CN207869490U - Metal-oxide-semiconductor fixed structure - Google Patents
Metal-oxide-semiconductor fixed structure Download PDFInfo
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- CN207869490U CN207869490U CN201721874158.7U CN201721874158U CN207869490U CN 207869490 U CN207869490 U CN 207869490U CN 201721874158 U CN201721874158 U CN 201721874158U CN 207869490 U CN207869490 U CN 207869490U
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- mounting hole
- oxide
- metal
- semiconductor
- elastic support
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Abstract
The utility model is related to a kind of metal-oxide-semiconductor fixed structures,Including radiator,The upper face setting that metal-oxide-semiconductor is located at radiator is multiple,It is provided with mounting bracket on adjacent mos pipe,It is provided with positioning column in mounting bracket and the location hole composition on metal-oxide-semiconductor is mating,Elastic support is provided in mounting bracket,Pcb board is provided on elastic support,The first mounting hole is provided on the pcb board,The upper face of radiator is provided with the second mounting hole,It is provided with fastening bolt in first mounting hole and is connect with the second mounting hole,Including radiator,The upper face setting that metal-oxide-semiconductor is located at radiator is multiple,It is provided with mounting bracket on adjacent mos pipe,It is provided with positioning column in mounting bracket and the location hole composition on metal-oxide-semiconductor is mating,It is provided with elastic support in the mounting bracket,Pcb board is provided on elastic support,The first mounting hole is provided on the pcb board,The upper face of radiator is provided with the second mounting hole,It is provided with fastening bolt in first mounting hole and is connect with the second mounting hole.
Description
Technical field
The utility model is related to electronic components, more particularly to a kind of metal-oxide-semiconductor fixed structure.
Background technology
With industrialized high speed development, the application of metal-oxide-semiconductor is more and more extensive, and the requirement to its fixed structure is also increasingly
It is high.The fixed structure being widely used at present is the assembly for being fixed by screw fixed structure, but using screw fixed structure
It is less efficient, and fixed with pcb board using simple bolt, since metal-oxide-semiconductor will produce certain heat in actual use,
Since the heat dissipation effect of metal-oxide-semiconductor itself is general, individual radiator is needed to radiate, can ensure the normal of metal-oxide-semiconductor itself
Work.
Utility model content
The purpose of this utility model is：A kind of metal-oxide-semiconductor fixed structure is provided, metal-oxide-semiconductor and the smooth close patch of radiator are made
It closes, improves heat dissipation effect.
To achieve the above object, the technical solution adopted in the utility model is：
Metal-oxide-semiconductor fixed structure, including radiator, the upper face setting that metal-oxide-semiconductor is located at radiator is multiple, on adjacent mos pipe
It is provided with mounting bracket, positioning column is provided in the mounting bracket and constitutes mating, the peace with the location hole on metal-oxide-semiconductor
It is provided with elastic support on dress holder, pcb board is provided on the elastic support, the first mounting hole is provided on the pcb board,
The upper face of the radiator is provided with the second mounting hole, and fastening bolt is provided in first mounting hole and is installed with second
Hole connects.
Compared with prior art, the technique effect that the utility model has is：Above-mentioned metal-oxide-semiconductor is fixed on radiator
On, and the upper end of metal-oxide-semiconductor is fixed with mounting bracket, and the location hole on the positioning column and metal-oxide-semiconductor in mounting bracket constitutes grafting
Match, elastic support is set in mounting bracket, and fixes pcb board on elastic support, the first mounting hole is provided on pcb board, and
And first setting fastening bolt in mounting hole and connect with the second mounting hole, to realize the connection strong degree of above-mentioned each component,
The metal-oxide-semiconductor fixed structure make metal-oxide-semiconductor and radiator it is smooth it is close be bonded, improve heat dissipation effect.
Description of the drawings
Fig. 1 is the structural schematic diagram of metal-oxide-semiconductor fixed structure；
Fig. 2 is the structural schematic diagram of pcb board；
Fig. 3 is the structural schematic diagram of elastic support；
Fig. 4 is the structural schematic diagram of mounting bracket；
Fig. 5 is the structural schematic diagram of radiator and metal-oxide-semiconductor；
Fig. 6 is the structural schematic diagram of cushion block.
Specific implementation mode
Shown in Fig. 1 to Fig. 6, the utility model is described in further detail：
Metal-oxide-semiconductor fixed structure, including radiator 10, the upper face setting that metal-oxide-semiconductor 20 is located at radiator 10 is multiple, adjacent
It is provided with mounting bracket 30 on metal-oxide-semiconductor 20, positioning column 31 and the location hole 21 on metal-oxide-semiconductor 20 are provided in the mounting bracket 30
It constitutes mating, elastic support 40 is provided in the mounting bracket 30, pcb board 50 is provided on the elastic support 40,
It is provided with the first mounting hole 51 on the pcb board 50, the upper face of the radiator 10 is provided with the second mounting hole 11, and described
It is provided with fastening bolt 60 in one mounting hole 51 and is connect with the second mounting hole 11；
In conjunction with shown in Fig. 1, above-mentioned metal-oxide-semiconductor 20 is fixed on radiator 10, and the upper end of metal-oxide-semiconductor 20 is fixed with peace
Holder 30 is filled, the positioning column 31 in mounting bracket 30 constitutes grafting with the location hole 21 on metal-oxide-semiconductor 20 and matches, and is set in mounting bracket 30
Elastic support 40 is set, and fixes pcb board 50 on elastic support 40, the first mounting hole 51, and first are provided on pcb board 50
Fastening bolt 60 is set in mounting hole 51 and connect strong degree with the second mounting hole 11, to realize the connection of above-mentioned each component,
20 fixed structure of metal-oxide-semiconductor make metal-oxide-semiconductor 20 and radiator 10 it is smooth it is close be bonded, improve heat dissipation effect.
As the preferred embodiment of the utility model, in conjunction with shown in Fig. 4, the whole mounting bracket 30 is in arc platy structure,
40 platy structure of the elastic support is provided with the upper face that pillar 41 is resisted against mounting bracket 30 on the elastic support 40；
Above-mentioned fastening bolt 60 is connect with the second mounting hole 11, is supported so that being provided with pillar 41 on elastic support 40
Lean against the upper face of mounting bracket 30, so ensure to mounting bracket 30 against strong degree.
Further, in conjunction with shown in Fig. 4, the centre of the mounting bracket 30 is provided with installing pipe 32, the installing pipe 32
Upper end protrude out the upper end aperture of the first mounting hole 51, the aperture of second mounting hole 11 is provided with grafting bulge loop 111, institute
It states the lower end of installing pipe 32 and is plugged on outside grafting bulge loop 111；
Above-mentioned 32 upper and lower side of installing pipe coordinates respectively at fastening bolt 60 and grafting bulge loop 111, and then ensures above-mentioned peace
Fill the strong degree of holder 30 and other component connection.
Further, in conjunction with shown in Fig. 3, third mounting hole 41, the installing pipe 32 are provided on the elastic support 40
Across third mounting hole 41；
To ensure above-mentioned pcb board 50 and 40 fixed strong degree of elastic support, the lower stomidium of first mounting hole 51
Mouth is provided with positioning convex ring 511, and the positioning convex ring 511 is resisted against the upper face of elastic support 40.
Specifically, in conjunction with shown in Fig. 6, the upper end outer wall of the installing pipe 32 is arranged with cushion block 70, is set on the cushion block 70
It is equipped with the 4th mounting hole 71 passed through for fastening bolt 60, the upper end aperture of the 4th mounting hole 71 is provided with step, described
Fastening bolt 60 is resisted against at the step in the upper end aperture of the 4th mounting hole 71.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing in the equivalent requirements of the claims will be fallen
All changes in justice and range are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.
Claims (6)
1.MOS pipe fixation structures, it is characterised in that：Including radiator (10), metal-oxide-semiconductor (20) is located at the upper face of radiator (10)
It is arranged multiple, mounting bracket (30) is provided on adjacent mos pipe (20), positioning column (31) is provided on the mounting bracket (30)
It is mating with location hole (21) composition on metal-oxide-semiconductor (20), it is provided with elastic support (40), institute on the mounting bracket (30)
It states and is provided with pcb board (50) on elastic support (40), the first mounting hole (51), the heat dissipation are provided on the pcb board (50)
The upper face of device (10) is provided with the second mounting hole (11), be provided in first mounting hole (51) fastening bolt (60) and with
Second mounting hole (11) connects.
2. metal-oxide-semiconductor fixed structure according to claim 1, it is characterised in that：The mounting bracket (30) is in integrally arc plate
Shape structure, the elastic support (40) are platy structure, and being provided with pillar (41) on the elastic support (40) is resisted against installation
The upper face of holder (30).
3. metal-oxide-semiconductor fixed structure according to claim 2, it is characterised in that：The intermediate setting of the mounting bracket (30)
There are installing pipe (32), the upper end of the installing pipe (32) to protrude out the upper end aperture of the first mounting hole (51), second installation
The aperture in hole (11) is provided with grafting bulge loop (111), the lower end of the installing pipe (32) and is plugged on grafting bulge loop (111) outside.
4. metal-oxide-semiconductor fixed structure according to claim 3, it is characterised in that：Is provided on the elastic support (40)
Three mounting holes (42), the installing pipe (32) pass through third mounting hole (42).
5. metal-oxide-semiconductor fixed structure according to claim 4, it is characterised in that：The lower stomidium of first mounting hole (51)
Mouth is provided with positioning convex ring (511), and the positioning convex ring (511) is resisted against the upper face of elastic support (40).
6. metal-oxide-semiconductor fixed structure according to claim 5, it is characterised in that：The upper end outer wall set of the installing pipe (32)
Equipped with cushion block (70), it is provided with the 4th mounting hole (71) passed through for fastening bolt (60) on the cushion block (70), the described 4th
The upper end aperture of mounting hole (71) is provided with step, and the fastening bolt (60) is resisted against the upper end aperture of the 4th mounting hole (71)
Step at.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721874158.7U CN207869490U (en) | 2017-12-27 | 2017-12-27 | Metal-oxide-semiconductor fixed structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721874158.7U CN207869490U (en) | 2017-12-27 | 2017-12-27 | Metal-oxide-semiconductor fixed structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207869490U true CN207869490U (en) | 2018-09-14 |
Family
ID=63463216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721874158.7U Active CN207869490U (en) | 2017-12-27 | 2017-12-27 | Metal-oxide-semiconductor fixed structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207869490U (en) |
-
2017
- 2017-12-27 CN CN201721874158.7U patent/CN207869490U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230303 Address after: 646606 Building 12, Yingtian Intelligent Terminal Industrial Park, No. 9, Liangang Road, Shangzhuang Village, Luohan Street, South Sichuan Lingang District, Sichuan Free Trade Zone, Luzhou, Sichuan Patentee after: Luzhou Loongson Micro Technology Co.,Ltd. Address before: No. 75, No. 66, Sen Di Avenue, West Peng Town, Jiulongpo District, Chongqing Patentee before: CHONGQING JIALINGXIN TECHNOLOGY CO.,LTD. |