5th article of connecting line and the 6th article of connecting line), then W1, W2 and W3 are at arithmetic progression.Every group is connected in the present embodiment
Line, in this way can be with connecting line between the corresponding pixel subelement of every group of connecting line and the data driving chip as regulating object
It is no more than difference threshold with the resistance value of data line segment and the difference of steady state value, is i.e. has one in the corresponding resistance value of every group of connecting line
A is steady state value, other resistance values relatively, can make every group of connecting line electrical connection picture of array substrate in this way with the steady state value
The corresponding display area of sub-prime unit has the similar display uniformity, and the bright of picture is shown to reach all pixels subelement
The similar effect of degree, improves the uniformity that picture is shown.Due to each display area luminance uniformity relatively, user's meat
Eye can not be discovered, so as to improve usage experience.
To reduce the distance between data line and pixel subelement, in one embodiment of the disclosure, connecting line is using the setting of S types
(can be with reference chart 1 and Fig. 2).Wherein, the number of connecting line bending can need to be adjusted according to realizing, to as far as possible
Reduce the distance between data line and pixel subelement.
In one embodiment, connecting line can be arranged from data line and pixel subelement in different layers, such connecting line
At place, layer carries out S type settings, and then connecting line is electrically connected with per data line with corresponding pixel subelement by via.By
It can be configured in the corresponding region of pixel subelement or the corresponding region of data line in connecting line, company can be increased in this way
The length of wiring is conducive to reduce adjacent pixel subelement corresponding voltage drop to reduce the amplitude that connecting line adjusts every time
Gap can refine the brightness that picture is shown, since user's naked eyes can not be discovered, can reach pixel subelement and show picture
Similar brightness or identical effect.
As it can be seen that the embodiment of the present disclosure by adjusting the width of connecting line with adjust data driving chip and pixel subelement it
Between resistance value, achieve the purpose that adjust the voltage drop between data driving chip and respective column pixel subelement, i.e., by adjusting
Voltage drop realizes that same pixel voltage reaches the still identical effect of the pixel voltage after each pixel subelement of same row, to solve
Certainly or pixel subelement caused by the resistance of alleviation data line and connecting line shows non-uniform problem, and picture is made to show
It is even, improve the usage experience of user.
One embodiment of the disclosure additionally provides a kind of array substrate, which includes substrate, is arranged in substrate
TFT layer and data driving chip.The connection relation of wherein TFT layer and data driving chip may refer to Fig. 1 or shown in Fig. 4 battle arrays
Row substrate.Since data line segment is longer, resistance value is bigger, to ensure to connect between each pixel subelement and data driving chip
The resistance value of wiring and data line segment is steady state value, or is no more than difference threshold with the difference of steady state value.The disclosure one is implemented
In example, the resistance value of connecting line is realized by adjusting the concentration for mixing donor impurity or acceptor impurity in connecting line, i.e., with data
On the basis of driving chip, the concentration of the incorporation donor impurity or acceptor impurity that connect the connecting line per data line is pre- according to third
If mode increases.
It should be noted that the concentration of incorporation donor impurity or acceptor impurity can be according to related skill to the relationship of resistance value
Model in art determines, can also be realized and is determined by a large amount of quantity, is not limited thereto.
In one embodiment, above-mentioned third predetermined manner may include linear mode or step-wise manner.
When third predetermined manner is linear mode, on the basis of data driving chip, the incorporation of adjacent two connecting lines
The concentration of donor impurity or acceptor impurity successively increases, to ensure between each pixel subelement and the data driving chip
The resistance value of connecting line and data line segment is steady state value.
When third predetermined manner is step-wise manner, on the basis of data driving chip, the incorporation of two adjacent groups connecting line
The concentration of donor impurity or acceptor impurity successively increases, and every group of connecting line includes the identical connection of third preset quantity length
Line.It should be noted that the third preset quantity can be configured according to concrete scene, for example, third preset quantity can be with
For 2,3,4,5 or other numerical value, it is not limited thereto.
Using every group of connecting line as regulating object in the present embodiment, the donor impurity of same concentrations is mixed in every group of connecting line
Or acceptor impurity, connecting line and data between the corresponding pixel subelement of this group of connecting line and the data driving chip can be made
The resistance value of line segment and the difference of steady state value are no more than difference threshold, i.e. there are one for perseverance in the corresponding resistance value of every group of connecting line
Definite value, other resistance values relatively, can make every group of connecting line electrical connection pixel of array substrate single in this way with the steady state value
The corresponding display area of member has the similar display uniformity, to reach the similar brightness that all pixels subelement shows picture
Effect, improve the uniformity that shows of picture.Due to each display area luminance uniformity relatively, user naked eyes can not
Discover, so as to improve usage experience.
Fig. 6 is the block diagram according to a kind of electronic equipment shown in an exemplary embodiment.For example, electronic equipment 600 can be with
It is mobile phone, computer, digital broadcast terminal, messaging devices, game console, tablet device, Medical Devices, body-building
Equipment, personal digital assistant etc..
Display screen；
Processor；
Memory for storing the processor-executable instruction；
Wherein, the display screen includes array substrate；
The array substrate includes substrate and setting TFT layer on the substrate and data driving chip；The TFT layer
Including multiple row pixel subelement, multiple data lines and data driving chip；The multiple data lines are electrically connected data driving chip；
It is electrically connected by connecting line between every data line and respective column pixel subelement in the multiple data lines；The connecting line
For adjusting the voltage drop adjusted between the data driving chip and respective column pixel subelement.
With reference to Fig. 6, electronic equipment 600 may include following one or more components：Processing component 602, memory 604,
Power supply module 606, multimedia component 608, audio component 610, the interface 612 of input/output (I/O), sensor module 614,
And communication component 616.
The integrated operation of 602 usual control device 600 of processing component, such as with display, call, data communication, phase
Machine operates and record operates associated operation.Processing component 602 may include that one or more processors 920 refer to execute
It enables.In addition, processing component 602 may include one or more modules, convenient for the friendship between processing component 602 and other assemblies
Mutually.For example, processing component 602 may include multi-media module, to facilitate between multimedia component 608 and processing component 602
Interaction.
Memory 604 is configured as storing various types of data to support the operation in device 600.These data are shown
Example includes instruction for any application program or method that are operated on device 600, contact data, and telephone book data disappears
Breath, picture, video etc..Memory 604 can be by any kind of volatibility or non-volatile memory device or their group
It closes and realizes, such as static RAM (SRAM), electrically erasable programmable read-only memory (EEPROM) is erasable to compile
Journey read-only memory (EPROM), programmable read only memory (PROM), read-only memory (ROM), magnetic memory, flash
Device, disk or CD.
Power supply module 606 provides electric power for the various assemblies of device 600.Power supply module 606 may include power management system
System, one or more power supplys and other generated with for device 600, management and the associated component of distribution electric power.
Multimedia component 608 is included in the screen of one output interface of offer between described device 600 and user.One
In a little embodiments, screen may include liquid crystal display (LCD) and touch panel (TP).If screen includes touch panel, screen
Curtain may be implemented as touch screen, to receive input signal from the user.Touch panel includes one or more touch sensings
Device is to sense the gesture on touch, slide, and touch panel.The touch sensor can not only sense touch or sliding action
Boundary, but also detect duration and pressure associated with the touch or slide operation.In some embodiments, more matchmakers
Body component 608 includes a front camera and/or rear camera.When device 600 is in operation mode, such as screening-mode or
When video mode, front camera and/or rear camera can receive external multi-medium data.Each front camera and
Rear camera can be a fixed optical lens system or have focusing and optical zoom capabilities.
Audio component 610 is configured as output and/or input audio signal.For example, audio component 610 includes a Mike
Wind (MIC), when device 600 is in operation mode, when such as call model, logging mode and speech recognition mode, microphone by with
It is set to reception external audio signal.The received audio signal can be further stored in memory 604 or via communication set
Part 616 is sent.In some embodiments, audio component 610 further includes a loud speaker, is used for exports audio signal.
I/O interfaces 612 provide interface between processing component 602 and peripheral interface module, and above-mentioned peripheral interface module can
To be keyboard, click wheel, button etc..These buttons may include but be not limited to：Home button, volume button, start button and lock
Determine button.
Sensor module 614 includes one or more sensors, and the state for providing various aspects for device 600 is commented
Estimate.For example, sensor module 614 can detect the state that opens/closes of device 600, and the relative positioning of component, for example, it is described
Component is the display and keypad of device 600, and sensor module 614 can be with 600 1 components of detection device 600 or device
Position change, the existence or non-existence that user contacts with device 600,600 orientation of device or acceleration/deceleration and device 600
Temperature change.Sensor module 614 may include proximity sensor, be configured to detect without any physical contact
Presence of nearby objects.Sensor module 614 can also include optical sensor, such as CMOS or ccd image sensor, at
As being used in application.In some embodiments, which can also include acceleration transducer, gyro sensors
Device, Magnetic Sensor, pressure sensor or temperature sensor.
Communication component 616 is configured to facilitate the communication of wired or wireless way between device 600 and other equipment.Device
600 can access the wireless network based on communication standard, such as WiFi, 2G or 3G or combination thereof.In an exemplary implementation
In example, communication component 616 receives broadcast singal or broadcast related information from external broadcasting management system via broadcast channel.
In one exemplary embodiment, the communication component 616 further includes near-field communication (NFC) module, to promote short range communication.Example
Such as, NFC module can be based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra wide band (UWB) technology,
Bluetooth (BT) technology and other technologies are realized.
In the exemplary embodiment, device 600 can be believed by one or more application application-specific integrated circuit (ASIC), number
Number processor (DSP), digital signal processing appts (DSPD), programmable logic device (PLD), field programmable gate array
(FPGA), controller, microcontroller, microprocessor or other electronic components are realized.
In the exemplary embodiment, it includes the non-transitorycomputer readable storage medium instructed, example to additionally provide a kind of
Such as include the memory 604 of instruction, above-metioned instruction can be executed by the processor 620 of device 600.For example, the non-transitory meter
Calculation machine readable storage medium storing program for executing can be that ROM, random access memory (RAM), CD-ROM, tape, floppy disk and optical data storage are set
It is standby etc..
Those skilled in the art will readily occur to its of the disclosure after considering specification and putting into practice disclosure disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and includes the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.
Claims (12)
1. a kind of array substrate, which is characterized in that the array substrate include substrate and setting TFT layer on the substrate and
Data driving chip；The TFT layer includes multiple row pixel subelement, multiple data lines；The multiple data lines are electrically connected data
Driving chip；It is electrically connected by connecting line between every data line and respective column pixel subelement in the multiple data lines；
The connecting line is used to adjust the voltage drop between the data driving chip and respective column pixel subelement.
2. array substrate according to claim 1, which is characterized in that every data line and respective column pixel subelement
Between voltage drop adjusted by the resistance value of the connecting line.
3. array substrate according to claim 2, which is characterized in that for each row pixel for connecting same data line
Subelement, the resistance value of connecting line and data line segment is steady state value between each pixel subelement and the data driving chip,
Or it is no more than difference threshold with the difference of steady state value；
The data line segment is the tie point of respective data lines and connecting line and between the tie point of the data driving chip
Part.
4. array substrate according to claim 3, which is characterized in that on the basis of the data driving chip, connect institute
The length for stating the connecting line of every data line reduces according to the first predetermined manner.
5. array substrate according to claim 4, which is characterized in that the length of the connection connecting line per data line
Include according to the reduction of the first predetermined manner：
The length of adjacent two connecting lines is sequentially reduced；
Alternatively,
The length of two adjacent groups connecting line is sequentially reduced, and every group of connecting line includes the identical connection of the first preset quantity length
Line.
6. array substrate according to claim 3, which is characterized in that on the basis of the data driving chip, connect institute
The width for stating the connecting line of every data line increases according to the second predetermined manner.
7. array substrate according to claim 3, which is characterized in that the width of the connection connecting line per data line
Include according to the second predetermined manner increase：
The width of adjacent two connecting lines successively increases；
Alternatively,
The width of two adjacent groups connecting line successively increases, and every group of connecting line includes the connection of same size of the second preset quantity item
Line.
8. according to claim 4~7 any one of them array substrate, which is characterized in that the connecting line is arranged using S types.
9. array substrate according to claim 3, which is characterized in that on the basis of the data driving chip, connect institute
The concentration of the incorporation donor impurity or acceptor impurity of stating the connecting line of every data line increases according to third predetermined manner.
10. array substrate according to claim 9, which is characterized in that the connection connecting line per data line is mixed
The concentration for entering donor impurity or acceptor impurity includes according to the increase of third predetermined manner：
The incorporation donor impurity of adjacent two connecting lines or the concentration of acceptor impurity are sequentially increased；
Alternatively,
The width of two adjacent groups connecting line is sequentially increased, every group of connecting line include third preset quantity item incorporation donor impurity or by
The identical connecting line of concentration of main impurity.
11. array substrate according to claim 1, which is characterized in that described single with respective column pixel per data line
Connecting line between member is electrically connected via via with the data line and pixel unit.
12. a kind of electronic equipment, which is characterized in that including array substrate described in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721926093.6U CN207895835U (en) | 2017-12-29 | 2017-12-29 | Array substrate, electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721926093.6U CN207895835U (en) | 2017-12-29 | 2017-12-29 | Array substrate, electronic equipment |
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| CN207895835U true CN207895835U (en) | 2018-09-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107958652A (en) * | 2017-12-29 | 2018-04-24 | 北京小米移动软件有限公司 | Array base palte, electronic equipment |
| CN112213885A (en) * | 2020-10-14 | 2021-01-12 | Tcl华星光电技术有限公司 | Backlight module and display device |
-
2017
- 2017-12-29 CN CN201721926093.6U patent/CN207895835U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107958652A (en) * | 2017-12-29 | 2018-04-24 | 北京小米移动软件有限公司 | Array base palte, electronic equipment |
| CN112213885A (en) * | 2020-10-14 | 2021-01-12 | Tcl华星光电技术有限公司 | Backlight module and display device |
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