CN207833192U - A kind of electrophoretic display device (EPD) - Google Patents

A kind of electrophoretic display device (EPD) Download PDF

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Publication number
CN207833192U
CN207833192U CN201820233174.6U CN201820233174U CN207833192U CN 207833192 U CN207833192 U CN 207833192U CN 201820233174 U CN201820233174 U CN 201820233174U CN 207833192 U CN207833192 U CN 207833192U
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Prior art keywords
layer
substrate
protective layer
electrophoretic display
electrophoresis showed
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CN201820233174.6U
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孙景泉
王喜杜
林永强
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Guangzhou OED Technologies Co Ltd
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Guangzhou OED Technologies Co Ltd
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Abstract

The utility model is related to a kind of electrophoretic display device (EPD)s, including protective layer, electrophoresis showed component, substrate, fluid sealant and silicon oxynitride layer, protective layer, electrophoresis showed component and substrate stack gradually connection from outside to inside, the width of electrophoresis showed component is less than the width of protective layer and substrate, the gap for the side for surrounding electrophoresis showed component is formed between protective layer and substrate, the surface in protective layer and substrate towards gap is formed with silicon oxynitride layer, filling with sealant in gap, and coat silicon oxynitride layer and electrophoresis showed component, by protective layer, electrophoresis showed component, substrate is sealed.The structure of the electrophoretic display device (EPD) is relatively simple.

Description

A kind of electrophoretic display device (EPD)
Technical field
The utility model is related to display device field more particularly to a kind of electrophoretic display device (EPD)s.
Background technology
Electrophoretic display device (EPD) is a kind of display as thin as paper, soft and erasable, in recent years in billboard and price It is more and more widely used on board.Referring to FIG. 3, existing electrophoretic display device (EPD) generally comprises electrophoresis showed component 60, protects Sheath 70, edge seal glue 80, substrate 90 and contain silicon due to the bonding force difference between edge seal glue 80 and plastic layer The cohesive force of oxide interface is also bad, and cohesive force further declines in degradation, influences the leakproofness of encapsulation, into And influence the service life of device.
Invention content
Based on the deficiencies of the prior art, the utility model technical issues that need to address are to provide a kind of electrophoretic display device (EPD).
On the one hand the utility model embodiment provides a kind of electrophoretic display device (EPD) comprising protective layer, electrophoresis showed component, base Plate, fluid sealant and silicon oxynitride layer, the protective layer, electrophoresis showed component and substrate stack gradually connection from outside to inside, described The width of electrophoresis showed component is less than the width of the protective layer and substrate, is formed between the protective layer and substrate and surrounds institute State the gap of the side of electrophoresis showed component, the surface in the protective layer and substrate towards gap is formed with silicon oxynitride layer, institute It states fluid sealant filling in the gap, and coats the silicon oxynitride layer and electrophoresis showed component.
Preferably, the protective layer is the plastic layer of the oxide containing silicon.
Preferably, the width of the substrate is more than the width of the protective layer, the width of the silicon oxynitride layer on the substrate Degree is more than the width of the silicon oxynitride layer on the protective layer.
Preferably, the electrophoresis showed component includes electrophoretic display layer and transparent conductive electrode, the transparent conductive electrode Between the protective layer and electrophoretic display layer, the adhesion layer is between electrophoretic display layer and the substrate.
Preferably, the adhesion layer and the substrate bonding.
Preferably, the silicon oxynitride layer is formed using chemical vapor deposition method.
Preferably, the thickness of the silicon oxynitride layer in 0 nanometer and is less than or equal to 500 nanometers.
On the other hand the utility model embodiment provides a kind of packaging method of electrophoretic display device (EPD) comprising following steps:
It is laminated electrophoresis showed component on a surface of a substrate;
Protective layer is laminated on the surface of the electrophoresis showed component, the width of the electrophoresis showed component is less than the guarantor The width of sheath and substrate;
Silicon oxynitride layer is formed in the inner surface of the protective layer and substrate, the silicon oxynitride layer is along the electrophoresis showed The periphery of component is arranged;
The filling with sealant between the protective layer and substrate, the fluid sealant coats the silicon oxynitride layer and electrophoresis is aobvious Show component;
The fluid sealant is cured.
Preferably, the silicon oxynitride layer is formed using chemical vapor deposition method.
Preferably, the thickness of the silicon oxynitride layer is more than 0 nanometer and is less than or equal to 500 nanometers.
Compared with prior art, the utility model embodiment is before module edge sealing, by encapsulating surface layer in contact interface Silicon oxynitride layer is done, there is the characteristic of strongly adherent using plastics and silicon oxy-nitride material, improves fluid sealant and protective layer and substrate Between caking property, preferably reach sealing effect, and then improve the service life of device.
According to the present invention will be described in detail below with reference to the accompanying drawings, as part of this specification, for embodiment Bright the principles of the present invention, other aspect, feature and its advantages of the utility model will become one by the detailed description Mesh is clear.
Description of the drawings
Fig. 1 is the structural schematic diagram for the electrophoretic display device (EPD) that the utility model embodiment provides.
Fig. 2 is the structural schematic diagram of the electrophoresis showed component in Fig. 1.
Fig. 3 is the structural schematic diagram of electrophoretic display device (EPD) in the prior art.
Specific implementation mode
In order to make the purpose of utility model, technical solution and its technique effect of the utility model be more clear, below in conjunction with The utility model is described in detail in the drawings and specific embodiments.It should be understood that described in this specification specific Embodiment is not intended to limit the utility model just for the sake of explaining the utility model.
Referring to FIG. 1, a kind of electrophoretic display device (EPD) of the utility model embodiment comprising protective layer 30, electrophoresis showed component 20, substrate 10, fluid sealant 50, silicon oxynitride layer 40, protective layer 30, electrophoresis showed component 20, substrate 10 layer successively from outside to inside Folded connection.It is signified outer and inner herein, it is to have for reference, i.e. this electrophoretic display device (EPD) from the point of view of user's ecto-entad with the visual angle of user For body, i.e., looked down above Fig. 1.The width of electrophoresis showed component 20 is less than the width of protective layer 30 and substrate 10, and Electrophoresis showed component 20 is held between protective layer 30 and substrate 10, therefore encirclement is formed between protective layer 30 and substrate 10 The gap of the side of electrophoresis showed component 20.The surface in protective layer 30 and substrate 10 towards gap is each formed with silicon oxynitride layer 40, filling with sealant 50 in gap, and silicon oxynitride layer 40 and electrophoresis showed component 20 are coated, electrophoresis showed component 20 is close Envelope, to prevent water, dust etc. from entering electrophoresis showed component 20.In the present embodiment, fluid sealant 50 is not only filled with above-mentioned Gap also covers most of outer surface (surface i.e. upward) and side surface and the inner surface of protective layer 30 of substrate 10 (surface i.e. directed downwardly).Thermoplastic glue material preferably may be used in fluid sealant 50.The thickness of silicon oxynitride layer is preferably more than 0 and receives Rice and be less than or equal to 500 nanometers.
Protective layer 30 can be by glass (such as tempered glass), polyethylene terephthalate (PET), polyethylene (PE), polymethyl methacrylate (PMMA) or makrolon (PC) are made.In a preferred embodiment, protective layer 30 is to contain silicon Oxide plastic layer.Protective layer 30 can be PET, and have the protective coating of the oxide containing silicon on its inner surface.
In a preferred embodiment, the width of substrate 10 is more than the width of protective layer 30, the silicon oxynitride layer 40 on substrate 10 Width be more than protective layer 30 on silicon oxynitride layer 40 width.Specifically, on the inner surface of protective layer 30, in addition to electricity It swims outside the position that display module 20 connects, other positions are all covered with silicon oxynitride layer 40, and on the outer surface of substrate 10, in ring The upright projection position of protective layer 30 and the neighboring area of upright projection position are covered with silicon oxynitride layer 40, but silicon oxynitride layer 40 can not cover to the entire outer surface of substrate 10.
Electrophoresis showed component 20 includes transparent conductive electrode 201, display micro unit 202, adhesion layer 203, electrophoretic display layer 204, wherein each display micro unit 202 includes electrophoresis liquid and the electrophoresis particle being suspended in electrophoresis liquid, electrophoresis particle is in electric field It is moved in electrophoresis liquid under effect, to show content.It is micro- at several microns to hundreds of microns that display micro unit 202 can be grain size Capsule or micro-cup.Structure, material and the manufacturing method of electrophoresis showed component 20 can refer in Chinese patent CN103091926A The structure of photoelectric medium or the electro-optic layer in Chinese patent CN1764861A, material and manufacturing method.
Transparent conductive electrode 201 can be by bases such as polyethylene terephthalate, polyethylene, polyimides (PI) Inside (i.e. close to the side of display micro unit 202) manufacture tin indium oxide (ITO) film, graphene film or the fine and close aluminium foil of material To be formed.Protective layer 30 and transparent conductive electrode 201 are connect by circuit with controller, for the two of electrophoresis showed component 20 End applies voltage signal, so that electrophoresis showed component 20 shows required content.
Due to moisture once penetrating into electrophoresis showed component 20, therefore the performance of electrophoretic display device (EPD), will be by extreme influence It realizes better waterproof effect, referring to FIG. 1, before module edge sealing, silicon oxynitride layer is done by encapsulating surface layer in contact interface 40, using plastic cement and the stronger characteristic of silicon oxy-nitride material adhesiveness, improve between fluid sealant 50 and protective layer 30 and substrate 10 Caking property preferably improves sealing effect, greatly improves sealing effect, and by these modes, it is aobvious can to further increase electrophoresis Show the water resistance of device.In other embodiments, include waterproof material in fluid sealant 50, waterproof material preferably may be used Either silica gel material or fluid sealant 50 itself are epoxy resin or silica gel material to epoxy resin.It, can by these modes To further increase the water resistance of electrophoretic display device (EPD).
The utility model embodiment also provides a kind of packaging method of electrophoretic display device (EPD) comprising following steps:
Lamination electrophoresis showed component 20 on the surface of the substrate 10;The structure of electrophoresis showed component 20 can refer to above-mentioned reality Example is applied, electrophoresis showed component 20 includes transparent conductive electrode 201, shows micro unit 202, adhesion layer 203, electrophoretic display layer 204, The stacking of transparent conductive electrode 201 is connected on the outer surface of electrophoretic display layer 204, is applied on the inner surface of electrophoresis showed component 20 Then electrophoresis showed component 20 is laminated on the outer surface of substrate 10 by cloth glue, by drying adhesive;
Protective layer 30 is laminated on the outer surface of electrophoresis showed component 20, the width of electrophoresis showed component 20 is less than protective layer 30 and substrate 10 width;Can on the outer surface of electrophoresis showed component 20 glue coating, then protective layer 30 is adhered to On the outer surface of electrophoresis showed component 20, and dry glue.
On the opposite surface (namely outer surface of the inner surface of protective layer 30 and substrate 10) of protective layer 30 and substrate 10 Upper formation silicon oxynitride layer 40, silicon oxynitride layer 40 are arranged along the periphery of electrophoresis showed component 20, electrophoresis showed component 20 are wrapped It encloses.Silicon oxynitride layer 40 preferably may be used chemical vapor deposition method and obtain, such as can be by monosilane, nitrous oxide It is obtained by chemical vapor deposition with nitrogen, thickness is preferably more than 0 nanometer and is less than or equal to 500 nanometers.
The filling with sealant 50 between protective layer 30 and substrate 10, fluid sealant 50 coat silicon oxynitride layer 40 and electrophoresis showed Component 20;Fluid sealant 50 is filled with the gap between protective layer 30 and substrate 10, also covers most of outer surface of substrate 10 And side surface and the inner surface of protective layer 30;
Fluid sealant 50 is cured;Thermoplastic glue material preferably may be used in fluid sealant 50, therefore can pass through heating Mode fluid sealant 50 is cured.
The manufacturing method of electrophoresis showed component 20 can refer to following steps:The coating electronic in transparent conductive electrode 201 Ink, it is rear after drying to form electrophoresis showed component 20;Electric ink is micro- by water, adhesive, dispersant, thickener and multiple displays Unit (such as microcapsules) mixes together;The ingredient and preparation method of electric ink can specifically refer to The ingredient of electrophoretic display coating fluid and preparation in the Chinese patents such as CN101738814A, CN103834285A, CN104073109A Method.
Display circuit, such as thin-film transistor circuit can be formed on the outside of substrate 10;Form the side of display circuit Method can refer to the preparation method in the Chinese patents such as CN105702700A, CN1963650A.
Above disclosed is only the preferred embodiment of the utility model, certainly cannot be new to limit this practicality with this The interest field of type, therefore equivalent variations made according to the patent scope of the utility model still belong to the utility model and are covered Range.

Claims (7)

1. a kind of electrophoretic display device (EPD), which is characterized in that including protective layer, electrophoresis showed component, substrate, fluid sealant and silicon oxynitride Layer, the protective layer, electrophoresis showed component and substrate stack gradually connection from outside to inside, and the width of the electrophoresis showed component is small In the protective layer and the width of substrate, the side for surrounding the electrophoresis showed component is formed between the protective layer and substrate Gap, the surface in the protective layer and substrate towards gap is formed with silicon oxynitride layer, the fluid sealant be filled in it is described between In gap, and coat the silicon oxynitride layer and electrophoresis showed component.
2. electrophoretic display device (EPD) as described in claim 1, which is characterized in that the protective layer is the plastics of the oxide containing silicon Layer.
3. electrophoretic display device (EPD) as described in claim 1, which is characterized in that the width of the substrate is more than the width of the protective layer It spends, the width of the silicon oxynitride layer on the substrate is more than the width of the silicon oxynitride layer on the protective layer.
4. electrophoretic display device (EPD) as described in claim 1, which is characterized in that the electrophoresis showed component include electrophoretic display layer, Transparent conductive electrode and adhesion layer, the transparent conductive electrode is between protective layer and electrophoretic display layer, the adhesion layer position Between electrophoretic display layer and the substrate.
5. electrophoretic display device (EPD) as claimed in claim 4, which is characterized in that the transparent conductive electrode is viscous with the protective layer It connects, the adhesion layer and the substrate bonding.
6. electrophoretic display device (EPD) as described in claim 1, which is characterized in that the silicon oxynitride layer uses chemical vapor deposition side Method is formed.
7. the thickness of electrophoretic display device (EPD) as described in claim 1, the silicon oxynitride layer is more than 0 nanometer and is less than or equal to 500 nanometers.
CN201820233174.6U 2018-02-09 2018-02-09 A kind of electrophoretic display device (EPD) Active CN207833192U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108279542A (en) * 2018-02-09 2018-07-13 广州奥翼电子科技股份有限公司 A kind of electrophoretic display device (EPD) and its packaging method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108279542A (en) * 2018-02-09 2018-07-13 广州奥翼电子科技股份有限公司 A kind of electrophoretic display device (EPD) and its packaging method

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