CN207869422U - It is provided with the heat power supply device of thick film integrated circuit - Google Patents
It is provided with the heat power supply device of thick film integrated circuit Download PDFInfo
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- CN207869422U CN207869422U CN201820338275.XU CN201820338275U CN207869422U CN 207869422 U CN207869422 U CN 207869422U CN 201820338275 U CN201820338275 U CN 201820338275U CN 207869422 U CN207869422 U CN 207869422U
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Abstract
The utility model is related to a kind of heat power supply devices being provided with thick film integrated circuit, including：Cylindrical body is provided with thick film integrated circuit on the surface of the cylindrical body；It is connected with described cylindrical body one end and there is the first end cover of fluid inlet；It is connected with the cylindrical body other end and there is the second end cover of fluid outlet；The first end cover, second end cover, cylindrical body hermetically form the chamber flowed through for fluid.The heat power supply device thermal efficiency provided by the utility model is high, compact-sized, convenient for being integrated in the various end products for liquid heating.
Description
Technical field
The utility model is related to a kind of heat power supply device, especially a kind of heat power supply device being provided with thick film integrated circuit.
Background technology
It is wider in the application range of intelligent electric-heating source domain, the low-temperature heat source of thick film circuit form, thick film circuit form
The frequency of middle temperature-heat-source application is not high, and the high temperature heat source of thick film circuit form is of high cost since technical sophistication, difficulty are big
It is high, hinder it to promote the use of daily use and conventional commercial Application.
Drawbacks described above is that those skilled in the art it is expected to overcome.
Utility model content
(1) technical problems to be solved
In order to solve the above problem of the prior art, the utility model provides a kind of heat source being provided with thick film integrated circuit
Device, to solve the problems, such as that the current heat power supply device thermal efficiency is low, size is big.
(2) technical solution
In order to achieve the above object, the main technical schemes of the utility model use include：
A kind of heat power supply device being provided with thick film integrated circuit, including：
Cylindrical body is provided with thick film integrated circuit on the surface of the cylindrical body；
It is connected with described cylindrical body one end and there is the first end cover of fluid inlet；
It is connected with the cylindrical body other end and there is the second end cover of fluid outlet；
The first end cover, second end cover, cylindrical body hermetically form the chamber flowed through for fluid.
Further, the heat power supply device,
It further include the power device for providing electric power to the thick film integrated circuit；
The thick film integrated circuit is arranged in the outer surface of the cylindrical body；
The thick film integrated circuit includes extending outwardly successively the substrate layer and device of setting along the radial direction of the cylindrical body
Part layer；
The device layer includes thick membrane electrode element and thick film resistance element；
The thick membrane electrode element is for the thick film resistance element to be connect with the power device；
The thick film resistance element is adapted to provide at least one predetermined heat source temperature.
Further, the heat power supply device further includes：
The spaced temperature in outer surface between the first end cover and the second end cover, with the cylindrical body
Device is controlled,
The temperature controller is electrically connected with the power device, and is adjusted to the thick film for controlling the power device
The electric power that integrated circuit provides.
Further, the heat power supply device further includes：
The spaced electricity in outer surface between the first end cover and the second end cover, with the cylindrical body
Pneumatic module, the electric component with city for being electrically connected.
Further, in the heat power supply device,
The temperature controller and/or the electric component are set to an interconnecting piece, and the connecting portion is in the first end cover
Appearance face interval setting between the second end cover and with the cylindrical body.
Further, in the heat power supply device,
The interconnecting piece includes multiple rod-shaped units extended between the first end cover and the second end cover.
Further, the heat power supply device further includes：
Diversion division, the diversion division are located in the chamber, for guiding the indoor fluid of the chamber close to the thickness
It flows in the region of film integrated circuit.
Further, in the heat power supply device,
The diversion division is one, is set on the central axis of the cylindrical body；Or
The diversion division is multiple, is uniformly arranged on the central axis of the cylindrical body.
Further, in the heat power supply device,
The diversion division includes cylinder body,
Spiral shape protrusion is provided on the outer wall of the cylinder body；Or,
It is provided with spiral groove on the outer wall of the cylinder body.
Further, the heat power supply device further includes：
Sealing device, is arranged between one end of the cylindrical body and the first end cover and/or the cylindrical body
The other end and the second end cover between.
A kind of heat power supply device being provided with thick film integrated circuit, including：
Cylindrical body, the cylindrical body are provided with curved surface thick film integrated circuit；
It is connected with described cylindrical body one end and there is the first end cover of fluid inlet；
It is connected with the cylindrical body other end and there is the second end cover of fluid outlet；
The first end cover, second end cover, cylindrical body hermetically form the chamber flowed through for fluid.
Further, the heat power supply device further includes：
Diversion division, the diversion division are located in the chamber, for guiding the indoor fluid of the chamber close to the thickness
It flows in the region of film integrated circuit.
Further, in the heat power supply device, the diversion division is one, is set to the central shaft of the cylindrical body
On line；Or
The diversion division is multiple, is uniformly arranged on the central axis of the cylindrical body.
Further, in the heat power supply device, the diversion division includes cylinder body,
Spiral shape protrusion is provided on the outer wall of the cylinder body；Or,
It is provided with spiral groove on the outer wall of the cylinder body.
Further, the heat power supply device further includes the power device for being electrically connected with city；
The thick film integrated circuit includes the substrate layer and device layer radially outward set gradually from the cylindrical body：
The device layer includes thick membrane electrode element and thick film resistance element；
The thick membrane electrode element is for the thick film resistance element to be connect with the power device；
The thick film resistance element is adapted to provide at least one predetermined heat source temperature.
Further, the heat power supply device further includes：
Between the first end cover and the second end cover, with the spaced temperature control of the cylindrical body outer wall
Device, the temperature controller are electrically connected with the thick film integrated circuit, and for generating the output for controlling the thick film integrated circuit
The temperature control of power instructs.
Further, the heat power supply device further includes：
Between the first end cover and the second end cover, with spaced electrical group of the cylindrical body outer wall
Part, the electric component is for the thick film integrated circuit to be electrically connected with city.
Further, in the heat power supply device,
The temperature controller and/or electric component setting and an interconnecting piece, the connecting portion is in the first end cover
It is arranged between the second end cover and with cylindrical body outer wall interval.
Further, in the heat power supply device,
The interconnecting piece includes multiple rod-shaped units extended between the first end cover and the second end cover.
Further, the heat power supply device further includes：
Sealing device is arranged between described cylindrical body one end and the first end cover and/or the cylindrical body is another
Between one end and the second end cover.
(3) advantageous effect
The utility model provides a kind of heat power supply device being provided with thick film integrated circuit, using setting outside cylindrical body
The thick film integrated circuit of the outer surface of wall cylindrical body heats the fluid positioned at cylindrical body inner cavity, and the thermal efficiency is high, structure is tight
It gathers, convenient for being integrated in the various end products for liquid heating.
Description of the drawings
Fig. 1 is the electrical connection signal of the heat power supply device for being provided with thick film integrated circuit of the utility model one embodiment
Figure；
Fig. 2 is the mechanical connection signal of the heat power supply device for being provided with thick film integrated circuit of the utility model one embodiment
Figure.
【Reference sign】
10：Cylindrical body；
20：Water inlet side end cap；
30：It is discharged side end cap；
40：Stay bolt；
50：Temperature controller fixing piece；
60：Electrode plug fixing piece；
70：Diversion division；
100：Temperature controller；
200：Power device；
300：Thick film integrated circuit.
Specific implementation mode
It is below in conjunction with the accompanying drawings, right by specific implementation mode in order to understand in order to preferably explain the utility model
The utility model is described in detail.
The heat power supply device provided by the utility model for being provided with thick film integrated circuit can be used as heat source assembly, be integrated in out
Water dispenser, making tea machine, small kitchen is precious, hot water halter, household, commercialization and the industrial machine of any water heating system such as water heater
In equipment.The heat source assembly has that uniform temperature fields, thermal response is fast, power density is big, wide temperature range, compact-sized, energy saving
Environmentally friendly, safe and reliable advantage, can green, cleaning, efficiently, heat source is healthily provided.
The heat power supply device for being provided with thick film integrated circuit of the utility model embodiment, including：Cylindrical body, in tubular sheet
The surface of body is provided with thick film integrated circuit；It is connected and has the first end cover of fluid inlet with cylindrical body one end；With cylinder
The shape ontology other end is connected and has the second end cover of fluid outlet；First end cover, second end cover, cylindrical body seal landform
At the chamber flowed through for fluid.
Further, the heat power supply device of the present embodiment can also include for providing electric power to thick film integrated circuit
Power device；The thick film integrated circuit is arranged in the outer surface of cylindrical body；The thick film integrated circuit includes along cylindrical body
Radial direction extend outwardly successively the substrate layer and device layer of setting；The device layer includes thick membrane electrode element and thick-film resistor member
Part；The thick membrane electrode element is for thick film resistance element to be connect with power device；The thick film resistance element is adapted to provide at least
One predetermined heat source temperature.
Further, the heat power supply device of the present embodiment can also include：Between first end cover and second end cover, with
The spaced temperature controller in outer surface of cylindrical body, the temperature controller are electrically connected with power device, and for controlling power device
Part adjusts the electric power provided to thick film integrated circuit.
Further, the heat power supply device of the present embodiment can also include：Between first end cover and second end cover, with
The spaced electric component in outer surface of cylindrical body, electric component with city for being electrically connected.
Further, in the heat power supply device of the present embodiment, the temperature controller and/or electric component are set to an interconnecting piece, even
Appearance face interval setting of the socket part between first end cover and second end cover and with cylindrical body.
Further, in the heat power supply device of the present embodiment, the interconnecting piece include it is multiple first end cover and second end cover it
Between the rod-shaped unit that extends.
Further, the heat power supply device of the present embodiment can also include：Diversion division, diversion division is located in chamber, for drawing
The indoor fluid of guide cavity is flowed close to the region of thick film integrated circuit.
Further, in the heat power supply device of the present embodiment, diversion division is one, is set to the central axis of cylindrical body
On；Or diversion division is multiple, is uniformly arranged on the central axis of cylindrical body.
Further, in the heat power supply device of the present embodiment, diversion division includes cylinder body, on the outer wall of cylinder body
It is provided with spiral shape protrusion；Or, being provided with spiral groove on the outer wall of cylinder body.
Further, the heat power supply device of the embodiment can also include：Sealing device is arranged in one end of cylindrical body
Between first end cover and/or between the other end and second end cover of cylindrical body.
As shown in Figure 1, the heat power supply device of the embodiment include be sequentially connected electrically and/or signal connection temperature controller 100, work(
Rate device 200 and thick film integrated circuit 300.Wherein, temperature controller 100 controls power device 200 and adjusts to thick film integrated circuit 300
The electric power of offer.Specifically, temperature controller 100 controls work(according to the surface temperature for the heater element for getting or detecting
Rate device 200 adjusts the electric power provided to thick film integrated circuit 300 to avoid heater element from overheating, and realizes to fever member
The active of part is protected.It is construed as, heater element here includes thick film integrated circuit.
In addition, temperature of the temperature controller 100 according to cavity fluid in the heat source assembly for getting or detecting, controls power device
Part 200 adjusts the electric power provided to thick film integrated circuit 300 so that having from the fluid of heat source assembly outlet outflow
Predetermined temperature.
Preferably, it is integrated with thermal-sensitive electric resistance device on the thick film integrated circuit, the temperature for detecting thick film integrated circuit,
Overheat, which is actively protected, to be realized to thick film integrated circuit.
The heat source assembly can also include the electric-controlled plate being connect with the electrical connection of temperature controller 100 or signal.Electric-controlled plate is for connecing
Fluid temperature (F.T.) and fluid temperature (F.T.) control model set by user is received, is used cooperatively with temperature controller 100 so that is exported from heat source assembly
The fluid of outflow has predetermined temperature.
Specifically, which includes that thick membrane electrode element and thick-film resistor member are printed on one side surface
The curved substrate layer of part.
The material of curved substrate layer can be metal substrate and non-metal base plate.Specifically, when the material of curved substrate layer
For metal substrate when, which includes the dielectric layer being attached on the outer wall of the metal substrate；And thick membrane electrode is first
Part and thick film resistance element are then arranged on dielectric layer.
It should be noted that dielectric layer is prepared by thick film dielectric paste, for realizing metal substrate and thick film electricity
Insulation between pole element, thick film resistance element.
Thick-film resistor is PTC (negative temperature coefficient) resistance, and heat density and the thermal efficiency are all very high, by thick-film resistor paste system
It is standby to form.Thick membrane electrode is prepared by thick membrane electrode slurry, and conductivity is high.
It should be noted that the various thick film integrated circuits having disclosed at present may be used in the thick film integrated circuit, such as
Rare earth thick film integrated circuit, such as graphene thick film integrated circuit.Wherein, the electronics slurry of graphene thick film integrated circuit is prepared
Micro graphene or graphite alkenes particle, can be distributed in thick-film resistor and dielectric layer by material, and the carbon formed is micro-nano
Improve to the fine grid number magnitude of material the electrical property of thick film circuit, hot property, chemical property and hot boundary in a thickness direction
The heat dissipation performance and mechanical strength of high-power thick-film integrated circuit greatly improved in the thermal conductivity in face.
When it is implemented, the thick film resistance element on thick film integrated circuit can have it is multigroup, it is identical or not to provide respectively
Same thermal power.Accordingly, thick membrane electrode element also has multigroup.
When it is implemented, each group thick film resistance element and/or thick membrane electrode element are stacked, or the light in same curved surface
The setting of sliding splicing ground.
It, can be on one piece of substrate by the way that multigroup dielectric layer and thick membrane electrode element, thick film resistance element to be stacked
Multiple chip heat sources are arranged in stacking ground, to realize total quantity of heat given up of bigger, improve the heat density of heat source assembly so that heat
The more compact structure of source assembly.
By the way that multigroup thick membrane electrode element and thick film resistance element is smooth in the curved surface of same dielectric layer or substrate layer
The setting of splicing ground, can be arranged multiple chip heat sources in subregional on substrate, realize that the subregion of multiple operating temperature heat sources is set
It sets or gradient is arranged so that temperature control is more flexible, and the configuration of heat source assembly is more flexible.
Preferably, substrate can be prepared as tubular structure part, for accommodating fluid；Optionally, which is beaten by 3D
India side formula is prepared；Correspondingly, dielectric layer and thick membrane electrode element, thick film resistance element are then sintered after silk-screen printing at this
The outer surface of tubular substrate.
Preferably, it is the specific size for accommodating the heat source assembly and reserved installation space, tubular sheet according to end product
Body can have the symmetrical cross section of the rule such as round, approximate circle, oval, rectangle, hexagon or irregular symmetrical cross
Section；Cylindrical body can have cylindrical external outline, conical outer profile or other revolving body contours or special-shaped outline.
When it is implemented, non-metal base plate can be ceramic substrate, crystallite glass substrate and polymer composite substrate
Deng.Specifically, ceramic substrate can be following all kinds of ceramics：Aluminium oxide, aluminium nitride, silicon carbide, aluminium silicon carbide.Devitrified glass is then
It can be high thermal conductivity coefficient rare earth oxide microcrystalline glass in series.Polymer composite substrate is then primarily referred to as Kapton
Flexible base board.
As shown in Fig. 2, the tubular sheet of the heat power supply device for being provided with thick film integrated circuit of the utility model one embodiment
It is provided with thick film integrated circuit on the outer wall of body 10；Water inlet side end cap 20 is combined with the head end of cylindrical body 10, is discharged side end cap
30 are combined with the end of cylindrical body 10.
Water inlet side end cap 20 and water outlet side end cap 30 are both provided with the runner for intaking or being discharged.For the ease of with terminal
The inlet and outlet pipe lines connection that product provides, water inlet side end cap or the central axis for being discharged the inlet and outlet channel being arranged on side end cap can
With parallel or perpendicular with the central axis of cylindrical body.Be construed as, can be provided in inlet and outlet channel rounding or
The structure of other flows that smoothly transit.
Be construed as, according to end product is the heat source assembly and the position of reserved Inlet and outlet water port, the heat source are total
At water inlet side end cap and water outlet side end cap size, location and shape can flexibly set.
Preferably, it is provided on water inlet side end cap 20 or water outlet side end cap 30 for installing and fixed temperature inductor
Installation position and fixed hole position.
Preferably, temperature sensor is thermistor patch type temperature sensor.
As shown in Fig. 2, 4 groups of standard component stay bolts 40 will intake, side end cap 20 and water outlet side end cap 30 relatively connect
Come so that water inlet side end cap 20, water outlet side end cap 30, cylindrical body 10 mutually enclose the chamber that can accommodate fluid.
To meet electrical code, it is provided with insulating materials on stay bolt 40, ensures the stay bolt of the good conductor as electricity
Meet the isolation specifications of electric product.
It should be appreciated that the quantity of standard component stay bolt 40 should be according to the shape of water inlet side end cap 20 or water outlet side end cap 30
The technical parameters such as shape, reach are selected according to fastener operating specification.
Preferably, when stay bolt 40 is installed, using stop nut, and ensure preset pretightning force.
It should be appreciated that according to the needs of end product, other connection structures may be used in standard component stay bolt 40
It replaces, such as closes shell, integral frame etc..
The heat power supply device number of parts for being provided with thick film integrated circuit of the utility model one embodiment is few, installation and dress
With simple for process, production efficiency height.
When it is implemented, the heat power supply device of the present embodiment is additionally provided with temperature controller fixing piece 50, it is used to accommodate temperature controller
100.According to the 3C authentication specifications of electric product, temperature controller fixing piece 50 is provided at least two temperature controller installation positions, realizes two
Pole electrical isolation protection.
As shown in Fig. 2, the installation site and space, temperature controller fixing piece 50 that are provided according to end product can be along long spiral shells
Bolt 40 is fixed again after sliding into position appropriate.
When it is implemented, the heat power supply device of the present embodiment is additionally provided with electrode plug fixing piece 60, it to be used for receiving and city
The electrode plug of electrical connection.As shown in Fig. 2, according to the installation site of end product offer and space, electrode plug fixing piece 60
It can slide into along stay bolt 40 behind position appropriate and fix again.
It should be appreciated that electrode plug fixing piece 60 be also a housing for for power device 200 and/or temperature controller 100
The electrical fitting of connection, to which the electric energy obtained from alternating current is connected to power device 200 and/or temperature controller 100.
When it is implemented, in order to be in tightening seal state when ensureing the chamber work of the receiving fluid, side end cap 20 of intaking
Or the end face seal of pre-pressing is realized between water outlet side end cap 30 and cylindrical body 10 using sealing ring.
Preferably, sealing ring is refractory material, and the mode that 3D printing or die casting may be used is process.
The heat power supply device of the present embodiment has been additionally provided with diversion division 70.As shown in Fig. 2, diversion division 70 is located in chamber, use
It is moved from fluid inlet to the flow direction in fluid outlet direction in guiding the indoor fluid edge of the chamber.Preferably, diversion division is adopted
It is prepared with silica gel material.
After fluid introduces chamber by negative pressure, moved to outlet conduit along preset flow direction；Wherein, close to tubular
The fluid of ontology is heated under conduction；And pass through convection action so that the fluid far from thick film integrated circuit is added
Heat.Meanwhile negative pressure introduces the indoor fluid of chamber under the radiation effects of thick film integrated circuit, can also be heated.
Diversion division 70 is arranged in chamber can be to avoid chamber by the flow direction and flow field of guidance cavity fluid inside
Inside fluid uneven heating is even everywhere, and the heterogeneity phantom of active guidance cavity fluid inside is evenly.
Specifically, according to the specific size and form parameter of cylindrical body inner cavity chamber, diversion division can be one, be set to
On the central axis of the cylindrical body；Diversion division may be multiple, and center axis is equal with the central axis of cylindrical body
Row, and be equably arranged around the central axis of the cylindrical body.
Preferably, the central axis diversion division parallel with the central axis of cylindrical body can be cylinder, the cylinder
Spiral shape protrusion is provided on the outer wall of body；Or it is provided with spiral groove on the outer wall of the cylinder.
Optionally, diversion division may be multiple, and the central axis of end face and cylindrical body is perpendicular, and the vertical cylinder
The central axis of shape ontology is positioned apart from.
Optionally, which can connect with water inlet side end cap 20 or water outlet side end cap 30 respectively.
The technical principle of the utility model is described above in association with specific implementation mode.These descriptions are intended merely to explain this
The principle of utility model, and it cannot be construed to the limitation to scope of protection of the utility model in any way.Based on solution herein
It releasing, those skilled in the art, which need not make the creative labor, can associate the other specific implementation modes of the utility model, this
A little modes are fallen within scope of protection of the utility model.
Claims (10)
1. a kind of heat power supply device being provided with thick film integrated circuit, which is characterized in that including：
Cylindrical body is provided with thick film integrated circuit on the surface of the cylindrical body；
It is connected with described cylindrical body one end and there is the first end cover of fluid inlet；
It is connected with the cylindrical body other end and there is the second end cover of fluid outlet；
The first end cover, second end cover, cylindrical body hermetically form the chamber flowed through for fluid.
2. heat power supply device according to claim 1, which is characterized in that
It further include the power device for providing electric power to the thick film integrated circuit；
The thick film integrated circuit is arranged in the outer surface of the cylindrical body；
The thick film integrated circuit includes extending outwardly successively the substrate layer and device layer of setting along the radial direction of the cylindrical body；
The device layer includes thick membrane electrode element and thick film resistance element；
The thick membrane electrode element is for the thick film resistance element to be connect with the power device；
The thick film resistance element is adapted to provide at least one predetermined heat source temperature.
3. heat power supply device according to claim 2, which is characterized in that further include：
The spaced temperature control in outer surface between the first end cover and the second end cover, with the cylindrical body
Device,
The temperature controller and the power device are electrically connected, and for control the power device adjust it is integrated to the thick film
The electric power that circuit provides.
4. heat power supply device according to claim 3, which is characterized in that further include：
Spaced electrical group of the outer surface between the first end cover and the second end cover, with the cylindrical body
Part, the electric component with city for being electrically connected.
5. heat power supply device according to claim 4, which is characterized in that
The temperature controller and/or the electric component are set to an interconnecting piece, and the connecting portion is in the first end cover and institute
It states between second end cover and is arranged with the appearance face interval of the cylindrical body.
6. heat power supply device according to claim 5, which is characterized in that
The interconnecting piece includes multiple rod-shaped units extended between the first end cover and the second end cover.
7. heat power supply device according to claim 1, which is characterized in that further include：
Diversion division, the diversion division are located in the chamber, for guiding the indoor fluid of the chamber close to the thick film collection
It is flowed at the region of circuit.
8. heat power supply device according to claim 7, which is characterized in that
The diversion division is one, is set on the central axis of the cylindrical body；Or
The diversion division is multiple, is uniformly arranged on the central axis of the cylindrical body.
9. heat power supply device according to claim 7, which is characterized in that
The diversion division includes cylinder body,
Spiral shape protrusion is provided on the outer wall of the cylinder body；Or,
It is provided with spiral groove on the outer wall of the cylinder body.
10. heat power supply device according to claim 1, which is characterized in that further include：
Sealing device, be arranged between one end of the cylindrical body and the first end cover and/or the cylindrical body it is another
Between one end and the second end cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820338275.XU CN207869422U (en) | 2018-03-13 | 2018-03-13 | It is provided with the heat power supply device of thick film integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820338275.XU CN207869422U (en) | 2018-03-13 | 2018-03-13 | It is provided with the heat power supply device of thick film integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207869422U true CN207869422U (en) | 2018-09-14 |
Family
ID=63455796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820338275.XU Active CN207869422U (en) | 2018-03-13 | 2018-03-13 | It is provided with the heat power supply device of thick film integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207869422U (en) |
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2018
- 2018-03-13 CN CN201820338275.XU patent/CN207869422U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190131 Address after: 528051 Second Floor, Four Blocks, No. 1 Huabao South Road, Chancheng District, Foshan City, Guangdong Province (Residence Declaration) Patentee after: Guangdong Jiang Calvin Electronic Technology Co. Ltd. Address before: 528000 Second Floor, Four Blocks, No. 1 Huabao South Road, Chancheng District, Foshan City, Guangdong Province Patentee before: Wang Chen |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 528000 2 / F, block 4, No.1, South Huabao Road, Chancheng District, Foshan City, Guangdong Province Patentee after: Guangdong Yuchen Electronic Technology Co.,Ltd. Address before: 528051 Second Floor, Four Blocks, No. 1 Huabao South Road, Chancheng District, Foshan City, Guangdong Province (Residence Declaration) Patentee before: Guangdong Jiang Calvin Electronic Technology Co.,Ltd. |