CN207834615U - A kind of interconnection structure between high speed circuit board - Google Patents
A kind of interconnection structure between high speed circuit board Download PDFInfo
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- CN207834615U CN207834615U CN201721807176.3U CN201721807176U CN207834615U CN 207834615 U CN207834615 U CN 207834615U CN 201721807176 U CN201721807176 U CN 201721807176U CN 207834615 U CN207834615 U CN 207834615U
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Abstract
The utility model discloses the interconnection structure between a kind of high speed circuit board, belongs to technical field of information processing, including plate and system structure body occur for signal-processing board, FMC connectors, signal；Signal-processing board, FMC connectors and signal occur plate and are arranged inside system structure body；FMC connectors are located between signal-processing board and signal generation plate, and FMC connectors occur plate with signal in such a way that table bottom is pasted and connect.The connection type pasted by the table bottom of FMC connectors so that the interconnection structure volume between high speed circuit board is small, at low cost, simple in structure.
Description
Technical field
The utility model is related to technical field of information processing, the interconnection structure between specially a kind of high speed circuit board.
Background technology
With the continuous development of high performance embedded system, interconnection is to bandwidth, cost, flexibility and reliable between circuit board
The requirement of property is higher and higher.Currently, the interconnection mode between common high speed circuit board has the standards such as PXI/PXIe, CPCI, VPX back of the body
Plate, although the interconnection mode between such high speed circuit board disclosure satisfy that most of design requirement, but there are of high cost, volumes
Greatly, design is complicated, the problem of lead time length.
Utility model content
For problems of the prior art, the utility model provides the interconnection structure between a kind of high speed circuit board, body
Product is small, at low cost, simple in structure.
The utility model is to be achieved through the following technical solutions：
Plate and system occur for the interconnection structure between a kind of high speed circuit board, including signal-processing board, FMC connectors, signal
Structure body；
The signal-processing board, FMC connectors and signal occur plate and are arranged inside system structure body；
The FMC connectors are located between signal-processing board and signal generation plate, what the FMC connectors were pasted by table bottom
Mode occurs plate with signal and connects.
Optionally, the FMC connectors include FMC plugs and FMC sockets, and FMC sockets are mounted on signal and occur on plate,
FMC plugs are mounted on signal-processing board, and FMC plugs are connected with FMC sockets.
Optionally, the signal occurs to be provided with the first FPGA on plate, is provided with the 2nd FPGA on signal-processing board, and first
FPGA and the 2nd FPGA are connected by FMC connectors.
Optionally, the signal occurs to be provided with LVDS interface between plate and signal-processing board.
Optionally, structure cooling fin is provided on the first FPGA, what the structure cooling fin generated the first FPGA
Heat is conducted to radiating on system structure body.
Optionally, be provided with the first riveting column between the signal-processing board and structure cooling fin, one end of the first riveting column and
Signal-processing board connects, and the other end is connected with structure cooling fin, and the first riveting column and system structure body are connected by screw, and signal occurs
The second riveting column is provided between plate and structure heat sink, one end of the second riveting column is connected with structure heat sink at the other end and signal
Plate connection is managed, the second riveting column and signal occur plate and pass through Stud connection.
Optionally, the both sides of the signal generation plate are symmetrically arranged with signal-processing board, and the signal of plate both sides occurs for signal
Processing board occurs plate with signal by FMC connectors respectively and connects.
Optionally, the signal occurs to be provided with the first FPGA on plate, and the signal-processing board difference of plate both sides occurs for signal
For the first signal-processing board and second signal processing board, the 2nd FPGA and DSP, second signal are provided on the first signal-processing board
The 3rd FPGA and DSP is provided in processing board.
Optionally, it is provided between the DSP on the DSP and second signal processing board on first signal-processing board
Hyperlink interfaces, two DSP are connected by FMC connectors, and SRIO interfaces are provided between the 2nd FPGA and the 3rd FPGA,
2nd FPGA and the 3rd FPGA pass through FMC connectors.
Optionally, the second signal processing board and signal occur to be provided with stud, one end of stud and signal between plate
Plate connection occurs, the other end is connected with second signal processing board.
Compared with prior art, the utility model has technique effect beneficial below：
The utility model discloses the interconnection structure between a kind of high speed circuit board, including signal-processing board, FMC connectors, letter
Number plate and system structure body occurs；Signal-processing board, FMC connectors and signal occur plate and are arranged inside system structure body；FMC connections
Device is located between signal-processing board and signal generation plate, and FMC connectors occur plate with signal in such a way that table bottom is pasted and connect.It is logical
Cross the connection type of the table bottom patch of FMC connectors so that interconnection structure volume between high speed circuit board is small, at low cost, structure is simple
It is single, solve of the existing technology of high cost, volume is big, and design is complicated, the problem of lead time length.
Description of the drawings
Fig. 1 is the front view of the interconnection structure between a kind of high speed circuit board that the utility model embodiment provides；
Fig. 2 is the side view of the interconnection structure between a kind of high speed circuit board that the utility model embodiment provides；
Fig. 3 is that the signal connection relation of the interconnection structure between a kind of high speed circuit board that the utility model embodiment provides is shown
It is intended to.
In figure：1. plate, 5. the 2nd FPGA, 6.DSP, 7. first occur for system structure body, 2. signal-processing boards, 3. signals
FPGA, 8.FMC connector, 9. second riveting columns, 10. screws, 11. first riveting columns, 12. studs, 13.Hyperlink interfaces,
14.SRIO interfaces, 15.LVDS interfaces, 81.FMC plugs, 82.FMC sockets.
Specific implementation mode
The following describes the utility model in further detail with reference to the accompanying drawings, it is described be the explanation to the utility model and
It is not to limit.
Embodiment one
As depicted in figs. 1 and 2, the interconnection structure between a kind of high speed circuit board, including signal-processing board 2, FMC connectors 8,
Plate 3 and system structure body 1 occur for signal；Signal-processing board 2, FMC connectors 8 and signal occur plate 3 and are arranged in system structure body 1
Portion；FMC connectors 8 are located between signal-processing board 2 and signal generation plate 3, and the FMC connectors 8 are in such a way that table bottom is pasted
Plate 3 occurs with signal-processing board 2 and signal respectively to connect.Wherein, height may be used in signal-processing board 2 and signal generation plate 3
Fast pcb board.The patch installation of table bottom refers to that in signal plate table bottom occurs for FMC connectors using completely overlapped above and below all pad-pins
Mode mounted.
FMC connectors 8 include FMC plugs 81 and FMC sockets 82, and FMC sockets 82 are mounted on signal and occur on plate 3, and FMC is inserted
First 81 are mounted on signal-processing board 2, and FMC plugs 81 and FMC sockets 82 connect.
For example, signal occurs to use the FMC sockets 82 of SAMTEC companies, model ASP-134486-01 on plate 3.Letter
Number processing board 2 uses the FMC sockets 82 of a SAMTEC company, model ASP-134488-01.Selected by this product
The depth that plugs together of FMC plugs 81 and FMC sockets 82 is that 10mm in practical applications, is required according to different system, also may be used certainly
Depth is plugged together as the FMC plugs 81 of 8.5mm and FMC sockets 82 to use, and the utility model embodiment is not specifically limited this.
Signal occurs to be provided with the first FPGA7 on plate 3, is provided with the 2nd FPGA5 on signal-processing board 2, the first FPGA7 and
2nd FPGA5 is connected by FMC connectors 8.Signal occurs to be provided with FMC connectors 8 between plate 3 and signal-processing board 2
The LVDS interface 15 of connection.Structure cooling fin, the heat that structure cooling fin generates the first FPGA7 are provided on first FPGA7
It radiates on conduction to system structure body 1.
Exemplary, the 2nd FPGA5 can be XC7VX690T-2FFG1761I, and DSP6 can be
TMS320C6678ACYPA25, the first FPGA7 can be XC7A100T-2FGG484I.
The first riveting column 11 is provided between signal-processing board 2 and structure cooling fin, at one end of the first riveting column 11 and signal
Plate 2 to be managed to connect, the other end is connected with structure cooling fin, and signal occurs to be provided with the second riveting column 9 between plate 3 and structure heat sink,
One end of second riveting column 9 connects the other end with structure heat sink and signal occurs plate 3 and connects, wherein the first riveting column 11 and system structure
Body 1 is connected by screw 10.
Interconnection structure between a kind of high speed circuit board that the utility model embodiment provides has broken FMC subcard small sizes
Limitation, table bottom patch mounting means can save pcb board area, have the characteristics that：Reliability is high, and autgmentability is strong, easy disassembly,
Cool-guiding type radiates.In the design of FMC subcards, PCB surface product is not limited by codes and standards, has prodigious flexibility.Connector FMC
Mounting means is pasted at table bottom, can effectively save PCB surface product, to optimize cost, reduces product size.Reliability is high, and satisfaction is shaken
The requirement of dynamic test, fall-down test and environmental test.Can be extending transversely, under conditions of not increasing board quantity, in pcb board
Multiple FMC connectors are extended in horizontal direction, to further expand interconnection I/O quantity between plate.Can Longitudinal Extension, refer to increasing
Under conditions of splice card quantity, multiple FMC connectors are extended up in the Vertical Square of pcb board, to further increase systematicness
Energy.Easy disassembly refers to that system uses modular mentality of designing and assembling mode, replaces and repair convenient for the later stage.Cool-guiding type
Heat dissipation refers to that high power device can utilize product systems structure to realize heat dissipation on each board.
Embodiment two
As depicted in figs. 1 and 2, the interconnection structure between a kind of high speed circuit board, including signal-processing board 2, FMC connectors 8,
Plate 3 and system structure body 1 occur for signal；Signal-processing board 2, FMC connectors 8 and signal occur plate 3 and are arranged in system structure body 1
Portion；FMC connectors 8 are located between signal-processing board 2 and signal generation plate 3, and the both sides that plate 3 occurs for signal are symmetrically arranged with signal
By FMC connectors 8 and signal the connection of plate 3 occurs for processing board 2, the signal-processing board 2 that 3 both sides of plate occur for signal respectively, wherein
Signal-processing board 2 and signal occur plate 3 and High Speed PCB Board may be used.The patch installation of table bottom refers to that in signal plate occurs for FMC connectors
It is mounted by the way of table bottom is completely overlapped above and below all pad-pins.
For example, signal occurs to use the FMC sockets 82 of SAMTEC companies, model ASP-134486-01 on plate 3.Letter
Number processing board 2 uses the FMC sockets 82 of a SAMTEC company, model ASP-134488-01.Selected by this product
The depth that plugs together of FMC plugs 81 and FMC sockets 82 is that 10mm in practical applications, is required according to different system, also may be used certainly
Depth is plugged together as the FMC plugs 81 of 8.5mm and FMC sockets 82 to use, and the utility model embodiment is not specifically limited this.
Signal occurs to be provided with the first FPGA7 on plate 3, and the signal-processing board 2 that 3 both sides of plate occur for signal is respectively the first letter
Number processing board and second signal processing board are provided with the 2nd FPGA5 and DSP6, second signal processing board on the first signal-processing board
On be provided with the 3rd FPGA and DSP6.The SRIO of the connection of FMC connectors 8 is provided between 2nd FPGA5 and the 3rd FPGA
The LVDS interface 15 that the connection of FMC connectors 8 is provided between plate 3 and signal-processing board 2 occurs for interface 14, signal.First
It is provided with Hyperlink between DSP6 on DSP6 on signal-processing board and second signal processing board, is connected by FMC, the
Structure cooling fin is provided on one FPGA7, structure cooling fin conducts the first FPGA7 heats generated to scattered on system structure body 1
Heat.
The first riveting column 11, one end and first of the first riveting column 11 are provided between first signal-processing board and structure cooling fin
Signal-processing board connects, and the other end is connected with structure cooling fin, and the first riveting column 11 and system structure body 1 are connected by screw 10, letter
Number occur to be provided with the second riveting column 9 between plate 3 and structure heat sink, one end of the second riveting column 9 is connected with structure heat sink, another
End and signal occur plate 3 and connect.Second signal processing board and signal occur to be provided with stud 12, one end of stud 12 between plate 3
Plate 3 occurs with signal to connect, the other end is connected with second signal processing board.
Exemplary, the 2nd FPGA5 and the 3rd FPGA are XC7VX690T-2FFG1761I, and DSP6 can be
TMS320C6678ACYPA25, the first FPGA7 can be XC7A100T-2FGG484I.
Interconnection structure between a kind of high speed circuit board that the utility model embodiment provides has broken FMC subcard small sizes
Limitation, table bottom patch mounting means can save pcb board area, have the characteristics that：Reliability is high, and autgmentability is strong, easy disassembly,
Cool-guiding type radiates.In the design of FMC subcards, PCB surface product is not limited by codes and standards, has prodigious flexibility.Connector FMC
Mounting means is pasted at table bottom, can effectively save PCB surface product, to optimize cost, reduces product size.Reliability is high, and satisfaction is shaken
The requirement of dynamic test, fall-down test and environmental test.Can be extending transversely, under conditions of not increasing board quantity, in pcb board
Multiple FMC connectors are extended in horizontal direction, to further expand interconnection I/O quantity between plate.Can Longitudinal Extension, refer to increasing
Under conditions of splice card quantity, multiple FMC connectors are extended up in the Vertical Square of pcb board, to further increase systematicness
Energy.Easy disassembly refers to that system uses modular mentality of designing and assembling mode, replaces and repair convenient for the later stage.Cool-guiding type
Heat dissipation refers to that high power device can utilize product systems structure to realize heat dissipation on each board.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, all in this practicality
Within novel spirit and principle, any modification, equivalent replacement, improvement and so on should be included in the guarantor of the utility model
Within the scope of shield.
Claims (10)
1. the interconnection structure between a kind of high speed circuit board, which is characterized in that including signal-processing board (2), FMC connectors (8), letter
Number plate (3) and system structure body (1) occurs；
The signal-processing board (2), FMC connectors (8) and signal occur plate (3) and are arranged in system structure body (1) inside；
The FMC connectors (8) are located between signal-processing board (2) and signal generation plate (3), and the FMC connectors (8) pass through
The mode and signal of table bottom patch occur plate (3) and connect.
2. the interconnection structure between a kind of high speed circuit board as described in claim 1, which is characterized in that the FMC connectors (8)
Including FMC plugs (81) and FMC sockets (82), FMC sockets (82) are mounted on signal and occur on plate (3), FMC plugs (81) installation
On signal-processing board (2), FMC plugs (81) and FMC sockets (82) connection.
3. the interconnection structure between a kind of high speed circuit board as described in claim 1, which is characterized in that plate occurs for the signal
(3) it is provided with the first FPGA (7) on, the 2nd FPGA (5), the first FPGA (7) and the 2nd FPGA are provided on signal-processing board (2)
(5) it is connected by FMC connectors (8).
4. the interconnection structure between a kind of high speed circuit board as claimed in claim 3, which is characterized in that plate occurs for the signal
(3) LVDS interface (15) is provided between signal-processing board (2).
5. the interconnection structure between a kind of high speed circuit board as claimed in claim 3, which is characterized in that the first FPGA (7)
On be provided with structure cooling fin, the structure cooling fin conducts the first FPGA (7) heats generated to dissipating on system structure body (1)
Heat.
6. the interconnection structure between a kind of high speed circuit board as claimed in claim 5, which is characterized in that the signal-processing board
(2) the first riveting column (11), one end of the first riveting column (11) and signal-processing board (2) connection are provided between structure cooling fin,
The other end is connected with structure cooling fin, and the first riveting column (11) and system structure body (1) are connected by screw (10), and plate occurs for signal
(3) the second riveting column (9) is provided between structure heat sink, one end of the second riveting column (9) connects the other end with structure heat sink
It is connected with signal-processing board (2), the second riveting column (9) and signal occur plate (3) and connected by stud (12).
7. the interconnection structure between a kind of high speed circuit board as described in claim 1, which is characterized in that plate occurs for the signal
(3) both sides are symmetrically arranged with signal-processing board (2), and the signal-processing board (2) that plate (3) both sides occur for signal passes through FMC respectively
Connector (8) and signal occur plate (3) and connect.
8. the interconnection structure between a kind of high speed circuit board as claimed in claim 7, which is characterized in that plate occurs for the signal
(3) be provided with the first FPGA (7) on, the signal-processing board (2) that plate (3) both sides occur for signal be respectively the first signal-processing board and
Second signal processing board is provided with the 2nd FPGA (5) and DSP (6) on the first signal-processing board, is arranged in second signal processing board
There are the 3rd FPGA and DSP (6).
9. the interconnection structure between a kind of high speed circuit board as claimed in claim 8, which is characterized in that first signal processing
Hyperlink interfaces (13), two DSP (6) are provided between DSP (6) on DSP (6) on plate and second signal processing board
It is connected by FMC connectors (8), SRIO interfaces (14), the 2nd FPGA and third is provided between the 2nd FPGA and the 3rd FPGA
FPGA passes through FMC connectors (8).
10. the interconnection structure between a kind of high speed circuit board as claimed in claim 8, which is characterized in that at the second signal
Reason plate and signal occur to be provided with stud (12) between plate (3), and one end of stud (12) and signal occur plate (3) and connect, another
End is connected with second signal processing board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721807176.3U CN207834615U (en) | 2017-12-21 | 2017-12-21 | A kind of interconnection structure between high speed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721807176.3U CN207834615U (en) | 2017-12-21 | 2017-12-21 | A kind of interconnection structure between high speed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207834615U true CN207834615U (en) | 2018-09-07 |
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ID=63388463
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721807176.3U Active CN207834615U (en) | 2017-12-21 | 2017-12-21 | A kind of interconnection structure between high speed circuit board |
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| CN (1) | CN207834615U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110392185A (en) * | 2019-07-17 | 2019-10-29 | 珠海纳睿达科技有限公司 | A kind of signal acquisition subcard work system |
-
2017
- 2017-12-21 CN CN201721807176.3U patent/CN207834615U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110392185A (en) * | 2019-07-17 | 2019-10-29 | 珠海纳睿达科技有限公司 | A kind of signal acquisition subcard work system |
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