CN207888482U - A kind of polishing pad grooving apparatus - Google Patents
A kind of polishing pad grooving apparatus Download PDFInfo
- Publication number
- CN207888482U CN207888482U CN201820232497.3U CN201820232497U CN207888482U CN 207888482 U CN207888482 U CN 207888482U CN 201820232497 U CN201820232497 U CN 201820232497U CN 207888482 U CN207888482 U CN 207888482U
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- CN
- China
- Prior art keywords
- main shaft
- plate
- saw blade
- polishing pad
- grooving apparatus
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Abstract
The utility model is related to a kind of polishing pad grooving apparatus comprising main shaft, retainer plate, saw blade fixed link, saw blade and fastening nut；It is equipped with the retainer plate on the output end of the main shaft, fine tuning structure is connected on the retainer plate；And the main shaft output end is sequentially connected with the saw blade fixed link；It is fixedly connected with the saw blade by the fastening nut positioned at the end of the saw blade fixed link.The split groove depth of the utility model can be finely adjusted, and ensured that chip removal is smooth, reduced dust pollution.
Description
Technical field
The present invention relates to a kind of grooving apparatus, are opened especially with regard to a kind of polishing pad applied in the art of semiconductor manufacturing
Slot device.
Background technology
Currently, there is various polishing pad grooving mechanisms in the market, and it is most of all by way of mold extruding into
Row fluting, the flute profile squeezed out, band circularity may generate deformation during extruding inside material, in practical polishing
It is undesirable to the processing of workpiece in processing.In order to overcome drawbacks described above, there is an urgent need for beneficial improvement is carried out to existing grooving mechanism.
Invention content
In view of the above-mentioned problems, the object of the present invention is to provide a kind of polishing pad grooving apparatus, the split groove depth of the device can
To be finely adjusted, ensures that chip removal is smooth, reduce dust pollution.
To achieve the above object, the present invention takes following technical scheme：A kind of polishing pad grooving apparatus, it is characterised in that：
The device includes main shaft, retainer plate, saw blade fixed link, saw blade and fastening nut；It is equipped on the output end of the main shaft described
Retainer plate is connected with the fine tuning structure on the retainer plate；And the main shaft output end is passed with the saw blade fixed link
Dynamic connection；It is fixedly connected with the saw blade by the fastening nut positioned at the end of the saw blade fixed link.
Further, the retainer plate both ends are vertically installed with two sliding blocks, and are provided with connection at the top of the retainer plate
Plate is provided with the first threaded hole and adjustment hole for connecting the fine tuning structure on the connecting plate.
Further, the fine tuning structure includes guide rail, guide rail cover board, pressing plate, trip bolt and knob micrometer；It is described to lead
Rail is arranged in guide rail cover board both sides, is vertical setting, two sliding blocks on the retainer plate and guide rail cover board both sides
Guide rail coordinates；It is provided with the second threaded hole at the top of the guide rail cover board, by upper between the retainer plate and the guide rail cover board
It states the first threaded hole, the second threaded hole and trip bolt to be attached, and is provided with the knob micrometer in the adjustment hole；
It is fixedly connected with the pressing plate, the grooved bore being arranged in the middle part of the pressing plate and the saw blade positioned at the guide rail cover board outer lower portion
In being correspondingly arranged.
Further, it is provided with spindle carrier outside the main shaft, mounting plate, the peace are provided at the top of the spindle carrier
Loading board top side is provided with fixed plate.
Further, the spindle carrier includes main shaft bottom plate and main shaft upper mounted plate, and the main shaft bottom plate is adopted
With semi-circular structure, the main shaft upper mounted plate uses the rectangular configuration with half slot；It is provided on the main shaft upper mounted plate
The side of half slot is fixedly connected with the main shaft bottom plate, forms hollow circular through-hole, and the main shaft is located at the hollow circle
In shape through-hole；The main shaft upper mounted plate other side is fixedly connected with the mounting plate.
Further, it is provided with dust cover above the saw blade.
Further, the dust cover is fixed on the end of the mounting plate by dust cover fixed block.
Further, the outlet of the dust cover is connect with existing high power vacuum cleaner.
Further, the main shaft uses 2.2KW water cooling main shafts.
Further, the saw blade uses sintered carbide circular saw.
The invention adopts the above technical scheme, which has the following advantages：1, the present invention is the side cut using saw blade
Formula is slotted, and the part in groove profile on polishing pad is cut off, split groove depth can be finely adjusted, and then the row of ensure that
It considers to be worth doing smooth, reduces dust pollution.2, main shaft of the present invention can reach 24000 using 2.2KW water cooling spindle motor maximum speeds
Rpm, smooth running.3, saw blade of the present invention uses sintered carbide circular saw, the external high power vacuum cleaner of dust cover to ensure
Chip removal is smooth.
Description of the drawings
Fig. 1 is the overall structure diagram of the present invention；
Fig. 2 is the decomposition texture schematic diagram of the present invention.
Specific implementation mode
The present invention is described in detail below with reference to the accompanying drawings and embodiments.
As shown in Figure 1 and Figure 2, the present invention provides a kind of polishing pad grooving apparatus, and it is micro- which may be implemented groove depth
It adjusts, realization is slotted on semiconductor consumptive material polishing pad.The present invention include main shaft 1, retainer plate 2, fine tuning structure, saw blade fixed link 3,
Saw blade 5 and fastening nut 4.It is equipped with retainer plate 2 on the output end of main shaft 1, fine tuning structure is connected on retainer plate 2；And
1 output end of main shaft is sequentially connected with saw blade fixed link 3.It is solid by fastening nut 4 and saw blade 5 positioned at the end of saw blade fixed link 3
Fixed connection, saw blade 5 drive rotation through main shaft 1 and saw blade fixed link 3, work.
In above-described embodiment, two sliding blocks are vertically installed with positioned at 2 both ends of retainer plate, and be provided with positioned at 2 top of retainer plate
Connecting plate 6 is provided with the first threaded hole 7 and adjustment hole 8 on connecting plate 6, for being connect with fine tuning structure.
In a preferred embodiment, fine tuning structure includes guide rail 9, guide rail cover board 10, pressing plate 14,12 and of trip bolt
Knob micrometer 13.Guide rail 9 is arranged in 10 both sides of guide rail cover board, is vertical setting, two sliding blocks on retainer plate 2 and guide cover
The guide rail 9 of 10 both sides of plate coordinates, and realization retainer plate 2 is slidably connected with guide rail cover board 10.The top of guide rail cover board 10 is provided with the
Two threaded holes 11, between retainer plate 2 and guide rail cover board 10 by the first threaded hole 7, the second threaded hole 11 and trip bolt 12 into
Row connection, and is provided with knob micrometer 13 in the adjustment hole 8 on retainer plate 2, for adjust the sliding of guide rail cover board 10 away from
From.It is fixedly connected with pressing plate 14 positioned at 10 outer lower portion of guide rail cover board, the grooved bore that 14 middle part of pressing plate is arranged and saw blade 5 are in pair
It should be arranged.In use, adjusting the sliding distance of guide rail cover board 10 by knob micrometer 13, and then adjust pressing plate 14 and saw blade 5
The distance between, realize the fine tuning of split groove depth.
In a preferred embodiment, it is provided with spindle carrier outside main shaft 1, mounting plate is provided at the top of spindle carrier
15,15 top side of mounting plate is provided with fixed plate 16, and the device of the invention is fixed on existing device through fixed plate 16.
In above-described embodiment, spindle carrier includes main shaft bottom plate 17 and main shaft upper mounted plate 18, main shaft bottom plate
17 use semi-circular structure, and main shaft upper mounted plate 18 is using the rectangular configuration with half slot.It is provided on main shaft upper mounted plate 18
The side of half slot is fixedly connected with main shaft bottom plate 17, forms hollow circular through-hole, and main shaft 1 is located at the hollow circular through-hole
It is interior；18 other side of main shaft upper mounted plate is fixedly connected with mounting plate 15.
In a preferred embodiment, dust cover 19 is additionally provided with above saw blade, dust cover 19 passes through dust cover
Fixed block 20 is fixed on the end of mounting plate 15.And the outlet of dust cover 19 is connect with existing high power vacuum cleaner, to ensure
The waste material of generation is excluded when work, ensures that chip removal is smooth, and ensure the peace and quiet of working environment.
In the various embodiments described above, main shaft 1 uses 2.2KW water cooling main shafts, motor maximum speed that can reach 24000 turns often
Minute, smooth running.
In the various embodiments described above, saw blade 5 uses sintered carbide circular saw.
In conclusion in the use of the present invention, being finely adjusted by 13 split groove depth of knob micrometer：It first will fastening
Screw 12 unclamps, and the fine tuning of groove depth is then carried out by knob micrometer 13, after adjusting, trip bolt 12 is locked.
The installation and dismounting of saw blade 5：Dust cover 19 is removed, then fastening nut 4 is removed, then removes saw blade 11；Reverse operating
Saw blade 5 is mounted in saw blade fixed link 3.
The various embodiments described above are merely to illustrate the present invention, and structure and size, installation position and the shape of each component are all can be with
It is varied from, based on the technical solution of the present invention, all improvement that individual part is carried out according to the principle of the invention and waits
With transformation, should not exclude except protection scope of the present invention.
Claims (10)
1. a kind of polishing pad grooving apparatus, it is characterised in that：The device includes main shaft, retainer plate, saw blade fixed link, saw blade and tight
Gu nut；It is equipped with the retainer plate on the output end of the main shaft, fine tuning structure is connected on the retainer plate；And institute
Main shaft output end is stated to be sequentially connected with the saw blade fixed link；Pass through the fastening nut positioned at the end of the saw blade fixed link
It is fixedly connected with the saw blade.
2. a kind of polishing pad grooving apparatus as described in claim 1, it is characterised in that：The retainer plate both ends are vertically installed with
Two sliding blocks, and it is provided with connecting plate at the top of the retainer plate, it is provided on the connecting plate for connecting the fine tuning knot
The first threaded hole and adjustment hole of structure.
3. a kind of polishing pad grooving apparatus as claimed in claim 2, it is characterised in that：The fine tuning structure includes guide rail, leads
Rail cover board, pressing plate, trip bolt and knob micrometer；The guide rail is arranged in guide rail cover board both sides, is vertical setting, institute
Two sliding blocks and the guide rail of guide rail cover board both sides stated on retainer plate coordinate；It is provided with the second screw thread at the top of the guide rail cover board
Hole is connected between the retainer plate and the guide rail cover board by above-mentioned first threaded hole, the second threaded hole and trip bolt
It connects, and is provided with the knob micrometer in the adjustment hole；It is fixedly connected with positioned at the guide rail cover board outer lower portion described
Pressing plate, the grooved bore that the pressing plate middle part is arranged are in be correspondingly arranged with the saw blade.
4. a kind of polishing pad grooving apparatus as described in any one of claims 1 to 3, it is characterised in that：It is set outside the main shaft
It is equipped with spindle carrier, is provided with mounting plate at the top of the spindle carrier, mounting plate top side is provided with fixed plate.
5. a kind of polishing pad grooving apparatus as claimed in claim 4, it is characterised in that：The spindle carrier includes solid under main shaft
Fixed board and main shaft upper mounted plate, the main shaft bottom plate use semi-circular structure, and the main shaft upper mounted plate, which uses, has semicircle
The rectangular configuration of slot；The side that half slot is provided on the main shaft upper mounted plate is fixedly connected with the main shaft bottom plate,
Hollow circular through-hole is formed, the main shaft is located in the hollow circular through-hole；The main shaft upper mounted plate other side and the peace
Loading board is fixedly connected.
6. a kind of polishing pad grooving apparatus as claimed in claim 4, it is characterised in that：It is provided with above the saw blade dust-proof
Cover.
7. a kind of polishing pad grooving apparatus as claimed in claim 6, it is characterised in that：The dust cover is fixed by dust cover
Block is fixed on the end of the mounting plate.
8. a kind of polishing pad grooving apparatus as claimed in claims 6 or 7, it is characterised in that：The outlet of the dust cover with it is existing
There is high power vacuum cleaner connection.
9. a kind of polishing pad grooving apparatus as described in claim 1, it is characterised in that：The main shaft uses 2.2KW water cooling masters
Axis.
10. a kind of polishing pad grooving apparatus as described in claim 1, it is characterised in that：The saw blade is justified using hard alloy
Saw blade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820232497.3U CN207888482U (en) | 2018-02-09 | 2018-02-09 | A kind of polishing pad grooving apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820232497.3U CN207888482U (en) | 2018-02-09 | 2018-02-09 | A kind of polishing pad grooving apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207888482U true CN207888482U (en) | 2018-09-21 |
Family
ID=63542762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820232497.3U Active CN207888482U (en) | 2018-02-09 | 2018-02-09 | A kind of polishing pad grooving apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207888482U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108127581A (en) * | 2018-02-09 | 2018-06-08 | 北京特思迪设备制造有限公司 | A kind of polishing pad grooving apparatus |
-
2018
- 2018-02-09 CN CN201820232497.3U patent/CN207888482U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108127581A (en) * | 2018-02-09 | 2018-06-08 | 北京特思迪设备制造有限公司 | A kind of polishing pad grooving apparatus |
| CN108127581B (en) * | 2018-02-09 | 2023-08-18 | 北京特思迪半导体设备有限公司 | Grooving device for polishing pad |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200515 Address after: 101300 Room 101, building 2, building 1, No.1, shunqiang Road, Shunyi District, Beijing Patentee after: Beijing tesidi Semiconductor Equipment Co., Ltd Address before: 101300 Beijing Shunyi District Shun Qiang Road No. 1 1 Building 1 floor Beijing special equipment manufacturing Co., Ltd. Patentee before: BEIJING TSD EQUIPMENT Co.,Ltd. |