CN207853964U - A kind of electronic device - Google Patents
A kind of electronic device Download PDFInfo
- Publication number
- CN207853964U CN207853964U CN201820325549.1U CN201820325549U CN207853964U CN 207853964 U CN207853964 U CN 207853964U CN 201820325549 U CN201820325549 U CN 201820325549U CN 207853964 U CN207853964 U CN 207853964U
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- China
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- layer
- cover board
- electronic device
- fingerprint recognition
- recognition module
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Abstract
The utility model provides a kind of electronic device, the fingerprint recognition module being adhesively fixed including cover board and by viscose glue and the cover board, the cover board includes substrate, silver slurry layer and ink layer, logo slot is offered on the substrate, silver paste layer is filled in the logo slot, the thickness of silver paste layer is consistent with the depth of the logo slot, and the ink layer is covered in the area on silver paste layer and substrate and more than the fingerprint recognition module.A kind of electronic device provided by the utility model then fills silver slurry layer by opening up logo slot on the cover board, to realize the effect that mark is presented on the cover board, and since silver slurry layer is consistent with the depth of logo slot with thickness, it can ensure the planarization of cover board after ink for screen printing layer, the consistency that can ensure adhesive effect when being bonded fingerprint recognition module is not in that part is bonded unsteady situation.
Description
Technical field
The utility model is related to fingerprint identification technology fields, more particularly to a kind of electronic device.
Background technology
Nowadays as people are higher and higher to the multi-functional demand of electronic device, more and more electronic devices require to match
It is equipped with fingerprint recognition module, is configured with after fingerprint recognition module and fingerprint payment may be implemented, that authentication, screen wake up etc. is a variety of
Function meets the needs of plurality of application scenes.Now, being constantly progressive with fingerprint recognition module recognition capability can will refer to
Line identifies that module is set to below the cover board of electronic device, does not have to that trepanning is arranged in the cover board of electronic device, can ensure electricity in this way
The consistency of sub-device cover board generally requires the area for corresponding to fingerprint recognition module on the cover board then in order to facilitate fingerprint recognition
Domain setting mark.The position that existing electronic device corresponds to fingerprint recognition module on the cover board is provided with mark, often directly
Label layer is set on the cover board, then is bonded with fingerprint recognition module by viscose glue.It is arranged in this way since label layer protrudes from cover board
On, the planarization of cover board is affected, while making label layer that there is certain height, it should when Nian Jie with fingerprint recognition module
Local viscose glue insufficient space so that adhesive thickness is small, and bonding force is insufficient, and it is bonding with cover board to have seriously affected fingerprint recognition module
Effect, be susceptible to fall off etc. it is bad.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of electronic device, it can realize that cover board is corresponded to because of setting
Surfacing is inconsistent caused by the mark of fingerprint recognition module and part is bonded unsteady problem.
In order to solve the above technical problems, the utility model provides a kind of electronic device, including cover board and pass through viscose glue
The fingerprint recognition module being adhesively fixed with the cover board, the cover board include substrate, silver slurry layer and ink layer, are opened on the substrate
Equipped with logo slot, silver paste layer is filled in the logo slot, the depth one of the thickness of silver paste layer and the logo slot
It causes, the ink layer is covered on silver paste layer and substrate, and the area coverage of the ink layer is more than the fingerprint recognition mould
Group corresponds to the projected area on cover board, and the fingerprint recognition module is adhered to by viscose glue on the ink layer.
As a kind of preferred embodiment of the utility model, the shape of the logo slot is round or oval.
As a kind of preferred embodiment of the utility model, the color of the ink layer is black.
As a kind of preferred embodiment of the utility model, the thickness of the ink layer is 0.02mm.
As a kind of preferred embodiment of the utility model, the side of the logo slot is equipped with strengthening layer.
As a kind of preferred embodiment of the utility model, the cover board further includes reflecting layer, and the reflecting layer is set to described
Ink layer is backwards to fingerprint recognition module side.
It is equipped with and fills out as a kind of preferred embodiment of the utility model, between silver paste layer and the side end face of the logo slot
Fill agent.
As a kind of preferred embodiment of the utility model, the substrate is made of tempered glass.
As a kind of preferred embodiment of the utility model, the electronic device is configured to mobile phone.
The utility model has the following technical effect that：A kind of electronic device provided by the utility model by opening on the cover board
If logo slot then fills silver slurry layer, to realize the effect of mark of presenting on the cover board, and due to silver slurry layer and thickness with
The depth of logo slot is consistent, i.e., after being filled through silver slurry layer, substrate towards ink layer side be smooth plane, while in ink
After layer is covered on silver paste layer and substrate, since the area coverage of the ink layer is corresponded to more than the fingerprint recognition module
In the projected area on cover board, the fingerprint recognition module is adhered to by viscose glue on the ink layer, in this way in ink for screen printing
The planarization that can ensure cover board after layer, can ensure the consistency of adhesive effect when being bonded fingerprint recognition module, will not go out
Current situation portion is bonded unsteady situation.In addition, by can effective reinforcement cover board after strengthening layer is arranged in the side of logo slot
Intensity improves the ability of cover board side anticollision, improves the product quality of electronic device.
Description of the drawings
In order to illustrate more clearly of the technical solution of the utility model embodiment, the attached drawing of embodiment will be made below simple
Ground introduction, it should be apparent that, the accompanying drawings in the following description merely relates to some embodiments of the utility model, rather than to this practicality
Novel limitation.
Fig. 1 is a kind of floor map of electronic device provided by the utility model；
Fig. 2 is a kind of structural schematic diagram of cover board provided by the utility model；
Fig. 3 is a kind of structural schematic diagram of substrate provided by the utility model；
Fig. 4 is a kind of arrangement schematic diagram of strengthening layer provided by the utility model；
Fig. 5 is a kind of arrangement schematic diagram of filler provided by the utility model；
Fig. 6 is a kind of arrangement schematic diagram in reflecting layer provided by the utility model.
Specific implementation mode
To make the purpose of this utility model, technical solution and advantage are clearer, below in conjunction with the accompanying drawings to the utility model
Embodiment is described in further detail.Obviously, described embodiment is a part of the embodiment of the utility model, rather than
Whole embodiments.Based on described the embodiments of the present invention, those of ordinary skill in the art are without creative labor
The every other embodiment obtained under the premise of dynamic, shall fall within the protection scope of the present invention.
As shown in Figs. 1-3, which show a kind of electronic device provided by the utility model, which includes cover board 1
With the fingerprint recognition module 3 being adhesively fixed by viscose glue 2 and the cover board 1, specifically, electronic device provided in this embodiment can
To be configured to mobile phone.The fingerprint recognition module 3 is set to cover board 1 time and is arranged in the center bottom of cover board 1, and the cover board 1 wraps
Substrate 11, silver slurry layer 12 and ink layer 13 are included, logo slot 111 is offered on the substrate 11, silver paste layer 12 is filled in institute
It states in logo slot 111, the thickness of silver paste layer 12 is consistent with the depth of the logo slot 111, and the ink layer 13 is covered in
On silver paste layer 12 and substrate 111, the area coverage of the ink layer 13 is more than the fingerprint recognition module 3 and corresponds to cover board
Projected area on 1, the fingerprint recognition module 3 are adhered to by viscose glue 2 on the ink layer 13.Specifically, the fingerprint
Identify that module 3 is Nian Jie with the cover board 1 by transparent optical cement.In this way, by opening up logo slot on the substrate 11 of cover board 1
111 then fill silver slurry layer 12, to realize the effect of mark of being presented on cover board 1, and due to the thickness of silver slurry layer 12 with
The depth of logo slot 111 is consistent, i.e., through silver slurry layer 12 fill after, substrate 11 towards 13 side of ink layer be smooth plane,
Simultaneously after ink layer 13 is covered on silver paste layer 12 and substrate 11, since the area coverage of the ink layer 13 is more than institute
Fingerprint recognition module 3 is stated corresponding to the projected area on cover board 1, the fingerprint recognition module 3 is adhered to the oil by viscose glue 2
In layer of ink 13, in this way, guarantee to ensure cover board 1 relative to the planarization at 3 position of fingerprint recognition module, and area is viscous enough
Fingerprint recognition module 3 is connect, can ensure the consistency of adhesive effect in bonding fingerprint recognition mould, 3, be not in local bonding
Unsteady situation.
In the present embodiment, the shape of the logo slot 111 is round or oval.Certainly, the shape of the logo slot 111
Shape can use other shapes, such as special logo etc. as needed.Preferably, the color of the ink layer 13 is black, institute
The thickness for stating ink layer 13 is 0.02mm, with excellent one when enabling to electronic device breath to shield using the ink layer 13 of black
The black display effect of body, and thickness can have a small amount of reductions compared to white ink layer, adapt to the lightening design of electronic device and want
It asks.Certainly, the ink layer may be set to be white as needed, is set as the thickness of the ink layer of white and can be controlled in
Between 0.03-0.04mm.
Further, as shown in figure 4, the side of the logo slot 111 is equipped with strengthening layer 112.Due to setting on the substrate 11
After having set logo slot 111 so that substrate 1 corresponds to the position thinner thickness of logo slot 111, and intensity is weaker, it is contemplated that electronics fills
Set causes the risk of damage higher by side collision, can effective reinforcement base after the side of logo slot 111 setting strengthening layer 112
The intensity of plate 1 improves the product quality of electronic device to improve the ability of 1 side anticollision of cover board；Specifically, described strong
It can be the strengthened coat or reinforcing glue being set to by coating method on the substrate to change layer 112.
Further, in the present embodiment, as shown in figure 5, the side end face of silver paste layer 12 and the logo slot 111 it
Between be equipped with filler 14, be after fill silver slurry layer 12, the side of silver slurry layer 12 and 11 joint of substrate setting filler
14, because of silver slurry layer 12 existing for fabrication error and logo slot 111 when setting filler 14 can compensate filling silver slurry layer 12 in time
Side end face between miniature gap, ensure planarization of the substrate 11 towards 13 side of ink layer, convenient then ink for screen printing layer
Ensure the planarization of cover board 1 after 13.
Further, in the present embodiment, as shown in fig. 6, the cover board 1 further includes reflecting layer 15, the reflecting layer 15
Set on the ink layer 13 backwards to 3 side of fingerprint recognition module.Preferably, the thickness in the reflecting layer 15 is less than 50um.In this way,
Reflecting layer 15 can enhance the display effect of ink layer 13, improve the product quality of electronic device.The thickness in the reflecting layer 15
It is controlled in and is less than 50um, ensure the inductive effects of fingerprint recognition module 3.In the present embodiment, the substrate 11 uses tempering glass
Glass is made.
The embodiment of the utility model above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot it therefore be interpreted as the limitation to the utility model patent range, as long as using the form institute of equivalent substitution or equivalent transformation
The technical solution of acquisition, shall fall within the scope of the present invention.
Claims (9)
1. a kind of electronic device, including cover board and the fingerprint recognition module that is adhesively fixed by viscose glue and the cover board, feature
It is, the cover board includes substrate, silver slurry layer and ink layer, and logo slot is offered on the substrate, and silver paste layer is filled in
In the logo slot, the thickness of silver paste layer is consistent with the depth of the logo slot, and the ink layer is covered in silver paste
On layer and substrate, the area coverage of the ink layer is more than the projected area that the fingerprint recognition module corresponds on cover board, institute
Fingerprint recognition module is stated to be adhered on the ink layer by viscose glue.
2. electronic device according to claim 1, which is characterized in that the shape of the logo slot is round or oval.
3. electronic device according to claim 1, which is characterized in that the color of the ink layer is black.
4. electronic device according to claim 1, which is characterized in that the thickness of the ink layer is 0.02mm.
5. electronic device according to claim 1, which is characterized in that the side of the logo slot is equipped with strengthening layer.
6. electronic device according to claim 1, which is characterized in that the cover board further includes reflecting layer, the reflecting layer
Set on the ink layer backwards to fingerprint recognition module side.
7. electronic device according to claim 1, which is characterized in that the side end face of silver paste layer and the logo slot it
Between be equipped with filler.
8. electronic device according to claim 1, which is characterized in that the substrate is made of tempered glass.
9. electronic device according to claim 1, which is characterized in that the electronic device is configured to mobile phone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820325549.1U CN207853964U (en) | 2018-03-09 | 2018-03-09 | A kind of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820325549.1U CN207853964U (en) | 2018-03-09 | 2018-03-09 | A kind of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207853964U true CN207853964U (en) | 2018-09-11 |
Family
ID=63409108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820325549.1U Active CN207853964U (en) | 2018-03-09 | 2018-03-09 | A kind of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207853964U (en) |
-
2018
- 2018-03-09 CN CN201820325549.1U patent/CN207853964U/en active Active
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